CN103716985A - 一种玻璃基线路板及其制造方法 - Google Patents
一种玻璃基线路板及其制造方法 Download PDFInfo
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- CN103716985A CN103716985A CN201310747333.6A CN201310747333A CN103716985A CN 103716985 A CN103716985 A CN 103716985A CN 201310747333 A CN201310747333 A CN 201310747333A CN 103716985 A CN103716985 A CN 103716985A
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- 239000011521 glass Substances 0.000 title claims abstract description 94
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 58
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910052802 copper Inorganic materials 0.000 claims abstract description 42
- 239000010949 copper Substances 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 40
- 238000005530 etching Methods 0.000 claims abstract description 13
- 230000003746 surface roughness Effects 0.000 claims abstract description 7
- 238000010023 transfer printing Methods 0.000 claims abstract description 4
- 238000001771 vacuum deposition Methods 0.000 claims description 30
- 238000005516 engineering process Methods 0.000 claims description 24
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 14
- 238000011161 development Methods 0.000 claims description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 12
- 238000009504 vacuum film coating Methods 0.000 claims description 12
- 238000012545 processing Methods 0.000 claims description 10
- 150000002500 ions Chemical class 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 8
- 229910052786 argon Inorganic materials 0.000 claims description 7
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 7
- 238000007738 vacuum evaporation Methods 0.000 claims description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- 238000009833 condensation Methods 0.000 claims description 4
- 230000005494 condensation Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 4
- 238000005566 electron beam evaporation Methods 0.000 claims description 4
- 229910001339 C alloy Inorganic materials 0.000 claims description 3
- 229910021591 Copper(I) chloride Inorganic materials 0.000 claims description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 3
- 229910001431 copper ion Inorganic materials 0.000 claims description 3
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 claims description 3
- 230000005484 gravity Effects 0.000 claims description 3
- 239000000615 nonconductor Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000004062 sedimentation Methods 0.000 claims description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000004891 communication Methods 0.000 abstract description 3
- 239000007888 film coating Substances 0.000 abstract description 3
- 238000009501 film coating Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 8
- 239000004744 fabric Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
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- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
性能 | 传统玻璃布板材 | 玻璃板材 |
尺寸稳定性 | 不易把控 | 非常稳定 |
透光性 | 无 | 透明 |
软化点 | 125-275℃ | ≥600℃ |
电性能 | 绝缘电阻:常态及浸水24小时后≥1010(Ω),耐电弧性>60(s),耐漏电起痕指数>175(v)。 | 绝缘电阻:常态及浸水24小时后≥1012(Ω),耐电弧性>150(s),耐漏电起痕指数>180(v)。 |
Claims (6)
Priority Applications (1)
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CN201310747333.6A CN103716985B (zh) | 2013-12-31 | 2013-12-31 | 一种玻璃基线路板及其制造方法 |
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CN201310747333.6A CN103716985B (zh) | 2013-12-31 | 2013-12-31 | 一种玻璃基线路板及其制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN103716985A true CN103716985A (zh) | 2014-04-09 |
CN103716985B CN103716985B (zh) | 2017-01-04 |
