CN103623962B - 喷雾喷嘴单元 - Google Patents

喷雾喷嘴单元 Download PDF

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Publication number
CN103623962B
CN103623962B CN201310367263.1A CN201310367263A CN103623962B CN 103623962 B CN103623962 B CN 103623962B CN 201310367263 A CN201310367263 A CN 201310367263A CN 103623962 B CN103623962 B CN 103623962B
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CN
China
Prior art keywords
chamber
wall
nozzle body
main body
containment member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201310367263.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN103623962A (zh
Inventor
郑基泽
崔虎重
姜明成
宋旭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SNU Precision Co Ltd
Original Assignee
SNU Precision Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SNU Precision Co Ltd filed Critical SNU Precision Co Ltd
Publication of CN103623962A publication Critical patent/CN103623962A/zh
Application granted granted Critical
Publication of CN103623962B publication Critical patent/CN103623962B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0278—Arrangement or mounting of spray heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/60—Arrangements for mounting, supporting or holding spraying apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
  • Nozzles (AREA)
CN201310367263.1A 2012-08-22 2013-08-21 喷雾喷嘴单元 Expired - Fee Related CN103623962B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0091912 2012-08-22
KR1020120091912A KR101394265B1 (ko) 2012-08-22 2012-08-22 분사노즐 유닛

Publications (2)

Publication Number Publication Date
CN103623962A CN103623962A (zh) 2014-03-12
CN103623962B true CN103623962B (zh) 2016-03-02

Family

ID=50205621

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310367263.1A Expired - Fee Related CN103623962B (zh) 2012-08-22 2013-08-21 喷雾喷嘴单元

Country Status (4)

Country Link
JP (1) JP5594503B2 (ko)
KR (1) KR101394265B1 (ko)
CN (1) CN103623962B (ko)
TW (1) TWI490047B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101974418B1 (ko) * 2018-10-10 2019-05-02 권오남 공정액 공급용 노즐튜브 및 이를 포함하는 노즐장치
CN110586380A (zh) * 2019-09-18 2019-12-20 大禹节水（天津）有限公司 一种水利灌溉用便于拆卸的洒水喷头
CN115522167B (zh) * 2022-09-22 2024-07-26 京东方科技集团股份有限公司 一种蒸镀源设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2282298A1 (fr) * 1973-04-12 1976-03-19 Lechler Apparatebau Kg Dispositif pour la fixation etanche de buses sur les pieces de canalisation
CN2285395Y (zh) * 1997-04-18 1998-07-01 王平 一种机械密封装置
KR20020074923A (ko) * 2001-03-22 2002-10-04 삼성전자 주식회사 반도체 제조장치의 반응가스 공급노즐
CN1481449A (zh) * 2000-12-20 2004-03-10 ͨ�õ�����˾ 将试剂延期注入等离子体的注射器和方法
WO2008004964A1 (en) * 2006-07-03 2008-01-10 Lind Finance & Development Ab Fixing device
CN101240850A (zh) * 2007-02-07 2008-08-13 财团法人工业技术研究院 密封结构及其衬垫组件
CN201841141U (zh) * 2010-11-11 2011-05-25 中国石油天然气股份有限公司 油气管道用在线清管器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03116553U (ko) * 1990-03-08 1991-12-03
JPH03293293A (ja) * 1990-04-12 1991-12-24 Nippon Chemicon Corp 機器の搬送補助治具
JPH08200956A (ja) * 1995-01-23 1996-08-09 Sumitomo Electric Ind Ltd 気密容器のシ−ル装置
JP3485104B2 (ja) * 2001-04-24 2004-01-13 日新電機株式会社 イオン源用オーブン
EP1445046A1 (fr) * 2003-02-07 2004-08-11 Vesuvius Crucible Company Dispositif de connexion d'une canalisation de circulation de fluide à une pièce réfractaire et pièce réfractaire
JP4158603B2 (ja) * 2003-06-03 2008-10-01 日新イオン機器株式会社 イオンビーム発生方法およびイオン源
US7871019B1 (en) * 2009-07-01 2011-01-18 Active Products International Limited Pressure-adjustable jet spray nozzle for cleaning machine

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2282298A1 (fr) * 1973-04-12 1976-03-19 Lechler Apparatebau Kg Dispositif pour la fixation etanche de buses sur les pieces de canalisation
CN2285395Y (zh) * 1997-04-18 1998-07-01 王平 一种机械密封装置
CN1481449A (zh) * 2000-12-20 2004-03-10 ͨ�õ�����˾ 将试剂延期注入等离子体的注射器和方法
KR20020074923A (ko) * 2001-03-22 2002-10-04 삼성전자 주식회사 반도체 제조장치의 반응가스 공급노즐
WO2008004964A1 (en) * 2006-07-03 2008-01-10 Lind Finance & Development Ab Fixing device
CN101240850A (zh) * 2007-02-07 2008-08-13 财团法人工业技术研究院 密封结构及其衬垫组件
CN201841141U (zh) * 2010-11-11 2011-05-25 中国石油天然气股份有限公司 油气管道用在线清管器

Also Published As

Publication number Publication date
KR101394265B1 (ko) 2014-05-13
JP5594503B2 (ja) 2014-09-24
KR20140025792A (ko) 2014-03-05
TWI490047B (zh) 2015-07-01
CN103623962A (zh) 2014-03-12
JP2014040664A (ja) 2014-03-06
TW201408378A (zh) 2014-03-01

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160302

Termination date: 20170821