JP5370622B1 - Laser processing apparatus and laser processing method - Google Patents

Abstract

  In the present invention, in order to prevent the flatness of a workpiece such as a sheet from being deteriorated, the work table, the outer periphery mounting portion (114), the first type movable mounting portion (112), and the second type movable It has a placing part (113), a work pressing part (121), a machining head part (109), and a movable dust collecting unit (123), and the first type movable placing part (112) and the second The seed movable mounting portion (113) is provided on the work table and inside the outer peripheral mounting portion (114), and is movable up and down. The work pressing portion (121) is provided on the outer peripheral mounting portion ( 114), and the processing head portion (109) is provided above the first type movable mounting portion (112) or the second type movable mounting portion (113), and the movable dust collecting unit (123). Is provided inside the outer periphery mounting portion (114) and is movable in the horizontal direction. A first processing step, a first dust moving unit moving step, a first first moving table moving step, a second laser processing step, Have

Description

  The present invention relates to a laser processing apparatus that performs processing by irradiating a laser, and particularly to a laser processing apparatus and a laser processing method that perform through-hole processing (through-hole processing).

  In recent years, with the miniaturization, high integration, and composite modularization of parts, the drilling of the base material of those parts has also become smaller in diameter, and has become difficult with conventional processing methods. In order to solve these problems, drilling using a laser is increasing. The drilling of the workpiece by the laser is roughly classified into two types, that is, through-hole processing for forming a through hole in the workpiece and blind hole processing for forming a non-through hole in the workpiece.

  FIG. 26 is a cross-sectional view showing a configuration of a first example of a conventional laser processing apparatus.

  As shown in FIG. 26, the workpiece 811 is placed on the upper part of the divided placing portion 812. The divided placement portions 812 can be individually moved in the vertical direction, and are moved up and down by an elevation drive unit such as an air cylinder.

  At the time of blind hole processing, the placement portion 812 is in a state where all the suction portions are raised. Then, the workpiece 811 is sucked and fixed on the entire surface of the mounting portion 812, and laser processing is performed on the workpiece 811. At the time of through-hole processing, as shown in FIG. 26, laser processing is performed on the workpiece 811 in a state where only the mounting portion 812 corresponding to the lower portion of the through-hole processing is lowered.

  As described above, damage to the mounting portion 812 due to the laser during through-hole processing is prevented while maintaining the flatness of the workpiece (for example, see Patent Document 1).

  FIG. 27 is a perspective view showing a configuration of a second example of a conventional laser processing apparatus.

  As shown in FIG. 27, the chuck 902 sandwiches and holds a thin plate-shaped workpiece 901 formed of a soft member on two sides. The pulling device 903 applies a pulling force to the workpiece 901 held by the chuck 902. The workpiece 901 is held by the chuck 902 and the tension device 903. The moving device 904 moves the workpiece 901. The dust collector 905 is provided on the back surface side of the workpiece 901 with respect to the surface irradiated with the laser light, with a size covering the entire processing region. The dust collector 905 includes a stop device 906 that stops the gas flow. The two holding devices 907 respectively hold opposite sides of the workpiece 901 that are orthogonal to the sides on which the tensile force by the pulling device 903 acts. The adjusting device 908 moves one of the holding devices 907 in a direction perpendicular to the tensile force.

  As described above, the workpiece 901 is pulled by the tensioning device 903 and the holding device 907 that hold the workpiece 901 while applying a tensile force to maintain the plane. The workpiece 901 is moved to the machining area while maintaining a flat surface. The back surface of the through-hole processed portion of the workpiece 901 is not touched with the placement portion, and the workpiece 901 is laser processed while maintaining a flat surface (see, for example, Patent Document 2).

International Publication No. 2008/084642 JP 2009-006356 A

  However, the above-described prior art has the following problems.

  In recent years, with more precise processing and higher integration, the thickness of plate-like workpieces has become thinner, and the diameter of the drilled holes has also become smaller. The workpiece is, for example, a resin film having a thickness of about 100 μm or a metal foil having a thickness of several tens of μm.

  In the conventional laser processing apparatus of the first example described above, at the time of through-hole processing, laser processing is performed on the workpiece while the suction portion corresponding to the lower portion of the processing of the workpiece is lowered. And dust is discharged | emitted by distribute | circulating air to a process part.

  Therefore, when the workpiece is in the form of a thin sheet or foil as described above, the processed portion of the workpiece hangs down due to its own weight. Further, fluttering occurs due to pressure fluctuations in the air flowing through the processed portion of the workpiece. As a result, the flatness of the processed part is deteriorated. Deterioration of flatness causes a shift in the focal point of the laser and a shift in the processing position, which hinders precise processing.

  Such a problem is prominent because the size of the workpiece sheet has been increased from 512 mm × 342 mm to 512 mm × 462 mm, and recently 560 mm × 610 mm.

