CN103635014A - Circuit packaging structure PCB (Printed Circuit Board) substrate - Google Patents
Circuit packaging structure PCB (Printed Circuit Board) substrate Download PDFInfo
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- CN103635014A CN103635014A CN201310563348.7A CN201310563348A CN103635014A CN 103635014 A CN103635014 A CN 103635014A CN 201310563348 A CN201310563348 A CN 201310563348A CN 103635014 A CN103635014 A CN 103635014A
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Abstract
The invention relates to a circuit packaging structure PCB (Printed Circuit Board) substrate which is characterized by consisting of a circuit layer, an insulating layer, a heat conducting layer and liquid metal. The circuit layer connects an electronic device on the substrate into a circuit; the insulating layer electrically insulates the circuit layer from the heat conducting layer so as to ensure normal operation of the circuit layer; the heat conducting layer can effectively conduct heat generated by the electronic device; the liquid metal is filled in a hole of a PCB board (the hole is positioned right below the electronic device and runs through the insulating layer and the heat conducting layer), can reduce a thermal resistance and greatly improves comprehensive heat conductivity of the substrate. The circuit packaging structure PCB substrate which the invention relates to has excellent performance; the temperatures of the electronic device can be obviously reduced, the service life of the electronic device is prolonged; the circuit packaging structure PCB substrate is convenient to process, is low in cost and can be widely used for the fields of computers, communication, consumer electronics and photoelectric illumination.
Description
Technical field
The present invention relates to a kind of circuit encapsulating structure PCB substrate, this circuit encapsulating structure PCB substrate is comprised of line layer, insulating barrier, heat-conducting layer and liquid metal, wherein, liquid metal runs through in the hole of insulating barrier and heat-conducting layer under being filled in electronic device, can significantly improve the Thermal Synthetic conductance of pcb board.The present invention can be widely used in computer, communication, consumer electronics and photoelectric lighting field.
Background technology
In recent years; high-power electronic component is towards more high-power, the future development of small size more; the heat problem causing is thus more and more serious; heat not only affects the speed of service of electronic devices and components; when serious, also can form heat protection; affect its useful life, therefore, it is more and more important that the heat management of electronic devices and components is just becoming.Keeping the key in electronic devices and components useful life is to adopt state-of-the-art thermal management material, and adopting the pcb board of high thermal conductivity is exactly one of key element wherein.
Pcb board is the important step of cooling electronic component, and its heat that electronic device is produced conducts to fin radiator, and then is dissipated in surrounding environment.Traditional pcb board is comprised of line layer, insulating barrier and heat-conducting layer.Wherein, insulating barrier is the most crucial technology of substrate, mainly play bonding, insulation and the function of heat conduction.Insulating barrier is conductive barrier maximum in power model structure, existing insulating layer material mostly is FR-4 prepreg (1080), its thermal conductivity very low (conductive coefficient is only 0.3W/mK), and because its electric insulating quality is poor, need to reach certain thickness and just can reach the desired breakdown strength of product, more reduce the comprehensive conductive coefficient of substrate, affected the heat dispersion of substrate.In order to improve the heat conductivility of insulating barrier, external producer adds suitable heat filling (pottery) in substrate insulating layer, make the thermal conductivity of insulating barrier be increased to 1-2 W/mK, so limited thermal conductivity promotes effect, not only greatly increased the difficulty of insulating barrier manufacture craft, and cost is increased substantially, hinder its being widely used in cooling electronic component field.Therefore, find and a kind ofly process simple, with low cost, can to significantly improve substrate heat conductance materials and methods and become the important subject that pcb board is applied in cooling electronic component field.
Summary of the invention
The object of the present invention is to provide a kind of circuit encapsulating structure PCB substrate, it is comprised of line layer, insulating barrier, heat-conducting layer and liquid metal.The circuit encapsulating structure PCB substrate the present invention relates to has the simple advantage of high thermal conductivity, low cost and technique, can be widely used in computer, communication, consumer electronics and photoelectric lighting field.
Technical scheme of the present invention is as follows:
A kind of circuit encapsulating structure PCB substrate provided by the invention, as shown in Figure 1, its structure is as follows:
One line layer 2, described line layer 2 is positioned at the top layer of substrate, and the electronic device on substrate 1 is coupled together, and forms circuit;
One insulating barrier 3, described insulating barrier 3 is positioned at 4 of described line layer 2 and heat-conducting layers, plays bonding, insulation and conductive force;
One heat-conducting layer 4, described heat-conducting layer 4 is positioned at described insulating barrier 3 belows, the heat that effectively conduction electron device produces;
One liquid metal 5, described liquid metal 5 runs through in the hole of insulating barrier 3 and heat-conducting layer 4, to improve the Thermal Synthetic conductance of pcb board under being filled in electronic device 1.
