CN101589465A - 芯片上板封装及其制造方法 - Google Patents
芯片上板封装及其制造方法 Download PDFInfo
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- CN101589465A CN101589465A CNA200680056397XA CN200680056397A CN101589465A CN 101589465 A CN101589465 A CN 101589465A CN A200680056397X A CNA200680056397X A CN A200680056397XA CN 200680056397 A CN200680056397 A CN 200680056397A CN 101589465 A CN101589465 A CN 101589465A
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Images
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Abstract
芯片上板(BOC)类型半导体封装包括带有开口的衬底和在有源表面带有导电区的半导体管芯。所述管芯安装在所述衬底上,使有源表面面对衬底的上表面并且完全覆盖衬底中的开口。管芯的有源表面的导电区暴露于衬底中的开口。使用粘合剂将管芯连接至衬底,并用引线键合穿过衬底的开口将管芯电连接至衬底。用填充衬底中的开口的密封剂保护引线键合。在密封剂以外的区域将焊料球植入到衬底的下表面上。所述封装的特征为管芯的无源面无密封剂以及管芯的侧面无密封剂。
Description
发明领域
【0001】本发明涉及半导体封装及其制造方法。
发明背景
【0002】DRAM(动态随机存取存储器(dynamic random accessmemory))存储设备的半导体封装技术的近来发展是芯片上板(board-on-chip)或BOC封装。这些封装也称为开窗型半导体封装(window-type semiconductor package),其包括形成有穿透其中的开口的衬底;半导体芯片或管芯,其通过粘合剂以面向下的方式安装在衬底上表面的所述开口上,以使芯片的有源表面面对衬底并且部分暴露于开口。多个键合引线将管芯的有源表面,穿过开口,连接至衬底的下表面。第一密封剂形成在衬底的下表面上,用于填充开口和密封键合引线,第二密封剂形成在衬底的上表面上,用于密封芯片的背面和/或侧面。多个焊料球被附着至衬底的下表面并位于第一密封剂外。
【0003】在实践中,可使用至少两种不同方法来制造BOC封装。在一个方法中,可印刷粘合膏(a printable adhesive paste)被施加至衬底,并在管芯附着之前进行B阶处理至非粘性状态。通常地,将几个管芯安装在单一衬底上,以便可由单个板制造多个封装。在塑封(molding)和焊料球附着后,将封装彼此分开以产生单个封装。图1显示在该方法的典型实施方式中封装的俯视图以及图2显示该封装的剖视图,其中粘合剂12被印刷在衬底10的顶表面101上,其印刷图样(pattern)可使管芯11安装在衬底10中的开口100上。管芯11附着在粘合剂12上后,穿过开口100从管芯11有源面111上的引线键合焊盘112至衬底10的底面102形成引线键合13。
【0004】然后,在塑封过程中,将密封剂15施加在引线键合13、管芯11的无源面110和管芯11的侧面113上。塑封后,将焊料球14应用于衬底10的底面102并且在锯切操作中,将封装彼此分开。图3显示代表该方法另一个典型实施方式的封装的横截面,其中管芯11的无源面110不被密封,但是管芯11的侧面113被密封。
【0005】这种常规方法具有几个缺点。如图1和2所示,粘合剂12不能沿开口100的整个周长印刷,留下了管芯11的有源表面111与衬底10的上表面101之间的间隙G。这些在粘合剂12中的间隙G使得必须在管芯的无源面和/或侧面使用密封剂15,原因在于在引线键合13的密装期间,密封剂15会在衬底10和管芯11之间流动并且沿管芯11的侧面113和/或无源面110流出。而且,管芯11的无源面110和/或侧面113在塑封化合物中密封,并且大面积的的塑封可导致衬底变形,原因在于在塑封过程中固有的热应力。这就使得必须将管芯以在塑封过程中允许衬底应力释放的构造进行布置。
【0006】图4A显示了可从单个衬底10产生多个封装的典型构造。在该构造中,粘合剂12被印在衬底10中开口100周围的区域,以使管芯可随后安装在粘合剂12上覆盖开口100的位置。在该构造中,应力释放通过被塑封的封装块之间加入未被塑封的衬底区域来提供,其包括在塑封的封装块之间区域的衬底10中的狭缝104。图4B是该构造的放大图,其显示由狭缝104提供的应力释放区使得必须使用明显比存储器封装本身所需要的明显更大的衬底区域。由于衬底10是一种在存储器封装中使用的较昂贵材料,所以这种浪费是非常不期望的。最后,塑封过程中固有的温度和压力在半导体管芯上产生热应力,其可导致低的器件产量。
【0007】图5显示了使用第二方法制造的BOC封装的俯视图以及图6显示了其剖视图。在该方法中,胶带粘合剂17,其具有对应于衬底的开口100位置的孔,被施加在衬底10的顶表面101的胶带粘附区105上,粘合剂胶带的孔与衬底的开口对准。因此,粘合剂胶带17被放入管芯11的有源表面111与衬底的上表面101之间,而没有在管芯11和衬底10之间形成任何间隙。管芯11被粘附至胶带粘合剂17上后,通过开口100,从管芯11的有源面111上的引线键合焊盘112至衬底10的底面102形成引线键合13。然后,在一个步骤中,将密封剂15施加在引线键合13上,并且在塑封过程中,将第二密封剂16施加在管芯11的侧面113上。塑封后,将焊料球14施加至衬底10的底面102并在锯切操作中将封装彼此分开。
【0008】在另一个实施方式中,密封剂被施加至管芯的无源面以及管芯的侧面。虽然由于未被粘合剂覆盖并且接近衬底的开口的区域,该方法排除了管芯的有源表面和衬底的上表面之间的间隙问题,但是它仍就有明显的缺点。首先,使用胶带粘合剂比易流动的粘合剂例如可印刷膏要昂贵得多。其次,管芯不能完全对准地放置在胶带上,其可导致在管芯下存在一些间隙。最后,该方法需要在塑封过程中密封管芯的侧面和/或背面。因此,如在上述方法中一样,存在明显的衬底浪费,并且在管芯上存在热应力。
【0009】拥有可以克服这两种方法的缺点的半导体封装以及制造那种封装的方法是非常有利的,其通过能够使用易流动的管芯附着膏、消除管芯的有源表面和衬底的上表面之间的间隙、减少衬底浪费和消除在用于密封管芯的背面和/或侧面的塑封过程中产生对管芯的热应力来进行。
发明概述
