CN112732043A - Computer system integrated equipment - Google Patents
Computer system integrated equipment Download PDFInfo
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- CN112732043A CN112732043A CN202110134002.XA CN202110134002A CN112732043A CN 112732043 A CN112732043 A CN 112732043A CN 202110134002 A CN202110134002 A CN 202110134002A CN 112732043 A CN112732043 A CN 112732043A
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
- G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/26—Drying gases or vapours
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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Abstract
The invention relates to the technical field of computers, in particular to a computer system integration device, which comprises a box body, wherein a first partition plate is arranged at the upper part in the box body, and divides an inner cavity of the box body into a first air duct at the upper part and an integration cavity at the lower part; the bottom in the integrated cavity is provided with a mounting seat for mounting integrated equipment, and the left side wall of the integrated cavity is provided with a plurality of groups of heat dissipation holes communicated with the outside; an air inlet is formed in the box body on the left side of the first air channel, an air outlet is formed in the box body on the right side of the first air channel, and a fan is arranged in the air outlet; according to the invention, the first partition plate is rapidly cooled by using a convection mode, so that cooling heat exchange above the integrated cavity is realized, the integral heat dissipation effect is improved under the condition of avoiding ash falling, and the problem that the service life is influenced due to the accumulation of a large amount of heat of integrated equipment is avoided.
Description
Technical Field
The invention relates to the technical field of computers, in particular to a computer system integration device.
Background
Big data, which refers to a data set that cannot be captured, managed and processed by a conventional software tool within a certain time range, is a massive, high-growth-rate and diversified information asset that needs a new processing mode to have stronger decision-making power, insight discovery power and process optimization capability.
In the process of processing big data, a plurality of integrated devices are needed to be used for respectively finishing different works, and in the process of working the big data integrated devices, the devices can generate heat to different degrees due to long-time work.
The existing heat dissipation mode of some big data integration devices is to dissipate heat through a single heat dissipation hole, but after the heat is accumulated in a large amount, the heat dissipation effect is greatly reduced, the condition that the heat is accumulated in a large amount in the device is caused, and the service life of the device is influenced.
Therefore, the computer system integration equipment provided by the application utilizes a convection mode to realize rapid cooling of the first partition plate, further realizes cooling and heat exchange above the integration cavity, improves the overall heat dissipation effect under the condition of avoiding ash falling, and therefore avoids the problem that the heat accumulation of the integration equipment greatly influences the service life.
Disclosure of Invention
In order to make up for the defects of the prior art and solve the problems that the heat dissipation effect of the existing computer system integration equipment is greatly reduced after a large amount of heat is accumulated due to the fact that heat is accumulated in the equipment in a large amount and the service life of the equipment is influenced, the invention provides the computer system integration equipment.
The technical scheme adopted by the invention for solving the technical problems is as follows: the computer system integration equipment comprises a box body, wherein a first partition plate is arranged at the upper part in the box body, and divides an inner cavity of the box body into an upper first air duct and a lower integration cavity; the bottom in the integrated cavity is provided with a mounting seat for mounting integrated equipment, and the left side wall of the integrated cavity is provided with a plurality of groups of heat dissipation holes communicated with the outside; the air inlet is formed in the box body on the left side of the first air channel, the air outlet is formed in the box body on the right side of the first air channel, and the fan is arranged in the air outlet.
When the heat dissipation device is used, through the arrangement of the heat dissipation holes, a part of hot air in the integrated cavity can be discharged through the heat dissipation holes, and the purpose of heat dissipation is further achieved; through set up the level to the first wind channel of arranging above the cavity, can make the external air get into first wind channel from the air intake through the intraoral fan of airing exhaust to form the air current in first wind channel, utilize the mode of convection current to realize the quick cooling of first baffle, and then realize the cooling heat transfer to the cavity top, improved its holistic radiating effect under the circumstances of avoiding falling the ash, consequently avoid the problem that the large amount of accumulations of integrated equipment heat lead to influencing life.