Circuit encapsulating structure PCB substrate described in the present invention, is characterized in that, described line layer 2 materials are Copper Foil, and thickness is 1oz ~ 10oz.
Described insulating barrier 3 materials are the polymer (being mainly epoxy resin) that FR-4 prepreg or ceramic powder filled form, and thickness of insulating layer is 50 ~ 200 μ m.
Described heat-conducting layer 4 materials are copper, aluminium or pottery, and thickness is between 0.5mm ~ 4mm.
Described liquid metal 5 runs through in the hole of insulating barrier 3 and heat-conducting layer 4 under being filled in electronic device 1, and bore dia is between 2mm ~ 20mm.
One side of described liquid metal 5 and heat-conducting layer 4 can connect aluminium fin radiator or heat pipe as required.
Described liquid metal 5 is selected from a kind of or arbitrarily two or more combination of fusing point in the sodium below 200 ℃, potassium, lithium, rubidium, caesium, gallium, indium, mercury, lead bismuth alloy, gallium base bianry alloy, gallium based multicomponent alloy, indium-base alloy, bismuth-base alloy, mercury-base alloy or Na-K alloy.
Described gallium base bianry alloy is gallium indium alloy, gallium ashbury metal, gallium kirsite, gallium lead alloy or gallium mercury alloy.
Described gallium based multicomponent alloy is gallium-indium-tin alloy or gallium indium tin kirsite.
A kind of using method of circuit encapsulating structure PCB substrate is as follows:
Liquid metal 5 is filled in to electronic device 1 bottom and runs through in the hole of insulating barrier 3 and heat-conducting layer 4 (bore dia is between 2mm ~ 20mm), the opposite side of heat-conducting layer 4 can connect aluminium fin radiator or heat pipe as required.When electronic device 1 work, the heat of generation, fraction spreads by pcb board insulating barrier 3 and conducts to heat-conducting layer 4, and then heat is passed on the aluminium fin radiator being attached thereto by heat-conducting layer 4; Most of heat directly passes to heat on the aluminium fin radiator being attached thereto by liquid metal 5.Due to the thermal transmission coefficient of the liquid metal conductive coefficient much larger than insulating barrier, and heat-transfer path is shorter.Therefore, sort circuit encapsulating structure PCB substrate can significantly reduce the working temperature of electronic device, and long-term safety is stably worked at a lower temperature.
A kind of circuit encapsulating structure PCB substrate tool of the present invention has the following advantages:
(1) processing technology is simple, on existing substrate processing technology basis, only need be to the punching of substrate relevant position filling liquid metal, and technique is simple, easy to operate;
(2) heat dispersion is excellent, high as the liquid metal thermal conductivity of packing material, and liquid metal be filled in electronic device under, greatly reduced heat-transfer path, guarantee the heat transfer property of substrate excellence;
(3) cost is low, and circuit encapsulating structure PCB substrate liquid metal consumption is less, thereby cost is lower, and poor insulating material is in conjunction with the scheme of liquid metal, can reach the heat-transfer effect of external High Performance Insulation material substrate.Compare with external product, cost is low and effect is remarkable.
Accompanying drawing explanation
Fig. 1 is a kind of circuit encapsulating structure PCB board structure schematic diagram in embodiment.
Wherein, 1 is electronic device, 2 line layers that are substrate, and 3 is substrate insulating layer, and 4 is substrate heat-conducting layer, and 5 is liquid metal.
Embodiment
Below in conjunction with specific embodiment, further describe the present invention, advantage and disadvantage of the present invention will be more clear along with description.But embodiment is only exemplary, scope of the present invention is not formed to any restriction.It will be understood by those skilled in the art that lower without departing from the spirit and scope of the present invention and can the details of technical solution of the present invention and form be modified or be replaced, but these modifications and replacement all fall within the scope of protection of the present invention.
Below in conjunction with drawings and the specific embodiments, further describe the present invention.