【0010】本发明是半导体封装,其包括:a)衬底,其具有上表面、与所述上表面相对的下表面、穿透所述上下表面的开口、以及所述下表面上的引线键合焊盘;b)半导体管芯,其具有带有一个或多个导电区的有源面和与所述有源面相对的无源面,所述半导体管芯安装在所述衬底上,使所述有源面放置其上并且完全覆盖穿透所述衬底上下表面的开口;c)粘合剂,被放置在所述衬底的上表面和所述管芯的有源面之间并连接它们,以使所述管芯的有源面,除所述导电区外,完全被粘合剂覆盖;d)多个导电键合引线,其将所述管芯的有源面的导电区,通过衬底中的开口,连接至所述衬底的下表面上的引线键合焊盘;e)密封剂,其施加至所述衬底的下表面上,密封所述键合引线并填充衬底的开口;以及f)多个焊料球,其在所述密封剂以外的区域被植入衬底下表面上;其中所述封装的特征在于管芯的无源面无密封剂以及管芯的侧面无密封剂。
【0011】在另一个实施方式中,本发明是制造半导体封装的方法,其包括:a)提供衬底,其具有上表面、与所述上表面相对的下表面、穿透所述上下表面的开口、以及所述下表面上的引线键合焊盘;b)提供至少一个半导体管芯,其具有带有一个或多个导电区的有源面,以及与所述有源面相对的无源面;c)按粘合图样(adhesive pattern)将易流动的粘合剂施加到衬底的上表面上,以使所述管芯粘附于所述衬底后,所述粘合剂包围所述开口,并且包括所述开口在内,其至少与所述管芯的底部一样大,d)任选地,将易流动的粘合剂硬化至非粘性状态,e)将所述管芯安装在所述衬底上,使所述有源面放置其上并且完全覆盖穿过所述衬底上下表面的开口,以使所述管芯有源表面上的导电区暴露于衬底的开口,并且所述管芯的有源面,除所述导电区外,完全被粘合剂覆盖,f)任选地,固化所述粘合剂、g)附着多个导电键合引线,其将所述管芯的有源面的导电区,通过衬底中的开口,连接至所述衬底的下表面上的引线键合焊盘;h)将密封剂施加至所述衬底的下表面上,密封所述键合引线并填充衬底的开口;i)固化所述密封剂;以及j)在所述密封剂以外区域的衬底下表面上植入焊料球;其中所述方法的特征在于管芯的无源面无密封步骤以及管芯的侧面无密封步骤。
【0012】在第三个实施方式中,本发明是制造半导体封装的方法,其包括:a)提供衬底,其具有上表面、与所述上表面相对的下表面、穿透所述上下表面的开口、以及所述下表面上的引线键合焊盘;b)提供至少一个半导体管芯,其具有带有一个或多个导电区的有源面,以及与所述有源面相对的无源面;c)按粘合图样将易流动的粘合剂施加到所述管芯的有源表面上,以使所述管芯粘附于所述衬底后,所述粘合剂包围所述开口,并且包括所述开口在内,其至少与所述管芯的底部一样大,d)任选地,将易流动的粘合剂硬化至非粘性状态,e)将所述管芯安装在所述衬底上,使所述有源面放置其上并且完全覆盖穿过所述衬底上下表面的开口,以使所述管芯有源表面上的导电区暴露于衬底的开口,并且所述管芯的有源面,除所述导电区外,完全被粘合剂覆盖,f)任选地,固化所述粘合剂、g)附着多个导电键合引线,其将所述管芯的有源面的导电区,通过衬底中的开口,连接至所述衬底的下表面上的引线键合焊盘;h)将密封剂施加至所述衬底的下表面上,密封所述键合引线并填充衬底的开口;i)固化所述密封剂;以及j)在所述密封剂以外区域的衬底下表面上植入焊料球;其中所述方法的特征在于管芯的无源面无密封步骤以及管芯的侧面无密封步骤。
【0013】在第四个实施方式中,本发明是用于制造芯片上板半导体封装的衬底,其包括顶表面、与所述顶表面相对的底表面以及穿透所述顶表面和底表面的开口;其特征在于无塑封应力消除区(mold stressrelief area)。
【0014】附图简述
【0015】对本发明更充分的理解可通过阅读以下详细描述并参考附图来进行,其中:
【0016】图1(现有技术)是传统半导体封装的俯视图。
【0017】图2(现有技术)是传统半导体封装的剖视图。
【0018】图3(现有技术)是传统半导体封装的另一个实施方式的剖视图。
【0019】图4A(现有技术)是在衬底上的BOC型封装的传统印刷图样的俯视图。
【0020】图4B(现有技术)是在衬底上的BOC型封装的传统印刷图样的放大俯视图。
【0021】图5(现有技术)是传统半导体封装的另一个实施方式的俯视图。
【0022】图6(现有技术)是传统半导体封装的另一个实施方式的剖视图。
【0023】图7是本发明半导体封装的俯视图。
【0024】图8A是本发明半导体封装的一个实施方式的剖视图。
【0025】图8B是本发明半导体封装的另一个实施方式的剖视图。
【0026】图9A至9E是根据本发明的方法组装的衬底的俯视图。
【0027】图10A和10B说明了本发明另一个实施方式的晶片上的印刷图样。
【0028】图11是用于特征在于无塑封应力释放区(mold stressrelease area)的BOC封装的衬底的俯视图。
【0029】图12A和12B是具有代表本发明另外两个实施方式的粘合剂印刷图样的衬底的俯视图。
【0030】图13是具有代表本发明另一个实施方式的粘合剂印刷图样的衬底的俯视图。
【0031】定义
【0032】如本文所用,术语“烷基”是指有支链的或无支链的1至24个碳原子的饱和烃基团,例如甲基(“Me”)、乙基(“Et”)、正丙基、异丙基、正丁基、异丁基、叔丁基、辛基、癸基及类似物。本文优选的烷基含有1至12个碳原子。
【0033】如本文提供的术语化合物、产物或组合物的“有效量”意思是用以提供所期望结果的化合物、产物或组合物的足够量。如下文所指出,不同封装所需的精确量将有所变化,其取决于具体所使用的化合物、产物或组合物,它的施用方式等等。因此,不可能总能规定精确量;但是有效量可由本领域普通技术人员仅使用常规实验来确定。
【0034】如本文所用,术语“适合的”用于指与如本文提供用于所述目的的化合物、产物或组合物相容的部分。所述目的适合性可由本领域普通技术人员仅使用常规实验来确定。
【0035】如本文所用,“取代的”通常用于指去除了氢或其他原子并用其他部分代替的碳或适合的杂原子。而且,意图是“取代的”是指不改变本发明所使用的基本化合物、产物或组合物的基本和新用途的取代。
【0036】如本文所用,“B阶(B-staging)”(及其变型)用于指用热或辐射对材料的处理,以使如果材料在溶剂中溶解或分散,溶剂则挥发而材料部分固化或不部分固化,或者如果材料是纯的、不含溶剂,则材料被部分固化至粘性或更硬化的状态。如果材料是易流动的粘合剂,B阶处理会提供极低的流动而没有充分固化,以使粘合剂用于将一个物件连接至另一个物件后,可进行另外的固化。流动的降低可通过溶剂挥发、树脂或聚合物的部分提早处理或固化或二者兼有来实现。
【0037】如本文所用,术语“可印刷膏(printable paste)”是指可印在表面例如衬底、管芯或晶片上的任何液体粘合剂。
【0038】发明详述
【0039】图7表示俯视图,图8A表示剖视图,其说明根据本发明的半导体封装的一个实施方式。衬底20具有上表面201和与上表面相对的下表面202,至少一个开口200形成以穿透衬底20的上表面201和下表面202。本发明考虑的衬底是刚性或半刚性的(不是弹性带),其主要由常规树脂材料制造——包括但不限于BT树脂、环氧树脂和FR-4。衬底可以是任何尺寸,但是通常在20mmx100mm和100mmx250mm之间,并且厚度为0.1和0.6mm之间。
