CN202975946U - Semiconductor water cooling CPU heat radiator - Google Patents
Semiconductor water cooling CPU heat radiator Download PDFInfo
- Publication number
- CN202975946U CN202975946U CN 201220499822 CN201220499822U CN202975946U CN 202975946 U CN202975946 U CN 202975946U CN 201220499822 CN201220499822 CN 201220499822 CN 201220499822 U CN201220499822 U CN 201220499822U CN 202975946 U CN202975946 U CN 202975946U
- Authority
- CN
- China
- Prior art keywords
- water
- water cooling
- cpu
- semiconductor
- silica gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 63
- 238000001816 cooling Methods 0.000 title claims abstract description 38
- 239000004065 semiconductor Substances 0.000 title claims abstract description 33
- 239000000741 silica gel Substances 0.000 claims abstract description 19
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 230000008676 import Effects 0.000 claims description 10
- 230000005855 radiation Effects 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000005057 refrigeration Methods 0.000 abstract 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a semiconductor water cooling CPU heat radiator, which comprises a heat conducting sheet, a semiconductor refrigeration sheet, a water cooler, a silica gel water pipe, a water cooling pump and a water cooling head, wherein the lower surface of the heat conducting sheet is clung to the upper surface of a CPU chip; the upper surface of the heat conducting sheet is clung to the cold end surface of the semiconductor refrigeration sheet; the hot end surface of the semiconductor refrigeration sheet is clung to the end surface of the water cooling head; the water cooling head is fixedly connected with a base plate of the CPU chip via bolts; the outlet of the water cooling head is connected with the inlet of a water cooling pump; the outlet of the water cooling pump is connected with the inlet of the water cooler; and the outlet of the water cooler is connected with the inlet of the water cooling head. The semiconductor water cooling CPU heat radiator can achieve the active heat radiation of a CPU, ensures that the temperature of the CPU keeps a lower value by utilizing a semiconductor refrigeration and water cooling technology, so that the purpose of quick heat radiation is achieved, and the CPU heat radiator has the advantages of small size, light weight, impact structure, high heat radiation efficiency.
Description
Technical field
The utility model relates to a kind of heating radiator, relates in particular to a kind of semiconductor water cooling cpu heat.
Background technology
CPU (central processing unit) is the main parts in computing machine, is also simultaneously maximum heater members (power reaches 100 watts of left and right), so, need to effectively dispel the heat to CPU.Known cpu heat belongs to passive heat radiation mostly, cabinet can only be reduced to environment temperature at most, utilize fan that the heat of heat radiator is blown away by the air that flows, too high if there is environment temperature or draw badly situation, the temperature of CPU is easily assembled rising, affects its work efficiency, and fan long-play rotating speed reduces, control of dust easily occurs, noise becomes large phenomenon.
Summary of the invention
The purpose of this utility model just is to provide in order to address the above problem a kind of active heat removal, semiconductor water cooling cpu heat that radiating efficiency is high.
The utility model is achieved through the following technical solutions above-mentioned purpose:
the utility model comprises conducting strip, semiconductor chilling plate, water cooler, the silica gel water pipe, water-cooled pump and water-cooling head, described conducting strip lower surface and cpu chip upper surface are fitted, the cold junction face of the upper surface of described conducting strip and described semiconductor chilling plate is fitted, the hot junction face of described semiconductor chilling plate and described water-cooling head end face are fitted, described water-cooling head is fixedly connected with the cpu chip bedplate by bolt with described semiconductor chilling plate, the outlet of described water-cooling head is connected with the import of described water-cooled pump, described water-cooled delivery side of pump and water cooler import be connected, the outlet of described water cooler is connected with the import of water-cooling head.
Particularly, the upper surface of described conducting strip is fitted by the cold junction face of heat conductive silica gel and described semiconductor chilling plate, and described conducting strip lower surface is fitted by heat conductive silica gel and cpu chip upper surface.Heat conductive silica gel can be effectively can blind, complete the heat transmission at heating position and heat conduction position, also play simultaneously damping, insulation, the effects such as sealing.
As preferentially, described water cooler comprises fan, water-cooled coil pipe, radiating fin and water cooler support, be welded with described radiating fin on described water-cooled coil pipe, described water-cooled coil pipe is arranged on described water cooler support, described fan is fixed on the water cooler support by fan cover, separately water cooler is spun off and effectively to avoid the exothermic temperature in cabinet to assemble, water cooler is arranged on the position of enclosure wind guide cover.
