JP2004160618A - Micro machine and method for manufacturing the same - Google Patents

Micro machine and method for manufacturing the same Download PDF

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Publication number
JP2004160618A
JP2004160618A JP2002331748A JP2002331748A JP2004160618A JP 2004160618 A JP2004160618 A JP 2004160618A JP 2002331748 A JP2002331748 A JP 2002331748A JP 2002331748 A JP2002331748 A JP 2002331748A JP 2004160618 A JP2004160618 A JP 2004160618A
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Japan
Prior art keywords
base material
laser
manufacturing
micromachine
formed
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002331748A
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Japanese (ja)
Inventor
Daisuke Sawaki
Kazunari Umetsu
一成 梅津
大輔 澤木
Original Assignee
Seiko Epson Corp
セイコーエプソン株式会社
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Priority to JP2002331748A priority Critical patent/JP2004160618A/en
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Abstract

A three-dimensional structure is formed as a movable body in a transparent member using laser irradiation and an etching process, and a micromachine including a movable element inside the member is manufactured.
A base material 2 that is transparent to a laser and a gear that is a three-dimensional movable structure formed separately from the base material 2 inside the base material 2 using a three-dimensional laser irradiation and etching process. The micro gear 1 is formed in a state where the three and the four interact with each other, and the rotation shafts 3B and 4B of the gears are supported by the bearing 2B of the base material 2 and communicate with the outside.
[Selection] Figure 1

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a micromachine in which a three-dimensional movable structure is separately formed in a member having transparency to a laser by processing using laser irradiation and etching, and a method for manufacturing the same.
[0002]
[Prior art]
As a technique for forming a three-dimensional structure in a transparent member, a laser is used, and the focus point of the mask pattern projection image is set to the outer diameter boundary surface opposite to the laser irradiation of the workpiece at the start of processing. At the same time, ablation is generated in the focus point portion, and the workpiece is gradually moved in the direction of irradiation of the laser in synchronization with the progress of the processing by the irradiation of the laser light, and at the same time, the processing is performed in the form of insertion, A method of processing a mask pattern while dynamically changing it in synchronization with the progress of the processing is known (for example, see Patent Document 1).
In addition, a femtosecond laser can be irradiated three-dimensionally to a predetermined location in silica glass, and the optically damaged portion can be removed by etching to produce an H-type microstructure in silica glass. It is known (for example, refer nonpatent literature 1).
[0003]
[Patent Document 1]
JP 2001-212798 (paragraph 0006, FIG. 2)
[Non-Patent Document 1]
A. Marcinkevicus, S.M. Juodkazis, M .; Watanabe, M.M. Miwa, S.M. Matsuo, H .; Misawa, J. et al. Nishii, OPTICS LETTERS, Vol. 26, no. 5, March 1, 2001
(Page 277, right column, last paragraph, FIG. 1)
[0004]
[Problems to be solved by the invention]
However, a three-dimensional structure formed on a transparent member using a conventional laser or the like is a fixed structure or a hole, and is not formed as a movable element inside the member. For this reason, the effect | action of the three-dimensional structure formed in the conventional transparent member was limited to the thing which does not accompany a motion.
The present invention has been made in view of this point. Using a three-dimensional laser irradiation and etching process, a three-dimensional structure is separately formed as a movable body in a transparent member, and the movable body is incorporated. It is an object of the present invention to provide a micromachine capable of omitting the process and a manufacturing method thereof.
[0005]
[Means for Solving the Problems]
A micromachine of the present invention includes a base material transparent to a laser, and a three-dimensional movable structure formed separately from the base material inside the base material using the laser irradiation and etching processes. This is a micromachine characterized by that. This micromachine consisting of a base material and a movable structure inside the base material has the advantage that it can be manufactured without an assembly process of a plurality of parts, which has been conventionally required when manufacturing a product having the same function as this. .
In the above case, the driving force supply unit from the outside of the base material, which is formed using laser irradiation and an etching process, and the outside of the base material from the three-dimensional movable structure. It is characterized by having an action force sending part. In this way, the driving force supply unit and the acting force delivery unit are also formed by using the laser irradiation and etching process, so that the entire micromachine can be manufactured only by the laser irradiation and etching process steps, thus simplifying the manufacturing process. It becomes.