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CN201310747333.6A Expired - Fee Related CN103716985B (zh) | 2013-12-31 | 2013-12-31 | 一种玻璃基线路板及其制造方法 |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104918413A (zh) * | 2015-03-09 | 2015-09-16 | 广州市祺虹电子科技有限公司 | 一种tgcb的制成工艺 |
CN104913217A (zh) * | 2015-05-29 | 2015-09-16 | 杭州杭科光电股份有限公司 | 一种驱动电源集成在泡壳内部的led球泡灯 |
CN105305047A (zh) * | 2015-10-20 | 2016-02-03 | 中山市福瑞卫浴设备有限公司 | 一种具有印刷电路的玻璃 |
CN106385768A (zh) * | 2016-04-26 | 2017-02-08 | 深圳市环基实业有限公司 | 一种透明介质线路板及其制造方法 |
WO2017152509A1 (zh) * | 2016-03-08 | 2017-09-14 | 意力(广州)电子科技有限公司 | 边框区线路和视窗区线路的搭接工艺及触摸屏 |
CN111559863A (zh) * | 2020-05-12 | 2020-08-21 | 江苏华鸥玻璃有限公司 | 一种耐热耐腐蚀的高硼硅棕色玻璃及其制备方法 |
CN111654977A (zh) * | 2020-06-22 | 2020-09-11 | 广德众泰科技有限公司 | 一种抗氧化性线路板的制作方法 |
CN111960683A (zh) * | 2020-08-11 | 2020-11-20 | 浙江工业大学 | 一种GO-WO3/TiO2微球薄膜电极的制备方法 |
CN112063985A (zh) * | 2020-09-02 | 2020-12-11 | 山东司莱美克新材料科技有限公司 | 玻璃基材真空磁控溅射镀铜方法 |
CN117769145A (zh) * | 2024-02-22 | 2024-03-26 | 深圳市盛鸿运科技有限公司 | 一种线路板蚀刻方法及线路板 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN86107670A (zh) * | 1986-11-25 | 1988-06-08 | 李海清 | 普通玻璃真空镀铜合金制茶镜工艺 |
CN1251830A (zh) * | 1998-10-16 | 2000-05-03 | 株式会社村田制作所 | 结晶玻璃合成物、结晶玻璃、绝缘合成物、绝缘膏以及厚膜电路板 |
CN201700082U (zh) * | 2010-03-24 | 2011-01-05 | 常州中英科技有限公司 | 聚四氟乙烯玻璃纤维陶瓷基板 |
CN102917546A (zh) * | 2012-10-21 | 2013-02-06 | 蔡新民 | 一种聚四氟乙烯高频电路板的制作方法 |
CN103305802A (zh) * | 2013-07-05 | 2013-09-18 | 北京东明兴业科技有限公司 | 电子产品金属表面pvd薄膜及其制备方法 |
CN203691747U (zh) * | 2013-12-31 | 2014-07-02 | 张伯平 | 玻璃基线路板 |
-
2013
- 2013-12-31 CN CN201310747333.6A patent/CN103716985B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN86107670A (zh) * | 1986-11-25 | 1988-06-08 | 李海清 | 普通玻璃真空镀铜合金制茶镜工艺 |
CN1251830A (zh) * | 1998-10-16 | 2000-05-03 | 株式会社村田制作所 | 结晶玻璃合成物、结晶玻璃、绝缘合成物、绝缘膏以及厚膜电路板 |
CN201700082U (zh) * | 2010-03-24 | 2011-01-05 | 常州中英科技有限公司 | 聚四氟乙烯玻璃纤维陶瓷基板 |
CN102917546A (zh) * | 2012-10-21 | 2013-02-06 | 蔡新民 | 一种聚四氟乙烯高频电路板的制作方法 |
CN103305802A (zh) * | 2013-07-05 | 2013-09-18 | 北京东明兴业科技有限公司 | 电子产品金属表面pvd薄膜及其制备方法 |
CN203691747U (zh) * | 2013-12-31 | 2014-07-02 | 张伯平 | 玻璃基线路板 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104918413A (zh) * | 2015-03-09 | 2015-09-16 | 广州市祺虹电子科技有限公司 | 一种tgcb的制成工艺 |
CN104913217A (zh) * | 2015-05-29 | 2015-09-16 | 杭州杭科光电股份有限公司 | 一种驱动电源集成在泡壳内部的led球泡灯 |
CN105305047A (zh) * | 2015-10-20 | 2016-02-03 | 中山市福瑞卫浴设备有限公司 | 一种具有印刷电路的玻璃 |
WO2017152509A1 (zh) * | 2016-03-08 | 2017-09-14 | 意力(广州)电子科技有限公司 | 边框区线路和视窗区线路的搭接工艺及触摸屏 |
CN106385768A (zh) * | 2016-04-26 | 2017-02-08 | 深圳市环基实业有限公司 | 一种透明介质线路板及其制造方法 |
CN111559863B (zh) * | 2020-05-12 | 2022-04-19 | 江苏华鸥玻璃有限公司 | 一种耐热耐腐蚀的高硼硅棕色玻璃及其制备方法 |
CN111559863A (zh) * | 2020-05-12 | 2020-08-21 | 江苏华鸥玻璃有限公司 | 一种耐热耐腐蚀的高硼硅棕色玻璃及其制备方法 |
CN111654977A (zh) * | 2020-06-22 | 2020-09-11 | 广德众泰科技有限公司 | 一种抗氧化性线路板的制作方法 |
CN111960683A (zh) * | 2020-08-11 | 2020-11-20 | 浙江工业大学 | 一种GO-WO3/TiO2微球薄膜电极的制备方法 |
CN112063985A (zh) * | 2020-09-02 | 2020-12-11 | 山东司莱美克新材料科技有限公司 | 玻璃基材真空磁控溅射镀铜方法 |
CN112063985B (zh) * | 2020-09-02 | 2022-06-24 | 山东司莱美克新材料科技有限公司 | 玻璃基材真空磁控溅射镀铜方法 |
CN117769145A (zh) * | 2024-02-22 | 2024-03-26 | 深圳市盛鸿运科技有限公司 | 一种线路板蚀刻方法及线路板 |
CN117769145B (zh) * | 2024-02-22 | 2024-04-19 | 深圳市盛鸿运科技有限公司 | 一种线路板蚀刻方法及线路板 |
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Owner name: XINGTAI HAINA ELECTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: ZHANG BOPING Effective date: 20150129 |
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Effective date of registration: 20150129 Address after: 054700 Weixian County Economic Development Zone, Hebei Province, open road, No. 3, No. Applicant after: Xingtai Haina Electronics Technology Co., Ltd Address before: 054000 Hebei Xingtai Weixian County Economic Development Zone Open Road No. 1 Haina electronics company Applicant before: Zhang Boping |
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