CN103492118A - Laser processing device and laser processing method - Google Patents

Laser processing device and laser processing method Download PDF

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Publication number
CN103492118A
CN103492118A CN201380001036.5A CN201380001036A CN103492118A CN 103492118 A CN103492118 A CN 103492118A CN 201380001036 A CN201380001036 A CN 201380001036A CN 103492118 A CN103492118 A CN 103492118A
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CN
China
Prior art keywords
mounting portion
movable
laser processing
dust
movable mounting
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201380001036.5A
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Chinese (zh)
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CN103492118B (en
Inventor
西原学
平本匡宽
樱井通雄
迫田义照
舩井皓平
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Publication of CN103492118A publication Critical patent/CN103492118A/en
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Publication of CN103492118B publication Critical patent/CN103492118B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

In order to prevent deterioration of the flatness of a sheet-form workpiece, this laser processing device is provided with a work table, an outer periphery mounting unit (114), a first movable mounting unit (112), a second movable mounting unit (113), a workpiece restraining unit (121), a processing head unit (109), and a movable dust collection unit (123). The first movable mounting unit (112) and second movable mounting unit (113) are provided on the work table and inside of the outer periphery mounting unit (114), and can move vertically. The workpiece restraining unit (121) is provided on the outer periphery mounting unit (114), and the processing head unit (109) is provided above the first movable mounting unit (112) or the second movable mounting unit (113). The movable dust collection unit (123) is provided inside of the outer periphery mounting unit (114) and can move horizontally. This laser processing method involves a first laser processing step, a first step for lowering the second movable mounting unit, a first step for moving the dust collection unit, a first step for raising the first movable mounting unit, and a second laser processing step.

Description

Laser processing device and laser processing
Technical field
The laser processing device that the present invention relates to irradiate laser and processed, relate in particular to the laser processing device and the laser processing that carry out through hole processing (through hole processing).
Background technology
In recent years, be accompanied by the miniaturization of parts, highly integrated, compound die blocking, become the also path of perforation processing of their basic base material, be difficult to realize with existing processing method.In order to address the above problem, increase gradually the perforation processing of using laser.Should the processing of the hole to machined object based on laser roughly be divided into two classes: the through hole processing of offering through hole on machined object; Offer the blind hole processing of non-through hole on machined object.
Figure 26 means the cutaway view of structure of the first case of existing laser processing device.
As shown in figure 26, machined object 811 loads in the top of divided mounting portion 812.Divided mounting portion 812 can be distinguished independently in the enterprising action of above-below direction and does, and utilizes the lifting drive division such as cylinder and carries out knee-action.
Add man-hour in blind hole, the state that mounting portion 812 rises on whole adsorption sections.And, at the fixing machined object 811 of whole of mounting portion 812 absorption, and machined object 811 is carried out to Laser Processing.Add man-hour at through hole, as shown in figure 26, under the state that only makes the mounting portion 812 suitable with the bottom of through hole processing descend, machined object 811 is carried out to Laser Processing.
As mentioned above, can when maintaining the flatness of machined object, prevent from adding because of through hole the damage (for example,, with reference to patent documentation 1) of the mounting portion 812 that the laser in man-hour causes.
Figure 27 means the stereogram of structure of the second case of existing laser processing device.
The machined object 901 of the thin sheet form that as shown in figure 27, chuck 902 utilizes the clamping of opposed both sides to be formed by soft member.903 pairs of machined objects 901 by chuck 902 clampings of stretching device are given tensile force.Utilize chuck 902 and stretching device 903 to keep machined object 901.Mobile device 904 moves machined object 901.Dust collect plant 905 is arranged on the rear side with respect to the face that laser was irradiated of machined object 901 with the size in the whole zone that spreads all over a plurality of machining areas.Dust collect plant 905 has the arresting stop 906 that air-flow is stopped in inside.Two holding devices 907 keep respectively the limit quadrature, opposed limit machined object 901 with the tensile force effect produced by stretching device 903.Adjusting device 908 makes a side of holding device 907 towards moving with the rectangular direction of tensile force.
As mentioned above, utilize and give tensile force and keep the stretching device 903 of machined object 901 and holding device 907 to stretch machined object 901 and maintain plane to machined object 901.Machined object 901 maintains plane, and moves to machining area with maintained state.The back side of the through hole working position of machined object 901 does not contact with mounting portion, and machined object 901 maintains plane and carries out Laser Processing (for example,, with reference to patent documentation 2).
Technical literature formerly
Patent documentation
Patent documentation 1: No. 2008/084642nd, International Publication
Patent documentation 2: TOHKEMY 2009-006356 communique
Brief summary of the invention
Yet there is following problem in above-mentioned prior art.
In recent years, be accompanied by more accurate processing and highly integrated, the thickness of tabular machined object becomes thinner, and the diameter of the hole processing of enforcement also diminishes gradually.Machined object for example becomes the metal forming of the thickness of the resin film of the thickness of 100 μ m left and right, tens of μ m.
In the existing laser processing device of above-mentioned first case, add man-hour at through hole, under the state that the adsorption section suitable with the bottom of the processing of machined object descended, machined object is carried out to Laser Processing.Then, by making air circulate to discharge dust in processing part.
Therefore, in the situation that machined object is sheet or the paper tinsel shape of thin thickness as described above, under the effect of deadweight, the processing part of machined object is sagging and become recess.In addition, the pressure oscillation because of the air of the processing part at machined object circulation produces lax.Consequently, the flatness of processing part worsens.The deterioration of flatness causes the skew of the focus of laser, the skew of Working position, becomes precision machined obstacle.
In the situation that the size of the sheet material of machined object be 512mm * 342mm～512mm * 462mm, the most proximad 560mm * 610mm is sheetization, it is more remarkable that the problems referred to above become.
In addition, the dust of carrying by air stream moves in the movable area of mounting portion.Therefore, dust is attached to drive division, the guide portion for sliding, and sometimes also causes mechanical damage.
In addition, in the existing laser processing device of above-mentioned second case, the opposed both sides by the stretching machined object are intended to keep plane.As described above, in the situation that the sheet that machined object is thin thickness or paper tinsel shape, the material that causes machined object that stretches produces extension, thereby Working position skew or generation gauffer.It is particularly remarkable that the problems referred to above become in the sheet of machined object.The laser processing device of second case is difficult to carry out accurate processing more than the prior art of first case, and then for large stretch of machined object, can be described as can not carry out precision machined.
