CN103579062A - Substrate conveying device - Google Patents
Substrate conveying device Download PDFInfo
- Publication number
- CN103579062A CN103579062A CN201310297548.2A CN201310297548A CN103579062A CN 103579062 A CN103579062 A CN 103579062A CN 201310297548 A CN201310297548 A CN 201310297548A CN 103579062 A CN103579062 A CN 103579062A
- Authority
- CN
- China
- Prior art keywords
- substrate
- air
- oscillating plate
- guide
- discharging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/911—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
- B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
- B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
- B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
Abstract
The invention provides a substrate conveying device, which can be used to convey a substrate under the condition of inhibiting the uneven drying of the coating film on the substrate. The device is characterized in that a substrate guide member is used to clamp the floating substrate by ultrasonic wave vibration, and at the same time, the substrate guide member can move forward; the substrate device can convey the substrate in a floating manner; the substrate guide member comprises a substrate abutting part, which abuts against the substrate; a floating unit can be used to float the substrate abutting part from the vibration plate to the determined height; the floating unit comprises an air cushion part comprising an air discharging part used for discharging air to the vibration plate, an air discharging channel used for discharging the air exhausted by the air discharging part; the air discharging channel is disposed between the air discharging part and the substrate abutting against the substrate abutting part, and can be formed to allow the air to discharging through the space formed between the air cushion part and the vibration plate to the position higher than the height of the substrate.
Description
Technical field
The base board delivery device of carrying when the present invention relates to substrate to float from vibration plate vibrates.
Background technology
What on the flat-panel monitor such as liquid crystal display or plasma scope, use is the substrate (being referred to as coated substrates) that is coated with resist liquid on substrate.This coated substrates is produced in the following way: by apparatus for coating painting erosion resistant agent liquid and form coated film on substrate after, being carried by base board delivery device equably on substrate, then by drying device, coated film is dried.
Base board delivery device in recent years, for fear of the back side (a contrary side of the coated face) damaged of coated substrates, carries by non-contacting mode.For example, following base board delivery device being disclosed in patent documentation 1: with air, substrate is floated from platform, in the time of then by substrate guide clamping substrate side surfaces, substrate guide is advanced, thus conveying substrate.
In addition, as can be by ultrasonic vibration by substrate floating by the technology of substrate floating.Particularly, as shown in figure 15, base board delivery device comprises: carry out the oscillating plate 100 of ultrasonic vibration and the substrate guide 101 of guiding substrate W, and by clamping the substrate W in ultrasonic float-up state substrate guide 101 advance conveying substrate W.In addition, sometimes in the rear side of oscillating plate 100, include heating unit (not shown), in course of conveying, by heating unit, can the coated film C on substrate W be dried in this case.
At this, substrate guide 101 comprises: substrate abutting part 102, itself and substrate W side butt; Float unit 103, it remains on described substrate abutting part 102 on oscillating plate 100 specified altitude positions, is the substrate W with 102 clampings of substrate abutting part to be remained on to the parts of float state.Particularly, float air cushion 104 is installed on unit 103, it is relative with oscillating plate 100 and put, and by the air of discharging from air cushion 104, substrate abutting part 102 is floated.And, by advancing of substrate guide 101, the substrate W on oscillating plate 100 can be carried with the state floating, and the coated film C on substrate W is dried.
Prior art document
Patent documentation
Patent documentation 1: JP 2008-166359 communique.
Summary of the invention
But, in above-mentioned base board delivery device, there is the problem that sometimes produces drying mark on the upper coated film C forming of substrate W.That is, in above-mentioned base board delivery device, for the coated film C on substrate W is dry equably, the mode that oscillating plate 100 is greater than to substrate W according to the size of oscillating plate 100 forms, so that irregular being difficult to of temperature produces.Therefore, the air cushion 104 that floats unit 103 must be advanced on oscillating plate 100, and the air of discharging from air cushion 104 flows with radial.Result, the air being discharged from also can flow to the substrate W side (representing with arrow in Figure 15) on same oscillating plate 100, if therefore coated film C is dried under this state, on coated film C, form from air cushion 104 vestige with radial mobile air-flow, have thus the problem that produces drying mark.
The present invention is the invention of carrying out in view of the problem of above-mentioned existence, and it is a kind of in the situation that can suppress to produce in the coated film on substrate the base board delivery device of drying mark conveying substrate that its object is to provide.
In order to solve above-mentioned problem, base board delivery device of the present invention, in the substrate floating by ultrasonic vibration with the clamping of substrate guide on the oscillating plate that produces ultrasonic vibration, substrate guide is advanced, thus substrate is carried with the state floating, it is characterized in that, described substrate guide comprises: substrate abutting part, itself and substrate butt; Float unit, this substrate abutting part floated to specified altitude from oscillating plate, described in float unit and comprise: air cushion portion, it comprises the air discharge portion of discharging air to oscillating plate; Degas passage, it is for escaping from the air of discharging from air discharge portion, described degas passage be at least arranged on described air discharge portion and and the substrate of described substrate abutting part butt between, and form to the mode of escaping from higher than the position of described substrate height according to the air in the gap that makes to form between air cushion portion and oscillating plate.
According to aforesaid substrate conveying device, due at least described air discharge portion and and the substrate of described substrate abutting part butt between be provided with degas passage, the air of therefore discharging from air cushion portion is discharged to the position higher than substrate from the gap forming between air cushion portion and oscillating plate.Therefore, the air flow substrate-side with radial discharge from air cushion portion can be suppressed, thereby the drying mark that the past forms as radial air-flow vestige in coated film can be suppressed.
