CN207534185U - For cutting the laser cutting device of flexible circuit board - Google Patents
For cutting the laser cutting device of flexible circuit board Download PDFInfo
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- CN207534185U CN207534185U CN201721636389.4U CN201721636389U CN207534185U CN 207534185 U CN207534185 U CN 207534185U CN 201721636389 U CN201721636389 U CN 201721636389U CN 207534185 U CN207534185 U CN 207534185U
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Abstract
A kind of laser cutting device for being used to cut flexible circuit board, including Cutting platform, laser module, mobile device and control unit.For support flexible PCB to be cut, which is used to send out laser and cuts flexible PCB the Cutting platform.Cutting platform or laser module carry out position adjustment under mobile device drive, so as to utilize the shape for being cut by laser function by flexible PCB and being cut into setting under the control of the control unit.Present invention take advantage of that quick, the high-precision feature that laser cutting has, to solve the problems, such as that the Operational preparation period is long, of high cost in conventional flex circuits plate manufacturing process.
Description
Technical field
This application involves flexible PCBs to fabricate equipment, and in particular to a kind of laser for being used to cut flexible circuit board
Cutting equipment.
Background technology
Flexible printed circuit board FPC (Flexible Printed Circuit Board) is " the glamour female in circuit board
King ".Compared with traditional rigid printed board (PCB), FPC Distribution densities are high, light-weight, thickness is thin, can with free bend,
Winding folds, and arbitrary arrangement is required according to space layout, and is arbitrarily moved and flexible in three dimensions, so as to reach component
Assemble the integration connected with conducting wire.
Processing method traditional FPC is using mold, is realized by the machining mode of mechanical stamping to FPC's
It cuts out.This mode Operational preparation period is long, of high cost, but with the quick expansion of FPC application ranges, and the output value is higher and higher,
Traditional processing method is caused to be not enough to support its period and required precision, it would therefore be highly desirable to provide a kind of new processing and manufacturing side
Formula substitutes traditional processing means.
Invention content
The application provides a kind of novel laser cutting device for being used to cut flexible circuit board.
According to the one side of the application, a kind of laser cutting for being used to cut flexible circuit board in a kind of embodiment is provided and is set
It is standby, including：
Rack, for playing a supportive role；
Cutting platform, for the flexible PCB that support is to be cut；
Laser module, for sending out laser and cutting flexible PCB；
In the mobile device, the mobile device drives cutting for mobile device, the Cutting platform or laser module installation
Platform or laser module movement, flexible PCB to be cut into the shape of setting；
And control unit, for controlling the operation of the movement of mobile device and laser module.
As being further improved for the laser cutting device, the mobile device includes X-axis mobile mechanism, Y-axis moves
Orthogonal two in mechanism and Z axis mobile mechanism, the X-axis mobile mechanism and Y-axis moving mechanism difference output level direction
Movement on a direction, the Z axis mobile mechanism export the movement on vertical direction, and the Cutting platform or laser module are in X
It is moved in the horizontal direction under axis mobile mechanism and Y-axis moving mechanism driving；The Cutting platform or laser module are in Z axis moving machine
It moves in vertical direction under structure driving, is sent out on the focal plane of laser flexible PCB is adjusted to laser module.
As being further improved for the laser cutting device, the laser module fixed setting, the Cutting platform peace
It fills on the mobile device, and the Cutting platform is located at the lower section of the laser emitting mouth of laser module, the mobile device driving
Cutting platform realizes the movement in tri- directions of XYZ.
As being further improved for the laser cutting device, the Z axis mobile mechanism include electric rotating machine, screw, under
Voussoir, upper voussoir and the connecting plate for being connect with Cutting platform, the output shaft of the electric rotating machine are fixedly connected with screw, institute
It states lower wedge block and forms feed screw nut pair with screw, the lower wedge block has the first inclined-plane set along lower wedge block moving direction, institute
Stating voussoir has the second inclined-plane coordinated with the first inclined-plane, and the upper voussoir is defined as moving in the vertical direction,
The screw is converted into the linear movement of lower wedge block, and passes through the upper voussoir raising and lowering of the first inclined-plane driving, described
The movement of upper voussoir drives connecting plate movement.