Further, described water-cooled delivery side of pump is provided with check (non-return) valve, prevents that the liquid coolant refluence from causing that the pump housing damages.
Particularly, described silica gel water pipe is imported and exported and is provided with the anticreep clip, prevents that excessive the causing of silica gel water pipe internal pressure from coming off.
The beneficial effects of the utility model are:
The utility model can be realized the CPU active heat removal, utilizes semiconductor refrigerating and Water Cooling Technology to guarantee that cpu temperature maintains at lower temperature, thereby reaches the order ground of quick heat radiating, has that volume is little, lightweight, a compact conformation, radiating efficiency advantages of higher.
Description of drawings
Fig. 1 is the structural representation of a kind of semiconductor water cooling cpu heat described in the utility model.
In figure: 1-water-cooling head, 2-CPU chip, 3-conducting strip, the 4-semiconductor chilling plate, 5-water-cooled pump, 6-anticreep clip, 7-silica gel water pipe, 8-water cooler, 9-check (non-return) valve, the 10-radiating fin, 11-water cooler support, 12-fan, 13-water-cooled coil pipe, the 14-bolt, 15-CPU chip pad plate, 16-fan cover.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing:
as shown in Figure 1, the utility model comprises conducting strip 3, semiconductor chilling plate 4, water cooler 8, silica gel water pipe 7, water-cooled pump 5 and water-cooling head 1, described conducting strip 3 lower surfaces and cpu chip 2 upper surfaces are fitted, the cold junction face of the upper surface of conducting strip 3 and semiconductor chilling plate 4 is fitted, the hot junction face of semiconductor chilling plate 4 and water-cooling head 1 end face are fitted, water-cooling head 1 is fixedly connected with cpu chip bedplate 15 by bolt 14 with semiconductor chilling plate 4, the outlet of water-cooling head 1 is connected with the import of water-cooled pump 5, the outlet of water-cooled pump 5 and water cooler 8 import be connected, the outlet of water cooler 8 is connected with the import of water-cooling head 1.
As shown in Figure 1, the upper surface of conducting strip 3 is fitted by the cold junction face of heat conductive silica gel and semiconductor chilling plate 4, and conducting strip 3 lower surfaces are fitted by heat conductive silica gel and cpu chip 2 upper surfaces.Heat conductive silica gel can be effectively can blind, complete the heat transmission at heating position and heat conduction position, also play simultaneously damping, insulation, the effects such as sealing.
As shown in Figure 1, water cooler 8 comprises fan 12, water-cooled coil pipe 13, radiating fin 10 and water cooler support 11, be welded with radiating fin 10 on water-cooled coil pipe 13, water-cooled coil pipe 13 is arranged on water cooler support 11, fan 12 is fixed on water cooler support 11 by fan cover 16, separately water cooler is spun off and effectively to avoid the exothermic temperature in cabinet to assemble, water cooler is arranged on the position of enclosure wind guide cover.The outlet of water-cooled pump 5 is provided with check (non-return) valve 9, prevents that the liquid coolant refluence from causing that the pump housing damages.The silica gel water pipe is imported and exported and is provided with anticreep clip 6, prevents that excessive the causing of silica gel water pipe internal pressure from coming off.
Claims (5)
1. semiconductor water cooling cpu heat, it is characterized in that: comprise conducting strip, semiconductor chilling plate, water cooler, the silica gel water pipe, water-cooled pump and water-cooling head, described conducting strip lower surface and cpu chip upper surface are fitted, the cold junction face of the upper surface of described conducting strip and described semiconductor chilling plate is fitted, the hot junction face of described semiconductor chilling plate and described water-cooling head end face are fitted, described water-cooling head is fixedly connected with the cpu chip bedplate by bolt with described semiconductor chilling plate, the outlet of described water-cooling head is connected with the import of described water-cooled pump, described water-cooled delivery side of pump and water cooler import be connected, the outlet of described water cooler is connected with the import of water-cooling head.
2. a kind of semiconductor water cooling cpu heat according to claim 1, it is characterized in that: the upper surface of described conducting strip is fitted by the cold junction face of heat conductive silica gel and described semiconductor chilling plate, and described conducting strip lower surface is fitted by heat conductive silica gel and cpu chip upper surface.