In addition, the formation of described degas passage can be that the mode that is less than the pressure loss in the gap forming between described air cushion portion and described oscillating plate according to its pressure loss forms.
According to this, form, compare the pressure loss in the gap forming between air cushion portion and oscillating plate, the pressure loss of degas passage is little, and the air of therefore discharging from air cushion portion is discharged by degas passage with discharging to compare more easily by described gap.
In addition, the formation of described degas passage can be to comprise from outside, surrounding the endless groove of described air discharge portion and connecting the through hole to top from described endless groove.
According to this, form, before the air flow air cushion outside of discharging from the air discharge portion of air cushion portion, first flow into endless groove, then from this endless groove, by through hole, discharge.Therefore, can effectively suppress to flow to from air cushion the Air Flow of substrate-side.
In addition, its formation can also be, on described oscillating plate downside, is provided with heating unit, by described heating unit, the coated film forming on substrate is dried.
According to this, form, by the setting of heating unit, compare with the natural drying situation being just transferred on oscillating plate, the drying time of the coated film on substrate is faster.
According to base board delivery device of the present invention, can be in the situation that suppress to produce drying mark conveying substrate in the coated film on substrate.
Accompanying drawing explanation
Fig. 1 is for representing the vertical view of the base board delivery device of an embodiment of the invention;
Fig. 2 is the vertical view after a unit of described base board delivery device is amplified;
Fig. 3 is the end view of a unit of described base board delivery device;
Fig. 4 is the front view of a unit of described base board delivery device;
Fig. 5 is delivered to substrate the vertical view of the state in abutment platforms for representing by the substrate guide of described base board delivery device;
Fig. 6 is for representing described substrate guide and keep out of the way and alignment pin being the vertical view of outstanding state;
Fig. 7 is for representing that the involution of described substrate guide is to the vertical view of the state of original position;
Fig. 8 is the vertical view of described substrate guide;
Fig. 9 is the A-A direction sectional view of Fig. 8;
Figure 10 is the amplification sectional view that floats unit;
Figure 11 is for representing the figure of air cushion portion 55, and Figure 11 (a) is for to see the figure of air cushion portion 55 from bottom surface side; Figure 11 (b) is the sectional view that side is seen from the side;
Figure 12 is for representing the flow chart of described base board delivery device action;
The sectional view that floats unit that Figure 13 is another execution mode;
Figure 14 is the vertical view of the substrate guide of another execution mode;
Figure 15 is for representing the figure of the critical piece of existing base board delivery device.
drawing reference numeral explanation
1 base board delivery device
2 substrates
12 oscillating plates
30 substrate guides
31 substrate guide main bodys
32 guide support portions
32a arm
34 substrate abutting parts
50 float unit
55 air cushion portions
55a air discharge portion
70 degas passages
71 endless grooves
72 through holes.
Embodiment
Utilize accompanying drawing to describe the execution mode of relevant base board delivery device of the present invention.
Fig. 1 is for representing the vertical view of an execution mode of base board delivery device, Fig. 2 is the vertical view after a unit of base board delivery device is amplified, Fig. 3 is the end view of a unit of base board delivery device, the front view of the unit that Fig. 4 is base board delivery device.
In Fig. 1 ~ Fig. 4, base board delivery device 1 is the device for substrate 2 is carried with the state floating, and substrate 2 is delivered to the device of substrate board treatment in the downstream of next operation from the substrate board treatment of upstream side.And, when substrate 2 is delivered to downstream from upstream side, the substrate of supplying with 2 can be delivered to downstream with the state floating not changing nyctitropic situation from upstream side.
In addition, in the following description, the throughput direction that substrate 2 is transferred is as X-direction, with direction rectangular in this X-direction plane as Y direction, with X-direction and Y direction all rectangular direction as Z-direction, describe.
Base board delivery device 1 comprises platform unit 10 and supply unit 20, on the Y direction both sides of platform unit 10, disposes supply unit 20.Platform unit 10 is for loading the device of substrate 2, loaded substrate 2 can be remained on to the state floating.In addition, supply unit 20 is devices of it being carried to throughput direction (X-direction) when retraining for the substrate 2 to floating.That is, from upstream side, be supplied to substrate 2 platform unit 10 is arranged on supply unit 20 on oscillating plate 12 substrate guide 30 constraints when floating.And, by substrate guide 30, to X-direction, advance, substrate 2 is transferred to X-direction thus.
As shown in Figure 3,4, platform unit 10 comprises: oscillating plate 12, and it loads on pedestal 11, and forms with flat condition; Vibration float-up device 13, it floats substrate 2 from the surface vibration of described oscillating plate 12.Oscillating plate 12 is rectangular-shaped flat-shaped parts of being manufactured by metal, disposes a plurality of along throughput direction.In the example of Fig. 1, dispose 4 oscillating plates 12.In addition, oscillating plate 12 comprises that the surperficial 12a(of oscillating plate 12 relative with supplied with substrate 2 and that put also can be referred to as surperficial 12a), its integral body forms with flat condition.In the present embodiment, the surperficial 12a size of oscillating plate 12 is larger than substrate 2 sizes, and the whole face of substrate 2 of supplying with can not expose, relative with the surperficial 12a of described oscillating plate 12 and put.Thus, whole substrate 2 is face-to-face with the surperficial 12a of oscillating plate 12, so the dry environment of the coated film C forming on substrate 2 keeps stable, thereby when coated film C is dried in conveying, can suppress the drying mark that produces because dry environment is inhomogeneous.
