CN103617974A - Positioning and mounting-facilitating lead frame - Google Patents
Positioning and mounting-facilitating lead frame Download PDFInfo
- Publication number
- CN103617974A CN103617974A CN201310548397.3A CN201310548397A CN103617974A CN 103617974 A CN103617974 A CN 103617974A CN 201310548397 A CN201310548397 A CN 201310548397A CN 103617974 A CN103617974 A CN 103617974A
- Authority
- CN
- China
- Prior art keywords
- lead
- lead frame
- location
- positioning
- dowel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a positioning and mounting-facilitating lead frame. Lead frame units (1) are in single-row connection with one another through connecting ribs (2-1, 2-2) so as to form the lead frame; the lead frame unit (1) comprises a lead head (3) and lead pins; the lead head (3) comprises a chip loading area (4) and a heat dissipation sheet (5); the heat dissipation sheet (5) is provided with a positioning and mounting hole (6-1); the ratio of the area of the heat dissipation sheet (5) to the area of the chip loading area (4) is 3:1; the lead pins comprise a middle lead pin (7) and side lead pins (8); the middle lead pin (7) is fixedly connected with the lead head (3); the side lead pins (8) are provided with bonding portions (9); the height of the bonding portions (9) are equal to the width of the chip loading area (4); and the connecting rib (2-2) is provided with positioning and mounting holes (6-2). The positioning and mounting-facilitating lead frame of the invention has the advantages of simple structure as well as convenient installation and positioning, and suitable for forging a plurality of wires.
Description
Technical field
The present invention is specifically related to lead frame, particularly a kind of lead frame of being convenient to location and installation.
Background technology
Development along with electron trade, semiconductor device adopts the more and more many of Plastic Package form, this just need to adapt to the lead frame of various different model plastic devices, and lead frame must adapt to the requirement of heat radiation, conduction and the carrying high-power chip of epoxy seal semiconductor device.In actual applications, lead frame sometimes needs to beat many with silk when breaking silk.
Summary of the invention
The problem to be solved in the present invention is to provide to be a kind ofly simple in structurely convenient to location and installation and to be suitable for beating many lead frames with silk.
For addressing the above problem, technical scheme provided by the invention is: a kind of lead frame of being convenient to location and installation, by lead frame unit, by dowel is single, connected to form, described lead frame unit comprises lead riser and terminal pin, described lead riser comprises slide glass district and fin, described fin is provided with location and installation hole, described fin area: slide glass district area=3:1, described terminal pin comprises middle leads pin and side terminal pin, described middle leads pin is fixedly connected with lead riser, described side terminal pin top is provided with bonding part, described bonding part height is consistent with the width in slide glass district, described dowel is provided with location and installation hole.
As the further improvement of invention, described bonding part is L shaped, and the height of described bonding part is 2.87mm.The width of described dowel is 1.13mm, and the width of described dowel is 2.8mm.The distance in described adjacent positioned hole is: 4.3-4.5mm.
The present invention compared with prior art has the following advantages.
(1), a kind of lead frame of being convenient to location and installation, by lead frame unit, by dowel is single, connected to form, described lead frame unit comprises lead riser and terminal pin, described lead riser comprises slide glass district and fin, described fin is provided with location and installation hole, described fin area: slide glass district area=3:1, described terminal pin comprises middle leads pin and side terminal pin, described middle leads pin is fixedly connected with lead riser, described side terminal pin top is provided with bonding part, described bonding part height is consistent with the width in slide glass district, described dowel is provided with location and installation hole.The present invention's suitability for industrialized production of being convenient to simple in structure, the lead riser part ear that do not go between is convenient to processing, and aperture, location and installation hole is strengthened and is convenient to location and installation, and bonding part strengthens to be convenient to beat multi-filament, is adapted to the specific (special) requirements of particular client.
(2), described bonding part is L shaped, the height of described bonding part is 2.87mm.The width of described dowel is 1.13mm, and the width of described dowel is 2.8mm.The distance in described adjacent positioned hole is 4.3-4.5mm.The shape of bonding part of the present invention is suitable for lead frame and installs and uses.
Accompanying drawing explanation
Fig. 1 is the structural representation that the lead frame of location and installation is convenient in the present invention.