Preferably, a plurality of inclined holes communicated with the first air duct and the integrated cavity are formed in the first partition plate, and the inclined holes are obliquely arranged towards one side of the air outlet. Through the setting of inclined hole, because can form high-speed air current in first wind channel when the fan starts, consequently can form the negative pressure in inclined hole department, and then can directly take the hot-air in integrated cavity out, reach quick radiating purpose, improved its radiating effect greatly, hot-air itself is lighter in addition, even consequently when the fan trouble, hot-air also can shift up automatically and follow the inclined hole and then first wind channel and discharge, consequently guaranteed radiating stability.
Preferably, a plurality of heat dissipation fins which are obliquely arranged towards one side of the air outlet are arranged on two sides of the inclined hole in the first air duct. Through the setting of the heat dissipation fin that the slope was arranged, on the one hand, can increase the actual heat radiating area of first baffle through the heat dissipation fin, and then increase the radiating effect, on the other hand, can reduce the latus rectum that is located the first wind channel of inclined hole department through the heat dissipation fin, and then form the throat, be favorable to the formation of negative pressure, and then can take out the hot-air in integrated cavity fast, reach rapid cooling's purpose.
Preferably, a second partition plate is arranged between the first partition plate and the bottom of the integrated cavity at the left part in the integrated cavity, a space between the second partition plate and the left side wall of the box body forms a second air duct, and a drying device is arranged in the second air duct; the lower side of the second partition plate is provided with a communication hole which is arranged towards the mounting seat, and the communication hole is communicated with the second air duct and the integrated cavity. Through the arrangement of the second partition plate, a second air channel is formed, and when external cold air enters from the second air channel, pre-heat exchange can be carried out through the second partition plate, so that the heat exchange stroke is prolonged, and more heat can be taken away; meanwhile, the air flow can be guided to the mounting seat through the second partition plate, the air flow speed of the mounting seat is improved, the heat dissipation effect is improved, and heat accumulation at the mounting seat can be reduced.
Preferably, a baffle is hinged to the position, located at the air inlet, in the first air duct, and the baffle is connected with the upper side wall of the first air duct through a spring; the fan is a forward and reverse rotation axial flow fan, the baffle can open the air inlet when the fan rotates forwards and close the air inlet when the fan rotates reversely. Through the setting of baffle, can open the air intake when the fan corotation, realize taking out the purpose of integrated intracavity hot-air, can close the air intake when the fan reversal simultaneously again, utilize the fan to the interior blast air of first wind channel, realize that the air discharges from the louvre after first wind channel, inclined hole, integrated chamber, intercommunicating pore and second wind channel in proper order, carry out the blowback to the louvre, avoid the louvre to fill the time and use the problem that leads to the dust to block up.
Preferably, a second partition plate is arranged between the first partition plate and the bottom of the integration cavity at the right part in the integration cavity, a heat exchange cavity is formed by a space between the second partition plate and the right side wall of the box body, a semiconductor refrigeration piece is arranged on the third partition plate, the cold end of the semiconductor refrigeration piece is positioned in the integration cavity, and the hot end of the semiconductor refrigeration piece is positioned in the heat exchange cavity; the heat exchange cavity is further provided with a heat exchange tube, one end of the heat exchange tube is connected with a water outlet pipe, one end of the heat exchange tube is connected with an output end of a liquid pump fixed outside the box body, and an input end of the liquid pump is provided with a water inlet pipe. The cooling of integrated components in the integrated cavity is realized by only integrating air in the cavity between the cold ends of the semiconductor refrigeration sheets, meanwhile, heat is led out from the semiconductor refrigeration sheets to the heat exchange cavity, and the heat is led out by using circulating cooling water in the heat exchange tube, so that the purpose of forced cooling is achieved; through drying device's setting, can get rid of the air moisture that gets into integrated intracavity, avoid hot-air cold junction condensation at the semiconductor refrigeration piece to lead to the water droplet to produce and then damage the condition of integrated equipment.