Summary of the invention
In order to solve above-mentioned problem, laser processing device of the present invention has workbench, periphery mounting portion, the movable mounting portion of the first, the movable mounting portion of the second, workpiece press section, processing head, movable collecting unit of dust.Workbench drives along horizontal direction.The periphery mounting portion is located on workbench, and has adsorption hole.The movable mounting portion of the first and the movable mounting portion of the second are located at inboard on workbench, the periphery mounting portion, and can move up and down.The periphery mounting portion is located in the workpiece press section.The processing head is located at the top of the movable mounting portion of the first or the movable mounting portion of the second, carries out Laser Processing.Movable collecting unit of dust is located at the inboard of periphery mounting portion, and can move by along continuous straight runs.
In addition, laser processing of the present invention comprises the first mounting operation, first fixedly operation, the first Laser Processing operation, the movable mounting portion decline of first the second operation, the first collecting unit of dust mobile process, the movable mounting portion rising of first the first operation, the second Laser Processing operation.The first mounting operation is the operation of mounting the first machined object on periphery mounting portion, the movable mounting portion of the second, movable collecting unit of dust.The periphery mounting portion has adsorption hole, and the movable mounting portion of the second is located at the inboard of periphery mounting portion, can move up and down, and have adsorption hole.Movable collecting unit of dust is located at the inboard of periphery mounting portion, and can move by along continuous straight runs.First fixedly operation be the operation of utilizing the workpiece press section be located at the periphery mounting portion to press the first machined object.The first Laser Processing operation is top, the operation that Laser Processing is carried out in first area the first machined object to being positioned at movable collecting unit of dust.The the first movable mounting portion decline of the second operation is the operation that the movable mounting portion of the second is moved down.The first collecting unit of dust mobile process is the operation that movable collecting unit of dust is moved along the first horizontal direction.The the first movable mounting portion rising of the first operation is the operation that the movable mounting portion of the first is moved up, and the movable mounting portion of this first is located at the inboard of periphery mounting portion, can move up and down, and have adsorption hole.The second Laser Processing operation is top, the operation that second area the first machined object carries out Laser Processing to being positioned at movable collecting unit of dust.
Laser processing device of the present invention and laser processing are by being made as said structure, even in the situation that be not held in the through hole processing of member of bottom in the Laser Processing zone of machined object, also sufficiently high plane precision can be guaranteed, unnecessary vibration can be do not produced.Therefore, even the machined object of the very thin sheet of thickness also can carry out the Laser Processing that precision is high.
The accompanying drawing explanation
Fig. 1 means the stereogram of the Sketch of the laser processing device that embodiments of the present invention are related.
Fig. 2 observes the partial sectional view of the related laser processing device of embodiments of the present invention from directions X.
Fig. 3 A is the stereogram of the related movable collecting unit of dust of embodiments of the present invention.
Fig. 3 B is the cutaway view of the related movable collecting unit of dust of embodiments of the present invention.
Fig. 4 is the stereogram of the related movable collecting unit of dust drive division of embodiments of the present invention.
Fig. 5 means the allocation plan of an example of setting of the machining area of the machined object that embodiments of the present invention are related.
Fig. 6 means the partial sectional view of the state when machined object of the laser processing device that embodiments of the present invention are related is supplied with.
Fig. 7 means the partial sectional view of the machined object hold mode of the laser processing device that embodiments of the present invention are related.
Fig. 8 means the partial sectional view of the position relationship of the movable collecting unit of dust under the Laser Processing SBR that embodiments of the present invention are related.
The partial sectional view of the position relationship of movable collecting unit of dust when Fig. 9 means the related Laser Processing of embodiments of the present invention.
The partial sectional view of the position relationship of movable collecting unit of dust when Figure 10 means the Laser Processing of the different machining area that embodiments of the present invention are related.
The partial sectional view of the position relationship of movable collecting unit of dust when Figure 11 means the Laser Processing of machining area of the final row that embodiments of the present invention are related.
Figure 12 means the partial sectional view of the position relationship of the movable mounting portion after the Laser Processing of whole machining area that embodiments of the present invention are related finishes.
Figure 13 means the partial sectional view of the state when machined object of the laser processing device that embodiments of the present invention are related is discharged.
Figure 14 mean embodiments of the present invention related processing sequence is set as to the supply machined object of rightabout Laser Processing the time state, partial sectional view that observe from X-direction.
Figure 15 means that the related processing sequence by the machining area of machined object of embodiments of the present invention is set as the allocation plan of rightabout example.
Figure 16 mean embodiments of the present invention related processing sequence is set as to the maintenance machined object of rightabout Laser Processing the time the partial sectional view of state.
Figure 17 means the partial sectional view of the position relationship of the movable collecting unit of dust under the SBR that processing sequence is set as to rightabout Laser Processing that embodiments of the present invention are related.
Figure 18 mean embodiments of the present invention related processing sequence is set as to rightabout Laser Processing the time the partial sectional view of position relationship of movable collecting unit of dust.
Figure 19 mean embodiments of the present invention related processing sequence is set as to the Laser Processing of rightabout different machining area the time the partial sectional view of position relationship of movable collecting unit of dust.
The partial sectional view of the position relationship of movable collecting unit of dust when Figure 20 means the Laser Processing of the machining area that processing sequence is set as to rightabout final row that embodiments of the present invention are related.
Figure 21 means the partial sectional view of the position relationship of the movable mounting portion after the related Laser Processing that processing sequence is set as to rightabout whole machining areas of embodiments of the present invention finishes.
Figure 22 means the partial sectional view of state when the related machined object that processing sequence is set as to rightabout laser processing device of embodiments of the present invention is discharged.
Figure 23 A means the cutaway view of the different structure of the movable collecting unit of dust that embodiments of the present invention are related.
Figure 23 B means the cutaway view of the different structure of the movable collecting unit of dust that embodiments of the present invention are related.
Figure 24 means the figure of effect of the different structure of the movable collecting unit of dust that embodiments of the present invention are related.
Figure 25 A means in the situation that do not have the figure of state of the machined object of fixture sheet material (jig sheet) in the related movable collecting unit of dust of an example of embodiments of the present invention.
Figure 25 B means in the situation that have the figure of state of the machined object of fixture sheet material in the related movable collecting unit of dust of an example of embodiments of the present invention.
Figure 26 means the cutaway view of structure of the mounting portion of the laser processing device that prior art is related.
Figure 27 means the stereogram of hold mode of the machined object of the laser processing device that prior art is related.
The specific embodiment
By reference to the accompanying drawings laser processing device of the present invention and laser processing are described.XYZ axle shown in figure is mutually orthogonal separately.The XY axle is and suitable all around horizontal direction that Z axis is and suitable up and down vertical.The reference axis of each figure with the direction with each visual field corresponding mode describe.In addition, in institute's drawings attached, identical inscape is marked to identical Reference numeral.