As being further improved for the laser cutting device, the Z axis mobile mechanism further includes at least one cylinder, institute
The movement for stating voussoir drives cylinder moving, and the cylinder drives connecting plate movement.
As being further improved for the laser cutting device, the X-axis mobile mechanism includes the first linear electric machine, described
Y-axis moving mechanism is mounted in X-axis mobile mechanism, and realizes the movement in X-direction, institute by first linear electric motor
It states Y-axis moving mechanism and includes the second linear electric machine, the Z axis mobile mechanism is mounted in Y-axis moving mechanism, and by described second
Linear electric motor realizes the movement in Y direction.
As being further improved for the laser cutting device, the laser module includes laser, laser condensing lens, swashs
Light beam expanding lens, laser scanning galvanometer and laser telecentric scan lens, the laser that the laser is sent out focus on successively by laser
It is irradiated on flexible PCB to be cut after mirror, laser beam expanding lens, laser scanning galvanometer and the effect of laser telecentric scan lens.
As being further improved for the laser cutting device, CCD positioning units are further included, laser scanning is arranged on and shakes
The side of mirror, for being positioned.
As being further improved for the laser cutting device, the Cutting platform includes vacuum extractor and sucker, institute
State sucker and include sucker disk seat, cellular board and honeycomb panel seat, the sucker disk seat has a cavity, the bottom wall of the cavity have fin and
Cavity is divided into different gas circuits by the air entry of perforation, the fin, and the cellular board seat tool has installation cavity, the installation cavity
Bottom has multiple blow vents, and the cellular board is mounted in installation cavity sealed aroundly, and the cellular board has multiple suckers
Mouthful, the sucker mouth is communicated with the blow vent of honeycomb panel seat, and the honeycomb panel seat is mounted in the cavity of sucker disk seat, and the bee
Nest panel seat bottom outer wall detaches to form gap with the fin in cavity, and the air entry of the cavity is connected with vacuum extractor.
As being further improved for the laser cutting device, the fin is independently arranged and substantially across to be multiple
Protrusion.
According to the laser cutting device of above-described embodiment, including Cutting platform, laser module, mobile device and control
Unit.For support flexible PCB to be cut, which is used to send out laser and cuts flexible electrical the Cutting platform
Road plate.Cutting platform or laser module carry out position adjustment under mobile device drive, so as to sharp under the control of the control unit
Flexible PCB is cut into the shape of setting with laser cutting function.Present invention take advantage of that laser cutting have it is quick,
High-precision feature, to solve the problems, such as that the Operational preparation period is long, of high cost in conventional flex circuits plate manufacturing process.
Description of the drawings
Fig. 1 is the structure diagram of laser cutting device in a kind of embodiment of the application；
Fig. 2 is the side view of embodiment illustrated in fig. 1；
Fig. 3 is a kind of structure diagram of embodiment ZhongZZhou mobile mechanisms of the application；
Fig. 4 is the structure diagram of Cutting platform in a kind of embodiment of the application；
Fig. 5 is sectional view of the embodiment illustrated in fig. 4 along A-A cuttings；
Fig. 6 is the structure diagram of cellular board in a kind of embodiment of the application；
Fig. 7 is the structure diagram of honeycomb panel seat in a kind of embodiment of the application；
Fig. 8 is the structure diagram of sucker disk seat in a kind of embodiment of the application；
Fig. 9 is the structure diagram of connection ring in a kind of embodiment of the application.
