TWI615370B - 半導體元件被覆用玻璃 - Google Patents

半導體元件被覆用玻璃 Download PDF

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Publication number
TWI615370B
TWI615370B TW101130709A TW101130709A TWI615370B TW I615370 B TWI615370 B TW I615370B TW 101130709 A TW101130709 A TW 101130709A TW 101130709 A TW101130709 A TW 101130709A TW I615370 B TWI615370 B TW I615370B
Authority
TW
Taiwan
Prior art keywords
glass
semiconductor element
coating
content
zno
Prior art date
Application number
TW101130709A
Other languages
English (en)
Chinese (zh)
Other versions
TW201309612A (zh
Inventor
西川欣克
Original Assignee
日本電氣硝子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電氣硝子股份有限公司 filed Critical 日本電氣硝子股份有限公司
Publication of TW201309612A publication Critical patent/TW201309612A/zh
Application granted granted Critical
Publication of TWI615370B publication Critical patent/TWI615370B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/068—Glass compositions containing silica with less than 40% silica by weight containing boron containing rare earths
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)
  • Formation Of Insulating Films (AREA)
TW101130709A 2011-08-25 2012-08-23 半導體元件被覆用玻璃 TWI615370B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011183703 2011-08-25
JP2012132531A JP6064298B2 (ja) 2011-08-25 2012-06-12 半導体素子被覆用ガラス

Publications (2)

Publication Number Publication Date
TW201309612A TW201309612A (zh) 2013-03-01
TWI615370B true TWI615370B (zh) 2018-02-21

Family

ID=47746383

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101130709A TWI615370B (zh) 2011-08-25 2012-08-23 半導體元件被覆用玻璃

Country Status (4)

Country Link
JP (1) JP6064298B2 (ja)
CN (1) CN103748049A (ja)
TW (1) TWI615370B (ja)
WO (1) WO2013027636A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2983197B1 (en) * 2013-03-29 2018-01-31 Shindengen Electric Manufacturing Co., Ltd. Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device
JP6410089B2 (ja) * 2014-09-09 2018-10-24 日本電気硝子株式会社 半導体素子被覆用ガラス
JP7185181B2 (ja) * 2018-10-04 2022-12-07 日本電気硝子株式会社 半導体素子被覆用ガラス及びこれを用いた半導体被覆用材料
CN110642519B (zh) * 2019-09-25 2022-06-14 湖南利德电子浆料股份有限公司 一种氮化铝基板用包封浆料及其制备方法和应用
US20230382785A1 (en) * 2020-10-13 2023-11-30 Nippon Electric Glass Co., Ltd. Semiconductor element coating glass and semiconductor element coating material using same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6231903A (ja) * 1985-08-01 1987-02-10 株式会社東芝 絶縁層用材料
TW200403196A (en) * 2002-04-24 2004-03-01 Central Glass Co Ltd Lead-free low-melting glass
TWI286127B (en) * 2000-01-18 2007-09-01 Central Glass Co Ltd Low-melting glass for covering substrate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5117027B1 (ja) * 1970-06-15 1976-05-29
JPS5137149B2 (ja) * 1971-10-04 1976-10-14
JPS547557B2 (ja) * 1974-03-30 1979-04-07
JPS57202742A (en) * 1981-06-09 1982-12-11 Toshiba Corp Glass for semiconductor coating
JPS623039A (ja) * 1985-06-29 1987-01-09 Toshiba Corp 絶縁層用材料
JPH05301738A (ja) * 1992-04-27 1993-11-16 Nippon Electric Glass Co Ltd 半導体被覆用ガラス
JP2005162600A (ja) * 2003-11-11 2005-06-23 Nippon Electric Glass Co Ltd 半導体パッケージ用カバーガラス
CN102741185B (zh) * 2010-01-28 2015-11-25 日本电气硝子株式会社 半导体覆盖用玻璃和使用该玻璃形成的半导体覆盖用材料

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6231903A (ja) * 1985-08-01 1987-02-10 株式会社東芝 絶縁層用材料
TWI286127B (en) * 2000-01-18 2007-09-01 Central Glass Co Ltd Low-melting glass for covering substrate
TW200403196A (en) * 2002-04-24 2004-03-01 Central Glass Co Ltd Lead-free low-melting glass

Also Published As

Publication number Publication date
TW201309612A (zh) 2013-03-01
WO2013027636A1 (ja) 2013-02-28
JP2013060353A (ja) 2013-04-04
CN103748049A (zh) 2014-04-23
JP6064298B2 (ja) 2017-01-25

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