The invention has the following beneficial effects:
1. according to the computer system integration equipment, the first partition plate is rapidly cooled in a convection mode, so that cooling heat exchange above the integration cavity is realized, the integral heat dissipation effect is improved under the condition of avoiding ash falling, and the problem that the service life of the integration equipment is influenced due to large heat accumulation is solved.
2. According to the computer system integration equipment, only air in the cavity can be integrated between the cold ends of the semiconductor refrigeration sheets, so that cooling between integrated components in the cavity is realized, heat is led out from the semiconductor refrigeration sheets to the heat exchange cavity, and the heat is led out by using circulating cooling water in the heat exchange pipe, so that the purpose of forced cooling is achieved; through drying device's setting, can get rid of the air moisture that gets into integrated intracavity, avoid hot-air cold junction condensation at the semiconductor refrigeration piece to lead to the water droplet to produce and then damage the condition of integrated equipment.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a cross-sectional view in one direction of the connecting rod of the present invention;
fig. 3 is a partially enlarged view of a portion a in fig. 2.
In the figure:
1. a box body; 2. an air inlet; 3. heat dissipation holes; 4. an air outlet; 5. a water outlet pipe; 6. a liquid pump; 7. a water inlet pipe; 8. a first separator; 9. a first air duct; 10. an integrated cavity; 11. a second separator; 12. a second air duct; 13. an inclined hole; 14. a heat dissipating fin; 15. a baffle plate; 16. a spring; 17. a third partition plate; 18. a semiconductor refrigeration sheet; 19. a heat exchange cavity; 20. a heat exchange pipe; 21. a fan; 22. a mounting seat; 23. a communicating hole; 24. and (7) a drying device.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1 to 3, an integrated device for a computer system includes a box 1, wherein a first partition plate 8 is disposed at an upper portion in the box 1, and the first partition plate 8 divides an inner cavity of the box 1 into an upper first air duct 9 and a lower integrated cavity 10; the bottom in the integrated cavity 10 is provided with a mounting seat 22 for mounting integrated equipment, and the left side wall of the integrated cavity 10 is provided with a plurality of groups of heat dissipation holes 3 communicated with the outside; an air inlet 2 is formed in the box body 1 on the left side of the first air duct 9, an air outlet 4 is formed in the box body 1 on the right side of the first air duct 9, and a fan 21 is arranged in the air outlet 4.
When in use, through the arrangement of the heat dissipation holes 3, a part of hot air in the integrated cavity 10 can be discharged through the heat dissipation holes 3, so that the purpose of heat dissipation is achieved; through set up the level to the first wind channel 9 of arranging above the cavity 10, can make the outside air get into in the first wind channel 9 from air intake 2 through fan 21 in the air exit 4, and form the air current in first wind channel 9, utilize the mode of convection current to realize the quick cooling of first baffle 8, and then realize the cooling heat transfer to the cavity 10 top, improved its holistic radiating effect under the circumstances of avoiding falling the ash, consequently avoid the problem that the heat of integrated equipment is gathered in a large number and is leaded to influencing life.
As an alternative embodiment, the first partition 8 is provided with a plurality of inclined holes 13 communicating the first air duct 9 and the integrated cavity 10, and the inclined holes 13 are obliquely arranged towards the air outlet 4 side. Through the setting of inclined hole 13, because fan 21 can form high velocity air in first wind channel 9 when starting, consequently can form the negative pressure in inclined hole 13 department, and then can directly take out the hot-air of collecting cavity 10, reach quick radiating purpose, its radiating effect has been improved greatly, hot-air itself is lighter in addition, even consequently when fan 21 trouble, hot-air also can move up automatically and follow inclined hole 13 and then first wind channel 9 and discharge, consequently radiating stability has been guaranteed.