Specific embodiment
The present invention is described in further detail below by specific embodiment combination attached drawing.Wherein different embodiments
Middle similar component employs associated similar element numbers.In the following embodiments, many datail descriptions be in order to
The application is better understood.However, those skilled in the art can be without lifting an eyebrow recognize, which part feature
It is dispensed or can be substituted by other elements, material, method in varied situations.In some cases, this Shen
Please it is relevant some operation there is no in the description show or describe, this is the core in order to avoid the application by mistake
More descriptions are flooded, and to those skilled in the art, these relevant operations, which are described in detail, not to be necessary, they
The general technology knowledge of description and this field in specification can completely understand relevant operation.
It is formed respectively in addition, feature described in this description, operation or feature can combine in any suitable way
Kind embodiment.Meanwhile each step in method description or action can also can be aobvious and easy according to those skilled in the art institute
The mode carry out sequence exchange or adjustment seen.Therefore, the various sequences in the description and the appended drawings are intended merely to clearly describe a certain
A embodiment is not meant to be necessary sequence, and wherein some sequentially must comply with unless otherwise indicated.
It is herein component institute serialization number itself, such as " first ", " second " etc., is only used for distinguishing described object,
Without any sequence or art-recognized meanings.And " connection ", " connection " described in the application, unless otherwise instructed, include directly and
It is indirectly connected with (connection).
Embodiment one：
The present embodiment provides a kind of for cutting the laser cutting device of flexible circuit board, such as can be a kind of ultraviolet sharp
Light cutting equipment.
It please refers to Fig.1 with 2, in a kind of embodiment, which includes rack 100, and Cutting platform 200 is mobile
Device 300, laser module 400 and control unit (are not shown in figure, but have no effect on the understanding of those skilled in the art).
The rack 100 is used to play a supportive role and must component for installing some.The Cutting platform 200 is used for support
Flexible PCB to be cut, so that laser module 400 can cut flexible PCB.The laser module 400 is used for
It sends out laser and cuts flexible PCB.Cutting platform 200 or laser module 400 are mounted in mobile device 300, movement dress
It puts 300 drive Cutting platforms 200 or laser module 400 moves, so as under the control of the control unit using being cut by laser function
Flexible PCB is cut into the shape of setting.
Present invention take advantage of that quick, the high-precision feature that has of laser cutting, to solve traditional moulds punching press it
The problem of insufficient, realizes convenient, high-precision processing.And the processing method can adapt to multiple material processing, and add
Work process cleans, environmental protection, machined object neat in edge, impulse- free robustness, without following process.
The laser cutting device can be such that laser module 400 fixes based on the movement of Cutting platform 200, can also make to cut
Cut platform 200 fix and with laser module 400 movement based on.
Further, it please refers to Fig.1 with 2, in a kind of embodiment, which includes Z axis mobile mechanism 310, Y
Axis mobile mechanism 320 and X-axis mobile mechanism 330.
X-axis mobile mechanism 330 and Y-axis moving mechanism 320 are distinguished in output level direction in orthogonal both direction
Movement, Z axis mobile mechanism 310 export vertical direction on movement, that is, form a mobile device that can cover XYZ coordinate
300。
The Cutting platform 200 or laser module 400 are in the case where X-axis mobile mechanism 330 and Y-axis moving mechanism 320 drive in water
Square to movement.The Cutting platform 200 or laser module 400 are moved in the case where Z axis mobile mechanism 310 drives in vertical direction, are used
It is sent out on the focal plane of laser so that flexible PCB is adjusted to laser module 400, ensures the effect of laser cutting.
Certainly, in some other embodiment, mobile device 300 can according to the demand of movement, only export some or
Movement in both direction.
In cutting process, at least one moves in laser module 400 and Cutting platform 200.It please refers to Fig.1 with 2,
In a kind of embodiment, which is fixedly installed, which is mounted in mobile device 300, and cuts flat
Platform 200 is located at the lower section of the laser emitting mouth of laser module 400, and the mobile device 300 driving Cutting platform 200 realizes XYZ tri-
The movement in a direction.
