CN202034409U - Fixing structure for preventing LED (light-emitting diode) chip from falling off - Google Patents
Fixing structure for preventing LED (light-emitting diode) chip from falling off Download PDFInfo
- Publication number
- CN202034409U CN202034409U CN2011200773660U CN201120077366U CN202034409U CN 202034409 U CN202034409 U CN 202034409U CN 2011200773660 U CN2011200773660 U CN 2011200773660U CN 201120077366 U CN201120077366 U CN 201120077366U CN 202034409 U CN202034409 U CN 202034409U
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- Prior art keywords
- groove
- led chip
- led
- chip
- utility
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a fixing structure for preventing an LED (light-emitting diode) chip from falling off. The fixing structure comprises an epoxy resin lamp cap and a bracket packaged in the epoxy resin lamp cap, a cathode and an anode are fixedly arranged on the bracket, a reflecting cup is arranged on the cathode, a groove is arranged at the bottom part of the reflecting cup, and an LED chip is fixed in the groove. In the utility model, the groove is arranged at the bottom of the reflecting cup, insections are arranged on the side edges of the groove, and the LED chip is fixedly arranged in the groove and is tightly contacted with the insections on the side edges of the groove. As the bottom of the LED chip is bonded at the bottom of the groove by elargol, and the side edges of the groove are contacted with the insections, the contact area of the LED chip and the whole reflecting cup is increased, so that the LED chip is fixed firmly; the fixing mode is realized by a mechanical punching mode, the quality of the LED is greatly improved, and the fault rate of the LED is reduced.
Description
Technical field
The utility model relates to the LED encapsulation technology, particularly a kind of fixed structure that prevents that led chip from coming off.
Background technology
In the existing LED encapsulation process; by being to adopt elargol with the bottom of led chip fixed bonding at reflector; and because the joint face between reflector and the led chip all belongs to even surface; occur coming unstuck or bonding phenomenon such as not firm through regular meeting in the bonding process; thereby cause led chip at the bottom of reflector, to come off; will cause LED not work like this, influence the performance of LED.
Summary of the invention
For solving the fixing not firm problem of led chip in the existing LED encapsulation process, the purpose of this utility model is to provide chip fixed structure at the bottom of a kind of LED cup, microgroove by the reflector bottom increases led chip fixedly elargol and the cup contact-making surface at the end, to reach the purpose of strengthening fixed L ED chip.
For achieving the above object, the utility model mainly adopts following technical scheme:
A kind of fixed structure that prevents that led chip from coming off, include the epoxy resin crown top of burner (1) and be encapsulated in support (2) in the epoxy resin crown top of burner (1), be installed with cathode (3) and anode (5) on the described support (2), described cathode (3) is provided with a reflector (4), this reflector (4) bottom is provided with a groove (401), is fixed with led chip (6) in the described groove (401).
The side of wherein said groove (401) is provided with groove (402), and described groove (402) contacts with the side of led chip (6).
The utility model is by being provided with a groove in reflector bottom, and is provided with groove at the side of this groove, and led chip is fixedly mounted in this groove, and closely contacts with the groove of groove side.Because the led chip bottom is the bottom that is bonded in groove by elargol, side then contacts with groove, therefore increased the contact area of led chip and entire emission cup, thereby make led chip fixing more firm, adopt this fixed form, only need can realize, can improve the quality and the failure rate that has reduced LED of LED greatly by the mode of mechanical stamping.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is the local enlarged diagram in A place among Fig. 1.
Identifier declaration among the figure: the epoxy resin crown top of burner 1, support 2, cathode 3, reflector 4, groove 401, groove 402, anode 5, led chip 6.
Embodiment
For setting forth thought of the present utility model and purpose, the utility model is described further below in conjunction with the drawings and specific embodiments.
See also shown in Figure 1ly, Fig. 1 is a structural representation of the present utility model.The utility model provides a kind of fixed structure that prevents that led chip from coming off, include the epoxy resin crown top of burner 1 and the support 2 that is encapsulated in the epoxy resin crown top of burner 1, be installed with cathode 3 and anode 5 on the described support 2, described cathode 3 is provided with a reflector 4, these reflector 4 bottoms are provided with led chip 6, and this led chip 6 is connected with above-mentioned cathode 3, anode 5 by gold thread respectively.