【0040】在一个实施方式中,粘合剂施加区域206被限定在开口周围的衬底20的上表面201,以使区域206——包括开口在内——至少与所述管芯的底部一样大。
【0041】在一个实施方式中,衬底被设计成使其不具有用于塑封的应力释放区域。图11说明衬底如何配置的一个实例的俯视图,其中衬底20具有顶表面201和与顶表面相对的底表面,并包括开口200,其穿透顶表面201和底表面202,通过开口可形成引线键合。该衬底设计的特征在于无塑封应力消除区。本领域普通技术人员可考虑具有同样的节约衬底区域优势的许多变型和类似布置,这通过以下事实能够实现:用于密封管芯的背面和/或侧面的封装塑封对于本发明所述的封装和方法是不必要的。
【0042】半导体管芯21或芯片被安装在衬底20上,以使管芯21的有源面211被安装在易流动的粘合剂22上,以使粘合剂22被放入管芯21的有源表面211与衬底的上表面201之间。有源表面211大于开口200并完全覆盖开口200,使得管芯21的有源表面211的导电区(一个或多个)暴露于衬底20的开口200。管芯21的有源表面211,除导电区(一个或多个)外,被易流动的粘合剂22完全覆盖,以免在管芯和衬底之间形成间隙。
【0043】半导体芯片或管芯21可以是任何大小和厚度,并且是例如硅集成电路元件,例如DRAM,其具有厚度范围0.05至0.4mm。在其他实施方式中,管芯21可以是硅数字信号处理器或由砷化镓、磷化铟或其他半导体材料制造。半导体管芯21制备成带有有源表面211(还被称为顶或前表面),其形成有电子元件和电路;以及与有源表面211相对的无源表面210(还被称为底或后表面)。有源表面211具有在至少一个导电区上形成的多个引线键合焊盘212,其用于将芯片的有源表面211引线键合至衬底20下表面202的引线键合焊盘203,以形成二者之间的电连接。
【0044】在一个实施方式中,半导体管芯在多个位置具有键合焊盘,例如,在管芯的中心和边缘。在该实施方式中,衬底包含多个开口,对应于这些键合焊盘位置的每一个。
【0045】粘合剂22将衬底20的上表面201连接至管芯21的有源面211。管芯21定位在衬底20上,以使管芯21上的含有引线键合焊盘212的导电区在衬底20的开口200上并完全覆盖开口200。这样,管芯21被粘附至衬底20而在管芯21和衬底20之间没有任何粘合剂覆盖间隙,但是导电区被暴露以使引线键合23可以形成在其上包含的键合焊盘212上。
【0046】在一个实施方式中,粘合剂22被施加至衬底20的上表面201。在另一个实施方式中,在从晶片上切割之前,粘合剂22被施加至管芯21的有源面211。在另一个实施方式中,在从晶片上切割之后,粘合剂22被施加至管芯21的有源面211。
【0047】可以使用任何利用易流动的粘合剂的方法,将粘合剂22施加至管芯21或衬底20,所述方法包括但不限于模版印刷(stencilprinting)、丝网印刷(screen printing)、喷墨印刷(ink jet printing)或其他相似的印刷、铺展、分散或喷涂方法。粘合剂22被施加的图样为使管芯21被粘附至衬底20后,粘合剂22完全覆盖除导电区外的管芯21的有源表面211。导电区没有粘合剂22,使得与衬底20的开口200对准,并且引线键合至导电区上含有的键合焊盘212。获得管芯覆盖度所需的粘合剂量和具体印刷图样取决于粘合剂流动性、键合压力和其他类似参数,并且可由本领域普通技术人员无需过多的实验来确定。粘合剂的厚度在湿时通常为10和250微米之间。
【0048】图12A说明本发明一个实施方式的衬底20上的印刷图样,其中粘合剂22被施加至衬底20的上表面201,以使粘合剂22完全包围衬底20中的开口200,并且至少与管芯底部一样大,但是不完全覆盖衬底20的上表面201。该实施方式可被用于将粘合剂覆盖度最小化。该印刷图样类型产生如图8A横截面所示的封装,其中粘合剂22延伸至管芯21的外部边缘或稍微超过边缘。
【0049】图12B说明本发明一个实施方式的衬底20的印刷图样,其中粘合剂22被施加至除开口200以外的全部衬底20的上表面201。该实施方式可被用于简化印刷方法,因为比图12A所述的图样需要更少的独立印刷元件。图12B所示的印刷图样会产生如图8B横截面所示的封装,其中粘合剂22延伸较多地超过管芯21的外部边缘。
【0050】图10说明本发明另一个实施方式的印刷图样,其中粘合剂22被施加至晶片26的有源表面211,图样为:覆盖除不含粘合剂的导电区V的晶片(并因而在晶片被切割后覆盖所有的管芯),使管芯上的导电区暴露,以对准在衬底中的开口上。
【0051】用于粘附管芯的粘合剂必须是在施加于衬底或晶片后易流动的,以使它可以通过模版印刷、丝网印刷、喷墨印刷或其他相似的印刷、铺展、分散或喷涂方法进行施加。粘合剂不是如同以预先成型、层压或冲压在衬底上施加的预制膜或胶带。施加至晶片或管芯后,粘合剂可以被硬化或进行B阶处理或固化,以使其不再具有用于如上所列施加方法的足够流动性。
【0052】在一个实施方式中,粘合剂是可印刷膏。
【0053】适合的粘合剂的选择取决于管芯类型和大小、衬底类型、封装几何学以及例如回流温度的下游制造变量和所需的可靠性。粘合剂通常含有某种类型的聚合物或可固化树脂,其可包括热塑性塑料、热固塑料(thermoset)、弹性体、热固性橡胶或这些的组合。粘合剂可含有或不含有溶剂。聚合物或可固化树脂通常是除任何存在的填料外的主要成分。通常用于粘合剂组合物的其他成分可以由专业人员选择添加;这些其他成分包括但不限于固化剂、融合剂、湿润剂、流动控制剂、助粘剂和脱气剂。固化剂是引发、传递或加速粘合剂固化的任何材料或材料的组合,并且包括促进剂、催化剂、引发剂和硬化剂。粘合剂组合物还可含有填料,在这种情况下,填料的存在量为总组合物的上至95%。
【0054】用于粘合剂的树脂和聚合物可以是固体、液体或二者的组合。适合的树脂包括环氧树脂、丙烯酸酯或甲基丙烯酸酯、马来酰亚胺、乙烯醚、聚酯、聚(丁二烯)、聚酰亚胺、苯并环丁烯、硅化烯烃、有机硅树脂、苯乙烯树脂、氰酸酯树脂或聚烯烃或聚硅氧烷。
【0055】在一个实施方式中,固体芳族双马来酰亚胺(BMI)树脂粉末包括在粘合剂中。适合的固体BMI树脂具有结构:
【0061】
【0063】
【0068】具有这些X桥连基的双马来酰亚胺树脂是可购得的并且能够从例如Sartomer(USA)或HOS-Technic GmbH(奥地利)获得。
【0069】在另一个实施方式中,用于粘合剂组合物的马来酰亚胺树脂包括具有通式结构的那些,其中n是1至3,并且X1是脂肪族或芳族基团。示例性的X1实体包括:聚(丁二烯)、聚(碳酸酯),聚(氨基甲酸乙酯)、聚(醚),聚(酯)、简单烃以及含有例如羰基、羧基、酰胺、氨基甲酸酯、脲或醚官能团的简单烃。这些类型的树脂可购得并且可从例如National Starch and Chemical Company和Dainippon Inkand Chemical,Inc获得。