Embodiment 1
As shown in Figure 1, the electronic device 1 of the present embodiment is LED light source, and line layer 2 is the Copper Foil of thickness 1oz.Insulating barrier 3 materials are FR-4, and its conductive coefficient is 0.3W/mK, and thickness is 200 μ m.Heat-conducting layer 4 materials are aluminium, and thickness is 1.5mm.Bore dia is 6mm, the liquid metal 5 of interior filling is gallium indium tin kirsite (each constituent mass mark is Ga 61%, In 24%, Sn 13%, Zn 2%), it has higher heat-conductivity (20W/mK), and the heat that LED light source 1 can be produced sheds in time, has guaranteed the normal operation of LED light source.
During use, liquid metal 5 is filled in to LED light source 1 bottom and runs through in the hole of insulating barrier 3 and heat-conducting layer 4 (bore dia is between 2mm ~ 20mm), aluminium fin radiator is arranged on to the heat-conducting layer of heating panel.When LED light source 1 work, the heat of generation, fraction spreads by LED insulating barrier 3 and conducts to heat-conducting layer 4, and then heat is passed on the aluminium fin radiator being attached thereto by heat-conducting layer 4; Most of heat directly passes to heat on the aluminium fin radiator being attached thereto by liquid metal 5.Due to the thermal transmission coefficient of the liquid metal conductive coefficient much larger than insulating barrier, and heat-transfer path is shorter.Therefore, sort circuit encapsulating structure PCB substrate can significantly reduce the working temperature of LED light source, and long-term safety is stably worked at a lower temperature.
In order to assess the heat dispersion of new type of substrate of the present invention, carry out following theoretical calculating.
The LED light source of diameter 6mm of take is example, and it is embedded on the substrate that the length of side is 1cm.
Conventional substrate parameter is as follows: insulating barrier material is FR-4, and conductive coefficient is 0.3W/mK, and thickness is 200 μ m.Heat-conducting layer material is aluminium alloy 6061, and thermal conductivity is 160 W/mK, and thickness is 1.5mm.Insulating barrier and heat-conducting layer are series model, that is:
Wherein, L is substrate gross thickness, and λ is substrate equivalent thermal conductivity.L
1for thickness of insulating layer, λ
1for insulating barrier thermal conductivity, L
2for heat-conducting layer thickness, λ
2for heat-conducting layer thermal conductivity.
From formula (1), substrate total heat conductance λ is:
From Fourier's law,
(3)
Obtaining the temperature rise of conventional aluminum substrate upper and lower sides is
ΔT=13.6oC （4）
The circuit encapsulating structure PCB substrate the present invention relates to is beaten 6mm hole below LED light source, filling liquid metal, and thermal conductivity is 20W/ (mK).From thermal conduction study law, perforated area and non-perforated area are paralleling model, that is:
λA=λ
1A
1+λ
2A
2 （5）
Wherein, λ is substrate equivalent thermal conductivity, and A is the substrate gross area, λ
1for non-perforated area thermal conductivity, A
1for the non-perforated area gross area, λ
2for perforated area thermal conductivity, A
2for the perforated area gross area.
The equivalent thermal conductivity of circuit encapsulating structure PCB substrate is:
λ =7.4W/(m·K) （6）
By Fourier formula
Obtaining the temperature rise of circuit encapsulating structure PCB substrate upper and lower sides is
ΔT’=4.6C （8）
From formula (4) and (8), circuit encapsulating structure PCB substrate with respect to the temperature increase of conventional substrate is:
ΔT-ΔT’=13.6-4.6=9（oC） （9）
Embodiment 2
As shown in Figure 1, the electronic device 1 of the present embodiment is chip for cell phone, and line layer 2 is the Copper Foil of thickness 2oz.Insulating barrier 3 materials are FR-4, and its conductive coefficient is 0.3W/mK, and thickness is 75 μ m.Heat-conducting layer 4 materials are copper, and thickness is 1mm.Bore dia is 2mm, and the liquid metal 5 of filling in hole is gallium-indium-tin alloy (each constituent mass mark is Ga 66%, In 20.5%, Sn 13.5%).Sort circuit encapsulating structure PCB substrate has higher heat-conductivity, and the heat that chip for cell phone 1 can be produced sheds in time, has guaranteed the normal operation of chip for cell phone.