That is, in the back side of oscillating plate 12 12b side (a contrary side of surperficial 12a), dispose heating unit 15, by the coated film C on 15 pairs of substrates 2 of this heating unit, be dried.The heating unit 15 of present embodiment is that cartridge heater, encapsulation heater are inserted in the aluminium sheet of rectangle and the device forming becomes thermal source, and these heaters are configured on the position that separates predetermined distance according to the back side 12b mode relative and that put with each oscillating plate 12.Therefore, if heating unit 15 substrate 2 in service is transferred, be subject to be heated from the thermal radiation of oscillating plate 12 back side 12b, the coated film C forming on substrate 2 is thus dry.That is when, substrate 2 is floated conveying, can be dried coated film C.
In addition, on oscillating plate 12, be provided with alignment pin 14, by this alignment pin 14, carried substrate 2 be fixed on assigned position.On an oscillating plate 12, be provided with four these alignment pins 14, on a diagonal, be respectively provided with two alignment pins 14.Particularly, this alignment pin 14 is configured on the position of two angle parts on chucking substrate 2 diagonal when substrate 2 is supplied on oscillating plate 12.That is, alignment pin 14 is configured according to being formed with on the position of minim gap between the size substrate 2 of carried substrate 2 and alignment pin 14.In addition, this alignment pin 14 can carry out lifting action, and when receiving state, whole alignment pin 14 is accommodated in oscillating plate 12, and when projected state, alignment pin 14 protrudes from oscillating plate 12 surfaces.Therefore, alignment pin 14 substrate 2 when receiving state is supplied to, and when substrate 2 is supplied on the surperficial 12a of oscillating plate 12, alignment pin 14 is projected state, and substrate 2 side 2a contact with alignment pin 14, and the position of substrate 2 is fixed thus.; when substrate 2 is supplied on oscillating plate 12, substrate 2 can float and the state in can move freely; by alignment pin 14, contact with the side 2a of substrate 2, the movement of substrate 2 suffers restraints thus, and substrate 2 is fixed on the assigned position (orientation range) on oscillating plate 12.
In addition, vibration float-up device 13 is for supplied with substrate 2 is floated to the device of specified altitude from the surperficial 12a vibration of oscillating plate 12.In the present embodiment, as shown in Figure 3,4, on the back side 12b of oscillating plate 12, be provided with oscillator 13a, supply with the vibration of characteristic frequency by this oscillator 13a, the substrate 2 on oscillating plate 12 can float from the surperficial 12a of oscillating plate 12 thus.Particularly, if for example oscillator 13a vibration, its vibration are communicated with ultrasonic wave, oscillating plate 12 self produces ultrasonic vibration.Thus, between the surperficial 12a of oscillating plate 12 and substrate 2, form small air layer, substrate 2 floats from the surperficial 12a of oscillating plate 12 thus.That is,, if make oscillator 13a vibration by characteristic frequency, substrate 2 remains on oscillating plate 12 to float the state of specified altitude position from the surperficial 12a of oscillating plate 12.
In addition, supply unit 20 is devices of the substrate on oscillating plate 12 2 being carried to throughput direction by substrate guide 30.Supply unit 20 comprises the pedestal 11a extending to a direction, and arranges according to the mode of clamping oscillating plate 12 along the throughput direction of oscillating plate 12.In addition, supply unit 20 comprises substrate guide 30, can move by the feed drive portion 40 with on pedestal 11a a plurality of substrate guides 30 and carry out conveying substrate 2.That is, substrate guide 30 is to arrange accordingly with each oscillating plate 12, and each substrate guide 30 can carry out following action: from an oscillating plate 12, move to the next oscillating plate 12 in downstream, then again involution to former oscillating plate 12.Substrate guide 30 by each oscillating plate 12 carries out such action simultaneously, substrate 2 can be carried to throughput direction.
Particularly, if substrate 2 is fed on an oscillating plate 12, this substrate 2 is by 30 constraints (state of Fig. 1) of substrate guide.And, by the movement of substrate guide 30, be transported to the state of the next oscillating plate 12(Fig. 5 in downstream), then load on the oscillating plate 12 in downstream (state of Fig. 6).Then, substrate guide 30 involutions in downstream (state of Fig. 7) to former oscillating plate 12, the substrate 2 that the substrate guide 30 of the new constraint of laying equal stress on by upstream side is transferred.By each oscillating plate 12, repeat such action, to throughput direction conveying substrate 2.That is, by the relay mode conveying substrate 2 of a plurality of substrate guides 30.
Feed drive portion 40 comprises: guide rail 41, and it extends to a direction; Carry main part 42, its mounted board guide 30; Linear motor 43, it drives carries main part 42.Guide rail 41 is the flat-shaped parts with even surface, according to its level and smooth supine mode, is separately positioned on pedestal 11.That is, as shown in Figure 2,4, guide rail 41 is arranging according to the mode of clamping oscillating plate 12 surperficial 12a with the throughput direction along oscillating plate 12 on the equidistant position of oscillating plate 12 respectively.In addition, the height and position of the even surface of each guide rail 41 is set as respectively on common height and position.
In addition, on the even surface of guide rail 41, be provided with LM guide 44 and linear motor 43.Particularly, the stator (magnet) of the Y direction middle position Linear motor 43 of even surface arranges according to the mode of extending to X-direction, and on the both sides of this stator, LM guide 44 arranges according to the mode of extending to X-direction.And, on this LM guide 44, be connected with and carry main part 42, carry can being connected with stator by mover of arranging on main part 42.Therefore, if by driving linear motor 43 to make to move along stator by mover, carry main part 42 to move along guide rail 41.That is, can control linear motor 43 by driving and make to carry main part 42 to move along X-direction, and stop on can be at an arbitrary position.
