CN107199404A - The optical chip array system of processing and method of ultrafast laser - Google Patents
The optical chip array system of processing and method of ultrafast laser Download PDFInfo
- Publication number
- CN107199404A CN107199404A CN201710423914.2A CN201710423914A CN107199404A CN 107199404 A CN107199404 A CN 107199404A CN 201710423914 A CN201710423914 A CN 201710423914A CN 107199404 A CN107199404 A CN 107199404A
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- processing
- workbench
- optical chip
- laser
- sextuple
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention discloses the optical chip array system of processing and method of a kind of ultrafast laser, belong to optical chip technical field of micro and nano fabrication.The system includes including LASER Light Source, spatial light modulator, beam expander, speculum, microlens array, sextuple workbench along optical path direction, also include air floating platform, central control computer, the control that the central control computer is connected for whole system with LASER Light Source, spatial light modulator, sextuple workbench respectively；The air floating platform, which is arranged on below sextuple workbench, to be used to carry sextuple workbench.The method that the present invention is processed using laser array can obtain dozens of optical chip in time processing, and its high in machining efficiency, quality consistency is good；Secondly, using the method for Laser Processing, process equipment is simple, less demanding to processing environment, therefore greatly reduces production cost.
Description
Technical field
The present invention relates to optical chip technical field of micro and nano fabrication, the optical chip array of more particularly to a kind of ultrafast laser adds
Work system and method.
Background technology
With continuing to develop for Fibre Optical Communication Technology, the direction that optic communication broadband is built is also progressively by backbone network, metropolitan area
Net, LAN etc. are shifted to FTTH.And it is used as the basic components of FTTH such as PLC, PLC optical branching device, WDM, AWG, semiconductor
Laser, grating etc. are also faced with reduction power consumption and reduce the pressure of manufacturing cost.
At present, the processing to optical chip has that manufacturing procedure is complicated, difficulty of processing is big, processing efficiency is low, passes
Unite processing method such as chemical corrosion method, mechanical processing method etc., the requirement to operating personnel is higher, its processing quality and its depend on
The degree of being skilled in technique of operating personnel.And use such as electron beam process then to there is the vacuum state for needing to maintain processing environment, its
Substantially increase production cost.Laser processing technology is manufacturing process more satisfactory at present, but its production efficiency is relatively low
Problem annoyings the realization of scale industrial production always.
The content of the invention
In order to solve the above-mentioned technical problem, there is provided a kind of optical chip of ultrafast laser for a variety of optical chips by the present invention
Array system of processing and method, the method processed using laser array can obtain dozens of optical chip in time processing, its
High in machining efficiency, quality consistency is good；Secondly, using the method for Laser Processing, process equipment is simple, to processing environment requirement not
Height, therefore greatly reduce production cost.
A kind of optical chip array system of processing of ultrafast laser, along optical path direction include LASER Light Source, spatial light modulator,
Beam expander, speculum, microlens array, sextuple workbench, in addition to air floating platform, central control computer,
The central control computer is connected for whole system with LASER Light Source, spatial light modulator, sextuple workbench respectively
Control；
The air floating platform, which is arranged on below sextuple workbench, to be used to carry sextuple workbench；
The LASER Light Source, for providing the laser needed for processing；
The spatial light modulator, for by incident single beam be reflected into certain amount, spatial distribution multiple beam, to reach
The purpose of light splitting；
The beam expander, for carrying out beam shaping to incident multi-beam, so as to obtain the light beam that the depth of parallelism is high, the angle of divergence is small；
The speculum, the direction for changing incident multiple beam so that the light path layout of whole system is compacter；
The microlens array, for being focused to incident multiple beam, obtains a certain size focal beam spot；The sextuple work
Make platform, moved for relative focus hot spot on six-freedom degree direction, process required pattern.
Wherein, there are vacuum absorption holes on the sextuple workbench, its surface, and the substrate of optical chip is inhaled by vacuum absorption holes
It is attached on sextuple workbench.
Wherein, the LASER Light Source is femtosecond laser or picosecond laser.
Wherein, six directions of motion of the sextuple workbench to move along the x-axis, moved along Y-axis, being moved along Z axis, around
X-axis rotates, rotates, rotates about the z axis around Y-axis.
