CN103571412B - 高压条件下具有增强可靠性的粘胶剂及使用该粘胶剂用于半导体封装的胶带 - Google Patents

高压条件下具有增强可靠性的粘胶剂及使用该粘胶剂用于半导体封装的胶带 Download PDF

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Publication number
CN103571412B
CN103571412B CN201310282858.7A CN201310282858A CN103571412B CN 103571412 B CN103571412 B CN 103571412B CN 201310282858 A CN201310282858 A CN 201310282858A CN 103571412 B CN103571412 B CN 103571412B
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CN
China
Prior art keywords
adhesive
adhesive tape
epoxy
component
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201310282858.7A
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English (en)
Chinese (zh)
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CN103571412A (zh
Inventor
洪昇佑
崔城焕
金晟镇
金演秀
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Toray Advanced Materials Korea Inc
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Toray Advanced Materials Korea Inc
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Publication date
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Publication of CN103571412A publication Critical patent/CN103571412A/zh
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Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lead Frames For Integrated Circuits (AREA)
CN201310282858.7A 2012-07-18 2013-07-05 高压条件下具有增强可靠性的粘胶剂及使用该粘胶剂用于半导体封装的胶带 Expired - Fee Related CN103571412B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0078113 2012-07-18
KR20120078113 2012-07-18

Publications (2)

Publication Number Publication Date
CN103571412A CN103571412A (zh) 2014-02-12
CN103571412B true CN103571412B (zh) 2017-05-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310282858.7A Expired - Fee Related CN103571412B (zh) 2012-07-18 2013-07-05 高压条件下具有增强可靠性的粘胶剂及使用该粘胶剂用于半导体封装的胶带

Country Status (4)

Country Link
JP (1) JP5799056B2 (ko)
KR (1) KR101395322B1 (ko)
CN (1) CN103571412B (ko)
TW (1) TWI500734B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR112017012644B1 (pt) * 2014-12-18 2022-04-19 Cytec Industries Inc Processo de fabricação para produzir um artigo moldado por infusão de resina líquida, composição curável, artigo moldado curado, e, uso de uma composição curável
CN104974471B (zh) * 2015-07-14 2017-12-05 江苏兆鋆新材料股份有限公司 一种高耐热、高韧性环氧树脂碳纤维复合材料的制备方法
CN106281175A (zh) * 2016-09-22 2017-01-04 佛山慧创正元新材料科技有限公司 一种pet薄膜用环氧树脂胶粘剂
JP6739390B2 (ja) * 2017-03-30 2020-08-12 富士フイルム株式会社 有機ｅｌ画像表示装置の製造方法
TWI719419B (zh) * 2019-03-11 2021-02-21 台光電子材料股份有限公司 環氧樹脂組成物及由其製成的物品
CN114945645A (zh) * 2020-03-31 2022-08-26 株式会社有泽制作所 粘合带
CN114806432A (zh) * 2022-03-23 2022-07-29 东莞市穗滢新型材料科技有限公司 一种防老化耐高温聚酰亚胺胶带及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5863988A (en) * 1995-12-25 1999-01-26 Tomoegawa Paper Co., Ltd. Liquid adhesive for electronic parts and adhesive tape
CN101210162A (zh) * 2006-12-28 2008-07-02 西安西电变压器有限责任公司 一种半导体胶及其制备方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3118420B2 (ja) * 1996-06-12 2000-12-18 株式会社巴川製紙所 電子部品用液状接着剤および接着テープ
JP4577716B2 (ja) * 2005-01-21 2010-11-10 日本化薬株式会社 加熱硬化型エポキシ樹脂組成物及びその硬化接着層を有する物品
JP2008074891A (ja) * 2006-09-19 2008-04-03 Daicel-Cytec Co Ltd 熱硬化性または活性エネルギー線硬化性の組成物およびフィルム
WO2008060280A1 (en) * 2006-11-16 2008-05-22 Henkel Ag & Co. Kgaa Board on chip package and process for making same
KR20100049499A (ko) * 2008-10-24 2010-05-12 스미토모 베이클리트 컴퍼니 리미티드 반도체용 접착제 조성물 및 그것을 이용하여 제조한 반도체 장치
JP5670048B2 (ja) * 2009-12-21 2015-02-18 株式会社Ｄｎｐファインケミカル 接着組成物および硬化性接着シートの製造方法
KR101045262B1 (ko) * 2009-12-21 2011-06-29 제일모직주식회사 스텔스 다이싱용 반도체용 접착 조성물 및 이를 이용한 접착 필름
KR101374364B1 (ko) * 2010-12-27 2014-03-17 제일모직주식회사 반도체용 접착 조성물 및 이를 포함하는 접착 필름
WO2012091306A2 (ko) * 2010-12-27 2012-07-05 제일모직 주식회사 반도체용 접착 조성물 및 이를 이용하는 접착 필름

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5863988A (en) * 1995-12-25 1999-01-26 Tomoegawa Paper Co., Ltd. Liquid adhesive for electronic parts and adhesive tape
CN101210162A (zh) * 2006-12-28 2008-07-02 西安西电变压器有限责任公司 一种半导体胶及其制备方法

Also Published As

Publication number Publication date
JP2014019869A (ja) 2014-02-03
KR101395322B1 (ko) 2014-05-16
CN103571412A (zh) 2014-02-12
JP5799056B2 (ja) 2015-10-21
TWI500734B (zh) 2015-09-21
KR20140011906A (ko) 2014-01-29
TW201404857A (zh) 2014-02-01

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Granted publication date: 20170524