Carry main part 42 to comprise the equipped section 42a of mounted board guide 30 and the shank 42b extending from this equipped section 42a, and cross section form roughly " コ " word shape.On this shank 42b, be connected with LM guide 44, and configure according to equipped section 42a mode upward.And, on the 42a of this equipped section, be provided with a substrate guide 30, and the mode laying respectively on oscillating plate 12 diagonal according to substrate guide 30 configures.That is, be configured on the diagonal different from the diagonal that has alignment pin 14.And, if drive to control linear motor 43, under the state of position relationship that keeps existing on diagonal substrate guide 30, carry main part 42 to move to throughput direction.In addition, the dotted line of Fig. 2 represents conveying main part 42 and the substrate guide 30 after movement.
As shown in Figure 8,9, substrate guide 30 comprises: substrate guide main body 31, and it is for retraining substrate 2; Guide support portion 32, it is for supporting this substrate guide main body 31; Float unit 50, it floats substrate guide main body 31 from the surperficial 12a of oscillating plate 12.Further comprise: deviator 60, its make substrate guide main body 31 to the surperficial 12a lateral deviation of oscillating plate 12 to; Substrate guide main body 31 can be maintained on the position of the surperficial 12a specified altitude of oscillating plate 12.
Guide support portion 32 comprises flat arm 32a, is provided with substrate guide main body 31 on its leading section.This arm 32a arranges by elevating mechanism on the equipped section 42a that carries main part 42, and can do lifting action to Z direction with respect to equipped section 42a.In the present embodiment, elevating mechanism is used slide unit cylinder 81, can, by controlling the air supply amount of supplying with to this slide unit cylinder 81, arm 32a be moved to Z direction.That is, the mode that slide unit cylinder 81 can move to Z direction according to the estrade 81a moving with linearity is installed, and on this estrade 81a, by slide unit cylinder 82, arm 32a is installed.And, by controlling air supply amount, arm 32a is moved down, substrate guide main body 31 approaches with substrate 2 thus, and by controlling air supply amount, arm 32a is moved up, and substrate guide main body 31 moves to the direction of leaving from substrate 2 thus.In the present embodiment, substrate guide main body 31 can rise to from the position of constraint substrate 2 position with alignment pin 14 discontiguous degree in projected state always.That is, as shown in Figure 5, substrate 2 is delivered to after the next oscillating plate 12 in downstream, as shown in Figure 6, substrate 2 is in alignment pin 14 constraints of projected state.In addition, in Fig. 1, Fig. 5 ~ 7, alignment pin 14 represents in projected state for black, and alignment pin 14 is that white represents in receiving state.And after making 31 risings of substrate guide main body, by making to carry main part 42 to advance, substrate guide 30 surpasses the top involution always (state of Fig. 7) to former oscillating plate 12 of the alignment pin 14 of this projected state.In addition, this slide unit cylinder 81 also plays the effect of deviator 60 as described later.
In addition, guide support portion 32 comprises driving and reversing mechanism, can make arm 32a with respect to substrate 2 action of advancing and retreat.In the present embodiment, on this driving and reversing mechanism, use slide unit cylinder 82, by controlling the quantity delivered of the air of supplying with to this slide unit cylinder 82, the action that can make substrate guide main body 31 contact and leave with respect to substrate 2.Particularly, the main body of slide unit cylinder 82 is arranged on slide unit cylinder 81, and the mode that can move to the direction at substrate 2 centers that are fixed towards position according to the estrade 82a of the slide unit cylinder 82 moving with linearity is installed.And, by controlling the quantity delivered of the air of supplying with to slide unit cylinder 82, can make estrade 82a to the action of advancing and retreat of the center position of substrate 2.That is the state of keeping out of the way that the projected state that, can make arm 32a be to stretch to the center position of substrate 2 by movement and arm 32a are contracted to main body side.That is,, when substrate 2 is retrained by substrate guide main body 31, make arm 32a to substrate 2 side-prominent (Fig. 7 → Fig. 1), and stop under the state of substrate guide main body 31 and substrate 2 butts.And, as shown in Figure 5, when substrate 2 is transported to next oscillating plate 12, by a contrary side that makes arm 32a move to substrate 2, is and keeps out of the way state, liberate thus the state of substrate 2(Fig. 6).
As shown in Figure 8,9, substrate guide main body 31 is supported by the fore-end of the arm 32a of guide support portion 32.In the present embodiment, two substrate guide main bodys 31 are installed on the fore-end of arm 32a, by these two substrate guide main bodys 31 that are configured on diagonal, contact with substrate 2, can be by substrate 2 constraints.
Substrate guide main body 31 is formed by columnar component, is the substrate abutting part 34 that makes substrate 2 butts at its outer peripheral face.And, these two substrate guide main bodys 31 are fixed on from equidistant position, arm 32a center, if drive slide unit cylinder 82, the arm 32a of guide support portion 32 is side-prominent to substrate 2, and substrate abutting part 34 retrains substrate 2 with substrate 2 side 2a butts thus.That is, by the substrate abutting part 34 of each substrate guide 30 and the side 2a of the angle part of substrate 2 configuring on diagonal, pushed and contact slightly, the activity of the substrate 2 floating on the surperficial 12a of oscillating plate 12 suffers restraints.In addition, even if can't help substrate abutting part 34 to the side 2a extruding of substrate 2, and also can retrain substrate 2 when can form the side 2a butt of the degree in small gap and substrate 2.That is, so long as can be suppressed at the free movable degree of substrate 2 of floating on the surperficial 12a of oscillating plate 12.