Further, a plurality of three-dimensional movable structures may be formed in a state of interacting with each other. Thereby, a micromachine having a more complicated mechanism can be obtained.
Further, the three-dimensional movable structure is a sphere, and a pair of flow paths having an inner diameter smaller than the outer diameter of the sphere that leads to the outside of the base material starting from a position at which the inner wall surface of the base material faces, An intermediate flow path that communicates with the outside of the base material is formed starting from an intermediate portion between the pair of flow path starting points on the inner wall surface. Thereby, a micro check valve can be formed.
The three-dimensional movable structure may be a gear having a rotation shaft, and a portion of the base material corresponding to the rotation shaft may be formed as a bearing. Thereby, a rotatable micro gear can be formed.
[0006]
In the micromachine manufacturing method of the present invention, a laser beam and a base material transparent to the laser are relatively moved three-dimensionally to irradiate the laser to a predetermined range of the base material, and a work-affected portion is formed inside the base material. Or a step of forming a fine crack part, and a step of etching the work-affected part or the fine crack part to form a three-dimensional movable structure having a desired shape separately from the base material. It is characterized by that. As a result, a micromachine composed of the base material and the movable structure inside the base material can be obtained immediately only by laser irradiation and etching without an assembling process of a plurality of parts.
In the above case, the relative movement between the laser and the base material is performed using a galvano scanner that scans the laser in a plane direction and a single-axis stage that moves the base material in the vertical direction. Also good. The laser and the base material can be moved relative to each other by placing the base material on a three-axis stage and moving the stage in three dimensions, but moving the laser along a predetermined position. However, laser irradiation positioning can be accurately performed with simpler control.
[0007]
In addition, before or during the etching, a part of the work-affected part or the fine crack part may be exposed on the surface of the base material. By doing so, the work-affected part or fine crack part whose etching rate has been increased by laser irradiation is selectively removed by etching, so that the surface of the base material and the three-dimensional structure are accommodated. This is because the space inside the base material is communicated without machining or the like, and the etching solution can enter the movable structure inside from the outside of the base material.
Further, the etching treatment may be performed not only on the work-affected part or fine crack part but also on the non-altered part adjacent thereto. Thereby, the clearance gap between a base material inner surface and a movable structure can be set to arbitrary magnitude | sizes.
[0008]
The laser has an energy density equal to or higher than a threshold value that causes cracking and alteration near the focal point.
For example, the laser may be a femtosecond laser. The femtosecond laser is superior in that it absorbs by multiphoton absorption at the condensing point even for a base material that is transparent to the laser, and easily causes processing deterioration and fine cracks on those members. .
The base material may be any one of quartz, glass, quartz, and sapphire. In order to internally process the base material using a laser, it is necessary for the laser to penetrate into the base material. Therefore, it is essential for the present invention to use a material that is transparent to the laser. It is. These members are preferable in that respect.
Further, the laser beam may be branched, and the base material may be irradiated with a plurality of branched laser beams at the same time. By doing so, multi-point simultaneous machining becomes possible and machining efficiency can be improved.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a perspective view of the inside of a micro gear according to an embodiment of the present invention as viewed from the side. The micro gear 1 is formed by forming a gear 3 and a gear 4 having a plurality of teeth 3A and 4A on the outer periphery inside a rectangular parallelepiped quartz base material 2, and an inner wall surface 2A of the base material 2 and Between the outer peripheral surfaces of the gears 3 and 4, there is a gap 5 in which the gears 3 and 4 can appropriately rotate. The gears 3 and 4 are engaged with each other so as to be rotatable, and rotating shafts 3B and 4B extending from the center of the gears 3 and 4 to the surface of the base material 2 are integrally formed with the gears 3 and 4, respectively. In addition, the inner wall surface of the base material 2 in the part corresponding to the intermediate part of the rotating shafts 3B and 4B of the gears 3 and 4 is formed as a bearing 2B corresponding to the rotating shafts 3B and 4B. When the driving force is supplied from the outside to one of the rotating shafts 3B and 4B, the micro gear 1 having the above-described configuration generates an acting force according to the rotation ratio of the gears 3 and 4 from the other of the rotating shafts 3B and 4B. Is sent to.