【0070】在进一步的实施方式中,马来酰亚胺树脂选自
【0075】适合的丙烯酸酯树脂包括具有通式结构
【0076】的那些,其中,n从1到6,R1是-H或-CH3,以及X2是芳香基团或脂肪基团。示例性的X2实体包括聚(丁二烯)、聚(碳酸酯)、聚(氨基甲酸乙酯)、聚(醚)、聚(酯)、简单烃、和含有官能团例如羰基、羧基、酰胺、氨基甲酸酯、脲、酯或醚的简单烃。可商业获得的材料包括(甲基)丙烯酸丁酯、(甲基)丙烯酸异丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸异癸酯、(甲基)丙烯酸正十二酯、(甲基)丙烯酸烷酯、(甲基)丙烯酸三癸基酯、(甲基)丙烯酸正十八酯、(甲基)丙烯酸环己酯、(甲基)丙烯酸四氢糠酯、(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸异冰片酯、二(甲基)丙烯酸1,4-丁二醇酯、二(甲基)丙烯酸1,6-己二醇酯、二(甲基)丙烯酸1,9-壬二醇酯、(甲基)丙烯酸全氟辛基乙酯、二(甲基)丙烯酸1,10-癸二醇酯、壬基苯酚聚丙氧基酯(甲基)丙烯酸酯(nonylphenol polypropoxylate(meth)acrylate)、以及聚戊氧基酯丙烯酸四氢糠酯,可从Kyoeisha Chemical Co.,LTD获得;聚丁二烯二(甲基)丙烯酸氨基甲酸乙酯(CN302、NTX6513)以及聚丁二烯二(甲基)丙烯酸酯(CN301、NTX6039、PRO6270),可从Sartomer Company,Inc获得;聚碳酸酯二丙烯酸氨基甲酸乙酯(ArtResin UN9200A),可从Negami Chemical Industries Co.,LTD获得;丙烯酸化脂肪族氨基甲酸乙酯低聚物(Ebecryl 230、264、265、270、284、4830、4833、4834、4835、4866、4881、4883、8402、8800-20R、8803、8804),可从RadcureSpecialities,Inc获得;聚酯丙烯酸酯低聚物(Ebecryl 657、770、810、830、1657、1810、1830),可从Radcure Specialities,Inc获得;以及环氧丙烯酸酯树脂(CN104、111、112、115、116、117、118、119、120、124、136),可从Sartomer Company,Inc获得。在一个实施方式中,丙烯酸酯树脂选自丙烯酸异冰片酯、甲基丙烯酸异冰片酯、丙烯酸十二酯、甲基丙烯酸十二酯、具有丙烯酸酯官能度的聚(丁二烯)以及具有甲基丙烯酸酯官能度的聚(丁二烯)。
【0077】适合的乙烯醚树脂包括具有通式结构的那些,其中n是1至6和X3是芳族或脂肪族基团。示例性的X3实体包括聚(丁二烯)、聚(碳酸酯)、聚(氨基甲酸乙酯)、聚(醚)、聚(酯)、简单烃和含有例如羰基、羧基、酰胺、氨基甲酸酯、脲或醚官能团的简单烃。可购得的树脂包括环己烷二甲醇二乙烯醚、十二烷基乙烯醚、环己基乙烯醚、2-乙基己基乙烯醚、双丙甘醇二乙烯醚、己二醇二乙烯醚、十八烷基乙烯醚和丁二醇二乙烯醚,可购自International Speciality Products(ISP);Vectomer 4010、4020、4030、4040、4051、4210、4220、4230、4060、5015,可购自Sigma-Aldrich,Inc。
【0078】适合的聚(丁二烯)树脂包括聚(丁二烯)、环氧化的聚(丁二烯)、马来酸聚(丁二烯)、丙烯酸化的聚(丁二烯)、丁二烯-苯乙烯共聚物和丁二烯-丙烯腈共聚物。可购得的材料包括均聚物丁二烯(Ricon130、131、134、142、150、152、153、154、156、157、P30D),可购自Sartomer Company,Inc;丁二烯和苯乙烯的无规共聚物(Ricon100、181、184),可购自Sartomer Company Inc.;马来化的聚(丁二烯)(Ricon 130MA8、130MA13、130MA20、131MA5、131MA10、131MA17、131MA20、156MA17),可购自Sartomer Company,Inc.;丙烯酸化的聚(丁二烯)(CN302、NTX6513、CN301、NTX6039、PRO6270、Ricacryl3100、Ricacryl 3500),可购自Sartomer Inc;环氧化的聚(丁二烯)(Polybd600、605),可购自Sartomer Company.Inc以及Epolead PB3600,可购自Daicel Chemical IndusIndustries,Ltd;以及丙烯腈和丁二烯共聚物(Hycar CTBN系列、ATBN系列、VTBN系列和ETBN系列),可购自Hanse Chemical。
【0079】适合的环氧树脂包括双酚、萘和脂肪族型环氧树脂。可购得的材料包括双酚型环氧树脂(Epiclon 830LVP、830CRP、835LV、850CRP),可购自Dainippon Ink&Chemicals,Inc.;萘型环氧树脂(Epiclon HP4032),可购自Dainippon Ink&Chemicals,Inc.;脂肪族环氧树脂(Araldite CY179、184、192、175、179),可购自Ciba SpecialtyChemicals,(Epoxy 1234、249、206),可购自Union Carbide Corporation,以及(EHPE-3150),可购自Daicel Chemical Industries,Ltd.。其它适合的环氧树脂包括脂环族环氧树脂、双酚-A型环氧树脂、双酚-F型环氧树脂、环氧酚醛清漆树脂、联苯型环氧树脂、萘型环氧树脂、二环戊二烯-苯酚型环氧树脂、反应性环氧树脂稀释液及其混合物。
【0080】适合的硅化烯烃树脂通过硅氧烷和二乙烯基材料的选择性硅氢化反应获得,其具有通式结构,
【0082】适合的有机硅树脂包括反应性有机硅树脂,其具有通式结构
【0083】其中n是0或任意整数,X4和X5是氢、甲基、胺、环氧、羧基、羟基、丙烯酸酯、甲基丙烯酸酯、巯基、苯酚或乙烯基官能团,R2和R3可以是-H、-CH3、乙烯基、苯基或任何具有大于两个碳的烃结构。可购得的材料包括KF8012、KF8002、KF8003、KF-1001、X-22-3710、KF6001、X-22-164C、KF2001、X-22-170DX、X-22-173DX、X-22-174DX X-22-176DX、KF-857、KF862、KF8001、X-22-3367以及X-22-3939A,可购自Shin-Etsu SiloconeInternational Trading(上海)Co.,Ltd.。
