CN103699191A - Semiconductor water-cooling central processing unit (CPU) radiator - Google Patents
Semiconductor water-cooling central processing unit (CPU) radiator Download PDFInfo
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- CN103699191A CN103699191A CN201210366689.0A CN201210366689A CN103699191A CN 103699191 A CN103699191 A CN 103699191A CN 201210366689 A CN201210366689 A CN 201210366689A CN 103699191 A CN103699191 A CN 103699191A
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Abstract
The invention discloses a semiconductor water-cooling central processing unit (CPU) radiator which comprises a heat conducting plate, a semiconductor chilling plate, a water cooler, a silica gel water pipe, a water-cooling pump and a water-cooling head, wherein the lower surface of the heat conducting plate is jointed with the upper surface of a CPU chip; the upper surface of the heat conducting plate is jointed with a cold end surface of the semiconductor chilling plate; a hot end surface of the semiconductor chilling plate is jointed with the end surface of the water-cooling head; the water-cooling head and the semiconductor chilling plate are fixedly connected with a base plate of the CPU chip by bolts; an outlet of the water-cooling head is connected with an inlet of the water-cooling pump; an outlet of the water-cooling pump is connected with an inlet of the water cooler; an outlet of the water cooler is connected with an inlet of the water-cooling head. After the semiconductor water-cooling CPU radiator is adopted, active heat dissipation of a CPU can be realized; a semiconductor refrigeration technology and a water-cooling technology are used for guaranteeing the temperature of the CPU to be maintained to be lower, so that the aim of rapidly cooling can be achieved; the semiconductor water-cooling CPU radiator has the advantages of being small in volume, light in weight, compact in structure, high in heat dissipation efficiency and the like.
Description
Technical field
The present invention relates to a kind of heating radiator, relate in particular to a kind of semiconductor water cooling cpu heat.
Background technology
CPU (central processing unit) is the main parts in computing machine, is also maximum heater members (power reaches 100 watts of left and right) simultaneously, so, need to effectively dispel the heat to CPU.Known cpu heat belongs to passive heat radiation mostly, cabinet can only be reduced to environment temperature at most, utilize fan that the heat of heat radiator is blown away by mobile air, too high if there is environment temperature or draw badly situation, the temperature of CPU is easily assembled rising, affects its work efficiency, and fan long-play rotating speed reduces, easily occur control of dust, noise becomes large phenomenon.
Summary of the invention
Object of the present invention is just to provide in order to address the above problem a kind of active heat removal, semiconductor water cooling cpu heat that radiating efficiency is high.
The present invention is achieved through the following technical solutions above-mentioned purpose:
The present invention includes conducting strip, semiconductor chilling plate, water cooler, silica gel water pipe, water-cooled pump and water-cooling head, described conducting strip lower surface and the laminating of cpu chip upper surface, the cold junction face laminating of the upper surface of described conducting strip and described semiconductor chilling plate, the hot junction face of described semiconductor chilling plate and the laminating of described water-cooling head end face, described water-cooling head is fixedly connected with cpu chip bedplate by bolt with described semiconductor chilling plate, the outlet of described water-cooling head is connected with the import of described water-cooled pump, described water-cooled delivery side of pump and water cooler import be connected, the outlet of described water cooler is connected with the import of water-cooling head.
Particularly, the upper surface of described conducting strip is fitted by the cold junction face of heat conductive silica gel and described semiconductor chilling plate, and described conducting strip lower surface is fitted by heat conductive silica gel and cpu chip upper surface.Heat conductive silica gel can be effectively can blind, complete the heat transmission at heating position and heat conduction position, also play damping, insulation, the effects such as sealing simultaneously.
As preferentially, described water cooler comprises fan, water-cooled coil pipe, radiating fin and water cooler support, on described water-cooled coil pipe, be welded with described radiating fin, described water-cooled coil pipe is arranged on described water cooler support, described fan is fixed on water cooler support by fan cover, separately water cooler is spun off and can effectively avoid the exothermic temperature in cabinet to assemble, water cooler is arranged on to the position of enclosure wind guide cover.
Further, described water-cooled delivery side of pump is provided with check (non-return) valve, prevents that liquid coolant refluence from causing that the pump housing damages.
Particularly, described silica gel water pipe is imported and exported and is provided with anticreep clip, prevents that excessive the causing of silica gel water pipe internal pressure from coming off.
Beneficial effect of the present invention is:
The present invention can realize CPU active heat removal, utilizes semiconductor refrigerating and Water Cooling Technology to guarantee that cpu temperature maintains at lower temperature, thereby reaches the order ground of quick heat radiating, has that volume is little, lightweight, a compact conformation, radiating efficiency advantages of higher.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of semiconductor water cooling cpu heat of the present invention.