Using Cutting platform 200 movement by the way of structure it is more simple, without consider laser module 400 move when its cable
It is caused to follow problem, it can also avoid each component in laser module 400 that relative displacement occurs during exercise, influence to be cut by laser
Effect.
It please refers to Fig.3, a kind of embodiment, which includes electric rotating machine 311, screw 312, lower wedge block
313rd, upper voussoir 314 and the connecting plate 315 for being connect with Cutting platform 200.
The output shaft of the electric rotating machine 311 is fixedly connected with screw 312, such as screw 312 is driven to do by shaft coupling 318
Rotary motion.The lower wedge block 313 forms feed screw nut pair with screw 312, which has along 313 side of movement of lower wedge block
To the first inclined-plane of setting, voussoir 314 has the second inclined-plane coordinated with the first inclined-plane on this.Voussoir 314 is defined as on this
It can move, such as be defined by guide frame in the vertical direction.The rotation of the screw 312 is converted into lower wedge block
313 linear movement can coordinate the movement of lower wedge block 313 to set guide rail 317.Lower wedge block 313 drives upper wedge by the first inclined-plane
314 raising and lowering of block, movement drive connecting plate 315 of voussoir 314 moves on this.
Mentioned here to refer to along 313 moving direction of lower wedge block shown in Fig. 3, the first inclined-plane is back and forth transported along lower wedge block 313
Dynamic direction tilts, so as to using the principle of motion on a slope, ensure that the first inclined-plane can be by second tiltedly when moving along a straight line to side
Face or even entire upper voussoir 314 jack up, and the first inclined-plane can put down the second inclined-plane when moving along a straight line to opposite side.
Further, in a kind of embodiment, which further includes at least one cylinder 316, voussoir on this
314 movement drives cylinder 316 to move, which drives connecting plate 315 to move.
This structure design compared to traditional Z axis structure (such as Z axis is independently hung on crossbeam), space availability ratio higher,
Cost is lower, more simple and convenient, functionally can more accurately control the variation degree of Z axis focal length.
Further, it please referring to Fig.1, in a kind of embodiment, which includes the first linear electric machine 321,
The Y-axis moving mechanism 320 is mounted in X-axis mobile mechanism 330, and is driven and realized in X-direction by the first linear electric machine 321
It is mobile.Y-axis moving mechanism 320 includes the second linear electric machine 331, and Z axis mobile mechanism 310 is mounted in Y-axis moving mechanism 320,
And the movement realized in Y direction is driven by the second linear electric machine 331, so as to fulfill the movement in tri- directions of XYZ.
On the other hand, please continue to refer to Fig. 1 and 2, in a kind of embodiment, which includes laser 410, swashs
Light focus lamp 420, laser beam expanding lens 430, laser scanning galvanometer 440 and laser telecentric scan lens 450, the laser 410 are sent out
The laser gone out passes through laser condensing lens 420, laser beam expanding lens 430, laser scanning galvanometer 440 and laser telecentric scan lens successively
It is irradiated on flexible PCB to be cut after 450 effects.
In actual processing production, control unit sends to laser 410 and instructs, and sends out laser beam, is gathered by laser
Burnt mirror 420 after focusing, forms focus on light beam, then pass through laser beam expanding lens 430, the diameter of expanded beam and reduction laser beam
The angle of divergence after, using laser scanning galvanometer 440 handle after, after laser telecentric scan lens 450, focus on plank
On.
Laser 410 can be all solid state laser, and minimum spot size 20um, optical maser wavelength 355nm, laser is defeated
More than 10W will be reached by going out power, the laser that laser 410 is sent out will by laser beam expanding lens 430, laser scanning galvanometer 440, swash
Light telecentric scan lens 450 can be just acted on processing plank.Scanning galvanometer is used to control laser enterprising on sheet fabrication surface
The track scanning of row cutting pattern.
On the other hand, it please refers to Fig.1 with 2, in a kind of embodiment, which further includes CCD positioning units
500, the side of laser scanning galvanometer 440 is arranged on, for being positioned.CCD positioning units 500 can acquire the height of processed goods
Clear image is transferred directly to control unit, to improve locating effect, and then ensures the precision of laser cutting.
It please refers to Fig.4 with 5, in a kind of embodiment, which is fixed to be cut soft by the way of vacuum suction
Property circuit board.
The Cutting platform 200 includes vacuum extractor, and (such as vacuum pump is not shown in figure, but have no effect on this field skill
The understanding of art personnel) and sucker.The vacuum extractor is used to provide negative pressure source.The sucker is used to adsorb flexible circuit to be cut
Plate.
- 8 are please referred to Fig.4, which includes sucker disk seat 210, honeycomb panel seat 220 and cellular board 230, which has
There is cavity 211, the bottom wall of the cavity 211 has the air entry 212 of perforation, which has installation cavity 221, the peace
Behave affectedly 221 bottom have multiple blow vents 222.The cellular board 230 is mounted in installation cavity 221 sealed aroundly, the honeycomb
Plate 230 has multiple sucker mouths 232, which communicates with the blow vent 222 of honeycomb panel seat 220, the honeycomb panel seat 220
In the cavity 211 of sucker disk seat 210, the air entry 212 of the cavity 211 is connected with vacuum extractor.
When vacuum extractor works, suction cup interior can generate suction, make to be placed in the flexible circuit board on cellular board 230
(FPC plates) can be adsorbed completely, enable its finished surface smooth, and laser is consistent to the heating degree on its surface, makes processing
Effect is more perfect.
The sucker disk seat 210 plays the role of forming a connecting link in total device, is connected to honeycomb panel seat 220 and takes out true
Empty device when vacuum extractor works, generates adsorption capacity, and 210 inside of sucker disk seat can form one air-flow, act on cellular board
On seat 220, so as to reach adsorption effect.
Honeycomb panel seat 220 can be made of aluminum alloy materials, and close aperture can ensure the permeability of absorption, intermediate peace
221 are behave affectedly for ensureing that cellular board 230 can be smooth, firm is placed on honeycomb panel seat 220.Honeycomb panel seat 220 and sucker
It can be fixed between seat 210 by screw.
Cellular board 230 can be used makrolon material and be made, abbreviation PC cellular boards.PC cellular boards physical mechanical property is good,
Especially excellent impact resistance is stretched, is bent, compressive strength height.
The setting of blow vent 222 on honeycomb panel seat 220 can so that, when vacuum extractor vacuumizes, suction force is not
The part of cellular board 230 can be confined to, but cellular board 230 is distributed to everywhere by blow vent 222, ensures cellular board 230
The suction of each sucker mouth 232 can be more uniformly distributed.
Further, in some embodiments, 232 stagger setting of blow vent 222 and sucker mouth can also be made, make a ventilation
Mouth 222 can be communicated with more than two sucker mouths 232, make the suction force on sucker mouth 232 more uniform.
Fig. 6 is please referred to, which has plate body 232, and the sucker mouth 232 is substantially in regular hexagon, and the sucker mouth
232 are arranged in arrays on plate body 232.It, can be smooth, firm after the structure of the honeycombed so that flexible circuit board is put up
Adsorbed, reach fixed effect.
Please refer to Fig. 7, in a kind of embodiment, which can also be arranged in the bottom wall of installation cavity 221 in arrays
On.
On the other hand, Fig. 5 and 8 are please referred to, the bottom wall of 210 cavity 211 of sucker disk seat has fin 213, which will be recessed
Chamber 211 is divided into different gas circuits, between 220 bottom outer wall of honeycomb panel seat is made to detach with the fin 213 in cavity 211 and to be formed
Gap.These gas circuits can cause the suction force of vacuum extractor to be distributed to cavity 211 everywhere, so as to the shape on cellular board 230
Into the adsorption capacity being more uniformly distributed.
Please refer to Fig. 8, in a kind of embodiment, which is independently arranged and the substantially protrusion of across to be multiple.It should
Protrusion can also be in arrays arranged on the bottom wall of cavity 211.
Further, it please refers to Fig. 8 and 9, in a kind of embodiment, further includes into the connection ring 240 of flange shape, the connection
Ring 240 is fixed in the cavity 211 of sucker disk seat 210, and its relatively narrow one end 241 is stretched out from air entry 212, the vacuum extractor
The part that air entry 212 is stretched out with connection ring 240 connects.
The connection ring 240 can be made of the little higher aluminum alloy materials of hardness level.Connection ring 240 is from sucker disk seat
210 above toward trapping, and is lockked with screw from two holes of its ring flange side 242 position toward sucker disk seat 210, below a section connection
Pvc pipe allows pvc pipe preferably to link together with sucker disk seat 210.Pvc pipe is used to connect vacuum extractor.
It please refers to Fig.1, motion control card, driver, cooling-water machine and circuit control unit can be housed below the rack 100
Point；Rack 100 has the support arm 120 of marble platform 110 and protrusion, and laser 410, laser is placed above in support arm 120
Focus lamp 420, laser beam expanding lens 430, galvanometer and CCD fixed plates, laser scanning galvanometer 440 and laser telecentric scan lens 450
It sequentially connects, telecentric scan lens are connected in below laser scanning galvanometer 440.CCD locating modules are fixed on the left of galvanometer.Rack
Marble platform 110 on 100 is connected with X/Y axis linear motors 321,331, Z axis mobile mechanism 310 and Cutting platform from bottom to top
200。
The process of equipment shown in the present embodiment is summarized as follows：
Flexible circuit board to be processed is kept flat on Cutting platform, and passes through control unit and determines that its position and control are adjusted
The height of whole Cutting platform so that laser focal reaches the height that can swash plank, then according to the characteristic of FPC, graphics processing
And cutting mode realizes cutting processing by control unit.Z axis mobile mechanism can cut according to preset parameter
The constantly height of the Cutting platform of adjust automatically FPC plates in process, so that the incised layer of FPC plates is located at the coke of laser
In plane, in this way with the progress of cutting, the focal plane of laser can gradually from the lower surface of FPC plates be moved to upper surface until
Monoblock FPC plates are all cut.
The present apparatus can solve the deficiency of traditional moulds punching press, realize convenient, high-precision processing, additionally it is possible to which raising is set
Standby the degree of automation reduces operating cost, improves work efficiency, while can adapt to multiple material processing, and processed
Cheng Qingjie, environmental protection, machined object neat in edge, impulse- free robustness, without following process.
Use above specific case is illustrated the present invention, is merely used to help understand the present invention, not limiting
The system present invention.For those skilled in the art, thought according to the present invention can also be made several simple
It deduces, deform or replaces.
Claims (10)
1. a kind of laser cutting device for being used to cut flexible circuit board, which is characterized in that including：
Rack, for playing a supportive role；
Cutting platform, for the flexible PCB that support is to be cut；
Laser module, for sending out laser and cutting flexible PCB；
In the mobile device, the mobile device drives Cutting platform for mobile device, the Cutting platform or laser module installation
Or laser module movement, flexible PCB to be cut into the shape of setting；
And control unit, for controlling the operation of the movement of mobile device and laser module.
2. laser cutting device as described in claim 1, which is characterized in that the mobile device includes X-axis mobile mechanism, Y
It mutually hangs down in axis mobile mechanism and Z axis mobile mechanism, the X-axis mobile mechanism and Y-axis moving mechanism difference output level direction
Movement in straight both direction, the Z axis mobile mechanism export the movement on vertical direction, the Cutting platform or laser group
Part moves in the horizontal direction under X-axis mobile mechanism and Y-axis moving mechanism driving；The Cutting platform or laser module are in Z axis
It is moved under mobile mechanism's driving in vertical direction, flexible PCB is adjusted to the focal plane that laser module sends out laser
On.