【0084】适合的苯乙烯树脂包括具有通式结构
【0085】的那些树脂,其中n是1或更大,R4 is-H或-CH3以及X6是脂肪族基团。示例性的X3实体包括聚(丁二烯)、聚(碳酸酯)、聚(氨基甲酸乙酯)、聚(醚)、聚(酯)、简单烃、和含有例如羰基、羧基、酰胺、氨基甲酸酯、脲或醚官能团的简单烃。这些树脂可购得并且可从例如National Starchand Chemical Company或Sigma-Aldrich Co.获得。
【0086】适合的氰酸酯树脂包括具有通式结构的那些,其中n是1或更大并且X7是烃基团。示例性的X7实体包括双酚、苯酚或甲酚线性酚醛清漆、二环戊二烯、聚丁二烯、聚碳酸酯、聚氨酯、聚醚或聚酯。可购得的材料包括:AroCy L-10、AroCy XU366、AroCyXU371、AroCy XU378、XU71787.02L以及XU 71787.07L,可购自Huntsman LLC;Primaset PT30、Primaset PT30 S75、Primaset PT60、Primaset PT60S、Primaset BADCY、Primaset DA230S、Primaset MethylCy以及Primaset LECY,可购自Lonza Group Limited;2-烯丙基苯酚氰酸酯、4-甲氧基苯酚氰酸酯、2,2-双(4-氰氧基苯酚)-1,1,1,3,3,3-六氟丙烷,双酚A氰酸酯、二烯丙基双酚A氰酸酯、4-苯基酚氰酸酯、1,1,1-三(4-氰氧苯基)乙烷、4-枯基苯酚氰酸酯、1,1-双(4-氰氧基-苯基)乙烷、2,2,3,4,4,5,5,6,6,7,7-十一氟-辛二醇二氰酸酯和4,4′-双酚氰酸酯,可从Oakwood Products,Inc.获得。
【0087】用于粘合剂组合物的适合的聚合物进一步包括聚酰胺、苯氧基、聚苯并噁嗪、丙烯酸酯、氰酸酯、双马来酰亚胺、聚醚砜、聚酰亚胺、苯并噁嗪、乙烯醚、硅化烯烃、聚烯烃、聚苯并噁唑(polybenzoxyzole)、聚酯、聚苯乙烯、聚碳酸酯、聚丙烯、聚(氯乙烯),聚异丁烯、聚丙烯腈、聚(甲基丙烯酸甲酯)、聚(乙酸乙烯酯)、聚(2-乙烯基吡啶)、顺-1,4-聚异戊二烯、3,4-聚氯丁二烯、乙烯基共聚物、聚(环氧乙烷)、聚(乙二醇)、聚甲醛、聚乙醛、聚(β-丙醇酸内酯)、聚(10-癸酸酯)、聚(对苯二甲酸亚乙酯)、聚己内酰胺、聚(11-十一烷酰胺),聚(间-亚苯基-对苯二甲酸酰胺)、聚(四亚甲基-间-苯磺酸酰胺)、聚酯聚芳基化物、聚(苯醚)、聚(苯硫醚)、聚砜、聚酰亚胺、聚醚醚酮、聚醚酰亚胺、氟化的聚酰亚胺、聚酰亚胺硅氧烷、聚-异吲哚并-喹唑啉二酮、聚硫醚酰亚胺聚-苯基-喹喔啉、聚喹喔酮(polyquuinixalone)、酰亚胺-芳基醚苯基喹喔啉共聚物、聚喹喔啉、聚苯并咪唑、聚苯并噁唑、聚降冰片烯、聚(芳撑醚)、聚硅烷、聚对亚苯基二甲基、苯并环丁烯、羟基(苯并噁唑)共聚物、聚(含硅亚芳基硅氧烷)(poly(silarylene siloxanes))和聚苯并咪唑。
【0088】包含在粘合剂组合物中的其他适合的材料包括橡胶聚合物,例如单乙烯基芳烃和共轭二烯的嵌段共聚物,例如苯乙烯-丁二烯、苯乙烯-丁二烯-苯乙烯(SBS)、苯乙烯-异戊二烯-苯乙烯(SIS)、苯乙烯-乙烯-丁烯-苯乙烯(SEBS)和苯乙烯-乙烯-丙烯-苯乙烯(SEPS)。
【0089】包含在粘合剂组合物中的其他适合的材料包括乙烯-乙酸乙烯酯聚合物、其他乙烯酯和共聚物,例如乙烯甲基丙烯酸酯、乙烯丙烯酸正丁酯和乙烯丙烯酸;聚烯烃,例如聚乙烯和聚丙烯;聚乙酸乙烯酯及其无规共聚物;聚丙烯酸酯;聚酰胺;聚酯;以及聚乙烯醇及其共聚物。
【0090】适合包含在粘合剂组合物中的热塑性橡胶包括羧基封端的丁二烯-腈(CTBN)/环氧加合物、丙烯酸酯橡胶、乙烯基-封端的丁二烯橡胶以及腈丁二烯橡胶(NBR)。在一个实施方式中,CTBN环氧加合物由约20-80wt%的CTBN和约20-80wt%的二缩水甘油醚双酚A:双酚A环氧(DGEBA)组成。多种CTBN材料可购自Noveon Inc.,并且多种双酚A环氧材料可购自Dainippon Ink and Chemicals,Inc.和Shell Chemicals。NBR橡胶可购自Zeon Corporation。
【0091】适合包含在粘合剂配制物中的硅氧烷包括弹性体聚合物,其包括主链和主链上伸出的至少一个赋予可透性的硅氧烷部分侧链,以及至少一个能够反应形成新的共价键的反应性部分。适合的硅氧烷的例子包括弹性体聚合物,其由如下制备:3-(三(三甲基甲硅氧基)甲硅烷基)-丙基甲基丙烯酸酯、丙烯酸正丁酯、甲基丙烯酸缩水甘油酯、丙烯腈和丙烯酸氰基乙酯;3-(三(三甲基甲硅氧基)甲硅烷基)-丙基甲基丙烯酸酯、丙烯酸正丁酯、甲基丙烯酸缩水甘油酯和丙烯腈;以及3-(三(三甲基甲硅氧基)甲硅烷基)-丙基甲基丙烯酸酯、丙烯酸正丁酯、甲基丙烯酸缩水甘油酯以及丙烯酸氰基乙酯。
【0092】如果粘合剂组合物需要固化剂,固化剂的选择取决于使用的聚合物化学性质和所应用的处理条件。作为固化剂,所述组合物可使用芳族胺、无环胺、脂族胺、叔膦、三嗪、金属盐、芳香族羟基化合物、或这些的组合。这些催化剂的例子包括咪唑,例如2-甲基咪唑,2-十一烷基咪唑、2-十七烷基咪唑、2-苯基咪唑、2-乙基4-甲基咪唑、1-苄基-2-甲基咪唑、1-丙基-2-甲基咪唑、1-氰乙基-2-甲基咪唑、1-氰乙基-2-乙基-4-甲基咪唑、1-氰乙基-2-十一烷基咪唑、1-氰乙基-2-苯基咪唑、1-胍胺乙基-2-甲基咪唑和咪唑与偏苯三酸的加成产物;叔胺,例如N,N-二甲基苄基胺、N,N-二甲基苯胺、N,N-二甲基甲苯胺、N,N-二甲基-对茴香胺、对-卤代-N,N-二甲基苯胺、2-N-乙基苯胺乙醇、三-正丁胺、吡啶、喹啉、N-甲基吗啉、三乙醇胺、三亚乙基二胺,N,N,N′,N′-四甲基丁二胺、N-甲基哌啶;酚,例如苯酚、甲酚、二甲苯酚、间二苯酚和间三苯酚;有机金属盐,例如环烷酸铅、硬脂酸铅、环烷酸锌、辛酸锌(zinc octolate)、油酸锡、二丁基马来酸锡、环烷酸锰、环烷酸钴以及乙酰丙酮铁;和无机金属盐,例如氯化锡、氯化锌和氯化铝;过氧化物,例如过氧化苯甲酰、过氧化月桂酰、过氧化辛酰、过氧化乙酰、过氧化对-氯苯甲酰和二-叔丁基二过邻苯二甲酸盐;酸酐,例如羧酸酐、马来酸酐、邻苯二甲酸酐、月桂酸酐、均苯四酸酐、偏苯三酸酐、六氢邻苯二甲酸酐;六氢均苯四酸酐和六氢偏苯三酸酐,偶氮化合物,例如偶氮异丁腈、2,2′-偶氮二丙烷、m,m′-氧化偶氮苯乙烯、腙(hydrozone)及其混合物。
【0093】在另一个实施方式中,固化促进剂可以选自三苯膦、烷基-取代的咪唑、咪唑鎓盐、鎓盐、季鏻化合物、硼酸鏻(onium borate)、金属螯合物、1,8-二氮杂环[5.4.0]十一-7-烯或其混合物。