[0010]
The gears 3 and 4 with the rotation shaft inside the base material 2 of the micro gear 1 are finally separated from the base material 2 by wet etching. The range or portion removed by the wet etching is basically a portion (including a portion where a microcrack has occurred) where the base material 2 has been altered by laser irradiation. Therefore, first, laser irradiation is performed on the range (or part) of the base material 2 to be removed by the wet etching. The laser irradiation to the base material 2 proceeds in the order above the base material 2 from the lower side of the gears 3 and 4 with the rotation shaft, and is performed along the three-dimensional shape of the gears 3 and 4 with the rotation shaft. . As a result, laser irradiation on the base material 2 is performed over three dimensions.
[0011]
The reason why the base material 2 is irradiated with the laser in order from the lower side is to prevent the laser from being transmitted through the layer altered by the laser irradiation. In addition, the portion where the gear 3 and the gear 4 are meshed with each other, and the portion where the rotating shafts 3B and 4B and the bearing 2B are opposed to each other are irradiated with a laser substantially linearly, and etching progresses more than necessary during wet etching. Care must be taken that the gap between them does not become too large.
[0012]
The base material 2 irradiated with the laser as described above is subsequently dipped in an etching solution, for example, a hydrogen fluoride (HF) aqueous solution, and a portion altered by the laser irradiation is removed by etching. Thereby, the gears 3 and 4 with a rotating shaft as a three-dimensional movable structure are formed inside the base material 2. In the case where there is a bearing 2B for receiving the rotating shafts 3B and 4B and the etching solution introduction path between the rotating shafts 3B and 4B and the bearing 2B is very narrow like the micro gear 1, the etching solution In order to separately form an intrusion path into the base material 2, laser etching may be performed on a portion where the intrusion path is to be formed before etching to form a work-affected layer or a fine hole.
[0013]
In the microgear 1 manufactured as described above, it is not necessary to handle and assemble each component part constituting the microgear and assemble them as in the conventional gear train assembly, The production efficiency can be increased and the cost can be reduced. The micro gear 1 includes two gears inside the base material. However, three or more gears may be formed in the base material so as to interact with each other.
[0014]
FIG. 2 is a perspective view of the inside of the microvalve according to the embodiment of the present invention as viewed from the side. The microvalve 11 has a sphere 30 formed inside a cubic quartz base material 20, and the sphere 30 can rotate and move between the inner wall surface 20 </ b> A of the base material 20 and the sphere 30. A gap 25 is provided. A first flow path 21 that communicates with the upper surface of the base material 20 from the center of the upper end of the base material inner wall surface 20 </ b> A is formed in the upper part of the base material 20. In addition, a second flow path 22 is formed in the lower part of the base material 20 so as to face the first flow path 21 and communicate with the bottom surface of the base material 20 from the lower end central portion of the base material inner wall surface 20A. Further, a third flow path 23 that communicates from the inner wall surface 20A of the base material 20 to the bottom surface of the base material 20 with an intermediate portion between both starting points of the first flow path 21 and the second flow path 22 of the base material inner wall surface 20A as a starting point. And the 4th flow path 24 is formed. The third flow path 23 and the fourth flow path 24 do not necessarily need to communicate with the bottom surface of the base material 20, and may communicate with the side surface of the base material 20. The third flow path 23 and the fourth flow path 24 are collectively referred to as an intermediate flow path. In the microvalve 11 having the above configuration, when the fluid is introduced from the first flow path 21 into the valve, the sphere 30 is pushed to the inlet side of the second flow path 22 to block the flow path. Since the inlets 23 and 24 are open, the fluid entering from the first channel 21 flows to the outside through the intermediate channels 23 and 24. On the other hand, when the fluid enters the valve from the second flow path 22 and the intermediate flow paths 23 and 24, the sphere 30 is moved to the inlet side of the first flow path 21 by the pressure of the fluid exiting the second flow path 22. The fluid flow is stopped because there is no outlet for fluid because the fluid is pushed to close the flow path. Therefore, the microvalve 11 acts as a check valve.
[0015]
The sphere 30 inside the microvalve 11 is also formed separately from the base material 20 by wet etching. The range or portion removed by the wet etching is basically a portion (including a portion where a microcrack has occurred) where the base material 20 has been altered by laser irradiation. Therefore, first, laser irradiation is performed on the range (or part) of the base material 20 to be removed by the wet etching. In addition, since the laser irradiation on the base material 20 is basically advanced upward from the lower side, the laser on the portions corresponding to the second flow path 22, the third flow path 23, and the fourth flow path 24. Irradiation is performed, and laser irradiation is performed on a portion for separating the sphere 30 from the middle. After that, the laser irradiation of the base material 20 sequentially proceeds to the portion corresponding to the upper part of the sphere for separating the sphere 30, and finally, the portion corresponding to the first flow path 21 is irradiated. In addition, regarding the formation of each flow path 21-24, after forming the process change part with respect to the circumference | surroundings of the spherical body 30, before etching, laser irradiation is performed from the outer surface of the base material in which each flow path 21-24 is formed. Thus, a work-affected layer or a fine hole corresponding to each of the flow paths 21 to 24 may be formed.
[0016]
The base material 20 irradiated with the laser as described above is subsequently dipped in an etching solution such as an aqueous hydrogen fluoride solution, and a portion altered by the laser irradiation is removed by etching. Thereby, the spherical body 30 and each flow path 21-24 as a three-dimensional movable structure are formed in the base material 20. FIG. In addition, the formation of the gap between the inner wall surface 20A of the base material 20 and the sphere 30 includes not only etching of the process-affected portion or the work-affected layer by laser, but also etching of the unmodified portion that has not been altered by the laser. Thus, the size of the gap can be adjusted.
[0017]
In the microvalve 11 manufactured as described above, the steps and means of handling and assembling the component parts constituting the microvalve, as in the conventional microvalve assembly, are not required. The production efficiency can be increased and the cost can be reduced.
[0018]
(About the laser irradiation apparatus used in the present invention)
Here, an example of the structure of the laser irradiation apparatus used in the manufacture of the micromachine of the present invention will be described. This laser irradiation apparatus includes a laser oscillator 40 serving as a processing energy source, a beam expander 42 that expands the beam diameter of a laser 41 emitted from the laser oscillator 40, and a laser intensity adjuster 43 that adjusts the intensity of the expanded laser. , A mirror 44 for adjusting the traveling direction of light (this may be provided in an arbitrary number as necessary), a condensing lens 45 for condensing the laser (having an aperture ratio NA as high as possible is desirable) A stage controller 47 for controlling the operation of the three-axis automatic stage 46 and the three-axis automatic stage 56 that can be moved in the X, Y, and Z directions by placing a transparent base material 50 on the irradiation laser 41 It consists of PC48 etc. which computer-controls the controller 47. FIG. The laser emitted from the laser oscillator 40 must be capable of accumulating energy higher than the threshold value for the base material 50. From this point, the femto which is an ultrashort pulse is required. A second laser is preferred. However, it is not limited to the femtosecond laser.
[0019]
In the laser irradiation apparatus, the relative movement between the base material 50 and the laser applied to the base material 50 is performed by the movement of the three-axis automatic stage 46. Regarding the movement in the biaxial direction among the three axes, The laser may be scanned. As means for scanning the laser, for example, a galvano scanner combining two galvanometer mirrors as shown in FIG. 4 can be used. In FIG. 4, 70 is a first galvanometer mirror that rotates in the X-axis direction, 71 is a second galvanometer mirror that rotates in the Y-axis direction, and both 70 and 71 are accurately arranged at predetermined positions. It is driven synchronously by driving means (not shown). In a processing apparatus having such galvanometer mirrors 70 and 71, a laser beam 72 oscillated from a laser oscillator (not shown) is reflected by the first galvanometer mirror 70 and reflected by the second galvanometer mirror 71, The light is condensed by a condenser lens (not shown) and can be irradiated to an arbitrary position in the horizontal plane direction of the workpiece, for example, a position indicated by reference numeral 73. Therefore, for example, when the laser scanning mechanism of FIG. 4 and the vertical movement mechanism of the stage on which the base material 50 is placed are combined, a three-dimensional relative movement between the base material 50 and the irradiation laser becomes possible. The advantage of doing this is that accurate positioning can be performed more easily by scanning the laser itself.