As an alternative embodiment, a plurality of heat dissipation fins 14 are disposed in the first air duct 9 on both sides of the inclined hole 13 and inclined toward one side of the air outlet 4. Through the setting of the heat dissipation fin 14 that the slope was arranged, on the one hand, can increase the actual heat radiating area of first baffle 8 through heat dissipation fin 14, and then increase the radiating effect, on the other hand, can reduce the latus rectum that is located the first wind channel 9 of inclined hole 13 department through heat dissipation fin 14, and then form the throat, be favorable to the formation of negative pressure, and then can take out the hot-air of integrated cavity 10 fast, reach rapid cooling's purpose.
As an optional implementation manner, a second partition plate 11 is arranged between the first partition plate 8 and the bottom of the integrated cavity 10 at the left part in the integrated cavity 10, a space between the second partition plate 11 and the left side wall of the box body 1 forms a second air duct 12, and a drying device 24 is arranged in the second air duct 12; the lower side of the second partition plate 11 is provided with a communication hole 23 arranged towards the mounting seat 22, and the communication hole 23 is communicated with the second air duct 12 and the integrated cavity 10. Through the arrangement of the second partition plate 11, the second air duct 12 is formed, and when external cold air enters from the second air duct 12, pre-heat exchange can be carried out through the second partition plate 11, so that the heat exchange stroke is prolonged, and more heat can be taken away; meanwhile, the air flow can be guided to the mounting seat 22 through the second partition plate 11, the air flow speed at the mounting seat 22 is improved, the heat dissipation effect is improved, and heat accumulation at the mounting seat 22 can be reduced.
As an optional embodiment, a baffle 15 is hinged to the position, located at the air inlet 2, inside the first air duct 9, and the baffle 15 is connected with the upper side wall of the first air duct 9 through a spring 16; the fan 21 is a forward and reverse rotation axial flow fan 21, the baffle 15 can open the air inlet 2 when the fan 21 rotates forward, and close the air inlet 2 when the fan 21 rotates reversely. Through the setting of baffle 15, can open air intake 2 when fan 21 corotation, the realization is taken out the purpose of the hot-air in integrated cavity 10, can close air intake 2 when fan 21 reversal simultaneously again, utilize fan 21 to blow air in the first wind channel 9, realize that the air discharges from louvre 3 behind first wind channel 9, inclined hole 13, integrated cavity 10, intercommunicating pore 23 and second wind channel 12 in proper order, carry out the blowback to louvre 3, avoid louvre 3 to fill the time use and lead to the problem of dust jam.
As an optional implementation manner, a second partition plate 11 is arranged between the first partition plate 8 and the bottom of the integrated cavity 10 at the right part in the integrated cavity 10, a heat exchange cavity 19 is formed by a space between the second partition plate 11 and the right side wall of the box body 1, a semiconductor chilling plate 18 is arranged on the third partition plate 17, the cold end of the semiconductor chilling plate 18 is arranged in the integrated cavity 10, and the hot end of the semiconductor chilling plate 18 is arranged in the heat exchange cavity 19; the heat exchange cavity 19 is further provided with a heat exchange tube 20, one end of the heat exchange tube 20 is connected with the water outlet pipe 5, one end of the heat exchange tube 20 is connected with the output end of a liquid pump 6 fixed outside the box body 1, and the input end of the liquid pump 6 is provided with a water inlet pipe 7. Only air in the cavity 10 can be integrated between the cold ends of the semiconductor refrigerating fins 18, so that the temperature reduction among the integrated components in the cavity 10 is realized, meanwhile, heat is led out from the semiconductor refrigerating fins to the heat exchange cavity 19, and the heat is led out by using circulating cooling water in the heat exchange tube 20, so that the purpose of forced temperature reduction is achieved; through the setting of drying device 24, can get rid of the air moisture that gets into in the integrated chamber 10, avoid hot-air to lead to the water droplet to produce and then damage the condition of integrated equipment at the cold junction condensation of semiconductor refrigeration piece 18.
