CN103682071B - 发光器件 - Google Patents

发光器件 Download PDF

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Publication number
CN103682071B
CN103682071B CN201310418515.9A CN201310418515A CN103682071B CN 103682071 B CN103682071 B CN 103682071B CN 201310418515 A CN201310418515 A CN 201310418515A CN 103682071 B CN103682071 B CN 103682071B
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China
Prior art keywords
light emitting
layer
light
electrode
lead electrode
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Active
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CN201310418515.9A
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English (en)
Chinese (zh)
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CN103682071A (zh
Inventor
尹汝赞
吴成株
郑在桓
金镇成
闵凤杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Liyu Semiconductor Co ltd
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LG Innotek Co Ltd
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Publication of CN103682071A publication Critical patent/CN103682071A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
CN201310418515.9A 2012-09-13 2013-09-13 发光器件 Active CN103682071B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0101819 2012-09-13
KR1020120101819A KR101973613B1 (ko) 2012-09-13 2012-09-13 발광 소자 및 이를 구비한 조명 시스템

Publications (2)

Publication Number Publication Date
CN103682071A CN103682071A (zh) 2014-03-26
CN103682071B true CN103682071B (zh) 2018-10-02

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Family Applications (1)

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CN201310418515.9A Active CN103682071B (zh) 2012-09-13 2013-09-13 发光器件

Country Status (5)

Country Link
US (1) US9219208B2 (https=)
EP (1) EP2709177B1 (https=)
JP (1) JP6306842B2 (https=)
KR (1) KR101973613B1 (https=)
CN (1) CN103682071B (https=)

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USD724548S1 (en) * 2013-09-13 2015-03-17 Citizen Electronics Co., Ltd. Light-emitting diode
USD724039S1 (en) * 2013-09-13 2015-03-10 Citizen Electronics Co., Ltd. Light-emitting diode
CN105874618A (zh) 2014-01-08 2016-08-17 皇家飞利浦有限公司 经波长转换的半导体发光器件
DE102014108295A1 (de) 2014-06-12 2015-12-17 Osram Opto Semiconductors Gmbh Licht emittierendes Halbleiterbauelement
JP6476703B2 (ja) * 2014-09-30 2019-03-06 日亜化学工業株式会社 セラミックスパッケージ、発光装置及びそれらの製造方法
USD778846S1 (en) * 2014-12-15 2017-02-14 Kingbright Electronics Co. Ltd. LED component
USD778847S1 (en) * 2014-12-15 2017-02-14 Kingbright Electronics Co. Ltd. LED component
EP3054492B1 (en) * 2015-02-03 2024-04-17 Epistar Corporation Light-emitting device
DE112015006115T5 (de) 2015-02-06 2017-12-14 Osram Opto Semiconductors Gmbh Leadframe und Chipgehäuse mit Leadframe
KR102346798B1 (ko) * 2015-02-13 2022-01-05 삼성전자주식회사 반도체 발광장치
KR101700306B1 (ko) * 2015-06-19 2017-01-31 주식회사 세미콘라이트 반도체 발광소자
KR102378761B1 (ko) * 2015-07-21 2022-03-25 엘지이노텍 주식회사 일체형 발광 패키지 및 이를 이용한 차량용 램프
JP6245239B2 (ja) * 2015-09-11 2017-12-13 日亜化学工業株式会社 半導体レーザ素子の製造方法
KR102487685B1 (ko) * 2015-11-10 2023-01-16 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 및 이를 구비한 조명 장치
KR102562091B1 (ko) * 2016-02-12 2023-08-02 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
KR102709497B1 (ko) * 2016-10-27 2024-09-26 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지
KR102680862B1 (ko) 2016-12-16 2024-07-03 삼성전자주식회사 반도체 발광장치
CN108269899B (zh) * 2016-12-30 2020-06-05 光宝光电(常州)有限公司 发光二极管封装结构及其制造方法
KR102739650B1 (ko) * 2017-02-10 2024-12-09 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 모듈
KR102360856B1 (ko) * 2017-06-08 2022-02-10 주식회사 아모센스 세라믹 기판 및 이를 포함하는 엘이디 패키지
CN107420856B (zh) * 2017-07-11 2020-01-03 深圳市华星光电技术有限公司 一种反射片及其制作方法、背光模组
KR102385940B1 (ko) 2017-09-01 2022-04-13 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원 장치
KR102593571B1 (ko) * 2018-10-26 2023-10-24 주식회사 아모텍 다이오드 복합소자
US11594665B2 (en) 2019-08-02 2023-02-28 Nichia Corporation Light-emitting unit and surface-emission light source
JP7277791B2 (ja) 2020-08-31 2023-05-19 日亜化学工業株式会社 発光装置および面状光源
JP7206504B2 (ja) 2020-09-30 2023-01-18 日亜化学工業株式会社 発光装置
CN113036024B (zh) * 2021-05-24 2021-08-10 至芯半导体(杭州)有限公司 紫外发光二极管封装结构
US12173428B2 (en) * 2022-10-07 2024-12-24 Mainstream Engineering Corporation Controlled surface chemistry for polytypic and microstructural selective growth on hexagonal SiC substrates