【0094】在另一个实施方式中,固化剂可以是自由基引发剂或阳离子引发剂,这取决于是选择自由基固化树脂还是离子固化树脂。如果使用自由基引发剂,它以有效量存在。有效量通常是按重量计有机化合物(不包括任何填料)的百分之0.1至10。自由基引发剂包括过氧化物,例如过辛酸丁酯和过氧化二枯基以及偶氮化合物,例如2,2’-偶氮双(2-甲基-丙腈)和2,2’-偶氮双(2-甲基-丁腈)。
【0095】如果使阳离子引发剂,它以有效量存在。有效量通常是按重量计有机化合物(不包括任何填料)的百分之0.1至10。适合的阳离子固化剂包括二氰胺、苯酚线性酚醛清漆(phenol novolak)、己二酸二酰肼、二烯丙基蜜胺、二氨基丙二腈(diamino malconitrile)、BF3-胺络合物、胺盐和改性的咪唑化合物。
【0096】金属化合物也可用作氰酸酯系统的固化促进剂,并且包括但不限于金属环烷酸盐、乙酰丙酮金属(螯合物)、金属辛酸盐、金属乙酸盐、金属卤化物、金属咪唑络合物以及金属胺络合物。
【0097】可以包括在粘合剂配制物中的其他固化促进剂包括三苯基膦,烷基-取代的咪唑、咪唑鎓盐和硼酸鎓。
【0098】某些情况下,对粘合剂组合物,期望使用多于一种类型的固化。例如,阳离子和自由基引发可均为期望的,在这种情况下,自由基固化和离子固化树脂均可用于组合物。这些组合物会含有对于每种类型树脂有效量的引发剂。这种组合物会允许例如由使用UV照射的阳离子引发启动固化过程,并且在随后的处理步骤,通过施加热进行自由基引发来完成。
【0099】一种或多种填料可以包括在粘合剂组合物中,并且通常添加用于改进流变学性质和降低应力。由于粘合剂与管芯的有源面接触,因此填料将是电绝缘的。适合的绝缘填料的例子包括氧化铝、氢氧化铝、硅石、蛭石、云母、硅灰石、碳酸钙、二氧化钛、沙子、玻璃、硫酸钡、锆、炭黑、有机填料和卤化的乙烯聚合物,如四氟乙烯、三氟乙烯、1,1-二氟乙烯、氟乙烯、1,1-二氯乙烯和氯乙烯。填料颗粒可以具有从纳米大小到几毫米范围的任何适当大小。对任何具体封装构造的这种大小的选择在本领域普通技术人员的技术知识内。填料可以按重量计全部组合物的0至95%的量存在。
【0100】在一个实施方式中,粘合剂配制物包括隔离物(spacers),其是加入用于控制粘合层至预定厚度的颗粒。适当的隔离物的选择取决于封装构造和粘合剂配制物,并且可由本领域普通技术人员无需过多的实验进行。适合的隔离物包括但不限于硅石、Teflon、聚合材料或弹性材料。它们的大小范围可以为25至150微米并且以有效量使用。
【0101】在另一个实施方式中,偶联剂可添加至粘合剂组合物。通常地,偶联剂是硅烷,例如环氧型硅烷偶联剂、胺型硅烷偶联剂或巯基型硅烷偶联剂。如果使用,偶联剂以有效量使用。典型的有效量为按重量计上至5%的量。
【0102】在进一步的实施方式中,表面活性剂可添加至粘合剂组合物。适合的表面活性剂包括硅氧烷、聚乙二醇、聚氧乙烯/聚氧丙烯嵌段共聚物、基于乙二胺的聚氧乙烯/聚氧丙烯嵌段共聚物,基于多元醇的聚氧化烯、基于脂肪醇的聚氧化烯以及脂肪醇聚氧化烯烷基醚。如果使用,表面活性剂以有效量使用:通常的有效量为按重量计上至5%的量。
【0103】在另一个实施方式中,湿润剂可以包括在粘合剂组合物中。湿润剂的选择取决于应用需要和所应用树脂的化学性质。如果使用,湿润剂以有效量使用:通常的有效量为按重量计上至5%的量。适合的湿润剂的例子包括Fluorad FC-4430含氟表面活性剂,可购自3M;Clariant Fluowet OTN、BYK W-990、Surfynol 104表面活性剂、Crompton Silwet L-7280、Triton X100,可购自Rhom and Haas;具有优选的大于240的Mw的丙二醇,γ-丁内酯,蓖麻油,甘油或其他脂肪酸,以及硅烷。
【0104】在进一步的实施方式中,流动控制剂可以包括在粘合剂组合物中。流动控制剂的选择取决于应用需要和所应用树脂的化学性质。如果使用,流动控制剂以有效量使用:有效量为按重量计上至5%的量。适合的流动控制剂的例子包括Cab-O-Sil TS720,可购自Cabot;AerosilR202或R972,可购自Degussa;热解法二氧化硅;热解法氧化铝或热解法金属氧化物。
【0105】在另一个实施方式中,助粘剂可以包括在粘合剂组合物中。助粘剂的选择取决于应用需要和所应用树脂的化学性质。如果使用,助粘剂以有效量使用:有效量为按重量计上至5%的量。适合的助粘剂的例子包括:硅烷偶联剂,例如Z6040环氧硅烷或Z6020胺硅烷,可购自Dow Corning;A186硅烷,A187硅烷,A174硅烷或A1289,可购自OSI Silquest;有机硅烷SI264,可购自Degussa;Johoku ChemicalCBT-1羧基苯并三唑(Carbobenzotriazole),可购自Johoku Chemical;官能苯并三唑;噻唑;钛酸盐;以及锆酸盐。
【0106】在进一步的实施方式中,脱气剂(消泡剂)可添加至粘合剂组合物。脱气剂的选择取决于应用需要和所应用树脂的化学性质。如果使用,脱气剂以有效量使用:有效量为按重量计上至5%的量。适合的脱气剂的例子包括Antifoam 1400,可购自Dow Corning;DuPontModoflow以及BYK A-510。
【0107】在一些实施方式中,这些组合物可用增粘树脂配制,以改进粘合和引入粘着;增粘树脂的例子包括天然存在的树脂和改性的天然存在树脂;多萜树脂;苯酚改性的萜树脂;苯并呋喃-茚树脂;脂肪族和芳香族石油烃树脂;邻苯二甲酸酯;氢化烃,氢化松香和氢化松香酯。
【0108】在一些实施方式中,其他成分可包括在粘合剂组合物中,例如稀释剂,例如液体聚丁烯或聚丙烯;石油蜡,例如石蜡和微晶蜡,聚乙烯油脂,氢化的动物、鱼和植物油,矿物油和合成蜡,环烷或链烷矿物油。
【0109】其他添加剂,例如稳定剂、抗氧化剂、抗冲改性剂和着色剂,其类型和量是本领域已知的,也可添加至粘合剂组合物中。
【0110】具有25℃至230℃范围的适合沸点的常用溶剂可用于粘合剂组合物。可用的溶剂的例子包括酮、酯、醇、醚和其他在组合物中稳定并溶解树脂的常用溶剂。适合的溶剂包括γ-丁内酯、丙二醇甲基乙基乙酸酯(PGMEA)和4-甲基-2-戊酮。
【0111】粘合剂被施加至衬底或管芯后,其可以在任选的处理步骤中被干燥和/或B阶处理。在本发明的一个实施方式中,粘合剂被硬化至非粘性状态以使在半导体管芯被粘附前,衬底、晶片或管芯可被储存和/或运送至分开的位置。通常地,粘合剂被充分硬化以使粘合剂涂布的衬底、管芯或晶片可以堆叠在另一个的顶部并储存,而不使用夹层。粘合剂的硬化可以多种方式完成,其取决于所使用的粘合剂配制物。
【0112】在一个实施方式中,粘合剂是热塑性塑料,其在高于它的熔点的温度应用,以使其处于易流动的状态。在这种情况下,通过在低于粘合剂的熔点和/或软化点时冷却粘合剂来硬化粘合剂。