When in use, through the arrangement of the heat dissipation holes 3, a part of hot air in the integrated cavity 10 can be discharged through the heat dissipation holes 3, so that the purpose of heat dissipation is achieved; by arranging the first air duct 9 horizontally arranged above the integrated cavity 10, outside air can enter the first air duct 9 from the air inlet 2 through the fan 21 in the air outlet 4, air flow is formed in the first air duct 9, the first partition plate 8 is rapidly cooled by utilizing a convection mode, cooling and heat exchange above the integrated cavity 10 are further realized, the integral heat dissipation effect is improved under the condition of avoiding ash falling, and the problem that the service life is influenced due to the large accumulation of heat of the integrated equipment is solved; through the arrangement of the inclined hole 13, because the fan 21 can form high-speed airflow in the first air duct 9 when being started, negative pressure can be formed at the inclined hole 13, and then hot air in the integrated cavity 10 can be directly pumped out, so that the purpose of rapid heat dissipation is achieved, the heat dissipation effect is greatly improved, and in addition, the hot air is light, so that even if the fan 21 fails, the hot air can automatically move upwards and is discharged from the inclined hole 13 and the first air duct 9, and the stability of heat dissipation is ensured; through the arrangement of the heat dissipation fins 14 which are arranged in an inclined mode, on one hand, the actual heat dissipation area of the first partition plate 8 can be increased through the heat dissipation fins 14, and then the heat dissipation effect is increased, on the other hand, the drift diameter of the first air duct 9 located at the inclined hole 13 can be reduced through the heat dissipation fins 14, and then a throat part is formed, negative pressure is favorably formed, hot air in the integrated cavity 10 can be rapidly pumped out, and the purpose of rapid cooling is achieved; through the arrangement of the second partition plate 11, the second air duct 12 is formed, and when external cold air enters from the second air duct 12, pre-heat exchange can be carried out through the second partition plate 11, so that the heat exchange stroke is prolonged, and more heat can be taken away; meanwhile, the second partition plate 11 can also guide the airflow to the mounting seat 22, so that the airflow speed at the mounting seat 22 is improved, the heat dissipation effect is improved, and the heat accumulation at the mounting seat 22 can be reduced; through the arrangement of the baffle 15, the air inlet 2 can be opened when the fan 21 rotates forwards, the purpose of pumping hot air in the integrated cavity 10 is achieved, meanwhile, the air inlet 2 can be closed when the fan 21 rotates backwards, air is blown into the first air channel 9 by the fan 21, the air is discharged from the heat dissipation holes 3 after sequentially passing through the first air channel 9, the inclined holes 13, the integrated cavity 10, the communication holes 23 and the second air channel 12, the heat dissipation holes 3 are subjected to back blowing, and the problem of dust blockage caused by the fact that the heat dissipation holes 3 are charged for a long time is solved; only air in the cavity 10 can be integrated between the cold ends of the semiconductor refrigerating fins 18, so that the temperature reduction among the integrated components in the cavity 10 is realized, meanwhile, heat is led out from the semiconductor refrigerating fins to the heat exchange cavity 19, and the heat is led out by using circulating cooling water in the heat exchange tube 20, so that the purpose of forced temperature reduction is achieved; through the setting of drying device 24, can get rid of the air moisture that gets into in the integrated chamber 10, avoid hot-air to lead to the water droplet to produce and then damage the condition of integrated equipment at the cold junction condensation of semiconductor refrigeration piece 18.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The computer system integration equipment is characterized by comprising a box body (1), wherein a first partition plate (8) is arranged at the upper part in the box body (1), and the first partition plate (8) divides an inner cavity of the box body (1) into an upper first air duct (9) and a lower integration cavity (10); a mounting seat (22) for mounting integrated equipment is arranged at the bottom in the integrated cavity (10), and a plurality of groups of heat dissipation holes (3) communicated with the outside are formed in the left side wall of the integrated cavity (10); be provided with air intake (2) on box (1) on first wind channel (9) left side, be provided with air exit (4) on box (1) on first wind channel (9) right side, be provided with fan (21) in air exit (4).
2. The computer system integration apparatus according to claim 1, wherein the first partition (8) is provided with a plurality of inclined holes (13) for communicating the first air duct (9) and the integration chamber (10), and the inclined holes (13) are arranged obliquely toward the air outlet (4).