In addition, floating unit 50 is by substrate guide main body 31(substrate abutting part 34) device that floats from the surperficial 12a of oscillating plate 12.The unit 50 that floats of present embodiment is arranged on guide support portion 32 in a fixed manner, and is configured between substrate guide main body 31 and the slide unit cylinder 82 of driving and reversing mechanism.That is,, in order to carry out reliably floating of substrate guide main body 31, float unit 50 and be configured on the position close to substrate guide 31.This floats unit 50 and comprises air cushion portion 55.At this, Figure 10 is the amplification sectional view that floats unit 50.In addition, Figure 11 is for representing the figure of air cushion portion 55, and Figure 11 (a) is for to see the figure of air cushion portion 55 from bottom surface side, and Figure 11 (b) is that side is seen the sectional view of air cushion portion 55 from the side.Air cushion portion 55 is disc-shape on the whole, comprises discharging the air discharge portion 55a of air and for covering the housing section 55b of this air discharge portion 55a.This air discharge portion 55a is formed by porous sintering material, and the air that is supplied to housing section 55b is discharged by agglomerated material.That is, by control, be supplied to the air capacity of housing section 55b, can regulate the discharge rate of the air of discharging from air discharge portion 55a.And air cushion portion 55 is that state relative with the surperficial 12a of oscillating plate 12 with air discharge portion 55a and that put is installed.Therefore, if air supply is to air cushion portion 55, by the air discharge portion 55a from air cushion portion 55, to the surperficial 12a of oscillating plate 12, spray air, the substrate guide main body 31 being connected with guide support portion 32 when guide support portion 32 is subject to floating power thus is also subject to floating power, and substrate guide main body 31 is floated slightly from the surperficial 12a of oscillating plate 12 thus.
In addition, deviator 60 is the devices to the surperficial 12a side extruding of oscillating plate 12 by substrate guide main body 31.The deviator 60 of present embodiment is slide unit cylinder 81, by controlling the air of supplying with to slide unit cylinder 81, makes substrate guide main body 31 to the surperficial 12a side extruding of oscillating plate 12.; by controlling air; the estrade 81a of slide unit cylinder 81 is moved down, and the driving and reversing mechanism being connected with estrade 81a thus, guide support portion 32 and substrate guide main body 31 are always subject to downward power, thereby substrate guide main body 31 is to the surperficial 12a side extruding of oscillating plate 12.
The position of the angular force that floats power and deviator 60 by floating unit 50 in balance, can be by substrate guide main body 31(substrate abutting part 34) height and position maintain on the height and position of substrate 2 side 2a.; if discharge air from the air discharge portion 55a of air cushion portion 55; air and oscillating plate 12 bump; therefore comprise that the guide support portion 32 of substrate guide main body 31 will float; but be extruded to surperficial 12a side by the whole guide of deviator 60 support portion 32; between air cushion portion 55 and oscillating plate 12, form under the state in small gap thus, static in poised state to float the angular force that floats power and deviator 60 of unit 50.Like this, substrate guide main body 31(substrate abutting part 34) height and position be maintained on assigned position.And, by mobile supply unit 20 under this state, can make substrate guide main body 31(substrate abutting part 34) with the discontiguous situation of the surperficial 12a of oscillating plate 12 under conveying substrate 2.
In addition, float and on unit 50, be formed with degas passage 70.This degas passage 70 is passages that the air for the air discharge portion 55a from air cushion portion 55 is discharged is escaped from.That is, the air flow substrate 2 for suppressing to discharge from air discharge portion 55a.
This degas passage 70 at least air discharge portion 55a and and substrate abutting part 34 butts and arranging between maintained substrate 2, according to the air in the gap that makes to form between air cushion portion 55 and oscillating plate 12, to the mode of escaping from higher than the height and position of substrate 2, form.As shown in figure 11, the degas passage 70 of present embodiment is formed by endless groove 71 and through hole 72, and described endless groove 71 is to form according to the mode of surrounding air discharge portion 55a, and described through hole 72 is communicated with described endless groove 71.Particularly, it is upper that endless groove 71 is formed on housing section 55b, and according to the mode along the all-round encirclement air of air discharge portion 55a exhaust portion 55a, form circular cannelure 71 on the position apart from air discharge portion 55a given size.And, according to the mode that is communicated with endless groove 71 from housing section 55b top (a contrary side of air discharge portion 55a), be formed with four through holes 72.In the example of Figure 11 (a), in 90 degree directions, form equably four through holes 72.Thus, the air that enters into endless groove 71 can be discharged upward by through hole 72, therefore the air that enters into endless groove 71 can be induced to (exhaust) to outside by through hole 72, can be suppressed at air flow substrate 2 sides (direction of arrow with X of Figure 10) that exist in this gap.
In addition, the little mode of the pressure loss that is less than between air cushion portion 55 and oscillating plate 12 according to the pressure loss of degas passage 70 gap forming forms.Particularly, the endless groove as degas passage 70 71 and through hole 72 are designed to the gap that its channel size is greater than air cushion portion 55 and oscillating plate 12 formation.Thus, because the pressure loss of degas passage 70 is less than the pressure loss in this gap, so compare with this gap, air more easily flows at degas passage 70.Thus, can effectively restrain air flow substrate 2 sides that exist in this gap.That is, the air of discharging from air discharge portion 55a flows to the overall diameter direction of air cushion portion 55 from the gap forming between air discharge portion 55a and oscillating plate 12 with radiation shapes, and flow in endless groove 71.And, the air that flow into endless groove 71 can not flow in the gap forming between the air cushion portion 55 of the outside diameter that the pressure loss is large and oscillating plate 12, but feed pressure loses in the little through hole 72 being communicated with endless groove 71, thus air is discharged to the position higher than the height and position of substrate 2 from through hole 72, thereby the air that can suppress to discharge from air discharge portion 55a flows into substrate 2 sides, and can be suppressed at the upper drying mark that leaves Air Flow vestige that forms of coated film C on substrate 2.
Then, according to the action of the flowchart text base board delivery device shown in Figure 12.
At this, in the state of substrate 2 before being transferred, each substrate guide 30 is in holding state on the position adjacent with each oscillating plate 12, and the arm 32a of guide support portion 32 is in keeping out of the way state.And alignment pin 14 is incorporated in the below of oscillating plate 12 surperficial 12a, and keep this receiving state.
First, by step S1, carry out the location of substrate 2.That is,, in order to retrain substrates 2 with substrate guide 30, carry out the location action of substrate 2.Particularly, if complete the substrate 2 of previous operation, be supplied to, outstanding from the surperficial 12a of oscillating plate 12 by the alignment pin 14 in receiving state, substrate 2 is fixed on to orientation range.; if substrate 2 is fed into by the vibrative oscillating plate 12 of oscillator 13a; substrate 2 floats and freely moves on the surperficial 12a of oscillating plate 12 from the surperficial 12a of oscillating plate 12, but by the mobile restricted system that contacts substrate 2 of the alignment pin 14 with in projected state.Thus, substrate 2 is fixed in orientation range (Fig. 7).
Then, by step S2, undertaken by the constrained action of substrate guide 30.That is, the arm 32a of guide support portion 32 stretches to substrate 2 sides.Particularly, from the air cushion portion 55 ejection air of substrate guide main body 31, this angular force that floats power and deviator 60 is in balance and substrate guide main body 31 is floated when being supported by arm 32a on the surperficial 12a of oscillating plate 12.Under this state, the height and position of substrate abutting part 34 is adjusted on the height and position with the side 2a butt of substrate 2.And if arm 32a stretches, substrate guide main body 31 approaches to the side 2a of substrate 2, when the 2a butt of the side of substrate abutting part 34 and substrate 2, arm 32a stops stretching.That is, the substrate abutting part 34 of four substrate guide main bodys 31 that configure on diagonal and the side 2a butt of the bight part of substrate 2, thus substrate 2 restrained (Fig. 1).Therefore,, in this state, the activity of substrate 2 is by substrate guide 30 and alignment pin 14 constraints.
Then, by step S3 conveying substrate 2.That is, restrained substrate guide 30 is loaded to the next oscillating plate 12 with these current oscillating plate 12 adjacency from current oscillating plate 12, by repeatedly carrying out such action, carrys out conveying substrate 2.Particularly, the alignment pin 14 that retrains substrate 2 activities is declined, make it to become only by the state of substrate guide 30 constraints.And, by driving feed drive portion 40 that substrate guide 30 is moved to downstream.
In course of conveying, by the heating of heating unit 15, the coated film C on substrate 2 is dried.That is, oscillating plate 12 forms larger than substrate 2, and the radiant heat oscillating plate 12 by heating unit 15 is uniformly heated.Therefore the coated film C, floating on the substrate 2 on oscillating plate 12 is also uniformly heated.
In addition, in course of conveying, by the air cushion portion 55 from substrate guide 30, spray constantly air, substrate guide main body 31 can be maintained to the state floating from the surperficial 12a of oscillating plate 12, the air of simultaneously discharging from air cushion portion 55 by degas passage 70 to escaping from higher than the position of substrate 2.; the air of discharging from the air discharge portion 55a of air cushion portion 55 flows to the overall diameter direction of air cushion portion 55 in radial mode from the gap by forming between air discharge portion 55a and oscillating plate 12, but flow into after endless groove 71 from through hole 72 discharges.Thus, can suppress from air flow substrate 2 sides of air cushion portion 55 discharges, thereby upper formation of coated film C that can suppress on substrate 2 left the drying mark as the vestige of Air Flow.
And, if substrate 2 arrives on the next oscillating plate 12 of adjacency on downstreams, the driven control of feed drive portion 40 and substrate guide 30 is stopped.That is when, alignment pin 14 is projected state, make it stop at the position (Fig. 5) that substrate 2 back sides and alignment pin 14 do not bump.
Then, by step S4, undertaken by the liberation of the substrate 2 of substrate guide 30.Particularly, alignment pin 14 is outstanding from the surperficial 12a of oscillating plate 12, and the substrate 2 being transferred is retrained by described alignment pin 14 on the surperficial 12a of next oscillating plate 12 in downstream.That is, substrate 2 pin 14 and substrate guide 30 constraints that are positioned.And, the arm 32a of substrate guide 30 keep out of the way and involution to original position, by elevating mechanism arm 32a, rise simultaneously.That is, substrate guide main body 31 rises to the position not contacting with alignment pin 14 always.Carry out thus by the liberation of the substrate 2 of substrate guide 30 pin 14 constraints (Fig. 6) thereby 2 of substrates are positioned.
Then, if arm 32a keep out of the way action and vertical motion finish, by 30 involutions of step S5 substrate guide to original position (Fig. 7).That is,, by driving feed drive portion 40, substrate guide 30 is moved to and the oscillating plate 12 of upstream side of liberating oscillating plate 12 adjacency of substrate 2.Now, in order to retrain substrate 2, alignment pin 14 is in outstanding state, but therefore the position rising to higher than alignment pin 14 due to substrate guide main body 31 the situation that substrate guide main body 31 contacts with alignment pin 14 due to the movement of substrate guide 30 can not occur.