【0113】在另一个实施方式中,粘合剂至少含有液体热固性树脂和溶剂。在该实施方式中,通过充分加热粘合剂和衬底以使溶剂挥发并部分固化热固性树脂或多种热固性树脂,使粘合剂硬化至非粘性或极低流动状态。
【0114】在另一个实施方式中,粘合剂含有溶解于溶剂的固体热固性树脂。施加至衬底后,通过充分加热粘合剂和衬底以使溶剂挥发、剩下涂布在衬底上的非粘性热固性树脂,粘合剂被硬化至非粘性或极低流动状态。
【0115】在另一个实施方式中,粘合剂含有至少一种液体热固性树脂。施加至衬底后,通过充分加热粘合剂和衬底以部分地将热固性树脂处理至非粘性或极低流动状态,粘合剂被硬化至非粘性或极低流动状态。
【0116】本领域技术人员可以理解的是粘合剂也可含有树脂的组合,其可利用机理的组合被干燥、B-阶和固化。例如,配制物可以通过使用紫外照射被B阶处理,并且在管芯粘附后的下游制造步骤中,通过使用热量来固化。配制物也可含有树脂的组合,其具有两个独立的固化温度,以使粘合剂可通过在第一(并且较低)温度加热衬底,导致第一树脂固化以及全部粘合剂配制物硬化至非粘性状态来进行硬化。在这种情况下,第二树脂,其具有第二(并且较高)固化温度,可在管芯粘附后,在随后的处理步骤中被固化。
【0117】粘合剂可以需要或不需要固化。如果粘合剂确实需要固化,该固化可以作为单独的处理步骤完成,或与另一个处理操作例如回流焊(solder reflow)或引线键合结合来完成。
【0118】如果应用B阶步骤,B阶温度通常在80℃至200℃的范围,并且B阶在一分钟至两小时范围的时间段实现,其取决于所选择的具体粘合剂配制物。每种粘合剂组合物的时间和温度B阶曲线会有所不同,并且不同组合物可被设计成提供适合于具体工业制造方法的B阶曲线。
【0119】在一个可选的实施方式中,在管芯粘附之前粘合剂不被硬化。在这种情况下,管芯安装在衬底上,而粘合剂仍处于易流动的状态。这使得当管芯被压至粘合剂时,在管芯周围形成圆角(fillet)。粘合剂的流动性和用于安装管芯的压力可以进行调整,以得到每种具体封装设计所期望的圆角量。在该实施方式中,必须小心以避免粘合剂流进衬底中的开口,因为这会干扰引线键合。
【0120】图13说明了本发明另一个实施方式的示例性印刷图样,其中粘合剂22被施加至衬底20的顶表面201,方式是在衬底开口200的周围,存在未用粘合剂22涂布的小的空白流动区F。当管芯被粘附时,粘合剂流动使得围绕管芯的外部形成圆角。粘合剂流动还使得粘合剂22向内流至围绕开口200的空白流动区F,以使粘合剂22完全覆盖管芯的有源表面,除导电(引线键合焊盘)区外,即,它不流入衬底20中的开口200。
【0121】如果固化步骤用于管芯粘附粘合剂,它可以在引线键合之前、引线键合过程中进行,或者它可以在引线键合和密封后进行。管芯粘附粘合剂固化可以是单独的处理步骤,或者它可以与密封剂的固化过程同时进行。
【0122】对于管芯粘附粘合剂,固化温度通常在80℃-250℃的范围,并且固化在几秒钟或直至120分钟范围的时间段来实现,这取决于具体树脂的化学性质和所选择的固化剂。每种粘合剂组合物的时间和温度固化曲线会有所不同,并且不同组合物可被设计成提供适合于具体工业制造方法的固化曲线。
【0123】如果粘合剂是可固化的,它可以通过热暴露、紫外(UV)照射或这些的组合来固化。每种粘合剂组合物的固化条件会有所不同,并且不同组合物可被设计成提供适合于具体工业制造方法的固化曲线。
【0124】在一个实施方式中,粘合剂在已经被B-阶处理后,具有至少两个月的工作寿命。这种长工作寿命可通过通常用于延长干燥的或部分提早处理的(partially advanced)粘合剂的工作寿命的任何方法来获得,其包括但不限于在粘合剂配制物中使用一种或多种如下物质:(i)至少一种潜固化剂,(ii)高浓度的热塑性树脂,以及(iii)高分子量树脂。工作寿命通过在粘合剂储存在环境条件后,检测在正常管芯粘附条件时粘合剂的流动来测试。如果粘合剂能够在正常管芯粘附条件下湿润管芯表面,则它仍在工作寿命内。但是,如果粘合剂具有不足的流动性以至影响管芯的湿润,那么它不能用于粘附管芯,并且被认为超出它的工作寿命。
【0125】多个引线键合23是在引线键合过程中穿过衬底20的开口200形成的。键合引线23被键合至管芯21的导电区上的暴露的引线键合焊盘212,穿过相应的衬底20的开口200,至衬底20下表面202的引线键合焊盘203。以这种方式,管芯21的有源表面211可被电连接至衬底的下表面202。键合引线23由任何传导电信号的金属例如金组成。
【0126】密封剂25在衬底20下表面202上的引线键合23上形成,以使它围绕或密封键合引线23并填充衬底20中的开口200。密封剂25可以通过分散、喷射(potting)、印刷、浇注或其他类似方法施加。密封剂25可以是在随后的制造工艺步骤和封装使用过程中保护键合引线23的任何材料,其包括但不限于环氧树脂和硅氧烷。密封剂25在与所选密封剂组合物相适合的条件下被固化。每种密封剂组合物的时间和温度固化曲线会有所不同,并且不同组合物可被设计成提供适合于具体工业制造方法的固化曲线。
【0127】在密封剂25以外的区域,焊料球24被植入到衬底20的下表面202上。焊料球24可以由常用于在封装和例如电路板之间形成电连接的任何导电金属组成。
【0128】这种封装的具体特征为在管芯的背面和/或侧面无密封剂。因此,不需要封装塑封。
【0129】图9A至9E用于进一步说明本发明并且显示了根据本发明一个实施方式的方法制备的、不同阶段的衬底俯视图。图9A显示了裸衬底20的顶表面201。图9B显示粘合剂22沉积后衬底20的顶表面201。图9C显示管芯21已被粘附后,衬底20的顶表面201,其上具有粘合剂22。图9D显示了引线键合23已穿过开口200形成后,衬底20的底表面202。图9E显示密封剂25已被施加至引线键合23上后,衬底20的底表面202。
【0130】可进行不偏离本发明精神和范围的许多修改和变化,这对本领域普通技术人员是显而易见的。本文所描述的具体实施方式仅以例子的方式提供,并且本发明仅通过所附权利要求以及与这些权利要求所赋予权利等同的全部范围进行限制。
Claims (16)
1.半导体封装,其包括:
a)衬底,其具有上表面、与所述上表面相对的下表面、穿透所述上下表面的开口、以及所述下表面上的引线键合焊盘;
b)半导体管芯,其具有带有一个或多个导电区的有源面和与所述有源面相对的无源面,所述半导体管芯安装在所述衬底上,使所述有源面放置其上并且完全覆盖穿透所述衬底上下表面的所述开口;
c)粘合剂,其被放置在所述衬底的上表面和所述管芯的有源面之间并连接所述衬底的上表面和所述管芯的有源面,以使所述管芯的有源面,除所述导电区外,完全被所述粘合剂覆盖;
d)多个导电键合引线,其将所述管芯的有源面上的所述导电区,穿过所述衬底中的所述开口,连接至所述衬底的下表面上的所述引线键合焊盘;
e)密封剂,其被施加至所述衬底的所述下表面上,密封所述键合引线并填充所述衬底的所述开口;以及