3. laser cutting device as claimed in claim 2, which is characterized in that the laser module fixed setting, the cutting
On the mobile device, and the Cutting platform is located at the lower section of the laser emitting mouth of laser module to stage+module, the mobile dress
Put the movement that driving Cutting platform realizes tri- directions of XYZ.
4. laser cutting device as claimed in claim 2, which is characterized in that the Z axis mobile mechanism includes electric rotating machine, silk
Bar, lower wedge block, upper voussoir and the connecting plate for being connect with Cutting platform, the output shaft of the electric rotating machine is fixed with screw to be connected
It connects, the lower wedge block forms feed screw nut pair with screw, and the lower wedge block is oblique with first set along lower wedge block moving direction
Face, the upper voussoir have the second inclined-plane coordinated with the first inclined-plane, and the upper voussoir is defined as can be in the vertical direction
Movement, the screw are converted into the linear movement of lower wedge block, and pass through the upper voussoir raising and lowering of the first inclined-plane driving,
The movement of the upper voussoir drives connecting plate movement.
5. laser cutting device as claimed in claim 4, which is characterized in that the Z axis mobile mechanism further includes at least one
Cylinder, the movement of the upper voussoir drive cylinder moving, and the cylinder drives connecting plate movement.
6. laser cutting device as claimed in claim 4, which is characterized in that the X-axis mobile mechanism includes the first linear electricity
Machine, the Y-axis moving mechanism are mounted in X-axis mobile mechanism, and are realized in X-direction by first linear electric motor
Mobile, the Y-axis moving mechanism includes the second linear electric machine, and the Z axis mobile mechanism is mounted in Y-axis moving mechanism, and by
Second linear electric motor realizes the movement in Y direction.
7. laser cutting device as claimed in claim 3, which is characterized in that the laser module includes laser, laser gathers
Jiao Jing, laser beam expanding lens, laser scanning galvanometer and laser telecentric scan lens, the laser that the laser is sent out is successively through too drastic
Flexible circuit to be cut is irradiated to after light focus lamp, laser beam expanding lens, laser scanning galvanometer and the effect of laser telecentric scan lens
On plate.
8. laser cutting device as claimed in claim 7, which is characterized in that further include CCD positioning units, be arranged on laser
The side of scanning galvanometer, for being positioned.
9. such as claim 1-8 any one of them laser cutting devices, which is characterized in that the Cutting platform includes vacuumizing
Device and sucker, the sucker include sucker disk seat, cellular board and honeycomb panel seat, and the sucker disk seat has cavity, the cavity
Bottom wall has fin and the air entry of perforation, and cavity is divided into different gas circuits by the fin, and the cellular board seat tool has installation
Chamber, the bottom of the installation cavity have multiple blow vents, and the cellular board is mounted in installation cavity sealed aroundly, the honeycomb
Plate has multiple sucker mouths, and the sucker mouth is communicated with the blow vent of honeycomb panel seat, and the honeycomb panel seat is mounted on sucker disk seat
In cavity, and the honeycomb panel seat bottom outer wall detaches to form gap with the fin in cavity, the air entry and pumping of the cavity
Vacuum plant connects.
10. laser cutting device as claimed in claim 9, which is characterized in that the fin is independently arranged and substantially to be multiple
The protrusion of across.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721636389.4U CN207534185U (en) | 2017-11-29 | 2017-11-29 | For cutting the laser cutting device of flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721636389.4U CN207534185U (en) | 2017-11-29 | 2017-11-29 | For cutting the laser cutting device of flexible circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107855667A (en) * | 2017-11-29 | 2018-03-30 | 深圳市冰海科技有限公司 | For cutting the laser cutting device of FPC |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107855667A (en) * | 2017-11-29 | 2018-03-30 | 深圳市冰海科技有限公司 | For cutting the laser cutting device of FPC |
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