3. The computer system integration apparatus according to claim 2, wherein a plurality of heat dissipation fins (14) are disposed in the first air duct (9) at two sides of the inclined hole (13) and inclined toward one side of the air outlet (4).
4. The computer system integration device according to claim 3, wherein a second partition plate (11) is arranged in the left part of the integration cavity (10) between the first partition plate (8) and the bottom of the integration cavity (10), a second air duct (12) is formed by a space between the second partition plate (11) and the left side wall of the box body (1), and a drying device (24) is arranged in the second air duct (12); the lower side of the second partition plate (11) is provided with a communication hole (23) which is arranged towards the mounting seat (22), and the communication hole (23) is communicated with the second air duct (12) and the integrated cavity (10).
5. The computer system integration device according to claim 4, wherein a baffle (15) is hinged inside the first air duct (9) at the air inlet (2), and the baffle (15) is connected with the upper side wall of the first air duct (9) through a spring (16); the fan (21) is a forward and reverse rotation axial flow fan (21), the baffle (15) can open the air inlet (2) when the fan (21) rotates forward and close the air inlet (2) when the fan (21) rotates reversely.
6. The computer system integration device according to claim 5, wherein a second partition plate (11) is arranged in the right part of the integration cavity (10) between the first partition plate (8) and the bottom of the integration cavity (10), a heat exchange cavity (19) is formed by a space between the second partition plate (11) and the right side wall of the box body (1), a semiconductor chilling plate (18) is arranged on the third partition plate (17), the cold end of the semiconductor chilling plate (18) is arranged in the integration cavity (10), and the hot end of the semiconductor chilling plate (18) is arranged in the heat exchange cavity (19); the heat exchange cavity (19) is further provided with a heat exchange tube (20), one end of the heat exchange tube (20) is connected with the water outlet tube (5), one end of the heat exchange tube (20) is connected with an output end of a liquid pump (6) fixed outside the box body (1), and an input end of the liquid pump (6) is provided with a water inlet tube (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110134002.XA CN112732043A (en) | 2021-02-01 | 2021-02-01 | Computer system integrated equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110134002.XA CN112732043A (en) | 2021-02-01 | 2021-02-01 | Computer system integrated equipment |
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| CN112732043A true CN112732043A (en) | 2021-04-30 |
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| CN202110134002.XA Withdrawn CN112732043A (en) | 2021-02-01 | 2021-02-01 | Computer system integrated equipment |
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| CN (1) | CN112732043A (en) |
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| US20190116688A1 (en) * | 2017-10-12 | 2019-04-18 | Dell Products, Lp | Information Handling System with Increased Air Velocity to Cool Internal Components |
| CN110531836A (en) * | 2018-05-24 | 2019-12-03 | 技嘉科技股份有限公司 | Radiator for radiating to pyrotoxin |
| CN208298107U (en) * | 2018-05-25 | 2018-12-28 | 兰州工业学院 | A kind of tower cooling cabinet of novel computer |
| WO2020059398A1 (en) * | 2018-09-19 | 2020-03-26 | 富士フイルム株式会社 | Projection device and method for controlling same |
| CN110262645A (en) * | 2019-06-25 | 2019-09-20 | 河南工业职业技术学院 | A kind of computer heat radiating device that can be automatically controled |
| CN210691189U (en) * | 2019-09-30 | 2020-06-05 | 欧丰林 | Computer with waterproof function |
| CN111459256A (en) * | 2020-02-20 | 2020-07-28 | 咸宁职业技术学院 | Convection type computer host heat dissipation device |
| CN211529107U (en) * | 2020-03-13 | 2020-09-18 | 郑州电力职业技术学院 | Computer heat abstractor |
| CN112105224A (en) * | 2020-09-03 | 2020-12-18 | 浙江启尔机电技术有限公司 | Closed cabinet beneficial to heat dissipation and heat dissipation method thereof |
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Application publication date: 20210430 |