f)多个焊料球,其在所述密封剂以外的区域被植入到所述衬底的所述下表面上;
其中所述封装的特征在于所述管芯的无源面无密封剂以及所述管芯的侧面无密封剂。
2.根据权利要求1所述的封装,其中所述衬底选自BT和FR-4。
3.根据权利要求1所述的封装,其中所述粘合剂选自环氧、双马来酰亚胺、丙烯酸酯、硅氧烷或这些的组合。
4.制造半导体封装的方法,其包括:
a)提供衬底,其具有上表面、与所述上表面相对的下表面、穿透所述上下表面的开口、以及所述下表面上的引线键合焊盘;
b)提供至少一个半导体管芯,其具有带有一个或多个导电区的有源面,以及与所述有源面相对的无源面;
c)按粘合图样将易流动的粘合剂施加到所述衬底的上表面上,以使所述管芯粘附于所述衬底后,所述粘合剂包围所述开口,并且包括所述开口在内,至少与所述管芯的底部一样大,
d)任选地,将所述易流动的粘合剂硬化至非粘性状态,
e)将所述管芯安装在所述衬底上,使所述有源面放置其上并且完全覆盖穿过所述衬底的上下表面的所述开口,以使所述管芯的有源表面上的所述导电区暴露于所述衬底的所述开口,并且所述管芯的所述有源面,除所述导电区外,完全被所述粘合剂覆盖,
f)任选地,固化所述粘合剂,
g)粘附多个导电键合引线,将所述管芯的有源面的所述导电区,穿过所述衬底中的所述开口,连接至所述衬底的下表面上的所述引线键合焊盘;
h)将密封剂施加至所述衬底的下表面上,密封所述键合引线并填充所述衬底的所述开口;
i)固化所述所述密封剂;以及
j)在所述密封剂以外的区域将多个焊料球植入到所述衬底的所述下表面上;
其中所述方法的特征在于所述管芯的所述无源面无密封步骤以及所述管芯的侧面无密封步骤。
5.根据权利要求4所述的方法,其中所述粘合剂是可印刷膏。
6.根据权利要求4所述的方法,其中所述衬底的特征在无塑封应力释放区。
7.根据权利要求4所述的方法,其中所述粘合图样包括在含有所述引线键合焊盘的所述导电区周围的小的空白区,其在管芯粘附之前不用粘合剂涂布,在管芯粘附期间粘合剂流入其中,以避免在所述管芯和所述底物之间形成间隙。
8.根据权利要求4所述的方法,其中在将所述管芯安装至所述衬底之前,所述粘合剂被B阶处理。
9.制造半导体封装的方法,其包括:
a)提供衬底,其具有上表面、与所述上表面相对的下表面、穿透所述上下表面的开口、以及所述下表面上的引线键合焊盘;
b)提供至少一个半导体管芯,其具有带有一个或多个导电区的有源面,以及与所述有源面相对的无源面;
c)按粘合图样将易流动的粘合剂施加到所述管芯的所述有源面上,以使所述管芯粘附于所述衬底后,所述粘合剂包围所述开口,并且包括所述开口在内,至少与所述管芯的底部一样大,
d)任选地,将所述易流动的粘合剂硬化至非粘性状态,
e)将所述管芯安装在所述衬底上,使所述有源面放置其上并且完全覆盖穿过所述衬底上下表面的所述开口,以使所述管芯的有源表面上的所述导电区暴露于所述衬底的所述开口,并且所述管芯的有源面,除所述导电区外,完全被所述粘合剂覆盖,
f)任选地,固化所述粘合剂,
g)粘附多个导电键合引线,将所述管芯的有源面上的所述导电区,穿过所述衬底中的所述开口,连接至所述衬底的下表面上的所述引线键合焊盘;
h)将密封剂施加至所述衬底的下表面上,密封所述键合引线并填充所述衬底的所述开口;
i)固化所述密封剂;以及
j)在所述密封剂以外的区域将多个焊料球植入到所述衬底的下表面上;
其中所述方法的特征在于所述管芯的所述无源面无密封步骤以及所述管芯的侧面无密封步骤。
10.根据权利要求9所述的方法,其中所述粘合剂是可印刷膏。
11.根据权利要求9所述的方法,其中所述衬底的特征在于无塑封应力释放区。
12.根据权利要求9所述的方法,其中所述粘合图样包括在含有所述引线键合焊盘的所述导电区周围的小的空白区,其在管芯粘附之前不用粘合剂涂布,在管芯粘附期间粘合剂流入其中,以避免在所述管芯和所述底物之间形成间隙。
13.根据权利要求9所述的方法,其中在将所述管芯安装至所述衬底之前,所述粘合剂被B阶处理。
14.根据权利要求9所述的方法,其中在从晶片切割之前,所述粘合剂被施加至所述管芯。
15.根据权利要求9所述的方法,其中在从晶片切割之后,所述粘合剂被施加至所述管芯。
16.用于制造芯片上板半导体封装的衬底,其包括顶表面、与所述顶表面相对的底表面以及穿透所述顶表面和底表面的开口;其特征在于无塑封应力消除区。
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TWI500734B (zh) * | 2012-07-18 | 2015-09-21 | Toray Advanced Mat Korea Inc | 於高電壓情況時可具增進可靠度之黏著劑組合物及使用此種組合物之半導體封裝用膠帶 |
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TW411537B (en) * | 1998-07-31 | 2000-11-11 | Siliconware Precision Industries Co Ltd | Semiconductor package with CSP-BGA structure |
TW409377B (en) * | 1999-05-21 | 2000-10-21 | Siliconware Precision Industries Co Ltd | Small scale ball grid array package |
US6385049B1 (en) * | 2001-07-05 | 2002-05-07 | Walsin Advanced Electronics Ltd | Multi-board BGA package |
US20050062152A1 (en) * | 2003-09-24 | 2005-03-24 | Chung-Che Tsai | Window ball grid array semiconductor package with substrate having opening and mehtod for fabricating the same |
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- 2006-11-16 CN CNA200680056397XA patent/CN101589465A/zh active Pending
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TWI500734B (zh) * | 2012-07-18 | 2015-09-21 | Toray Advanced Mat Korea Inc | 於高電壓情況時可具增進可靠度之黏著劑組合物及使用此種組合物之半導體封裝用膠帶 |
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