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CN102593336A (zh) * 2011-01-17 2012-07-18 三星Led株式会社 发光器件封装件及其制造方法

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JP4539235B2 (ja) 2004-08-27 2010-09-08 日亜化学工業株式会社 半導体装置およびその製造方法
US7736945B2 (en) * 2005-06-09 2010-06-15 Philips Lumileds Lighting Company, Llc LED assembly having maximum metal support for laser lift-off of growth substrate
US9754926B2 (en) * 2011-01-31 2017-09-05 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
US9660153B2 (en) * 2007-11-14 2017-05-23 Cree, Inc. Gap engineering for flip-chip mounted horizontal LEDs
JP2009158656A (ja) 2007-12-26 2009-07-16 Panasonic Corp 発光装置
KR101645009B1 (ko) * 2010-01-06 2016-08-03 서울반도체 주식회사 방열기판을 갖는 ｌｅｄ 패키지
DE102010024864B4 (de) * 2010-06-24 2021-01-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil
JP2012015437A (ja) * 2010-07-05 2012-01-19 Citizen Holdings Co Ltd 半導体発光装置
JP2012080026A (ja) * 2010-10-06 2012-04-19 Toshiba Corp Ｌｅｄパッケージ
JP2012099544A (ja) * 2010-10-29 2012-05-24 Nichia Chem Ind Ltd 発光装置の製造方法
KR101711644B1 (ko) * 2010-11-15 2017-03-03 서울반도체 주식회사 발광다이오드 패키지
KR102042150B1 (ko) * 2012-09-13 2019-11-07 엘지이노텍 주식회사 발광 소자 및 조명 시스템
KR101997243B1 (ko) * 2012-09-13 2019-07-08 엘지이노텍 주식회사 발광 소자 및 조명 시스템

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CN102593336A (zh) * 2011-01-17 2012-07-18 三星Led株式会社 发光器件封装件及其制造方法
CN102263194A (zh) * 2011-04-13 2011-11-30 日月光半导体制造股份有限公司 半导体封装与制造半导体封装的方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240063171A1 (en) * 2020-12-31 2024-02-22 International Business Machines Corporation Assembly of a chip to a substrate
US12519076B2 (en) * 2020-12-31 2026-01-06 International Business Machines Corporation Assembly of a chip to a substrate

Also Published As

Publication number Publication date
KR20140035211A (ko) 2014-03-21
JP2014057062A (ja) 2014-03-27
CN103682071A (zh) 2014-03-26
KR101973613B1 (ko) 2019-04-29
EP2709177A2 (en) 2014-03-19
US9219208B2 (en) 2015-12-22
US20140070249A1 (en) 2014-03-13
EP2709177B1 (en) 2017-08-30
JP6306842B2 (ja) 2018-04-04
EP2709177A3 (en) 2015-11-04

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Effective date of registration: 20210823

Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Leyu Semiconductor Co.,Ltd.

Address before: Seoul, South Kerean

Patentee before: LG INNOTEK Co.,Ltd.

TR01 Transfer of patent right
CP03 Change of name, title or address

Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Liyu Semiconductor Co.,Ltd.

Country or region after: China

Address before: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee before: Suzhou Leyu Semiconductor Co.,Ltd.

Country or region before: China

CP03 Change of name, title or address