[0020]
Next, a basic process for forming a three-dimensional movable structure separated from the base material in the base material will be described. FIG. 5 is a process diagram when the sphere 51 is separated from the base material 50 and is used as the movable sphere 51 </ b> A inside the base material 50. In this step, first, along the outer periphery of the sphere 51 to be separated, the work-affected part 52 (including fine cracks) is three-dimensionally radiated from the lower side of the sphere, starting with laser irradiation and sequentially irradiating the laser upward. (FIG. 5A). As described above, when the work-affected portion 52 is formed over the entire outer periphery of the sphere 51 to be separated, the etching solution introduction path connected to the work-affected portion 52 formed around the sphere 51 from the outside of the base material 50. Altered portions 53A and 53B (or narrow holes) are formed by laser irradiation. Next, the base material 50 on which the work-affected part is formed is immersed in the etching solution 60 (FIG. 5B). Examples of the etchant 60 include hydrofluoric acid, potassium hydroxide aqueous solution, ammonium fluoride, and the like. Then, the sphere 51 is separated from the base material 50 by the etching process, and the movable sphere 51A is formed inside the base material 50, and the gap 54 required for the movable sphere 51A inside the base material 50 is formed. Etching is performed until When the desired gap 54 is formed, the etching process is finished (FIG. 5C). Note that the altered portions 53A and 53B of the etchant introduction path are formed into fine holes by removing the altered portions by etching at the end of the etching process.
[0021]
Incidentally, in FIG. 5, the etching solution introduction path altered portions 53A and 53B are formed after the processed altered portion 52 has been formed over the entire outer periphery of the sphere 51 to be separated. The introduction path alteration parts 53A and 53B are grasped as an integral shape, and laser irradiation is performed in the order of the lower etching solution introduction path alteration part 53B, the processing alteration part 52 on the entire outer periphery of the sphere 51, and the upper etchant introduction path alteration part 53A. This may be performed to form a work-affected portion. Further, the adjustment of the size of the gap 54 between the separated movable sphere 51A and the inner surface of the base material 50 can be performed by widening or narrowing the laser irradiation range to change the processing-affected portion width, as well as etching. It is also possible to perform etching up to the non-altered part region other than the process-altered part by adjusting the time.
[0022]
In the above-described embodiment, an example in which a work-affected portion is formed on a base material by a single focused laser beam is shown. However, as shown in FIG. These beams may be branched into a plurality of beams using an optical branching element such as the phase grating 49, and the plurality of branched beams may be simultaneously irradiated to a plurality of locations on the base material 50. According to this, when a plurality of the microvalves 11 shown in FIG. 2 are manufactured in the base material 20, the processing efficiency can be improved.
[0023]
Moreover, in the said embodiment, although the material of the base material was quartz, in this invention, the other material which has transparency with respect to a laser can also be used as a base material. Examples of such a property include glass, quartz, sapphire and the like in addition to quartz.
[Brief description of the drawings]
FIG. 1 is a perspective view of the inside of a micro gear according to an embodiment of the present invention when viewed from the side.
FIG. 2 is a perspective view when the inside of the microvalve according to the embodiment of the present invention is viewed from the side.
FIG. 3 is a configuration diagram of a laser irradiation apparatus used for manufacturing a micromachine.
FIG. 4 is a configuration diagram of a galvano scanner that two-dimensionally scans a laser.
FIG. 5 is a process diagram in which a movable sphere is separately formed from a base material inside the base material.
FIG. 6 is a configuration diagram of a laser irradiation apparatus for irradiating a base material with a plurality of branched beams.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Micro gear, 2 ... Base material, 2A ... Inner wall surface of base material, 2B ... Inner wall surface of base material which receives gear rotating shaft, 3, 4 ... Gear, 3A, 4A ... Gear teeth, 3B, 4B ... Rotation shaft of gear, 5 ... clearance between inner wall surface of base material and gear, 11 ... micro valve, 20 ... base material, 20A ... inner wall surface of base material, 21 ... first flow path, 22 ... second flow path, 23 ... 3rd flow path, 24 ... 4th flow path, 25 ... Gap between inner wall surface of base material and sphere, 30 ... Sphere, 40 ... Laser oscillator, 41 ... Laser (or laser beam), 45 ... Condensing lens , 46 ... 3-axis automatic stage, 49 ... phase grating, 50 ... base material, 51 ... sphere to be separated, 51A ... separated movable sphere, 52 ... processing alteration part, 53A, 53B ... etching solution introduction path alteration part 54 ... Gap, 60 ... Etching solution, 70 ... First galvanometer mirror, 71 ... Second galvanometer Error.