During use, liquid metal 5 is filled in to chip for cell phone 1 bottom and runs through in the hole of insulating barrier 3 and heat-conducting layer 4 (bore dia is between 2mm ~ 20mm).When chip for cell phone 1 work, the heat of generation, fraction spreads by PCB insulating barrier 3 and conducts to heat-conducting layer 4, and then by heat-conducting layer 4, heat is passed to aluminium fin radiator or the heat pipe being attached thereto; Most of heat directly passes to by heat aluminium fin radiator or the heat pipe being attached thereto by liquid metal 5.Due to the thermal transmission coefficient of the liquid metal conductive coefficient much larger than insulating barrier, and heat-transfer path is shorter.Therefore, sort circuit encapsulating structure PCB substrate can significantly reduce the working temperature of chip for cell phone, and long-term safety is stably worked at a lower temperature.
Embodiment 3
As shown in Figure 1, the electronic device 1 of the present embodiment is computer chip, line layer 2 for thickness be the Copper Foil of 3oz.The polymer that insulating barrier 3 forms for ceramic powder filled (being mainly epoxy resin), its conductive coefficient is 2W/mK, thickness is 75 μ m.Heat-conducting layer 4 is pottery, and thickness is 1mm.Bore dia is 4mm, the liquid metal of filling in hole is gallium indium tin kirsite (each constituent mass mark is Ga 61%, In 24%, Sn 13%, Zn 2%), it has higher heat-conductivity, and the heat that computer chip 1 can be produced sheds in time, has guaranteed the normal operation of computer chip.
During use, liquid metal 5 is filled in to computer chip 1 bottom to be run through in the hole of insulating barrier 3 and heat-conducting layer 4 (bore dia is between 2mm ~ 20mm), when computer chip 1 work, the heat producing, fraction spreads by PCB insulating barrier 3 and conducts to heat-conducting layer 4, and then by heat-conducting layer 4, heat is passed to aluminium fin radiator or the heat pipe being attached thereto; Most of heat directly passes to by heat aluminium fin radiator or the heat pipe being attached thereto by liquid metal 5.Due to the thermal transmission coefficient of the liquid metal conductive coefficient much larger than insulating barrier, and heat-transfer path is shorter.Therefore, sort circuit encapsulating structure PCB substrate can significantly reduce computer chip working temperature, and long-term safety is stably worked at a lower temperature.
Finally it should be noted that above embodiment is only unrestricted in order to technical scheme of the present invention to be described.Although the present invention is had been described in detail with reference to embodiment, those of ordinary skill in the art is to be understood that, technical scheme of the present invention is modified or is equal to replacement, do not depart from the spirit and scope of technical solution of the present invention, it all should be encompassed in the middle of claim scope of the present invention.
Claims (8)
1. a circuit encapsulating structure PCB substrate, is characterized in that, its structure is as follows:
One line layer, described line layer is positioned at the top layer of substrate, and the electronic device on substrate is coupled together, and forms circuit;
One insulating barrier, described insulating barrier is positioned between line layer and heat-conducting layer, plays bonding, insulation and conductive force;
One heat-conducting layer, described heat-conducting layer is positioned at insulating barrier below, the heat that effectively conduction electron device produces;
One liquid metal, described liquid metal runs through in the hole of insulating barrier and heat-conducting layer under being filled in electronic device, to improve the Thermal Synthetic conductance of substrate.
2. a kind of circuit encapsulating structure PCB substrate according to claim 1, is characterized in that, described wiring material layer is Copper Foil, and thickness is 1oz ~ 10oz.
3. by a kind of circuit encapsulating structure PCB substrate claimed in claim 1, it is characterized in that, described insulating layer material is the polymer (being mainly epoxy resin) that FR-4 prepreg or ceramic powder filled form, and thickness of insulating layer is 50 ~ 200 μ m.
4. by a kind of circuit encapsulating structure PCB substrate claimed in claim 1, it is characterized in that, described heat-conducting layer material is copper, aluminium or pottery, and thickness is between 0.5mm ~ 4mm.
5. by a kind of circuit encapsulating structure PCB substrate claimed in claim 1, it is characterized in that, described liquid metal runs through in the hole of insulating barrier and heat-conducting layer under being filled in electronic device, and bore dia is between 2mm ~ 20mm.
6. by a kind of circuit encapsulating structure PCB substrate claimed in claim 1, it is characterized in that, a side of described liquid metal and heat-conducting layer can connect aluminium fin radiator or heat pipe as required.
7. by a kind of circuit encapsulating structure PCB substrate claimed in claim 1, it is characterized in that, described liquid metal is selected from a kind of or arbitrarily two or more combination of fusing point in the sodium below 200 ℃, potassium, lithium, rubidium, caesium, gallium, indium, mercury, lead bismuth alloy, gallium base bianry alloy, gallium based multicomponent alloy, indium-base alloy, bismuth-base alloy, mercury-base alloy or Na-K alloy.
