CN103533766B - 电路板的制作方法以及该方法制得的电路板 - Google Patents
电路板的制作方法以及该方法制得的电路板 Download PDFInfo
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- CN103533766B CN103533766B CN201310497992.9A CN201310497992A CN103533766B CN 103533766 B CN103533766 B CN 103533766B CN 201310497992 A CN201310497992 A CN 201310497992A CN 103533766 B CN103533766 B CN 103533766B
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
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CN103533766A CN103533766A (zh) | 2014-01-22 |
CN103533766B true CN103533766B (zh) | 2016-07-06 |
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Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104363704B (zh) * | 2014-10-30 | 2017-12-29 | 江门崇达电路技术有限公司 | 一种厚孔铜pcb的制作方法 |
CN104519675A (zh) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | 薄板大孔树脂塞孔的工艺方法 |
CN104812179B (zh) * | 2015-04-21 | 2017-12-01 | 深圳崇达多层线路板有限公司 | 一种印刷电路板的孔铜制备工艺及印刷电路板 |
CN105072825A (zh) * | 2015-09-08 | 2015-11-18 | 深圳市迅捷兴电路技术有限公司 | 线性阻抗电路板的制作方法 |
CN105392299B (zh) * | 2015-11-27 | 2018-08-03 | 北大方正集团有限公司 | 一种改善pcb减铜均匀性的方法 |
CN105744766A (zh) * | 2016-04-05 | 2016-07-06 | 苏州市惠利华电子有限公司 | Hdi板的制造方法 |
CN108684141A (zh) * | 2018-04-20 | 2018-10-19 | 胜宏科技(惠州)股份有限公司 | 一种提高孔铜铜厚均匀性的方法 |
CN109548321B (zh) * | 2018-12-10 | 2021-06-25 | 江门崇达电路技术有限公司 | 一种正凹蚀pcb的制作方法 |
CN110831334A (zh) * | 2019-10-25 | 2020-02-21 | 广州兴森快捷电路科技有限公司 | 一种选择性树脂塞孔的线路板制作方法 |
CN111867266A (zh) * | 2020-07-14 | 2020-10-30 | 江门崇达电路技术有限公司 | 一种防止pcb孤立线路短路的线路设计方法 |
CN112165778A (zh) * | 2020-10-19 | 2021-01-01 | 东莞森玛仕格里菲电路有限公司 | 一种避免选择性塞孔过程磨板露基材的方法 |
CN113766750B (zh) * | 2021-09-27 | 2023-03-28 | 广州广合科技股份有限公司 | 一种线路板制备方法及线路板 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4601916A (en) * | 1984-07-18 | 1986-07-22 | Kollmorgen Technologies Corporation | Process for bonding metals to electrophoretically deposited resin coatings |
CN101304638A (zh) * | 2008-04-30 | 2008-11-12 | 李东明 | 印刷电路板掩膜孔铜加厚电镀工艺 |
Family Cites Families (1)
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JPH02255289A (ja) * | 1989-03-28 | 1990-10-16 | Mitsubishi Electric Corp | 複合材料の穴あけ方法 |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US4601916A (en) * | 1984-07-18 | 1986-07-22 | Kollmorgen Technologies Corporation | Process for bonding metals to electrophoretically deposited resin coatings |
CN101304638A (zh) * | 2008-04-30 | 2008-11-12 | 李东明 | 印刷电路板掩膜孔铜加厚电镀工艺 |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 413 No. 523039 Guangdong province Dongguan City Wanjiang Wando spike Avenue Patentee before: Dongguan Shengyi Electronics Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Manufacture method for gold finger circuit board and circuit board manufactured by method Effective date of registration: 20180103 Granted publication date: 20160706 Pledgee: China Co truction Bank Corp Dongguan branch Pledgor: Shengyi electronic Limited by Share Ltd Registration number: 2017440000224 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
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Date of cancellation: 20200522 Granted publication date: 20160706 Pledgee: China Co truction Bank Corp Dongguan branch Pledgor: SHENGYI ELECTRONICS Co.,Ltd. Registration number: 2017440000224 |