  Furthermore, the dust carried by the air flow moves in the movable region of the placement unit. Therefore, dust adheres to the drive part and the guide part for sliding, and may cause mechanical damage.

  Further, in the conventional laser processing apparatus of the second example described above, the plane is held by pulling two opposite sides of the workpiece. As described above, when the workpiece is in the form of a thin sheet or foil, the material of the workpiece is stretched by being pulled, and the processing position is displaced or wrinkles are generated. Such a problem becomes more prominent when the workpiece is enlarged. In the laser processing apparatus of the second example, it is difficult to perform precise processing more than in the prior art of the first example, and it can be said that precise processing is impossible for a large-sized workpiece.

  In order to solve the above-described problems, a laser processing apparatus of the present invention includes a work table, an outer periphery mounting portion, a first type movable mounting portion, a second type movable mounting portion, a workpiece pressing portion, and a processing. It has a head part and a movable dust collection unit. The work table is driven in the horizontal direction. The outer periphery mounting portion is provided on the work table and has a suction hole. The first type movable mounting unit and the second type movable mounting unit are provided on the work table and inside the outer peripheral mounting unit, and are movable up and down. The work pressing part is provided on the outer periphery mounting part. The processing head unit is provided above the first type movable mounting unit or the second type movable mounting unit and performs laser processing. The movable dust collection unit is provided on the inner side of the outer periphery mounting portion and is movable in the horizontal direction.

  Furthermore, the laser processing method of the present invention includes a first mounting step, a first fixing step, a first laser processing step, a first second-type movable mounting portion lowering step, and a first collection step. It has a dust unit moving process, a 1st 1st type movable mounting part raising process, and a 2nd laser processing process. The first placement step is a step of placing the first workpiece on the outer periphery placement portion, the second type movable placement portion, and the movable dust collection unit. The outer periphery mounting portion has an adsorption hole, and the second type movable mounting portion is provided inside the outer periphery mounting portion, is movable up and down, and has an adsorption hole. The movable dust collection unit is provided on the inner side of the outer periphery mounting portion and is movable in the horizontal direction. The first fixing step is a step of pressing the first workpiece by a workpiece pressing portion provided on the outer periphery mounting portion. The first laser processing step is a step of performing laser processing on the first region of the first workpiece located above the movable dust collection unit. The first type 2 movable mounting part lowering step is a step of moving the second type movable mounting unit downward. The first dust collection unit moving step is a step of moving the movable dust collection unit in the first horizontal direction. A 1st 1st type movable mounting part raising process is a process which is provided inside an outer periphery mounting part, is movable up and down, and moves the 1st type movable mounting part which has an adsorption hole upwards. . The second laser processing step is a step of performing laser processing on the second region of the first workpiece located above the movable dust collection unit.

  The laser processing apparatus and the laser processing method of the present invention have the above-described configuration, so that sufficiently high planar accuracy can be obtained even when through-hole processing without a member to be held below the laser processing area of the workpiece is performed. To prevent unnecessary vibrations. Therefore, even a sheet-like workpiece having a very thin thickness can be subjected to highly accurate laser processing.