3. a kind of semiconductor water cooling cpu heat according to claim 1, it is characterized in that: described water cooler comprises fan, water-cooled coil pipe, radiating fin and water cooler support, be welded with described radiating fin on described water-cooled coil pipe, described water-cooled coil pipe is arranged in described water cooler support, and described fan is fixed on the water cooler support by fan cover.
4. said a kind of semiconductor water cooling cpu heat according to claim 1, it is characterized in that: described water-cooled delivery side of pump is provided with check (non-return) valve.
5. said a kind of semiconductor water cooling cpu heat according to claim 1, it is characterized in that: the outlet of the import of described silica gel water pipe and described silica gel water pipe is provided with the anticreep clip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220499822 CN202975946U (en) | 2012-09-28 | 2012-09-28 | Semiconductor water cooling CPU heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220499822 CN202975946U (en) | 2012-09-28 | 2012-09-28 | Semiconductor water cooling CPU heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202975946U true CN202975946U (en) | 2013-06-05 |
Family
ID=48516998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220499822 Expired - Fee Related CN202975946U (en) | 2012-09-28 | 2012-09-28 | Semiconductor water cooling CPU heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202975946U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108681381A (en) * | 2018-05-24 | 2018-10-19 | 黑龙江工业学院 | A kind of computer high speed circulation radiator |
| CN110137146A (en) * | 2019-04-30 | 2019-08-16 | 东南大学 | A kind of fractal runner liquid cooling apparatus |
| CN110634650A (en) * | 2019-10-07 | 2019-12-31 | 沛县恒瑞电子厂 | Transformer mounting seat with heat dissipation effect |
-
2012
- 2012-09-28 CN CN 201220499822 patent/CN202975946U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108681381A (en) * | 2018-05-24 | 2018-10-19 | 黑龙江工业学院 | A kind of computer high speed circulation radiator |
| CN108681381B (en) * | 2018-05-24 | 2021-02-09 | 黑龙江工业学院 | A high-speed flow cooling device for a computer |
| CN110137146A (en) * | 2019-04-30 | 2019-08-16 | 东南大学 | A kind of fractal runner liquid cooling apparatus |
| CN110634650A (en) * | 2019-10-07 | 2019-12-31 | 沛县恒瑞电子厂 | Transformer mounting seat with heat dissipation effect |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103699191A (en) | Semiconductor water-cooling central processing unit (CPU) radiator | |
| CN202887086U (en) | Side-blown water-cooled central processing unit (CPU) radiator | |
| CN104571377A (en) | Heat radiation computer case | |
| CN202975946U (en) | Semiconductor water cooling CPU heat radiator | |
| CN202948389U (en) | Semiconductor central processing unit (CPU) radiator | |
| CN107844176A (en) | Passive heat dissipation type water cooling cabinet | |
| CN202978042U (en) | Water cooling heat radiation system of power distribution cabinet | |
| CN103855630A (en) | Power distribution cabinet heat-dissipation system | |
| CN205139817U (en) | Liquid cooling machine case | |
| CN201407147Y (en) | Cooling device of vacuum pump | |
| CN202771361U (en) | Circulating liquid-cooled server cooling system | |
| CN202368640U (en) | Steering system of vehicle | |
| CN202971113U (en) | Air cooling device on air compressor | |
| CN104384672A (en) | Intelligent high-efficiency cooling machine | |
| CN201251324Y (en) | Air-conditioner outdoor unit heat exchanger | |
| CN209546207U (en) | A cooling electrical cabinet | |
| CN208421688U (en) | A kind of radiator for computer water-cooling | |
| CN106766346B (en) | Circulating water-cooled heat dissipation semiconductor refrigerating system | |
| CN201674744U (en) | A new cooling device for air conditioner frequency conversion module | |
| CN209419408U (en) | A liquid-cooled heat sink | |
| CN206343751U (en) | A kind of radiator of contravariant carbon dioxide gas arc welding and manual double-purpose welding machine | |
| CN214007307U (en) | A high-efficiency heat dissipation and high temperature resistant generator set | |
| CN202718746U (en) | Radiator for big-power tractor | |
| CN101667464A (en) | Novel high-power cooling module integrating air cooling, water cooling and electronic cooling | |
| CN206774522U (en) | A kind of chip heat radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130605 Termination date: 20130928 |