8. a kind of circuit encapsulating structure PCB substrate according to claim 7, is characterized in that, described gallium base bianry alloy is gallium indium alloy, gallium ashbury metal, gallium kirsite, gallium lead alloy or gallium mercury alloy; Described gallium based multicomponent alloy is gallium-indium-tin alloy or gallium indium tin kirsite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310563348.7A CN103635014B (en) | 2013-11-14 | A kind of circuit encapsulating structure PCB substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310563348.7A CN103635014B (en) | 2013-11-14 | A kind of circuit encapsulating structure PCB substrate |
Publications (2)
| Publication Number | Publication Date |
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| CN103635014A true CN103635014A (en) | 2014-03-12 |
| CN103635014B CN103635014B (en) | 2016-11-30 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106954368A (en) * | 2017-03-15 | 2017-07-14 | 东莞市明骏智能科技有限公司 | One step prepares preparation method, preparation facilities and the production line of the integral heat dissipation structure for sealing liquid metal |
| CN106960830A (en) * | 2017-03-15 | 2017-07-18 | 东莞市明骏智能科技有限公司 | Sealing frame and application, integral heat dissipation structure and electronic component for sealing liquid metal |
| CN108231707A (en) * | 2016-12-14 | 2018-06-29 | 中国航空工业集团公司西安航空计算技术研究所 | A kind of chip to conduct heat in liquid metal enhancing |
| CN113924688A (en) * | 2019-02-19 | 2022-01-11 | 约翰森·马瑟公开有限公司 | Interconnect member |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201352881Y (en) * | 2008-04-16 | 2009-11-25 | 淳华科技(昆山)有限公司 | Radiating type soft circuit board used for backlight module |
| CN101652020A (en) * | 2009-09-04 | 2010-02-17 | 大连九久光电科技有限公司 | High heat radiating circuit substrate and manufacturing method thereof |
| CN202551494U (en) * | 2012-04-08 | 2012-11-21 | 嵇刚 | High heat conductivity PCB (Printed Circuit Board) metal substrate |
| CN203590590U (en) * | 2013-11-14 | 2014-05-07 | 北京依米康科技发展有限公司 | Circuit packaging structure PCB substrate |
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201352881Y (en) * | 2008-04-16 | 2009-11-25 | 淳华科技(昆山)有限公司 | Radiating type soft circuit board used for backlight module |
| CN101652020A (en) * | 2009-09-04 | 2010-02-17 | 大连九久光电科技有限公司 | High heat radiating circuit substrate and manufacturing method thereof |
| CN202551494U (en) * | 2012-04-08 | 2012-11-21 | 嵇刚 | High heat conductivity PCB (Printed Circuit Board) metal substrate |
| CN203590590U (en) * | 2013-11-14 | 2014-05-07 | 北京依米康科技发展有限公司 | Circuit packaging structure PCB substrate |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231707A (en) * | 2016-12-14 | 2018-06-29 | 中国航空工业集团公司西安航空计算技术研究所 | A kind of chip to conduct heat in liquid metal enhancing |
| CN106954368A (en) * | 2017-03-15 | 2017-07-14 | 东莞市明骏智能科技有限公司 | One step prepares preparation method, preparation facilities and the production line of the integral heat dissipation structure for sealing liquid metal |
| CN106960830A (en) * | 2017-03-15 | 2017-07-18 | 东莞市明骏智能科技有限公司 | Sealing frame and application, integral heat dissipation structure and electronic component for sealing liquid metal |
| CN106954368B (en) * | 2017-03-15 | 2023-09-12 | 东莞市光钛科技有限公司 | Preparation method, preparation device and production line for one-step preparation of integrated heat dissipation structure |
| CN113924688A (en) * | 2019-02-19 | 2022-01-11 | 约翰森·马瑟公开有限公司 | Interconnect member |
| CN113924688B (en) * | 2019-02-19 | 2024-04-16 | 庄信万丰股份有限公司 | Interconnect element |
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Address after: 100040, room 368, Yuquan building, 3 Shijingshan Road, Beijing, Shijingshan District Applicant after: BEIJING LIQUIDKING TECHNOLOGY Co.,Ltd. Address before: 100040, room 368, Yuquan building, 3 Shijingshan Road, Beijing, Shijingshan District Applicant before: BEIJING EMIKON TECHNOLOGY DEVELOPMENT CO.,LTD. |
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