FIG. 1 is a perspective view showing a schematic configuration of a laser processing apparatus according to an embodiment of the present invention. FIG. 2 is a partial cross-sectional view of the laser processing apparatus according to the embodiment of the present invention as viewed from the X direction. FIG. 3A is a perspective view of the movable dust collection unit according to the embodiment of the present invention. FIG. 3B is a cross-sectional view of the movable dust collection unit according to the embodiment of the present invention. FIG. 4 is a perspective view of the movable dust collection unit driving unit according to the embodiment of the present invention. FIG. 5 is a layout diagram illustrating an example of setting of a processing area of a workpiece according to the embodiment of the present invention. FIG. 6 is a partial cross-sectional view showing a state when a workpiece is supplied by the laser processing apparatus according to the embodiment of the present invention. FIG. 7 is a partial cross-sectional view showing a workpiece holding state of the laser processing apparatus according to the embodiment of the present invention. FIG. 8 is a partial cross-sectional view showing the positional relationship of the movable dust collection unit in the laser processing preparation state according to the embodiment of the present invention. FIG. 9 is a partial cross-sectional view showing the positional relationship of the movable dust collection unit during laser processing according to the embodiment of the present invention. FIG. 10 is a partial cross-sectional view showing the positional relationship of the movable dust collection unit during laser processing in different processing areas according to the embodiment of the present invention. FIG. 11 is a partial cross-sectional view showing the positional relationship of the movable dust collection unit during laser processing of the final row processing area according to the embodiment of the present invention. FIG. 12 is a partial cross-sectional view showing the positional relationship of the movable mounting portion after completion of laser processing in all processing areas according to the embodiment of the present invention. FIG. 13 is a partial cross-sectional view showing a state when the workpiece is discharged by the laser processing apparatus according to the embodiment of the present invention. FIG. 14 is a partial cross-sectional view seen from the X-axis direction, showing a state when supplying a laser-machined workpiece in which the machining order according to the embodiment of the present invention is set in the reverse direction. FIG. 15 is a layout diagram showing an example in which the processing order of the processing areas of the workpiece according to the embodiment of the present invention is set in the reverse direction. FIG. 16 is a partial cross-sectional view showing a state when holding a laser-machined workpiece in which the machining order according to the embodiment of the present invention is set in the reverse direction. FIG. 17 is a partial cross-sectional view showing the positional relationship of the movable dust collection unit in a laser processing preparation state in which the processing order according to the embodiment of the present invention is set in the reverse direction. FIG. 18 is a partial cross-sectional view showing the positional relationship of the movable dust collection unit during laser processing in which the processing order according to the embodiment of the present invention is set in the reverse direction. FIG. 19 is a partial cross-sectional view showing the positional relationship of the movable dust collection unit during laser processing in different processing areas in which the processing order according to the embodiment of the present invention is set in the reverse direction. FIG. 20 is a partial cross-sectional view showing the positional relationship of the movable dust collection unit during laser processing of the processing area in the final row in which the processing order according to the embodiment of the present invention is set in the reverse direction. FIG. 21 is a partial cross-sectional view showing the positional relationship of the movable mounting portion after completion of laser processing in all processing areas in which the processing order according to the embodiment of the present invention is set in the reverse direction. FIG. 22 is a partial cross-sectional view showing a state when the workpiece is discharged by the laser processing apparatus in which the processing order according to the embodiment of the present invention is set in the reverse direction. FIG. 23A is a cross-sectional view showing a different configuration of the movable dust collection unit according to the embodiment of the present invention. FIG. 23B is a cross-sectional view showing a different configuration of the movable dust collection unit according to the embodiment of the present invention. FIG. 24 is a diagram illustrating effects of different configurations of the movable dust collection unit according to the embodiment of the present invention. FIG. 25A is a diagram showing a state of a workpiece when there is no jig sheet in the movable dust collecting unit according to an example of the embodiment of the present invention. FIG. 25B is a diagram showing a state of the workpiece when there is a jig sheet in the movable dust collection unit according to an example of the embodiment of the present invention. FIG. 26 is a cross-sectional view showing the configuration of the mounting portion of the laser processing apparatus according to the prior art. FIG. 27 is a perspective view showing a state in which a workpiece is held in a laser processing apparatus according to the prior art.

  The laser processing apparatus and laser processing method of the present invention will be described with reference to the drawings. The XYZ axes shown in the figure are orthogonal to each other. The XY axis is a horizontal direction corresponding to front, back, left and right, and the Z axis is a vertical direction corresponding to up and down. The coordinate axes in each figure are drawn so as to correspond to the directions of the respective fields of view. Moreover, the same code | symbol is attached | subjected to the same component through all the figures.

(Embodiment)
FIG. 1 is a perspective view showing a schematic configuration of a laser processing apparatus 100 according to an example of an embodiment of the present invention. In FIG. 1, in order to make it easy to visually recognize the structure of the apparatus, a workpiece and a jig sheet described later are omitted. In order to describe the detailed structure, FIG. 2 is a cross-sectional view of the laser processing apparatus 100 viewed from the X direction.

  1 and 2, a laser beam 103 is emitted from a laser oscillator 102 and guided to an optical system 104 having a mirror and a lens. In the optical system 104, the density (laser diameter) of the laser beam 103 is adjusted, the shape of the laser beam 103 is adjusted, the light is suppressed, and the laser beam 103 is directed in a predetermined direction.

  The laser beam 103 that has passed through the optical system 104 is guided to the galvano scanner 105. The laser beam 103 is scanned and positioned by an X mirror 106 for scanning in the X axis direction and a Y mirror 107 for scanning the laser beam 103 reflected by the X mirror 106 in the Y axis direction. Then, the laser beam 103 reflected by the Y mirror 107 is condensed by the fθ lens 108 and irradiated to a processing point at a predetermined position.

  As shown in FIG. 2, the galvano scanner 105 and the fθ lens 108 are installed on the processing head 109. The galvano scanner 105 includes an X mirror 106 and a Y mirror 107, reflects the laser beam 103, and controls the irradiation position. The fθ lens 108 makes the direction of the laser beam 103 perpendicular to the surface of the workpiece 111 and collects the light. The machining head 109 is attached to a Z slider (not shown), and the machining head 109 is movable in the Z direction, that is, the vertical direction in FIG.