Claims (13)

  1. A base material transparent to the laser,
    A three-dimensional movable structure formed separately from the base material inside the base material using the laser irradiation and etching process;
    A micromachine characterized by comprising.
  2. A driving force supply unit from the outside of the base material to the three-dimensional movable structure formed by using laser irradiation and an etching process; and an acting force transmission unit from the three-dimensional movable structure to the outside of the base material. The micromachine according to claim 1, wherein:
  3. 3. The micromachine according to claim 2, wherein there are a plurality of the three-dimensional movable structures, and the three-dimensional movable structures are formed so as to interact with each other.
  4. The three-dimensional movable structure is a sphere, and a pair of flow paths having an inner diameter smaller than the outer diameter of the sphere that leads to the outside of the base material starting from a position at which the inner wall surface of the base material faces, The micromachine according to any one of claims 1 to 2, wherein an intermediate flow path is formed which starts from an intermediate portion between the pair of flow path starting points on the wall surface and communicates with the outside of the base material.
  5. The micromachine according to any one of claims 1 to 3, wherein the three-dimensional movable structure is a gear having a rotation shaft, and a bearing corresponding to the rotation shaft is formed on the base material.
  6. A step of irradiating a predetermined range of the base material while moving a laser and a base material transparent to the laser in a three-dimensional manner to form a work-affected portion or a fine crack portion inside the base material When,
    Etching the work-affected part or fine crack part to form a three-dimensional movable structure having a desired shape separated from the base material inside the base material; and
    A method of manufacturing a micromachine, comprising:
  7. 7. The relative movement between the laser and the base material is performed using a galvano scanner that scans the laser in a plane direction and a single-axis stage that moves the base material in a vertical direction. Micromachine manufacturing method.
  8. 8. The method of manufacturing a micromachine according to claim 6, wherein a part of the work-affected part or the fine crack part is exposed on the surface of the base material before or during the etching process.
  9. 9. The method of manufacturing a micromachine according to claim 6, wherein the etching process is performed not only on the work-affected part or the fine crack part but also on an unaltered part adjacent thereto.
  10. 10. The method of manufacturing a micromachine according to claim 6, wherein the laser has an energy density equal to or higher than a threshold value causing cracks and alteration in the vicinity of the focal point.
  11. The method for manufacturing a micromachine according to claim 6, wherein the laser is a femtosecond laser.
  12. 12. The method of manufacturing a micromachine according to claim 6, wherein the base material is any one of quartz, glass, quartz, and sapphire.
  13. 13. The method of manufacturing a micromachine according to claim 6, wherein the laser beam is branched, and the base material is irradiated with a plurality of branched laser beams at the same time.
JP2002331748A 2002-11-15 2002-11-15 Micro machine and method for manufacturing the same Pending JP2004160618A (en)

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JP2006303360A (en) * 2005-04-25 2006-11-02 Fujikura Ltd Through-wire board, composite board, and electronic apparatus
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US8945416B2 (en) 2010-07-26 2015-02-03 Hamamatsu Photonics K.K. Laser processing method
US8741777B2 (en) 2010-07-26 2014-06-03 Hamamatsu Photonics K.K. Substrate processing method
US8802544B2 (en) 2010-07-26 2014-08-12 Hamamatsu Photonics K.K. Method for manufacturing chip including a functional device formed on a substrate
US8828873B2 (en) 2010-07-26 2014-09-09 Hamamatsu Photonics K.K. Method for manufacturing semiconductor device
US8828260B2 (en) 2010-07-26 2014-09-09 Hamamatsu Photonics K.K. Substrate processing method
US8841213B2 (en) 2010-07-26 2014-09-23 Hamamatsu Photonics K.K. Method for manufacturing interposer
US8703517B2 (en) 2010-10-29 2014-04-22 Denso Corporation Method of Manufacturing a Semiconductor Device Including Removing a Reformed Layer
WO2012108316A1 (en) * 2011-02-08 2012-08-16 株式会社フジクラ Method for manufacturing substrate having micropore, and substrate
WO2012161317A1 (en) * 2011-05-25 2012-11-29 株式会社フジクラ Method of manufacturing base substance disposed with fine hole, and base substance disposed with fine hole
JP5873488B2 (en) * 2011-05-25 2016-03-01 株式会社フジクラ Manufacturing method of substrate having micropores, and substrate having micropores

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