Be provided with a groove 401 in the bottom of reflector 4, the side of this groove 401 is provided with groove 402, and above-mentioned led chip 6 is fixedly mounted on the groove 401, and the groove 402 by being positioned at groove 401 sides is with its chucking.
Compare by the packaged type that elargol is bonded in the reflector bottom with traditional led chip bottom, the utility model has increased by two aspects fixing more firm of led chip, it passes through on the basis of the bonding encapsulation of elargol original, also the side of led chip is fixed, this fixed form only need process groove at the side of groove by mechanical stamping and get final product.
Above-mentioned fixed form, on the one hand led chip is contacted with the bottom of reflector, simultaneously the bottom side edge joint of led chip and reflector is touched, thereby increased the contact area of led chip greatly, not only be convenient to its heat radiation, and make led chip fixing more firm, thereby the quality and the failure rate that has reduced LED of LED have been improved greatly.
More than a kind of fixed structure that prevents that led chip from coming off described in the utility model is described in detail, used specific case herein principle of the present utility model and execution mode are set forth, above explanation just is used for helping to understand core concept of the present utility model; Simultaneously, for one of ordinary skill in the art, according to thought of the present utility model, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as restriction of the present utility model.
Claims (2)
1. fixed structure that prevents that led chip from coming off, it is characterized in that including the epoxy resin crown top of burner (1) and be encapsulated in support (2) in the epoxy resin crown top of burner (1), be installed with cathode (3) and anode (5) on the described support (2), described cathode (3) is provided with a reflector (4), this reflector (4) bottom is provided with a groove (401), is fixed with led chip (6) in the described groove (401).
2. the fixed structure that prevents that led chip from coming off according to claim 1 is characterized in that the side of described groove (401) is provided with groove (402), and described groove (402) contacts with the side of led chip (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200773660U CN202034409U (en) | 2011-03-22 | 2011-03-22 | Fixing structure for preventing LED (light-emitting diode) chip from falling off |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200773660U CN202034409U (en) | 2011-03-22 | 2011-03-22 | Fixing structure for preventing LED (light-emitting diode) chip from falling off |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202034409U true CN202034409U (en) | 2011-11-09 |
Family
ID=44896697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200773660U Expired - Lifetime CN202034409U (en) | 2011-03-22 | 2011-03-22 | Fixing structure for preventing LED (light-emitting diode) chip from falling off |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202034409U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102779931A (en) * | 2012-07-17 | 2012-11-14 | 福建鸿博光电科技有限公司 | Polarized light type LED (light emitting diode) support, lamp bead and manufacture method of polarized light type LED support |
-
2011
- 2011-03-22 CN CN2011200773660U patent/CN202034409U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102779931A (en) * | 2012-07-17 | 2012-11-14 | 福建鸿博光电科技有限公司 | Polarized light type LED (light emitting diode) support, lamp bead and manufacture method of polarized light type LED support |
| CN102779931B (en) * | 2012-07-17 | 2014-09-17 | 福建鸿博光电科技有限公司 | Polarized light type LED (light emitting diode) support, lamp bead and manufacture method of polarized light type LED support |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wu Ming Inventor after: Kang Qi Inventor after: Li Yimin Inventor before: Wu Ming Inventor before: Lin Ming Inventor before: Li Yimin |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: WU MING LIN MING LI YIMIN TO: WU MING KANG QI LI YIMIN |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000, Shenzhen, Guangdong, Fuyong Baoan District street, Chongqing Road No. 128, the Han Dynasty Laser Industry Park 6, 4 floor, 5 floor Patentee after: Shenzhen Guoyexing Optoelectronics Technology Co., Ltd. Address before: 518000, Shenzhen, Guangdong, Fuyong Baoan District street, Chongqing Road No. 128, the Han Dynasty Laser Industry Park 6, 4 floor, 5 floor Patentee before: Guoye-Xingguang Electronics Co., Ltd., Shenzhen |
|
| CX01 | Expiry of patent term |
Granted publication date: 20111109 |
|
| CX01 | Expiry of patent term |