TWI500734B - 於高電壓情況時可具增進可靠度之黏著劑組合物及使用此種組合物之半導體封裝用膠帶 - Google Patents

於高電壓情況時可具增進可靠度之黏著劑組合物及使用此種組合物之半導體封裝用膠帶 Download PDF

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Publication number
TWI500734B
TWI500734B TW102121144A TW102121144A TWI500734B TW I500734 B TWI500734 B TW I500734B TW 102121144 A TW102121144 A TW 102121144A TW 102121144 A TW102121144 A TW 102121144A TW I500734 B TWI500734 B TW I500734B
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TW
Taiwan
Prior art keywords
adhesive composition
weight
tape
resin
epoxy
Prior art date
Application number
TW102121144A
Other languages
English (en)
Chinese (zh)
Other versions
TW201404857A (zh
Inventor
Seung Woo Hong
Sung Hwan Choi
Sung Jin Kim
Yeon Soo Kim
Original Assignee
Toray Advanced Mat Korea Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Advanced Mat Korea Inc filed Critical Toray Advanced Mat Korea Inc
Publication of TW201404857A publication Critical patent/TW201404857A/zh
Application granted granted Critical
Publication of TWI500734B publication Critical patent/TWI500734B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW102121144A 2012-07-18 2013-06-14 於高電壓情況時可具增進可靠度之黏著劑組合物及使用此種組合物之半導體封裝用膠帶 TWI500734B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20120078113 2012-07-18

Publications (2)

Publication Number Publication Date
TW201404857A TW201404857A (zh) 2014-02-01
TWI500734B true TWI500734B (zh) 2015-09-21

Family

ID=50044136

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102121144A TWI500734B (zh) 2012-07-18 2013-06-14 於高電壓情況時可具增進可靠度之黏著劑組合物及使用此種組合物之半導體封裝用膠帶

Country Status (4)

Country Link
JP (1) JP5799056B2 (ko)
KR (1) KR101395322B1 (ko)
CN (1) CN103571412B (ko)
TW (1) TWI500734B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR112017012644B1 (pt) * 2014-12-18 2022-04-19 Cytec Industries Inc Processo de fabricação para produzir um artigo moldado por infusão de resina líquida, composição curável, artigo moldado curado, e, uso de uma composição curável
CN104974471B (zh) * 2015-07-14 2017-12-05 江苏兆鋆新材料股份有限公司 一种高耐热、高韧性环氧树脂碳纤维复合材料的制备方法
CN106281175A (zh) * 2016-09-22 2017-01-04 佛山慧创正元新材料科技有限公司 一种pet薄膜用环氧树脂胶粘剂
JP6739390B2 (ja) * 2017-03-30 2020-08-12 富士フイルム株式会社 有機ｅｌ画像表示装置の製造方法
TWI719419B (zh) * 2019-03-11 2021-02-21 台光電子材料股份有限公司 環氧樹脂組成物及由其製成的物品
CN114945645A (zh) * 2020-03-31 2022-08-26 株式会社有泽制作所 粘合带
CN114806432A (zh) * 2022-03-23 2022-07-29 东莞市穗滢新型材料科技有限公司 一种防老化耐高温聚酰亚胺胶带及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101589465A (zh) * 2006-11-16 2009-11-25 汉高股份两合公司 芯片上板封装及其制造方法
TW201016734A (en) * 2008-10-24 2010-05-01 Sumitomo Bakelite Co Adhesive composition for semiconductor and semiconductor device manufactured using the same
TW201130941A (en) * 2009-12-21 2011-09-16 Cheil Ind Inc Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device including the adhesive film
TW201229190A (en) * 2010-12-27 2012-07-16 Cheil Ind Inc Adhesive composition for semiconductor and adhesive film comprising the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3118420B2 (ja) * 1996-06-12 2000-12-18 株式会社巴川製紙所 電子部品用液状接着剤および接着テープ
US5863988A (en) * 1995-12-25 1999-01-26 Tomoegawa Paper Co., Ltd. Liquid adhesive for electronic parts and adhesive tape
JP4577716B2 (ja) * 2005-01-21 2010-11-10 日本化薬株式会社 加熱硬化型エポキシ樹脂組成物及びその硬化接着層を有する物品
JP2008074891A (ja) * 2006-09-19 2008-04-03 Daicel-Cytec Co Ltd 熱硬化性または活性エネルギー線硬化性の組成物およびフィルム
CN101210162B (zh) * 2006-12-28 2011-11-30 西安西电变压器有限责任公司 一种半导体胶及其制备方法
JP5670048B2 (ja) * 2009-12-21 2015-02-18 株式会社Ｄｎｐファインケミカル 接着組成物および硬化性接着シートの製造方法
KR101374364B1 (ko) * 2010-12-27 2014-03-17 제일모직주식회사 반도체용 접착 조성물 및 이를 포함하는 접착 필름

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101589465A (zh) * 2006-11-16 2009-11-25 汉高股份两合公司 芯片上板封装及其制造方法
TW201016734A (en) * 2008-10-24 2010-05-01 Sumitomo Bakelite Co Adhesive composition for semiconductor and semiconductor device manufactured using the same
TW201130941A (en) * 2009-12-21 2011-09-16 Cheil Ind Inc Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device including the adhesive film
TW201229190A (en) * 2010-12-27 2012-07-16 Cheil Ind Inc Adhesive composition for semiconductor and adhesive film comprising the same

Also Published As

Publication number Publication date
JP2014019869A (ja) 2014-02-03
KR101395322B1 (ko) 2014-05-16
CN103571412A (zh) 2014-02-12
JP5799056B2 (ja) 2015-10-21
CN103571412B (zh) 2017-05-24
KR20140011906A (ko) 2014-01-29
TW201404857A (zh) 2014-02-01

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