(embodiment)
Fig. 1 means the stereogram of the Sketch of the laser processing device 100 that an example of embodiments of the present invention is related.In Fig. 1, for the ease of the structure of visual confirmation device, remove machined object and fixture sheet material described later.In addition, for detailed structure is described, Fig. 2 observes the cutaway view of laser processing device 100 from directions X.
In Fig. 1 and Fig. 2, laser beam 103 penetrates by laser oscillator 102, and be directed to there is speculum, the optical system of lens 104.Optical system 104 is carried out the adjustment of the density (laser path) of laser beam 103, the shaping of shape, the inhibition of veiling glare etc., makes the direction of laser beam 103 towards regulation.
Be directed to current scanning device 105 by the laser beam 103 after optical system 104.Laser beam 103 is scanned location by the X speculum 106 for being scanned in X-direction with for the Y speculum 107 that will be scanned in Y direction by the laser beam 103 after 106 reflections of X speculum.Then, utilize f θ lens 108 optically focused by the laser beam 103 after 107 reflections of Y speculum, and shine the processing stand of assigned position.
As shown in Figure 2, current scanning device 105 is arranged at processing head 109 with f θ lens 108.Current scanning device 105 has X speculum 106 and Y speculum 107, and laser beam 103 is reflected and controls irradiation position.F θ lens 108 make the direction of laser beam 103 become the direction vertical with the face of machined object 111, and carry out optically focused.It is upper that processing head 109 is installed on Z slide block (not shown), and processing head 109 is configured in the Z direction, is movable on the above-below direction of Fig. 2.
Mounting keeps the mounting portion of the machined object 111 of sheet to comprise periphery mounting portion 114, is provided with a plurality of movable mounting portions 115, movable collecting unit of dust 123, a plurality of workpiece press section 121.
Movable mounting portion 115 is divided into the movable mounting portion 112 of the different the first of action and the movable mounting portion 113 of the second.In the present embodiment, the movable mounting portion 113 of the second is to be arranged near mounting portion central authorities and the member with larger face moved.The movable mounting portion 112 of the first lays respectively at the opposed both sides of the movable mounting portion 113 of the second, is two less members that can be moved independently of each other.
Two movable mounting portions 112 of the first are supported by a pair of movable mounting portion lifting work cylinder 118 respectively with the movable mounting portion 113 of the second.The cylinder that movable mounting portion lifting work cylinder 118 is used in the present embodiment by air-pressure controlling, can make two movable mounting portions 112 of the first and the lifting independently of the movable mounting portion 113 of the second.
Be respectively equipped with a plurality of movable mounting portion adsorption holes 116 on the movable mounting portion 112 of the first and the movable mounting portion 113 of the second.In addition, also be provided with periphery adsorption hole 117 in periphery mounting portion 114.By movable mounting portion adsorption hole 116 is carried out to vacuum draw with periphery adsorption hole 117, thereby machined object 111 is adsorbed maintenance.
At least at the long side direction with movable mounting portion 115, parallel both sides are provided with a pair of in workpiece press section 121.In the present embodiment, also on the parallel both sides of the short side direction of movable mounting portion 115, also be provided with a pair of, thereby be arranged at whole four limits of movable mounting portion 115.Install in the mode that can rotate by being arranged on the fulcrum on the member of being located at periphery mounting portion 114 workpiece press section 121, and drive working cylinder 119 to be opened and closed by press section.
The workpiece press section 121 tabular metallic object more rectangular by the restriction of the size than Z direction forms, and in workpiece press section 121, with the opposed face of machined object, is provided with clamping component 120.Clamping component 120 is formed by the organic matter elastomer as polyurethane rubber, silicon rubber.Thus, when contacting with machined object, can not cause damage ground to produce pressing force, and, can prevent the skew that the slip because of machined object causes.
Movable collecting unit of dust 123 with can with respect to machined object with the contrary side of processing head, be that the mode that the lower side along continuous straight runs moves arranges.Dust during machined object 111 was collected and discharged to movable collecting unit of dust 123 Laser Processing.
Fig. 3 A is the stereogram of the basic configuration of movable collecting unit of dust 123, and Fig. 3 B is the cutaway view of movable collecting unit of dust 123.As shown in Fig. 3 A and 3B, movable collecting unit of dust 123 is the section shape of the roughly コ word of support 302 with machined object and circulation of air section 303.Be blown into air blast and attract (plug-type (push-pull)) to ventilate from the opposing party by the side from circulation of air section 303, thereby collect and discharge dust.
Fig. 4 means the partial perspective view of an example of the driving part structure of movable collecting unit of dust 123.As shown in Figure 4, CD-ROM drive motor 200 is set near mounting portion, utilizing CD-ROM drive motor 200 to make to drive transfer part 201 is the ball-screw rotation, can make thus movable collecting unit of dust 123 slide mobile.
Perhaps, as an example of other structures, also can guiding piece and band (not shown) be set at movable collecting unit of dust 123, the rotation of CD-ROM drive motor 200 is passed to band and makes movable collecting unit of dust 123 slide mobile.
Fixture sheet material 122 is pre-arranged in the position with the mounting portion clamping by machined object 111, is the member of the sheet that formed by flame-retardant porous material.Flame-retardant porous material be the fire retardant that will by phosphorus compound be for example carried out flame treatment paper pulp fiber as base material, and add adhesive and form the nonwoven of sheet.
About anti-flammability, with common anti-flammability material in the same manner, possess oneself's fire extinguishing property of burning diffusion got final product.In addition, the fire retardant of interpolation also is not limited to phosphorus compound system, can use bromine compounds, chlorine compound or have the phosphate of halogen, or use metal hydroxides etc. as inorganic material.
Base material is not limited to paper pulp fiber, can add above-mentioned anti-flammability, as long as have the Porous that for attracting, can make gas pass through.Base material is preferably the material that has effect of heat insulation as the nonwoven of the organic materials such as paper pulp fiber, synthetic resin fiber.
As shown in Figure 2, the machine table 130 arranged in mode that can be mobile in the horizontal direction is by these two module compositions roughly of Y platform 131 and X platform 133.
Upload at Y platform 131 and be equipped with the movable mounting portion 112 of the first, the movable mounting portion 113 of the second, periphery mounting portion 114, movable collecting unit of dust 123, workpiece press section 121, reach the incidental a whole set of structure of above-mentioned member, form in mode movable on Y-direction.By utilizing Y platform drive division 132 to carry out CD-ROM drive motor, make thus the ball-screw rotation, with the member of the whole series mounting, make accordingly Y platform 131 slide, carry out thus the movement of Y-direction.
X platform 133 also loads Y platform 131 and its incidental a whole set of structure, in mode movable on directions X, forms.By utilizing X platform drive division 134 to carry out CD-ROM drive motor, make thus the ball-screw rotation, with the member of the whole series mounting, make accordingly X platform 133 slide, carry out thus the movement of directions X.
It should be noted that, laser processing device 100 has the machining control section 101 of the control of carrying out device able to programmely.101 pairs, machining control section comprises that laser oscillator 102, current scanning device 105, X platform drive division 134, Y platform drive division 132, press section drive air-breathing exhaust, action laser processing device of working cylinder 119, movable mounting portion lifting work cylinder 118, other adsorption holes to be controlled.
Fig. 5 means the allocation plan of an example of the setting of the machining area in present embodiment.The sweep limits of the current scanning device 105 of the irradiation position of locating laser bundle 103 is less than the area of machined object 111 accurately.Therefore, machined object 111 is split into a plurality of machining areas 125 and carries out Laser Processing.In Fig. 5, the zone that machined object 111 is marked to the numbering that has 1～48 is machining area.
Thus, each machining area 125 is set in the sweep limits of current scanning device 105, and the location of the Laser Processing in machining area 125 is undertaken by controlling the current scanning device.It should be noted that, illustrated zone is only an example, is not limited to this figure.
Action to the laser processing device 100 that forms as mentioned above describes.
Mounting portion when Fig. 6 means lift-launch machined object 111 and the partial sectional view state of movable collecting unit of dust 123, that observe from X-direction.
When machined object 111 is equipped on to device, by making machine table 130, move, make mounting portion move to the loading position of machined object 111.At this, stop movable mounting portion adsorption hole 116 with the vacuum draw of periphery adsorption hole 117 in the state of absorption not.In addition, movable collecting unit of dust 123 also stops the air stream for control of dust.Fixture sheet material 122 sets in advance in assigned position.
Make movable collecting unit of dust 123 be positioned at a side's of machining area end, the movable mounting portion 113 of the movable mounting portion 112b of the first, the second that makes to be positioned at beyond the movable mounting portion 112a of the first of position of movable collecting unit of dust 123 rises in advance.In addition, workpiece press section 121 drives working cylinder 119 by press section and state in opening.
As shown in Figure 7, on the fixture sheet material 122 that machined object 111 is carried on mounting portion, (the first mounting operation) afterwards, carries out vacuum draw and starts the lower surface of machined object 111 and fixture sheet material 122 are adsorbed to maintenance in the lump with periphery adsorption hole 117 movable mounting portion adsorption hole 116.Then, utilize press section to drive working cylinder 119, workpiece press section 121 is urged to closed condition (first fixedly operation) from open mode.
As shown in Figure 7, machined object 111 remains in the lump the periphery mounting portion 114 that is formed with adsorption hole, the movable mounting portion 112b of the first that is formed with adsorption hole and the movable mounting portion 113 of the second, reaches on movable collecting unit of dust 123 with fixture sheet material 122.The periphery of machined object 111 and fixture sheet material 122 are pressed by workpiece press section 121 accordingly.The part of joining with machined object 111 in workpiece press section 121 is provided with clamping component 120, to machined object 111, produces pressing forces, and prevents the slip of machined object 111 and the skew that causes.Thus, the plane that utilizes periphery mounting portion 114 and workpiece press section 121 to keep machined object 111.
After finishing, the maintenance of machined object 111 carries out following action.
Stop the attraction of the movable mounting portion adsorption hole 116 based on the movable mounting portion 112b of the first and the movable mounting portion 113 of the second, and the absorption that discharges this zone is fixed.After liberation absorption is fixing, make the movable mounting portion 112b of the first of rising and the position (the movable mounting portion decline of first the second operation) that the movable mounting portion 113 of the second drops to regulation.Fig. 8 illustrates this state.
After having carried out above-mentioned action, or with above-mentioned action concurrently, for the mounting portion that makes to keep machined object 111 moves to the first machining area (first area) and starts the movement of machine table.The processing head 109 that is positioned at origin position carries out to the SBR that moves and enter Laser Processing of the focal position of the processing that is suitable for machined object 111 most.
Now, movable collecting unit of dust 123 is positioned at the lower surface of the row that comprise the first machining area.From side's air supply in the space of the コ word of movable collecting unit of dust 123, from the opposing party, discharge air.So make plug-type air stream, can control thus the pressure flatness of machined object 111 impacted for not, and, owing to obtaining stable laminar flow, therefore can not make the machined object vibration yet.
After the first machining area 125 of above-mentioned release, machined object 111 arrives the residing position of processing head 109, utilize laser beam 103 to start the hole processing (the first Laser Processing operation) of the first machining area 125.
Fig. 9 observes from X-direction the partial sectional view that the first machining area 125 is carried out to the state of laser hole processing.There is movable collecting unit of dust 123 in the position corresponding with machining area, illuminating laser beam 103 under the states that all descend in the movable mounting portion 112a of the first, 112b and the movable mounting portion of the second 113 and carry out hole processing.The periphery of machined object 111 is adsorbed maintenance by the periphery adsorption hole 117 of being located at periphery mounting portion 114, and press the workpiece press section 121 that is provided with clamping component 120.Thus, can prevent deflection and the position skew of machined object.
Although hole processing arrives clamp sheet material 122, because the material by anti-flammability forms, even therefore generation being charred slightly, but do not produce on fire, damaged yet.
In addition, in movable collecting unit of dust 123, by circulation of air section 303, manufacture air stream, air is discharged to outside.Therefore, the dust produced at the lower surface of the lower surface of machined object 111 or fixture sheet material 122 is discharged by air stream efficiently.
Irradiation at the laser beam of regulation finishes, after the whole hole process finishing in the first machining area 125, in order to move to the second machining area 125 of next shown in Fig. 5, machine table is moved in the present embodiment on directions X.About the state of the processing of the laser hole in the second machining area 125, also as shown in Figure 9.Thus, repeat identical action before the Laser Processing that finishes whole machining areas (first in Fig. 5～the 8th machining area) of residing row to movable collecting unit of dust 123.
After the Laser Processing of the Zone Full that finishes row, start following action.
At first, for the mounting portion that makes to be equipped with machined object moves to the machining area of next column, start the movement of machine table to Y-direction.Simultaneously, movable collecting unit of dust 123 is also moved (the first collecting unit of dust mobile process).The movable mounting portion 113 of the movable mounting portion 112a of the first, 112b and the second keeps the state descended.Figure 10 illustrates the state after moving.
Take machined object 111 as benchmark, movable collecting unit of dust 123 moves to the position corresponding with the machining area (the 9th machining area in Fig. 5) of next column, direction (the first horizontal direction) is mobile left, if but take processing head as benchmark, be positioned at as illustrated roughly the same position.
As mentioned above, after the processing in the machining area (second area) of these row is ready to complete, controls current scanning device 105, and the hole Working position is started to the irradiation of laser beam 103.
Figure 10 observes from X-direction the partial sectional view that machining area is carried out to the state of laser hole processing.Be positioned at illuminating laser beam 103 under the state of the position corresponding with machining area at movable collecting unit of dust 123 and carry out hole processing.Movable collecting unit of dust 123 is manufactured from side's air supply in the space of コ word and is discharged the plug-type air stream of air from the opposing party.
When the Laser Processing finished whole machining areas (the 9th～the 16 machining area in Fig. 5) of movable collecting unit of dust 123 residing row, similarly move to next machining area.Then, repeat above-mentioned action and sequentially machining area processed according to the rules.
Figure 11 is illustrated in the state of successively machining area being processed the Working position of the row (the 41～the 48 machining area in Fig. 5) that move to the last machining area of machined object 111 afterwards.
At this, in the same manner, movable collecting unit of dust 123 is positioned at the position corresponding with machining area, in manufacture, side's air supply from the space of コ word is arranged, discharges from the opposing party the state of plug-type air stream of air, illuminating laser beam 103 and carry out hole processing.
Irradiation at the laser beam of regulation finishes, after the whole hole process finishing in the initial machining area (the 41 machining area) of these row, in order to move to next machining area, machine table is moved in the present embodiment on directions X.The Laser Processing of then similarly being stipulated.Thus, repeated identical action before the Laser Processing that finishes whole machining areas (the 41～the 48 machining area in Fig. 5) of residing row to movable collecting unit of dust 123.So, carry out the processing of the machining area of last row, thereby finish the processing of whole of machined object 111.
After the process finishing of whole of machined object 111, start following action.
At first, in order to start to the movement of machined object extracting position and to start the movement of machine table.Start the movement to initial point of processing head 109.
The end of opposition side when as shown in figure 12, movable collecting unit of dust 123 is positioned at the processing beginning.Movable mounting portion 113 risings (the movable mounting portion rising of first the first operation) of the movable mounting portion 112a of the first, the second except the movable mounting portion 112b of the first of movable collecting unit of dust 123 residing parts.After the end of rising, the movable mounting portion adsorption hole 116 of being located at the movable mounting portion 112a of the first, the movable mounting portion 113 of the second is carried out to vacuum draw, thereby absorption keeps machined object 111 and fixture sheet material 122 again.Above-mentioned action is parallel.
After above-mentioned whole releases, machine table move to the machined object extracting position, as shown in figure 13, make press section drive working cylinder 119 actions, make workpiece press section 121 become the state of opening.Then, stop the vacuum draw of whole movable mounting portion adsorption hole 116 and whole periphery adsorption hole 117.Then, confirm that machined object 111 is not adsorbed maintenance, machined object withdrawing device (not shown) takes out machined object 111 from mounting portion, thereby finishes the laser hole processing of machined object.Residual above the movable mounting portion 113 of the movable mounting portion 112a of the first, the second and movable collecting unit of dust 123 have a fixture sheet material 122, in the processing of upper once machined object, uses.
As mentioned above, in laser processing device of the present invention, the movable collecting unit of dust 123 that forms stable air stream is positioned at the bottom of the machining area that carries out Laser Processing all the time as the movable mounting portion in bottom.The dust produced because of processing is collected and discharged to movable collecting unit of dust 123.Thus, realize high efficiency control of dust, prevent that in addition dust is attached to the movable part of device.
In addition, by the absorption of the machined object 111 based on periphery mounting portion 114 and the fixing maintenance of carrying out the machined object that deflection is few of workpiece press section 121.And, the machining area that the support 302 of the machined object of movable collecting unit of dust 123 is listed as from lower support one all the time.Therefore, even the machined object of the very thin sheet of sheet and thickness also can carry out the considerably less high-precision Laser Processing of deflection.
Then, to the discharge from shown in Figure 13 the state of machined object 111 again carry machined object 111 and the action of carrying out the situation of above-mentioned a series of Laser Processing describes.In this case, also the order of the processing of the machining area of machined object 111 can be set as to rightabout.
Figure 14 means state, the partial sectional view that observe from X-direction when the processing sequence of the Laser Processing based on laser processing device of the present invention is set as to the supply machined object in rightabout situation.
When machined object 111 is equipped on to device, till machine table 130 moves to the loading position of machined object 111.Stop movable mounting portion adsorption hole 116 and be pre-formed the not state of absorption with the vacuum draw of periphery adsorption hole 117.In addition, movable collecting unit of dust 123 also stops the air stream for control of dust.Fixture sheet material 122 sets in advance in assigned position.
Movable collecting unit of dust 123 is positioned at a side's of machining area end, and the movable mounting portion 113 of the movable mounting portion 112a of the first, the second except the movable mounting portion 112b of the residing the first of movable collecting unit of dust 123 rises.In addition, workpiece press section 121 is by press section driving working cylinder 119 and in open mode.
The state of the structure during supply of the machined object 111 shown in Figure 14 is positioned on the opposition side this point different from the state shown in described Fig. 6 in the position of movable collecting unit of dust 123.Follow in this, different with the state shown in described Fig. 6 the movable mounting portion 112a of the first also becomes contrary this point from the movable mounting portion 112b of the first upper-lower position separately on.
The speciality of setting the said apparatus action is, the position relationship that comprises movable collecting unit of dust 123 and the movable mounting portion 112a of the first, 112b, the position relationship of the structure of the position relationship of the structure that the machine table during discharge of the machined object 111 shown in Figure 13 is relevant during with the supply of the machined object 111 shown in Figure 14 is identical.Thus, only make machine table mobile supply preparation that just can promptly realize machined object 111 on X-direction after discharging machined object.
Figure 15 is set as the processing sequence of machining area the allocation plan of rightabout machined object.The order of processing is Mirror Symmetry with the machining area of Fig. 5 with respect to Y-axis.
As shown in figure 16, machined object 111 (the second machined object) is being equipped on the fixture sheet material 122 on mounting portion to (the second mounting operation) afterwards, movable mounting portion adsorption hole 116 is carried out to vacuum draw with periphery adsorption hole 117, start the lower surface of machined object 111 and fixture sheet material 122 are adsorbed to maintenance in the lump.Then, utilize press section to drive working cylinder 119, by workpiece press section 121 from the state-driven opened to the state of closing (second fixedly operation).
As shown in figure 16, machined object 111 remains in the lump the periphery mounting portion 114 that is formed with adsorption hole, the movable mounting portion 112a of a plurality of the first that is formed with adsorption hole and the movable mounting portion 113 of the second, reaches on movable collecting unit of dust 123 with fixture sheet material 122.The periphery of machined object 111 and fixture sheet material 122 are pressed by workpiece press section 121 accordingly.The part of joining with machined object 111 in workpiece press section 121 is provided with clamping component 120, to machined object 111, produces pressing forces, and prevents the slip of machined object 111 and the skew that causes.Thus, the plane that utilizes periphery mounting portion 114 and workpiece press section 121 to keep machined object 111.
The action illustrated in above action and Fig. 7 is special the variation not
After finishing, the maintenance of machined object 111 carries out following action.
Stop the attraction of the movable mounting portion adsorption hole 116 based on the movable mounting portion 112a of the first and the movable mounting portion 113 of the second, the absorption that discharges this zone is fixed.After liberation absorption is fixing, make the movable mounting portion 112a of the first of rising and the position (the movable mounting portion manufacturing procedure of second the second) that the movable mounting portion 113 of the second drops to regulation.Figure 17 illustrates this state.
After having carried out above-mentioned action, or with above-mentioned action concurrently, move to the first machining area and start the movement of machine table in order to make the mounting portion that maintains machined object 111.The processing head 109 that is positioned at origin position carries out to the SBR that moves and enter Laser Processing of the focal position of the processing that is suitable for machined object 111 most.
The action illustrated in above action and Fig. 8 is basic identical, but because the first machining area is Mirror Symmetry with respect to Y-axis, so the amount of movement difference of Y direction.
Now, movable collecting unit of dust 123 is positioned at the lower surface of the row that comprise the first machining area.From side's air supply in the space of the コ word of movable collecting unit of dust 123, from the opposing party, discharge air.So manufacture plug-type air stream, can control thus the pressure flatness of machined object 111 impacted for not, and, owing to obtaining stable laminar flow, so can not make machined object vibrate yet.
After the first machining area 125 of above-mentioned release, machined object 111 arrives the residing position of processing head 109, utilize laser beam 103 to start the hole processing of the first machining area 125.
Figure 18 observes from X-direction the partial sectional view that the first machining area 125 (the 3rd zone) is carried out to the state of laser hole processing (the 3rd Laser Processing operation).There is movable collecting unit of dust 123 in the position corresponding with machining area, illuminating laser beam 103 under the states that all descend in the movable mounting portion 112a of the first, 112b and the movable mounting portion of the second 113 and carry out hole processing.The periphery of machined object 111 is adsorbed maintenance by the periphery adsorption hole 117 of being located at periphery mounting portion 114, and press the workpiece press section 121 that is provided with clamping component 120.Thus, can prevent deflection and the position skew of machined object.
With similarly above-mentioned, in movable collecting unit of dust 123, by circulation of air section 303, manufacture air stream, air is discharged to outside.Therefore, the dust produced at the lower surface of the lower surface of machined object 111 or fixture sheet material 122 is discharged by air stream efficiently.
Irradiation at the laser beam of regulation finishes, after the whole hole process finishing in the first machining area 125, in order to move to the second machining area 125, machine table is moved in the present embodiment on directions X.About the state of the processing of the laser hole in the second machining area 125, as shown in Figure 18.So, repeated identical action before the Laser Processing that finishes whole machining areas (first in Figure 15～the 8th machining area) of residing row to movable collecting unit of dust 123.
After the Laser Processing of the Zone Full that finishes row, start following action.
At first, for the mounting portion that makes to be equipped with machined object moves to the machining area of next column, start the movement of machine table to Y-direction.Simultaneously, movable collecting unit of dust 123 is also moved (the second collecting unit of dust mobile process).The movable mounting portion 113 of the movable mounting portion 112a of the first, 112b and the second keeps the state descended.Figure 19 illustrates the state after moving.
Take machined object 111 as benchmark, movable collecting unit of dust 123 moves to the position corresponding with the machining area (the 9th machining area in Figure 15) of next column, mobile to right (the second horizontal direction), if but take processing head as benchmark, be positioned at as illustrated roughly the same position.
As mentioned above, after the processing in the machining area (the 4th zone) of these row is ready to complete, control current scanning device 105, start the irradiation (the 4th Laser Processing operation) to the laser beam 103 of hole Working position.
Figure 19 observes from X-direction the partial sectional view that machining area is carried out to the state of laser hole processing.Be positioned at illuminating laser beam 103 under the state of the position corresponding with machining area at movable collecting unit of dust 123 and carry out hole processing.Movable collecting unit of dust 123 is manufactured from side's air supply in the space of コ word and is discharged the plug-type air stream of air from the opposing party.
When the Laser Processing finished whole machining areas (the 9th～the 16 machining area in Figure 15) of movable collecting unit of dust 123 residing row, similarly move to next machining area.Then, repeat above-mentioned action and sequentially machining area processed according to the rules.
Figure 20 is illustrated in the state of successively machining area being processed the Working position of the row (the 41～the 48 machining area in Figure 15) that move to the last machining area of machined object 111 afterwards.
At this, in the same manner, movable collecting unit of dust 123 is positioned at the position corresponding with machining area, in manufacture, side's air supply from the space of コ word is arranged, discharges from the opposing party the state of plug-type air stream of air, illuminating laser beam 103 and carry out hole processing.
Irradiation at the laser beam of regulation finishes, after the whole hole process finishing in the initial machining area (the 41 machining area) of these row, in order to move to next machining area, machine table is moved in the present embodiment on directions X.The Laser Processing of then similarly being stipulated.So, repeated identical action before the Laser Processing that finishes whole machining areas (the 41～the 48 machining area in Figure 15) of residing row to movable collecting unit of dust 123.So, carry out the processing of the machining area of last row, thereby finish the processing of whole of machined object 111.
After the process finishing of whole of machined object 111, start following action.
At first, in order to start to the movement of machined object extracting position and to start the movement of machine table.Start the movement to initial point of processing head 109.