A kind of processing method of optical chip array system of processing using ultrafast laser described above, including following step
Suddenly：
Step S1, substrate is arranged on sextuple workbench, completes its positioning, clamping process；
Step S2, the optical chip array system of processing for starting ultrafast laser, set LASER Light Source parameter；
Step S3, light splitting, several computer holograms generated using central control computer are superimposed and are loaded into spatial light tune
The superposition of multiple diffraction grating is formed on device processed；When single beam incides spatial light modulator, it will obtain certain amount, sky
Between the multiple beam that is distributed；
Step S4, shaping, focusing are expanded, the multiple beam after light splitting obtains that the depth of parallelism is high, the angle of divergence is small through beam expander shaping
Multiple beam；The reflected mirror of multiple beam after shaping incides microlens array, and multiple beam is focused on to optical chip to be processed
Substrate surface；
Step S5, inscription processing, the substrate of processed optical chip are arranged on sextuple workbench, are existed with sextuple workbench
Move, according to the motor program write in advance, the base material of focal point can be removed simultaneously per Shu Guang on six direction
Pattern is formed, required pattern array is finally given.
Wherein, in addition to step S6, the optical chip to completing processing, polished, cleaning treatment.
Beneficial effect：
The invention provides a kind of optical chip array system of processing of ultrafast laser and method, the system is along optical path direction bag
Include LASER Light Source, spatial light modulator, beam expander, speculum, microlens array, sextuple workbench, in addition to air floating platform,
Central control computer, the central control computer is connected for whole with LASER Light Source, spatial light modulator, sextuple workbench respectively
The control of system；The air floating platform, which is arranged on below sextuple workbench, to be used to carry sextuple workbench.The present invention is used
The method of laser array processing can obtain dozens of optical chip in time processing, and its high in machining efficiency, quality consistency is good；
Secondly, using the method for Laser Processing, process equipment is simple, less demanding to processing environment, therefore greatly reduces and be produced into
This.
Brief description of the drawings
Fig. 1 is the structural representation of the optical chip array system of processing of ultrafast laser of the present invention；
Fig. 2 is division of 5 × 5 arrays in substrate in the embodiment of the present invention.
In figure：
1- LASER Light Sources；2- spatial light modulators；3- beam expanders；4- speculums；5- microlens arrays；6- 6 DOF workbenches；
7- air floating platforms；8- central control computers；9- substrates；10- vacuum absorption holes.
Embodiment
Below in conjunction with drawings and examples to the present invention ultrafast laser optical chip array system of processing and method make into
One step explanation.
As shown in figure 1, a kind of optical chip array system of processing of ultrafast laser of the present invention, includes laser along optical path direction
Light source 1, spatial light modulator 2, beam expander 3, speculum 4, microlens array 5, sextuple workbench 6, additionally including air supporting
Platform 7, central control computer 8, substrate 9, vacuum absorption holes 10；
The central control computer 8 is connected for being entirely with LASER Light Source 1, spatial light modulator 2, sextuple workbench 6 respectively
The control of system；
The air floating platform 7, which is arranged on sextuple workbench 6, to be used to carry sextuple workbench 6 below.
The LASER Light Source 1 can be that there is provided the laser needed for processing for the ultrafast lasers such as femtosecond laser, picosecond laser.
Incident single beam, can be reflected into certain amount, the multiple beam of spatial distribution by the spatial light modulator 2, with
This reaches the purpose of light splitting.
The beam expander 3, for carrying out beam shaping to incident multi-beam, so that it is small to obtain depth of parallelism height, the angle of divergence
Light beam.
The speculum 4, the direction for changing incident multiple beam so that the light path layout of whole system is compacter.
The microlens array 5, according to design needs, it has certain amount, the lenticule of spatial distribution, per Shu Guangke
Corresponding to a lenticule, for being focused to incident multiple beam, a certain size focal beam spot is obtained.
There are vacuum absorption holes 10 on the sextuple workbench 6, its surface, for drive the substrate 9 of optical chip six from
By spending the motion on direction, so that relative motion between substrate 9 and focal beam spot, processes required pattern.
Wherein, six directions of motion of the sextuple workbench 6 to move along the x-axis, moved along Y-axis, being moved along Z axis,
Rotate, rotated around Y-axis, rotate about the z axis around X-axis.
The light of the ultrafast laser provided using the optical chip array system of processing of the ultrafast laser of above-described embodiment, the present invention
Chip array processing method, its step is as described below.