In figure: 1-lead frame unit, 2-1 dowel, 2-2 dowel, 3-lead riser ，4-slide glass district, 5-fin, 6-1 location and installation hole, 6-2 location and installation hole, 7-middle leads pin, 8-side terminal pin, 9-bonding part.
Embodiment
Below in conjunction with drawings and Examples, the present invention is improved further to explanation.
As shown in Figure 1, a kind of lead frame of being convenient to location and installation, by lead frame unit 1, pass through dowel 2-1, 2-2 is single to be connected to form, lead frame unit 1 comprises lead riser 3 and terminal pin, lead riser 3 comprises slide glass district 4 and fin 5, fin 5 is provided with location and installation hole 6-1, fin 5 areas: slide glass district 4 areas=3:1, terminal pin comprises middle leads pin 7 and side terminal pin 8, middle leads pin 7 is fixedly connected with lead riser 3, side terminal pin 8 tops are provided with bonding part 9, bonding part 9 height are consistent with the width in slide glass district 4, dowel 2-2 is provided with location and installation hole 6-2, 10-2.Bonding part 9 is L shaped, and the height of bonding part 9 is 2.87mm.The width of dowel 2-1 is 1.13mm, and the width of dowel 2-2 is 2.8mm.
The distance of adjacent positioned installing hole 6-2 is 4.4mm.
Teachings herein is example of the present invention and explanation; but do not mean that the obtainable advantage of the present invention is so limited, may be to wherein one or more of the advantage realizing in the simple transformation of structure and/or some execution modes all in the application's protection range in every practice process of the present invention.
Claims (4)
1. a lead frame of being convenient to location and installation, by lead frame unit (1), pass through dowel (2-1, 2-2) single connecting to form, it is characterized in that: described lead frame unit (1) comprises lead riser (3) and terminal pin, described lead riser (3) comprises slide glass district (4) and fin (5), described fin (5) is provided with location and installation hole (6-1), described fin (5) area: slide glass district (4) area=3:1, described terminal pin comprises middle leads pin (7) and side terminal pin (8), described middle leads pin (7) is fixedly connected with lead riser (3), described side terminal pin (8) top is provided with bonding part (9), described bonding part (9) height is consistent with the width of slide glass district (4), described dowel (2-2) is provided with location and installation hole (6-2).
2. the lead frame of being convenient to location and installation according to claim 1, is characterized in that: described bonding part (9) is for L shaped, and the height of described bonding part (9) is 2.87mm.
3. the lead frame of being convenient to location and installation according to claim 1, is characterized in that: the width of described dowel (2-1) is 1.13mm, and the width of described dowel (2-2) is 2.8mm.
4. the lead frame of being convenient to location and installation according to claim 1, is characterized in that: the distance of described adjacent positioned installing hole (6-2) is: 4.3-4.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310548397.3A CN103617974A (en) | 2013-11-08 | 2013-11-08 | Positioning and mounting-facilitating lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310548397.3A CN103617974A (en) | 2013-11-08 | 2013-11-08 | Positioning and mounting-facilitating lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103617974A true CN103617974A (en) | 2014-03-05 |
Family
ID=50168677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310548397.3A Pending CN103617974A (en) | 2013-11-08 | 2013-11-08 | Positioning and mounting-facilitating lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103617974A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110073999A1 (en) * | 2009-09-30 | 2011-03-31 | Zhi Qiang Niu | Mixed alloy lead frame for packaging power semiconductor devices and its fabrication method |
| CN201829485U (en) * | 2010-10-21 | 2011-05-11 | 江阴康强电子有限公司 | Dot-type electroplating lead frame |
| CN102637671A (en) * | 2012-04-12 | 2012-08-15 | 张轩 | Novel lead frame |
| CN203617273U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | Lead frame convenient for being positioned and installed |
-
2013
- 2013-11-08 CN CN201310548397.3A patent/CN103617974A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110073999A1 (en) * | 2009-09-30 | 2011-03-31 | Zhi Qiang Niu | Mixed alloy lead frame for packaging power semiconductor devices and its fabrication method |
| CN201829485U (en) * | 2010-10-21 | 2011-05-11 | 江阴康强电子有限公司 | Dot-type electroplating lead frame |
| CN102637671A (en) * | 2012-04-12 | 2012-08-15 | 张轩 | Novel lead frame |
| CN203617273U (en) * | 2013-11-08 | 2014-05-28 | 张轩 | Lead frame convenient for being positioned and installed |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140305 |