The end of the opposition side of (Figure 18) when as shown in figure 21, movable collecting unit of dust 123 is positioned at the processing beginning.Movable mounting portion 113 risings (the movable mounting portion rising of second the first operation) of the movable mounting portion 112b of the first, the second except the movable mounting portion 112a of the first of movable collecting unit of dust 123 residing parts.After the end of rising, the movable mounting portion adsorption hole 116 of being located at the movable mounting portion 112b of the first, the movable mounting portion 113 of the second is carried out to vacuum draw, thereby absorption keeps machined object 111 and fixture sheet material 122 again.Above-mentioned action is parallel.
Now, the machining area of last row is positioned at different positions on X-direction, so the amount of movement of X-direction is different from the situation of the processing sequence of the machining area of Fig. 5.
After above-mentioned whole releases, machine table move to the machined object extracting position, as shown in figure 22, make press section drive working cylinder 119 actions, make workpiece press section 121 become the state of opening.Then, stop the vacuum draw of whole movable mounting portion adsorption hole 116 and whole periphery adsorption hole 117.Then, confirm that machined object 111 is not adsorbed maintenance, machined object withdrawing device (not shown) takes out machined object 111 from mounting portion, thereby finishes the laser hole processing of machined object.
The position relationship that comprises movable collecting unit of dust 123 and the movable mounting portion 112a of the first, 112b, the position relationship of the structure that the machine table of the position relationship of the structure during discharge of the machined object 111 shown in Figure 22 during with the supply of the machined object 111 shown in Fig. 6 is relevant is identical.Therefore, the supply preparation of machined object 111 just can promptly be realized in the supply position that only makes machine table move and move to machined object 111 in X-direction after discharging machined object.After, as long as alternately repeat the processing sequence of Fig. 5 and the processing sequence of Figure 15, even carry out the processing of multi-disc machined object, also the loss of productive temp can be suppressed for minimum, thereby realize high efficiency processing.
As mentioned above, even the processing sequence of machining area is back and forth processed, also, with above-mentioned identical ground, the movable collecting unit of dust 123 that forms stable air stream is positioned at the bottom of the machining area that carries out Laser Processing all the time as the movable mounting portion in bottom.The dust produced because of processing is collected and discharged to movable collecting unit of dust 123.Thus, realize high efficiency control of dust, prevent that in addition dust is attached to the movable part of device.
In addition, the absorption by the machined object 111 based on periphery mounting portion 114 and workpiece press section 121 fixedly carries out the maintenance of the machined object that deflection is few.And, the machining area that the support 302 of the machined object of movable collecting unit of dust 123 is listed as from lower support one all the time.Therefore, even the machined object of the very thin sheet of sheet and thickness also can carry out the considerably less high-precision Laser Processing of deflection.
Then, as an example of the preferred mode of the present invention, use Figure 23 A and Figure 23 B to describe the example of the different structure of movable collecting unit of dust 123.
As shown in Figure 23 A, at this in different structure, support is configured to the support bar 301 of the member that the member with the コ word separates.Thus, can make the precision at the position that joins with machined object 111, fixture sheet material 122 very high.With respect to directly using the situation of the stamping parts of コ word, the flatness that support is is in the situation that form and more easily obtain high accuracy as the member separated.For example, in the present embodiment, even the length of support bar 301 surpasses 500mm, also flatness can be suppressed at below 50 μ m.
In addition, Figure 23 B is configured to movable up and down example by support bar 301.Figure 24 illustrates the action of the support bar 301 of formation like this.In the situation that movable collecting unit of dust 123 is positioned at not near the central authorities that interfere with periphery mounting portion 114, state and fixture sheet material 122 that pair of support parts bar 301 is outstanding towards top with two sides are close to.Thus, the flatness of the machining area of machined object 111 be can maintain, and can stable control of dust and discharge do not realized in the situation that air stream is not revealed.In the situation that near machining area periphery is processed, only a side of support bar 301 is accommodated in the main body side of コ word, thereby can prevent the interference with periphery mounting portion 114.By this state, left and right is in the drawings illustrated by dotted line.Thus, can contribute to do one's utmost to reduce the zone that can't process of the periphery of machined object 111.It should be noted that, the knee-action of support bar 301 according to and periphery mounting portion 114 between relation carry out, as long as therefore suitable guiding piece is set and lobe plate (not shown) can be realized.
It should be noted that, in the present embodiment, the situation of carrying out Laser Processing to setting in advance fixture sheet material 122 is illustrated.Yet, even do not use fixture sheet material 122, also can utilize the machined object 111 based on periphery mounting portion 114 absorption, workpiece press section 121 fixing, the machined object based on movable collecting unit of dust 123 bottom supporting and maintain accurately plane.In addition, can also discharge efficiently the dust of the lower side of machined object 111.
Yet, by with fixture sheet material 122, carrying out in the lump the maintenance of machined object 111, the integral rigidity on plane improves.In addition, the machining area that the support of movable collecting unit of dust 123 is listed as from lower support one all the time.Therefore, even the machined object of the very thin sheet of sheet and thickness also can carry out the considerably less high-precision Laser Processing of deflection.Figure 25 A is the state without the machined object 111 in the situation of fixture sheet material 122.Figure 25 B is the state with the machined object 111 in the situation of fixture sheet material 122.Figure 25 A and Figure 25 B emphasize the state of machined object 111 qualitatively.
In addition, in the situation that movable collecting unit of dust 123 moves to the machining area of next column, when setting in advance fixture sheet material 122, the back side of protection machined object 111.Therefore, can eliminate the abrasive tiny probability that produces the machined object 111 caused because of movable collecting unit of dust 123.
In addition, in the present embodiment, show following example: the movable mounting portion 113 of the second forms and is arranged near mounting portion central authorities and the member with larger face moved, and two movable mounting portions 112 of the first are positioned at the opposed both sides of the movable mounting portion 113 of the second and are configured to the primary structural component that can move independently.As described above, the movable mounting portion 112 of the first is in the situation that the rise movable mounting portion of the part corresponding with the position of movable collecting unit of dust of movable mounting portion while carrying machined object.In the present embodiment, following example is shown: from X-axis, observe, movable collecting unit of dust is positioned at two places, left and right, so the movable mounting portion 112 of the first is arranged at opposed both sides.
Certainly, also can make according to the control sequence of Laser Processing movable collecting unit of dust be positioned at different positions, as long as cut apart movable mounting portion in position correspondingly, it is the movable mounting portion of the first.
In addition, the movable mounting portion of the second is called not the movable mounting portion with the position of the location conflicts of movable collecting unit of dust.As in the present embodiment, the movable mounting portion of the second can be formed to the member with a larger face, also can cut apart and form a plurality of movable mounting portions, be not limited to size, number.
