CN104602452B - 一种电路板的制作方法 - Google Patents
一种电路板的制作方法 Download PDFInfo
- Publication number
- CN104602452B CN104602452B CN201310531114.4A CN201310531114A CN104602452B CN 104602452 B CN104602452 B CN 104602452B CN 201310531114 A CN201310531114 A CN 201310531114A CN 104602452 B CN104602452 B CN 104602452B
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- CN
- China
- Prior art keywords
- circuit board
- multilayer circuit
- carried out
- resin
- electroconductive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310531114.4A CN104602452B (zh) | 2013-10-31 | 2013-10-31 | 一种电路板的制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310531114.4A CN104602452B (zh) | 2013-10-31 | 2013-10-31 | 一种电路板的制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104602452A CN104602452A (zh) | 2015-05-06 |
CN104602452B true CN104602452B (zh) | 2017-11-10 |
Family
ID=53127829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310531114.4A Active CN104602452B (zh) | 2013-10-31 | 2013-10-31 | 一种电路板的制作方法 |
Country Status (1)
Country | Link |
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CN (1) | CN104602452B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105451429B (zh) * | 2014-08-29 | 2018-06-26 | 深南电路有限公司 | 一种电路板的加工方法和电路板 |
CN105142361A (zh) * | 2015-08-04 | 2015-12-09 | 永利电子铜陵有限公司 | 一种pcb通孔树脂塞孔工艺 |
CN105407647B (zh) * | 2015-12-24 | 2018-08-24 | 竞陆电子(昆山)有限公司 | Pcb假负片结构及其生产方法 |
CN107567180A (zh) * | 2017-08-28 | 2018-01-09 | 广德新三联电子有限公司 | 基于pofv树脂塞孔饱满度及热应力后塞孔树脂膨胀控制工艺 |
CN109275286A (zh) * | 2018-11-24 | 2019-01-25 | 开平太平洋绝缘材料有限公司 | 一种改善控深钻孔图电后镀锡不良的工艺 |
CN110099523A (zh) * | 2019-03-29 | 2019-08-06 | 东莞联桥电子有限公司 | 一种多层线路板的制作工艺 |
CN110572959B (zh) * | 2019-07-31 | 2021-11-02 | 珠海精毅电路有限公司 | 一种耐高压电源板的生产工艺 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2617121Y (zh) * | 2003-04-25 | 2004-05-19 | 威盛电子股份有限公司 | 多层板的结构 |
JP2005116910A (ja) * | 2003-10-10 | 2005-04-28 | Tanaka Kikinzoku Kogyo Kk | 複合導体のプリント配線板の製造方法 |
CN101626666A (zh) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | 蚀刻线路后树脂塞孔工艺流程 |
CN101977482B (zh) * | 2010-11-09 | 2012-03-28 | 深圳崇达多层线路板有限公司 | 一种高纵横比的pcb产品外层线路蚀刻方法 |
CN102958288B (zh) * | 2011-08-21 | 2015-04-29 | 深南电路有限公司 | 印刷电路板钻孔方法 |
CN102348336B (zh) * | 2011-09-23 | 2014-07-09 | 深南电路有限公司 | 一种对电路板导电孔进行树脂塞孔的方法 |
CN103369867B (zh) * | 2012-04-01 | 2016-06-01 | 北大方正集团有限公司 | 印刷电路板(pcb)的制作方法以及pcb |
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2013
- 2013-10-31 CN CN201310531114.4A patent/CN104602452B/zh active Active
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Publication number | Publication date |
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CN104602452A (zh) | 2015-05-06 |
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CP03 | Change of name, title or address |
Address after: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871 room 808, founder building, Zhongguancun, 298 Chengfu Road, Haidian District, Beijing Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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Effective date of registration: 20220921 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |