CN103748049A - 半导体元件包覆用玻璃 - Google Patents

半导体元件包覆用玻璃 Download PDF

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Publication number
CN103748049A
CN103748049A CN201280040871.5A CN201280040871A CN103748049A CN 103748049 A CN103748049 A CN 103748049A CN 201280040871 A CN201280040871 A CN 201280040871A CN 103748049 A CN103748049 A CN 103748049A
Authority
CN
China
Prior art keywords
glass
semiconductor element
coated
covering
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280040871.5A
Other languages
English (en)
Chinese (zh)
Inventor
西川欣克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
Original Assignee
Nippon Electric Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co Ltd filed Critical Nippon Electric Glass Co Ltd
Publication of CN103748049A publication Critical patent/CN103748049A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/068—Glass compositions containing silica with less than 40% silica by weight containing boron containing rare earths
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)
  • Formation Of Insulating Films (AREA)
CN201280040871.5A 2011-08-25 2012-08-14 半导体元件包覆用玻璃 Pending CN103748049A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2011-183703 2011-08-25
JP2011183703 2011-08-25
JP2012132531A JP6064298B2 (ja) 2011-08-25 2012-06-12 半導体素子被覆用ガラス
JP2012-132531 2012-06-12
PCT/JP2012/070702 WO2013027636A1 (ja) 2011-08-25 2012-08-14 半導体素子被覆用ガラス

Publications (1)

Publication Number Publication Date
CN103748049A true CN103748049A (zh) 2014-04-23

Family

ID=47746383

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280040871.5A Pending CN103748049A (zh) 2011-08-25 2012-08-14 半导体元件包覆用玻璃

Country Status (4)

Country Link
JP (1) JP6064298B2 (ja)
CN (1) CN103748049A (ja)
TW (1) TWI615370B (ja)
WO (1) WO2013027636A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107074617A (zh) * 2014-09-09 2017-08-18 日本电气硝子株式会社 半导体元件包覆用玻璃
CN110642519A (zh) * 2019-09-25 2020-01-03 湖南利德电子浆料股份有限公司 一种氮化铝基板用包封浆料及其制备方法和应用

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2983197B1 (en) * 2013-03-29 2018-01-31 Shindengen Electric Manufacturing Co., Ltd. Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device
JP7185181B2 (ja) * 2018-10-04 2022-12-07 日本電気硝子株式会社 半導体素子被覆用ガラス及びこれを用いた半導体被覆用材料
US20230382785A1 (en) * 2020-10-13 2023-11-30 Nippon Electric Glass Co., Ltd. Semiconductor element coating glass and semiconductor element coating material using same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS623039A (ja) * 1985-06-29 1987-01-09 Toshiba Corp 絶縁層用材料
JPS6231903A (ja) * 1985-08-01 1987-02-10 株式会社東芝 絶縁層用材料
JPH05301738A (ja) * 1992-04-27 1993-11-16 Nippon Electric Glass Co Ltd 半導体被覆用ガラス
CN1616364A (zh) * 2003-11-11 2005-05-18 日本电气硝子株式会社 半导体封装用覆层玻璃
WO2011093177A1 (ja) * 2010-01-28 2011-08-04 日本電気硝子株式会社 半導体被覆用ガラスおよびそれを用いてなる半導体被覆用材料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5117027B1 (ja) * 1970-06-15 1976-05-29
JPS5137149B2 (ja) * 1971-10-04 1976-10-14
JPS547557B2 (ja) * 1974-03-30 1979-04-07
JPS57202742A (en) * 1981-06-09 1982-12-11 Toshiba Corp Glass for semiconductor coating
JP2002012445A (ja) * 2000-01-18 2002-01-15 Central Glass Co Ltd 低融点ガラス
DE60318517T2 (de) * 2002-04-24 2009-07-23 Central Glass Co., Ltd., Ube Bleifreies niedrigschmelzendes Glas

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS623039A (ja) * 1985-06-29 1987-01-09 Toshiba Corp 絶縁層用材料
JPS6231903A (ja) * 1985-08-01 1987-02-10 株式会社東芝 絶縁層用材料
JPH05301738A (ja) * 1992-04-27 1993-11-16 Nippon Electric Glass Co Ltd 半導体被覆用ガラス
CN1616364A (zh) * 2003-11-11 2005-05-18 日本电气硝子株式会社 半导体封装用覆层玻璃
WO2011093177A1 (ja) * 2010-01-28 2011-08-04 日本電気硝子株式会社 半導体被覆用ガラスおよびそれを用いてなる半導体被覆用材料

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107074617A (zh) * 2014-09-09 2017-08-18 日本电气硝子株式会社 半导体元件包覆用玻璃
CN110642519A (zh) * 2019-09-25 2020-01-03 湖南利德电子浆料股份有限公司 一种氮化铝基板用包封浆料及其制备方法和应用

Also Published As

Publication number Publication date
TW201309612A (zh) 2013-03-01
WO2013027636A1 (ja) 2013-02-28
JP2013060353A (ja) 2013-04-04
TWI615370B (zh) 2018-02-21
JP6064298B2 (ja) 2017-01-25

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Legal Events

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20140423