And, be delivered to substrate 2 on the oscillating plate 12 in downstream by from being arranged at first substrate guide 30 oscillating plate 12, from substrate guide 30 constraints of oscillating plate 12 involutions in these oscillating plate 12 downstreams, and be further delivered on the oscillating plate 12 in downstream.Like this, by be arranged on substrate guide 30 substrates 2 on each oscillating plate 12 by relay-type be tied and be moved on the oscillating plate 12 in next downstream, substrate 2 is transported to the final position of base board delivery device 1 thus.
So, according to base board delivery device 1, can be in the situation that suppress, on the coated film C on substrate 2, drying mark conveying substrate 2 occurs.
In addition, in the above-described embodiment, about the structure of degas passage 70, the example of endless groove 71 and through hole 72 has been described, but can also has been other structure.For example, as shown in figure 13, the structure of set degas passage 70 can also be that on housing section 55b outside, installation has the endless member 57 of another parts of conduct of given size, makes thus endless groove 71 directly penetrate into top.That is, as long as form according to the air in the gap forming between air cushion portion 55 and oscillating plate 12 is put to the mode of running to higher than substrate 2 height and positions.
In addition, the endless groove 71 that degas passage 70 has been described is in the above-described embodiment examples of the continuous groove of ring-type, but can also be intermittent groove.So long as be at least arranged on air discharge portion 55a and and the substrate 2 of substrate abutting part 34 butts between structure, can suppress air flow substrate 2 sides of discharging from air discharge portion 55a.
In addition, having illustrated in the above-described embodiment and utilized heating unit 15 forcibly to carry out dry example, but except so enforceable heat drying, can also be not carry out mandatory heating but by naturally transporting the formation being dried.
In addition, in the above-described embodiment, the situation of only having one to float unit 50 has been described about substrate guide 30, but can also has been on a substrate guide 30, to use the plural unit 50 that floats.That is, as shown in figure 14, the arm 32a of guide support portion 32 makes L word shape, and substrate guide main body 31(substrate abutting part 34 is set on two fore-end), and unit 50 is floated in setting near substrate guide main body 31 separately.Thus, due to each substrate guide main body 31(substrate abutting part 34) near be provided with and float unit 50, therefore can make substrate guide main body 31(substrate abutting part 34) reliably and stably float.And, by floating at these on unit 50, degas passage 70 being set, can suppress from floating air flow substrate 2 sides of air cushion portion 55 discharges of unit 50, therefore can suppress the upper drying mark that produces of coated film C on substrate 2.
Claims (4)
1. a base board delivery device, advances substrate guide in the substrate floating on the oscillating plate that produces ultrasonic vibration with the clamping of substrate guide by ultrasonic vibration, thus substrate is carried with the state floating, it is characterized in that,
Described substrate guide comprises:
Substrate abutting part, itself and substrate butt;
Float unit, this substrate abutting part floated to specified altitude from oscillating plate,
Describedly float unit and comprise: air cushion portion, it comprises the air discharge portion of discharging air to oscillating plate; Degas passage, it is for escaping from the air of discharging from air discharge portion;
Described degas passage be at least arranged on described air discharge portion and and the substrate of described substrate abutting part butt between, and form to the mode of escaping from higher than the position of described substrate height according to the air in the gap that makes to form between air cushion portion and oscillating plate.
2. base board delivery device according to claim 1, is characterized in that, the mode that described degas passage is less than the pressure loss in the gap forming between described air cushion portion and described oscillating plate according to its pressure loss forms.
3. base board delivery device according to claim 1 and 2, is characterized in that, described degas passage comprises endless groove and the through hole from described endless groove perforation to top that surrounds air discharge portion from outside.
4. according to the base board delivery device described in claims 1 to 3 any one, it is characterized in that, at described oscillating plate downside, be provided with heating unit, by described heating unit, the coated film forming on substrate is dried.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-159165 | 2012-07-18 | ||
| JP2012159165A JP6033593B2 (en) | 2012-07-18 | 2012-07-18 | Substrate transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103579062A true CN103579062A (en) | 2014-02-12 |
| CN103579062B CN103579062B (en) | 2017-07-28 |
Family
ID=50050552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310297548.2A Expired - Fee Related CN103579062B (en) | 2012-07-18 | 2013-07-16 | Base board delivery device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6033593B2 (en) |
| KR (1) | KR20140011472A (en) |
| CN (1) | CN103579062B (en) |
| TW (1) | TWI557835B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105151780A (en) * | 2015-08-28 | 2015-12-16 | 武汉华星光电技术有限公司 | Ultrasonic conveying device |
| CN106784411A (en) * | 2017-03-09 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of film levelling equipment |