In figure: 1-water-cooling head, 2-CPU chip, 3-conducting strip, 4-semiconductor chilling plate, 5-water-cooled pump, 6-anticreep clip, 7-silica gel water pipe, 8-water cooler, 9-check (non-return) valve, 10-radiating fin, 11-water cooler support, 12-fan, 13-water-cooled coil pipe, 14-bolt, 15-CPU chip pad plate, 16-fan cover.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described:
As shown in Figure 1, the present invention includes conducting strip 3, semiconductor chilling plate 4, water cooler 8, silica gel water pipe 7, water-cooled pump 5 and water-cooling head 1, described conducting strip 3 lower surfaces and cpu chip 2 upper surface laminatings, the cold junction face laminating of the upper surface of conducting strip 3 and semiconductor chilling plate 4, the hot junction face of semiconductor chilling plate 4 and water-cooling head 1 end face laminating, water-cooling head 1 is fixedly connected with cpu chip bedplate 15 by bolt 14 with semiconductor chilling plate 4, the outlet of water-cooling head 1 is connected with the import of water-cooled pump 5, the outlet of water-cooled pump 5 and water cooler 8 import be connected, the outlet of water cooler 8 is connected with the import of water-cooling head 1.
As shown in Figure 1, the upper surface of conducting strip 3 is fitted by the cold junction face of heat conductive silica gel and semiconductor chilling plate 4, and conducting strip 3 lower surfaces are fitted by heat conductive silica gel and cpu chip 2 upper surfaces.Heat conductive silica gel can be effectively can blind, complete the heat transmission at heating position and heat conduction position, also play damping, insulation, the effects such as sealing simultaneously.
As shown in Figure 1, water cooler 8 comprises fan 12, water-cooled coil pipe 13, radiating fin 10 and water cooler support 11, on water-cooled coil pipe 13, be welded with radiating fin 10, water-cooled coil pipe 13 is arranged on water cooler support 11, fan 12 is fixed on water cooler support 11 by fan cover 16, separately water cooler is spun off and can effectively avoid the exothermic temperature in cabinet to assemble, water cooler is arranged on to the position of enclosure wind guide cover.The outlet of water-cooled pump 5 is provided with check (non-return) valve 9, prevents that liquid coolant refluence from causing that the pump housing damages.Silica gel water pipe is imported and exported and is provided with anticreep clip 6, prevents that excessive the causing of silica gel water pipe internal pressure from coming off.
Claims (5)
1. a semiconductor water cooling cpu heat, it is characterized in that: comprise conducting strip, semiconductor chilling plate, water cooler, silica gel water pipe, water-cooled pump and water-cooling head, described conducting strip lower surface and the laminating of cpu chip upper surface, the cold junction face laminating of the upper surface of described conducting strip and described semiconductor chilling plate, the hot junction face of described semiconductor chilling plate and the laminating of described water-cooling head end face, described water-cooling head is fixedly connected with cpu chip bedplate by bolt with described semiconductor chilling plate, the outlet of described water-cooling head is connected with the import of described water-cooled pump, described water-cooled delivery side of pump and water cooler import be connected, the outlet of described water cooler is connected with the import of water-cooling head.
2. a kind of semiconductor water cooling cpu heat according to claim 1, it is characterized in that: the upper surface of described conducting strip is fitted by the cold junction face of heat conductive silica gel and described semiconductor chilling plate, described conducting strip lower surface is fitted by heat conductive silica gel and cpu chip upper surface.
3. a kind of semiconductor water cooling cpu heat according to claim 1, it is characterized in that: described water cooler comprises fan, water-cooled coil pipe, radiating fin and water cooler support, on described water-cooled coil pipe, be welded with described radiating fin, described water-cooled coil pipe is arranged in described water cooler support, and described fan is fixed on water cooler support by fan cover.
4. according to the said a kind of semiconductor water cooling cpu heat of claim 1, it is characterized in that: described water-cooled delivery side of pump is provided with check (non-return) valve.