In addition, in the present embodiment, the quantity of machining area etc. illustrate concrete numerical value for illustrated convenience.But these concrete numerical value determine to get final product according to the size of machined object, the Design Designations such as size of device, are not limited to this example.
Utilizability on industry
Laser processing device involved in the present invention can prevent the damage of mounting portion in the hole based on laser processing, and keeps the flatness of machined object and realize high manufacturing accuracy.In addition, the dust produced when Laser Processing also can be collected efficiently and discharge, and can also prevent that dust is attached to the movable part of device.Therefore, in laser processing device that carries out through hole processing etc., be useful.
Symbol description
100 laser processing devices
101 machining control sections
102 laser oscillators
103 laser beams
104 optical systems
105 current scanning devices
The 106X speculum
The 107Y speculum
108 f θ lens
109 processing heads
111,811,901 machined objects
112,112a, the movable mounting portion of 112b the first
The movable mounting portion of 113 the second
114 periphery mounting portions
115 movable mounting portions
116 movable mounting portion adsorption holes
117 periphery adsorption holes
118 movable mounting portion lifting work cylinders
119 press sections drive working cylinder
120 clamping components
121 workpiece press sections
122 fixture sheet materials
123 movable collecting unit of dust
125 machining areas
130 machine table
131 Y platforms
132 Y platform drive divisions
133 X platforms
134 X platform drive divisions
200 CD-ROM drive motors
201 drive transfer part
301 support bars
302 supports
303 circulation of air sections

Claims (11)

1. a laser processing device wherein, possesses:
Workbench, it drives along horizontal direction;
The periphery mounting portion, it is located on described workbench, and has adsorption hole;
The movable mounting portion of the first, it is located at the inboard of periphery mounting portion on described workbench, described, can move up and down, and have adsorption hole;
The movable mounting portion of the second, it is located at the inboard of periphery mounting portion on described workbench, described, can move up and down, and have adsorption hole;
The workpiece press section, it is located on described periphery mounting portion;
The processing head, it is located at the top of the movable mounting portion of described the first or the movable mounting portion of described the second, carries out Laser Processing;
Movable collecting unit of dust, it is located at the inboard of described periphery mounting portion, can move by along continuous straight runs.
2. laser processing device according to claim 1, wherein,
The roughly コ word that the section shape of described movable collecting unit of dust is upper opening.
3. laser processing device according to claim 2, wherein,
The support bar that it is different member that described movable collecting unit of dust also possesses from the part of described コ word.
4. laser processing device according to claim 3, wherein,
Described support bar can move up at upper and lower.
5. according to the described laser processing device of any one in claim 1 to 4, wherein,
The movable mounting portion of described the first with the position with described movable collecting unit of dust corresponding mode locate.
6. laser processing device according to claim 5, wherein,
The movable mounting portion of described the first has a plurality of,
In the mode that clips the movable mounting portion of described the second, locate at least two in the movable mounting portion of described the first.
7. according to the described laser processing device of any one in claim 1 to 6, wherein,
Whole four limits of described periphery mounting portion are located in described workpiece press section.
8. according to the described laser processing device of any one in claim 1 to 7, wherein,
Also possesses the sheet material formed by flame-retardant porous material on the movable mounting portion of described the first and the movable mounting portion of described the second.
9. laser processing device according to claim 8, wherein,
It is base material that described sheet material be take the nonwoven of fiber of the organic matter that is added with fire retardant.
10. a laser processing wherein, possesses:
The first mounting operation, in this first mounting operation, mounting the first machined object on periphery mounting portion, the movable mounting portion of the second, movable collecting unit of dust, described periphery mounting portion has adsorption hole, the movable mounting portion of described the second is located at the inboard of described periphery mounting portion, can move up and down, and have adsorption hole, described movable collecting unit of dust is located at the inboard of described periphery mounting portion, and can move by along continuous straight runs;
The first fixing operation, first fixedly in operation, utilize the workpiece press section of being located on described periphery mounting portion to press described the first machined object at this;
The first Laser Processing operation, in this first Laser Processing operation, carry out Laser Processing to the top, the first area described the first machined object that are positioned at described movable collecting unit of dust;
The movable mounting portion decline of first the second operation, in the movable mounting portion decline of this first the second operation, move down the movable mounting portion of described the second;
The first collecting unit of dust mobile process, in this first collecting unit of dust mobile process, make described movable collecting unit of dust move along the first horizontal direction;
The movable mounting portion rising of first the first operation, in the movable mounting portion rising of this first the first operation, the movable mounting portion of the first is moved up, the movable mounting portion of described the first is located at the inboard of described periphery mounting portion, can move up and down, and there is adsorption hole;
The second Laser Processing operation, in this second Laser Processing operation, carry out Laser Processing to top, the second area described the first machined object that is positioned at described movable collecting unit of dust.
11. laser processing according to claim 10, wherein,
After described the first machined object has been carried out to Laser Processing, possess:
The second mounting operation, in this second mounting operation, mounting the second machined object on described periphery mounting portion, the movable mounting portion of described the second, described movable collecting unit of dust;
The second fixing operation, second fixedly in operation, utilize the workpiece press section of being located at described periphery mounting portion to press described the second machined object at this;
The 3rd Laser Processing operation, in the 3rd Laser Processing operation, carry out Laser Processing to the top, the 3rd zone described the second machined object that are positioned at described movable collecting unit of dust;
The movable mounting portion decline of second the second operation, in the movable mounting portion decline of this second the second operation, move down the movable mounting portion of described the second;
The second collecting unit of dust mobile process, in this second collecting unit of dust mobile process, make described movable collecting unit of dust move along the second horizontal direction;
The movable mounting portion rising of second the first operation, in the movable mounting portion rising of this second the first operation, the movable mounting portion of the first is moved up, the movable mounting portion of described the first is located at the inboard of described periphery mounting portion, can move up and down, and there is adsorption hole;
The 4th Laser Processing operation, in the 4th Laser Processing operation, carry out Laser Processing to the top, the 4th zone described the second machined object that are positioned at described movable collecting unit of dust,
Described the first horizontal direction is contrary with described the second horizontal direction.
CN201380001036.5A 2012-03-16 2013-02-28 Laser processing device and laser processing method Active CN103492118B (en)

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JP2012-059773 2012-03-16
JP2012059773 2012-03-16
PCT/JP2013/001193 WO2013136695A1 (en) 2012-03-16 2013-02-28 Laser processing device and laser processing method

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TW201343299A (en) 2013-11-01

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