By taking the processing of the silica ridge optical waveguide of 5 × 5 arrays as an example, its step is as follows：
Step one, the substrate 9 of appropriate size is got out, the substrate 9 that the present embodiment is selected is silicon dioxide wafer substrate, by substrate
9 are arranged on sextuple workbench 6, complete its positioning, clamping process.
Step 2, starts the optical chip array system of processing of femtosecond laser, sets the power of femto-second laser, repeats frequency
The parameters such as rate.
Step 3, light splitting：Every Shu Guangke in multiple beam is produced by corresponding secondary computer hologram, therefore by several
Computer hologram superposition achieves that multiple beam；According to processing request, design and generate 25 width computer hologram altogether, will
It is superimposed and is loaded into the superposition that 25 diffraction grating are formed in spatial light modulator 2；When single beam incides space light modulation
During device 2, it will obtain 25 beams, the multiple beam by 5 × 5 array distributions altogether.
Step 4, expands shaping, focusing：Multiple beam after light splitting obtains depth of parallelism height, diverging through the shaping of beam expander 3
The small multiple beam in angle；The reflected mirror 4 of multiple beam after shaping incides microlens array 5, and each of which light beam correspondence one is micro-
Mirror, multiple beam is focused on the surface of substrate 9 to be processed；As shown in Fig. 2 basis is pre-designed division 5 × 5 in substrate 9
Grid（It is represented by dashed line）, light beam focuses on the same position of each grid.
Step 5, inscribes processing：It is processed substrate 9 to be arranged on sextuple workbench 6, with sextuple workbench 6 six
Individual direction（Prolong X-axis movement, prolong Y-axis movement, prolong Z axis movement, rotated around X-axis, rotate, rotate about the z axis around Y-axis）Upper motion, i.e.,
The multiple beam remains stationary of line focus, sextuple workbench 6 does the motion on sextuple direction relative to multiple beam.According to prior institute
The motor program write, the material of substrate 9 of focal point can be removed per Shu Guang and form pattern, will eventually get required
Pattern array.
5 × 5 silica ridge optical waveguide arrays for completing processing are cut by step 6 by the grid of division along dotted line,
Single silica ridge optical waveguide is obtained through processing such as polishing, cleanings.
The core of the present invention is the optical chip array system of processing and method for providing a kind of ultrafast laser, using laser battle array
The method of row processing can obtain dozens of optical chip in time processing, and its high in machining efficiency, quality consistency is good.Secondly,
Using the method for Laser Processing, process equipment is simple, less demanding to processing environment, therefore greatly reduces production cost.
Described above is highly preferred embodiment of the present invention, not makees any formal limitation, every foundation to the present invention
Any simple modification, equivalent variations and modification that the technical spirit of the present invention is made to above example, still fall within the present invention
Protection domain in.For example：Using different types of laser as LASER Light Source, different machined parameters are set, and generation is not
With the multi-beam array of form, the various combination of above-mentioned system of processing module etc..
Claims (6)
1. a kind of optical chip array system of processing of ultrafast laser, it is characterised in that along optical path direction include LASER Light Source (1),
Spatial light modulator (2), beam expander (3), speculum (4), microlens array (5), sextuple workbench (6), in addition to air supporting
Platform (7), central control computer (8),
The central control computer (8) is mutually used in conjunction with LASER Light Source (1), spatial light modulator (2), sextuple workbench (6) respectively
In the control of whole system；
The air floating platform (7), which is arranged on sextuple workbench (6), to be used to carry sextuple workbench (6) below；
The LASER Light Source (1), for providing the laser needed for processing；
The spatial light modulator (2), for by incident single beam be reflected into certain amount, spatial distribution multiple beam, with
Reach the purpose of light splitting；
The beam expander (3), for carrying out beam shaping to incident multi-beam, so as to obtain the light that the depth of parallelism is high, the angle of divergence is small
Beam；
The speculum (4), the direction for changing incident multiple beam so that the light path layout of whole system is compacter；
The microlens array (5), for being focused to incident multiple beam, obtains a certain size focal beam spot；Described six
Workbench (6) is tieed up, is moved for relative focus hot spot on six-freedom degree direction, processes required pattern.