5. according to the said a kind of semiconductor water cooling cpu heat of claim 1, it is characterized in that: the outlet of the import of described silica gel water pipe and described silica gel water pipe is provided with anticreep clip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210366689.0A CN103699191A (en) | 2012-09-28 | 2012-09-28 | Semiconductor water-cooling central processing unit (CPU) radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210366689.0A CN103699191A (en) | 2012-09-28 | 2012-09-28 | Semiconductor water-cooling central processing unit (CPU) radiator |
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|---|---|
| CN103699191A true CN103699191A (en) | 2014-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210366689.0A Pending CN103699191A (en) | 2012-09-28 | 2012-09-28 | Semiconductor water-cooling central processing unit (CPU) radiator |
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| CN (1) | CN103699191A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104851855A (en) * | 2015-04-27 | 2015-08-19 | 上海理工大学 | Semiconductor liquid-cooling radiator |
| CN105097734A (en) * | 2015-08-25 | 2015-11-25 | 上海理工大学 | Semiconductor liquid-cooling heat radiation device |
| CN106020392A (en) * | 2016-05-11 | 2016-10-12 | 电子科技大学 | Computer water cooling system based on pulsating flow |
| CN106028762A (en) * | 2016-07-19 | 2016-10-12 | 南京工程学院 | Double-cooling comprehensive system for electric car control system |
| CN106155241A (en) * | 2015-04-03 | 2016-11-23 | 深圳市万景华科技有限公司 | Heat abstractor |
| CN106802700A (en) * | 2016-11-28 | 2017-06-06 | 重庆诚硕科技有限公司 | The manufacture method of computer dust cabinet |
| TWI660475B (en) * | 2018-03-30 | 2019-05-21 | 京威科技有限公司 | Water cooling device capable of switching pump circuit |
| CN111309118A (en) * | 2020-03-24 | 2020-06-19 | 河南工业贸易职业学院 | Water-cooling efficient heat dissipation mainboard mechanism for computer |
| CN112732043A (en) * | 2021-02-01 | 2021-04-30 | 范衍琴 | Computer system integrated equipment |
| CN113325936A (en) * | 2021-06-24 | 2021-08-31 | 新疆农业大学 | Quick cold type heat sink of CPU frost |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
| CN2532524Y (en) * | 2002-03-04 | 2003-01-22 | 方宋玉 | Refrigerator for CPU |
| CN2569218Y (en) * | 2002-09-13 | 2003-08-27 | 张高祥 | Heat radiator of closed micro computer host casing |
| WO2005060370A2 (en) * | 2003-12-15 | 2005-07-07 | Nanocoolers, Inc. | Cooling of high power density devices by electrically conducting fluids |
| US20090154104A1 (en) * | 2007-12-14 | 2009-06-18 | Yoshihiro Kondo | Cooling Device and Electronic Apparatus Using the Same |
-
2012
- 2012-09-28 CN CN201210366689.0A patent/CN103699191A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
| CN2532524Y (en) * | 2002-03-04 | 2003-01-22 | 方宋玉 | Refrigerator for CPU |
| CN2569218Y (en) * | 2002-09-13 | 2003-08-27 | 张高祥 | Heat radiator of closed micro computer host casing |
| WO2005060370A2 (en) * | 2003-12-15 | 2005-07-07 | Nanocoolers, Inc. | Cooling of high power density devices by electrically conducting fluids |
| US20090154104A1 (en) * | 2007-12-14 | 2009-06-18 | Yoshihiro Kondo | Cooling Device and Electronic Apparatus Using the Same |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106155241A (en) * | 2015-04-03 | 2016-11-23 | 深圳市万景华科技有限公司 | Heat abstractor |
| CN104851855A (en) * | 2015-04-27 | 2015-08-19 | 上海理工大学 | Semiconductor liquid-cooling radiator |
| CN105097734A (en) * | 2015-08-25 | 2015-11-25 | 上海理工大学 | Semiconductor liquid-cooling heat radiation device |
| CN106020392A (en) * | 2016-05-11 | 2016-10-12 | 电子科技大学 | Computer water cooling system based on pulsating flow |
| CN106020392B (en) * | 2016-05-11 | 2019-05-07 | 电子科技大学 | A kind of computer water-cooling system based on Pulsating Flow |
| CN106028762A (en) * | 2016-07-19 | 2016-10-12 | 南京工程学院 | Double-cooling comprehensive system for electric car control system |
| CN106028762B (en) * | 2016-07-19 | 2018-03-27 | 南京工程学院 | A kind of double cooling integrated systems for electric vehicle control system |
| CN106802700A (en) * | 2016-11-28 | 2017-06-06 | 重庆诚硕科技有限公司 | The manufacture method of computer dust cabinet |
| TWI660475B (en) * | 2018-03-30 | 2019-05-21 | 京威科技有限公司 | Water cooling device capable of switching pump circuit |
| CN111309118A (en) * | 2020-03-24 | 2020-06-19 | 河南工业贸易职业学院 | Water-cooling efficient heat dissipation mainboard mechanism for computer |
| CN112732043A (en) * | 2021-02-01 | 2021-04-30 | 范衍琴 | Computer system integrated equipment |
| CN113325936A (en) * | 2021-06-24 | 2021-08-31 | 新疆农业大学 | Quick cold type heat sink of CPU frost |
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Application publication date: 20140402 |