CN103680370A - 显示装置及其测试线路修复方法 - Google Patents

显示装置及其测试线路修复方法 Download PDF

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Publication number
CN103680370A
CN103680370A CN201310693323.9A CN201310693323A CN103680370A CN 103680370 A CN103680370 A CN 103680370A CN 201310693323 A CN201310693323 A CN 201310693323A CN 103680370 A CN103680370 A CN 103680370A
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CN
China
Prior art keywords
segmentation
film transistor
display device
test signal
siding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310693323.9A
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English (en)
Chinese (zh)
Inventor
杜鹏
施明宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to CN201310693323.9A priority Critical patent/CN103680370A/zh
Priority to EA201690996A priority patent/EA031911B1/ru
Priority to JP2016526832A priority patent/JP2016538590A/ja
Priority to PCT/CN2013/090821 priority patent/WO2015089878A1/zh
Priority to KR1020167010222A priority patent/KR101894523B1/ko
Priority to GB1604875.3A priority patent/GB2534317B/en
Publication of CN103680370A publication Critical patent/CN103680370A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/08—Fault-tolerant or redundant circuits, or circuits in which repair of defects is prepared
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/10—Dealing with defective pixels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Liquid Crystal Display Device Control (AREA)
CN201310693323.9A 2013-12-17 2013-12-17 显示装置及其测试线路修复方法 Pending CN103680370A (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN201310693323.9A CN103680370A (zh) 2013-12-17 2013-12-17 显示装置及其测试线路修复方法
EA201690996A EA031911B1 (ru) 2013-12-17 2013-12-30 Дисплейное устройство и способ восстановления его испытательной линии
JP2016526832A JP2016538590A (ja) 2013-12-17 2013-12-30 表示装置及びその試験回線修復方法
PCT/CN2013/090821 WO2015089878A1 (zh) 2013-12-17 2013-12-30 显示装置及其测试线路修复方法
KR1020167010222A KR101894523B1 (ko) 2013-12-17 2013-12-30 디스플레이장치 및 그 테스트 라인의 수리 방법
GB1604875.3A GB2534317B (en) 2013-12-17 2013-12-30 Display device and testing line repairing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310693323.9A CN103680370A (zh) 2013-12-17 2013-12-17 显示装置及其测试线路修复方法

Publications (1)

Publication Number Publication Date
CN103680370A true CN103680370A (zh) 2014-03-26

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ID=50317762

Family Applications (1)

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CN201310693323.9A Pending CN103680370A (zh) 2013-12-17 2013-12-17 显示装置及其测试线路修复方法

Country Status (6)

Country Link
JP (1) JP2016538590A (ru)
KR (1) KR101894523B1 (ru)
CN (1) CN103680370A (ru)
EA (1) EA031911B1 (ru)
GB (1) GB2534317B (ru)
WO (1) WO2015089878A1 (ru)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107884693A (zh) * 2017-11-06 2018-04-06 武汉华星光电半导体显示技术有限公司 电气特性测试方法
CN109741699A (zh) * 2019-01-22 2019-05-10 深圳市华星光电技术有限公司 用于显示面板的检测设备
US10565912B2 (en) 2017-11-06 2020-02-18 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Electrical characteristics inspection method
CN111798779A (zh) * 2019-07-26 2020-10-20 友达光电股份有限公司 用于可挠性显示面板的备用线路系统及其自动切换方法
CN113516917A (zh) * 2021-05-26 2021-10-19 京东方科技集团股份有限公司 一种显示面板、显示装置及断线修复方法
WO2022068655A1 (zh) * 2020-09-30 2022-04-07 荣耀终端有限公司 一种显示装置、驱动芯片及电子设备

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111203631A (zh) * 2020-03-12 2020-05-29 苏州晶振智能科技有限公司 一种显示屏智能检测激光修复方法
CN112289836B (zh) * 2020-10-26 2023-05-02 武汉天马微电子有限公司 显示面板及显示装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5102361A (en) * 1989-01-23 1992-04-07 Sharp Kabushiki Kaisha Method for the manufacture of active matrix display apparatuses
CN101059636A (zh) * 2006-04-21 2007-10-24 株式会社日立显示器 液晶显示装置
JP2007292878A (ja) * 2006-04-21 2007-11-08 Hitachi Displays Ltd 液晶表示装置及びその製造方法
CN101191964A (zh) * 2006-11-27 2008-06-04 中华映管股份有限公司 像素结构及其修补方法
CN101382709A (zh) * 2007-09-04 2009-03-11 上海广电Nec液晶显示器有限公司 一种液晶显示器薄膜晶体管结构
CN102692774A (zh) * 2012-05-23 2012-09-26 深圳市华星光电技术有限公司 液晶显示面板
CN103345093A (zh) * 2013-06-28 2013-10-09 京东方科技集团股份有限公司 像素单元、阵列基板及其制造、修复方法和显示装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5350495B2 (ja) * 2010-02-08 2013-11-27 シャープ株式会社 表示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5102361A (en) * 1989-01-23 1992-04-07 Sharp Kabushiki Kaisha Method for the manufacture of active matrix display apparatuses
CN101059636A (zh) * 2006-04-21 2007-10-24 株式会社日立显示器 液晶显示装置
JP2007292878A (ja) * 2006-04-21 2007-11-08 Hitachi Displays Ltd 液晶表示装置及びその製造方法
CN101191964A (zh) * 2006-11-27 2008-06-04 中华映管股份有限公司 像素结构及其修补方法
CN101382709A (zh) * 2007-09-04 2009-03-11 上海广电Nec液晶显示器有限公司 一种液晶显示器薄膜晶体管结构
CN102692774A (zh) * 2012-05-23 2012-09-26 深圳市华星光电技术有限公司 液晶显示面板
CN103345093A (zh) * 2013-06-28 2013-10-09 京东方科技集团股份有限公司 像素单元、阵列基板及其制造、修复方法和显示装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107884693A (zh) * 2017-11-06 2018-04-06 武汉华星光电半导体显示技术有限公司 电气特性测试方法
US10565912B2 (en) 2017-11-06 2020-02-18 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Electrical characteristics inspection method
CN109741699A (zh) * 2019-01-22 2019-05-10 深圳市华星光电技术有限公司 用于显示面板的检测设备
CN111798779A (zh) * 2019-07-26 2020-10-20 友达光电股份有限公司 用于可挠性显示面板的备用线路系统及其自动切换方法
CN111798779B (zh) * 2019-07-26 2022-07-29 友达光电股份有限公司 用于可挠性显示面板的备用线路系统及其自动切换方法
WO2022068655A1 (zh) * 2020-09-30 2022-04-07 荣耀终端有限公司 一种显示装置、驱动芯片及电子设备
US11928996B2 (en) 2020-09-30 2024-03-12 Honor Device Co., Ltd. Display apparatus, drive chip, and electronic device
CN113516917A (zh) * 2021-05-26 2021-10-19 京东方科技集团股份有限公司 一种显示面板、显示装置及断线修复方法

Also Published As

Publication number Publication date
KR101894523B1 (ko) 2018-09-04
EA201690996A1 (ru) 2016-10-31
KR20160060106A (ko) 2016-05-27
GB201604875D0 (en) 2016-05-04
EA031911B1 (ru) 2019-03-29
GB2534317B (en) 2020-12-09
GB2534317A (en) 2016-07-20
JP2016538590A (ja) 2016-12-08
WO2015089878A1 (zh) 2015-06-25

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Application publication date: 20140326

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