2. a kind of optical chip array system of processing of ultrafast laser according to claim 1, it is characterised in that the 6 DOF
There are vacuum absorption holes (10) on workbench (6), its surface, and the substrate (9) of optical chip is adsorbed six by vacuum absorption holes (10)
Tie up on workbench (6).
3. a kind of optical chip array system of processing of ultrafast laser according to claim 1, it is characterised in that the laser
Light source (1) is femtosecond laser or picosecond laser.
4. a kind of optical chip array system of processing of ultrafast laser according to claim 1, it is characterised in that the 6 DOF
Six directions of motion of workbench (6) to move along the x-axis, moved along Y-axis, being moved along Z axis, being rotated around X-axis, being rotated around Y-axis,
Rotate about the z axis.
5. a kind of processing side of the optical chip array system of processing of the ultrafast laser described in use the claims any one of 1-4
Method, it is characterised in that comprise the following steps：
Step S1, substrate (9) is arranged on sextuple workbench (6), completes its positioning, clamping process；
Step S2, the optical chip array system of processing for starting ultrafast laser, set LASER Light Source (1) parameter；
Step S3, light splitting, several computer holograms generated using central control computer (8), are superimposed and are loaded into space
The superposition of multiple diffraction grating is formed on optical modulator (2)；When single beam incides spatial light modulator (2), it will obtain
The multiple beam of certain amount, spatial distribution；
Step S4, shaping, focusing are expanded, the multiple beam after light splitting obtains that the depth of parallelism is high, the angle of divergence through beam expander (3) shaping
Small multiple beam；The reflected mirror of multiple beam (4) after shaping incides microlens array (5), and multiple beam is focused on to be added
Substrate (9) surface of the optical chip of work；
Step S5, inscription processing, the substrate (9) of processed optical chip are arranged on sextuple workbench (6), are worked with 6 DOF
Platform (6) is moved on six direction, according to the motor program write in advance, can be by the substrate of focal point per Shu Guang
(9) material removes and forms pattern, finally gives required pattern array.
6. the optical chip array-processing method of a kind of ultrafast laser according to claim 5, it is characterised in that also including step
Rapid S6, the optical chip to completing processing, are polished, cleaning treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710423914.2A CN107199404A (en) | 2017-06-07 | 2017-06-07 | The optical chip array system of processing and method of ultrafast laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710423914.2A CN107199404A (en) | 2017-06-07 | 2017-06-07 | The optical chip array system of processing and method of ultrafast laser |
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| CN107199404A true CN107199404A (en) | 2017-09-26 |
Family
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| CN201710423914.2A Pending CN107199404A (en) | 2017-06-07 | 2017-06-07 | The optical chip array system of processing and method of ultrafast laser |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109848547A (en) * | 2019-04-08 | 2019-06-07 | 北京理工大学 | The modified transparent material of femtosecond laser efficient stable is uniformly at silk method |
| CN111055018A (en) * | 2019-12-29 | 2020-04-24 | 中国科学院西安光学精密机械研究所 | Drag reduction microstructure machining system and method |
| CN112192030A (en) * | 2020-09-07 | 2021-01-08 | 中国科学院西安光学精密机械研究所 | Micro-nano structure processing method and system with array anti-reflection and anti-reflection functions |
| CN112496531A (en) * | 2020-11-24 | 2021-03-16 | 中国科学院西安光学精密机械研究所 | Integrated femtosecond laser marking method and system based on space shaping |
| CN113458588A (en) * | 2021-06-09 | 2021-10-01 | 上海航天控制技术研究所 | Small-caliber deep hole inner wall laser processing system |
| CN114024197A (en) * | 2021-10-26 | 2022-02-08 | 湖北工业大学 | Parallel composite optical device etching system and method |
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| CN113458588A (en) * | 2021-06-09 | 2021-10-01 | 上海航天控制技术研究所 | Small-caliber deep hole inner wall laser processing system |
| CN113458588B (en) * | 2021-06-09 | 2022-09-13 | 上海航天控制技术研究所 | Small-caliber deep hole inner wall laser processing system |
| CN114024197A (en) * | 2021-10-26 | 2022-02-08 | 湖北工业大学 | Parallel composite optical device etching system and method |
| CN114024197B (en) * | 2021-10-26 | 2023-02-24 | 湖北工业大学 | Parallel composite optical device etching system and method |
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