| CN109148344A (en) * | 2017-06-19 | 2019-01-04 | 细美事有限公司 | Transfer guide assembly and base plate transfer device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6629876B2 (en) * | 2015-10-27 | 2020-01-15 | 平田機工株式会社 | Transfer unit, transfer device and transfer method |
| KR101865274B1 (en) * | 2016-08-31 | 2018-06-07 | 씨디에스(주) | Device for floating substrate using sloped structure |
| KR101958111B1 (en) * | 2017-09-29 | 2019-03-14 | 씨디에스(주) | Device for floating substrate using sloped structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0380962A (en) * | 1989-08-25 | 1991-04-05 | Hitachi Ltd | Coating apparatus |
| JP2006282345A (en) * | 2005-04-01 | 2006-10-19 | Hiroshi Akashi | Non-contact carrying device |
| CN101254495A (en) * | 2007-03-02 | 2008-09-03 | 东京应化工业株式会社 | Conveying coating apparatus of substrate |
| JP2009253135A (en) * | 2008-04-09 | 2009-10-29 | Psc Kk | Gas pressure support mechanism for plate material |
| CN101829647A (en) * | 2009-03-11 | 2010-09-15 | 东丽工程株式会社 | Decompression drying device |
| CN102437076A (en) * | 2010-09-27 | 2012-05-02 | 东丽工程株式会社 | Substrate delivery device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09132309A (en) * | 1995-11-09 | 1997-05-20 | Dainippon Screen Mfg Co Ltd | Substrate conveying device |
| JP4608954B2 (en) * | 2004-06-09 | 2011-01-12 | 株式会社Ｉｈｉ | Transport device |
| JP4992906B2 (en) * | 2006-10-03 | 2012-08-08 | 株式会社Ｉｈｉ | Substrate transfer system |
| JP2008260591A (en) * | 2007-04-10 | 2008-10-30 | Nippon Sekkei Kogyo:Kk | Sheet-like material conveying device and method |
| WO2009063562A1 (en) * | 2007-11-15 | 2009-05-22 | Hirata Corporation | Substrate transport device |
| JP5099435B2 (en) * | 2008-03-05 | 2012-12-19 | 独立行政法人国立高等専門学校機構 | Non-contact transfer device |
| JP2010238986A (en) * | 2009-03-31 | 2010-10-21 | Nikon Corp | Exposure apparatus and device manufacturing method |
| JP5081261B2 (en) * | 2010-02-24 | 2012-11-28 | 東京エレクトロン株式会社 | Coating device |
| JP2011213435A (en) * | 2010-03-31 | 2011-10-27 | Toray Eng Co Ltd | Carrying device and applying system |
| JP2012091122A (en) * | 2010-10-27 | 2012-05-17 | Toray Eng Co Ltd | Coating system |
-
2012
- 2012-07-18 JP JP2012159165A patent/JP6033593B2/en not_active Expired - Fee Related
-
2013
- 2013-06-04 TW TW102119741A patent/TWI557835B/en not_active IP Right Cessation
- 2013-07-15 KR KR1020130082827A patent/KR20140011472A/en not_active Application Discontinuation
- 2013-07-16 CN CN201310297548.2A patent/CN103579062B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0380962A (en) * | 1989-08-25 | 1991-04-05 | Hitachi Ltd | Coating apparatus |
| JP2006282345A (en) * | 2005-04-01 | 2006-10-19 | Hiroshi Akashi | Non-contact carrying device |
| CN101254495A (en) * | 2007-03-02 | 2008-09-03 | 东京应化工业株式会社 | Conveying coating apparatus of substrate |
| JP2009253135A (en) * | 2008-04-09 | 2009-10-29 | Psc Kk | Gas pressure support mechanism for plate material |
| CN101829647A (en) * | 2009-03-11 | 2010-09-15 | 东丽工程株式会社 | Decompression drying device |
| CN102437076A (en) * | 2010-09-27 | 2012-05-02 | 东丽工程株式会社 | Substrate delivery device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105151780A (en) * | 2015-08-28 | 2015-12-16 | 武汉华星光电技术有限公司 | Ultrasonic conveying device |
| CN106784411A (en) * | 2017-03-09 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of film levelling equipment |
| CN109148344A (en) * | 2017-06-19 | 2019-01-04 | 细美事有限公司 | Transfer guide assembly and base plate transfer device |
| CN109148344B (en) * | 2017-06-19 | 2024-01-09 | 细美事有限公司 | Transfer guide assembly and substrate transfer device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103579062B (en) | 2017-07-28 |
| KR20140011472A (en) | 2014-01-28 |
| JP6033593B2 (en) | 2016-11-30 |
| TWI557835B (en) | 2016-11-11 |
| JP2014022532A (en) | 2014-02-03 |
| TW201405698A (en) | 2014-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103579062A (en) | Substrate conveying device | |
| KR101707090B1 (en) | Substrate transport system | |
| TW202004984A (en) | Gas floated workpiece supporting apparatus and noncontact workpiece support method | |
| JP2011148593A (en) | Substrate carrying device and substrate carrying method | |
| JP2011213435A (en) | Carrying device and applying system | |
| KR101845090B1 (en) | Apparatus for coating film and method of coating film | |
| JP2010192684A (en) | Substrate transfer apparatus and substrate treatment system | |
| JP2011056335A (en) | Apparatus for pre-drying and method of pre-drying | |
| KR20080085646A (en) | Substrate transfering apparatus | |
| JP5733636B2 (en) | Nozzle unit, substrate processing apparatus, and substrate processing method | |
| CN106684014B (en) | Substrate floating and conveying device | |
| CN108325788B (en) | Coating device and coating method | |
| JP2012201437A (en) | Base board carrying device and base board carrying method | |
| KR20130017443A (en) | Substrate coating apparatus, substrate conveyance apparatus having the function for floating the surface and the method of conveying floating the substrate | |
| JP4982292B2 (en) | Coating apparatus and coating method | |
| US20220081227A1 (en) | Devices, systems, and methods for controlling floatation of a substrate | |
| JP5165718B2 (en) | Substrate processing equipment | |
| JP2010159164A (en) | Vacuum processing device, vacuum processing system and processing method | |
| JP5465846B2 (en) | Substrate heating apparatus, liquid material coating apparatus including the same, and substrate heating method | |
| JP6860357B2 (en) | Coating device and coating method | |
| KR101350950B1 (en) | Nozzle unit, substrate treating apparatus and substrate treating method | |
| CN102437076A (en) | Substrate delivery device | |
| TW201338868A (en) | Coating device | |
| KR20150105696A (en) | Wafer transfer device | |
| KR101328159B1 (en) | Control apparatus and method for coating and transferring of glass panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170728 |