  The placement unit for placing and holding the sheet-like workpiece 111 includes an outer periphery placement unit 114, a plurality of movable placement units 115, a movable dust collection unit 123, and a plurality of work pressing units 121. Is done.

  The movable placement unit 115 is divided into a first type movable placement unit 112 and a second type movable placement unit 113 having different operations. In the present embodiment, the second type movable mounting portion 113 is a member having a large surface that is installed and operates near the center of the mounting portion. The first type movable mounting part 112 is two small members that are located on two opposite sides of the second type movable mounting part 113 and that can operate independently of each other.

  The two first type movable mounting parts 112 and the second type movable mounting part 113 are each supported by a pair of movable mounting part lifting cylinders 118. In the present embodiment, the movable mounting unit elevating cylinder 118 uses an air cylinder controlled by air pressure, and the two first type movable mounting units 112 and the second type movable mounting unit 113 are independently provided. Can be moved up and down.

  Each of the first type movable placement unit 112 and the second type movable placement unit 113 is provided with a plurality of movable placement unit suction holes 116. In addition, an outer peripheral suction hole 117 is provided in the outer peripheral mounting portion 114. The workpiece 111 is sucked and held by evacuating the movable placement portion suction hole 116 and the outer periphery suction hole 117.

  A pair of work pressing parts 121 are installed on at least two sides parallel to the longitudinal direction of the movable mounting part 115. In the present embodiment, a pair is also installed on two parallel sides in the short direction of the movable placement unit 115 and installed on all four sides of the movable placement unit 115. The work pressing part 121 is attached so as to be rotatable by a fulcrum provided on a member installed on the outer periphery mounting part 114, and is opened and closed by a pressing part drive cylinder 119.

  The work pressing part 121 is formed of a long plate-like metal body due to dimensional constraints in the Z direction, and a clamp member 120 is provided on the surface of the work pressing part 121 that faces the workpiece. The clamp member 120 is formed of an organic elastic body such as urethane rubber or silicon rubber. Thereby, when it contacts with a workpiece, a pressing force is generated without being damaged, and displacement due to slippage of the workpiece can be prevented.

  The movable dust collecting unit 123 is installed on the opposite side of the workpiece to the workpiece, that is, on the lower side, so as to be movable in the horizontal direction. The movable dust collection unit 123 collects and discharges dust during laser processing of the workpiece 111.

  3A is a perspective view of a basic shape of the movable dust collection unit 123, and FIG. 3B is a cross-sectional view of the movable dust collection unit 123. As shown in FIGS. 3A and 3B, the movable dust collection unit 123 has a substantially U-shaped cross-sectional shape having a workpiece support portion 302 and an air circulation portion 303. Air is blown from one side of the air circulation unit 303 and sucked from the other side (push-pull) to circulate air and collect and discharge dust.

  FIG. 4 is a partial perspective view showing an example of the drive unit configuration of the movable dust collection unit 123. As shown in FIG. 4, the movable dust collection unit 123 can be slid by installing the drive motor 200 in the vicinity of the placement unit and rotating the ball screw as the drive transmission unit 201 by the drive motor 200.

  Alternatively, as an example of another configuration, a guide and a belt (not shown) may be provided in the movable dust collection unit 123, and the rotation of the drive motor 200 may be transmitted to the belt to slide the movable dust collection unit 123. .

  The jig sheet 122 is a sheet-like member that is installed in advance at a position that is sandwiched between the workpiece 111 and the mounting portion and is formed of a flame-retardant porous material. The flame retardant porous material is, for example, a non-woven fabric formed into a sheet shape using a pulp fiber treated with a phosphorus compound flame retardant as a base material and a binder added thereto.

  As for the flame retardancy, self-extinguishing properties that do not spread and spread as in general flame retardant materials are sufficient. Further, the flame retardant to be added is not limited to the phosphorus compound type, and a bromine compound, a chlorine compound, a phosphoric acid ester having a halogen group, or a metal hydroxide as an inorganic material can be used.

  The base material is not limited to pulp fiber, and may have the above-described flame retardancy and may have a porous property that allows gas to pass through suction. The base material is preferably a material having a heat insulating effect, such as a nonwoven fabric of an organic material such as pulp fiber or synthetic resin fiber.

  As shown in FIG. 2, the machining table 130 provided so as to be movable in the horizontal direction is composed of two blocks, a Y table 131 and an X table 133.

  The Y table 131 includes a first type movable mounting unit 112, a second type movable mounting unit 113, an outer peripheral mounting unit 114, a movable dust collecting unit 123, a work pressing unit 121, and a set of them attached thereto. The configuration is placed and configured to move in the Y direction. The Y table drive unit 132 drives the motor to rotate the ball screw, and the Y table 131 is slid along with the entire set to be moved in the Y direction.

  The X table 133 is further mounted with a Y table 131 and a set of configurations accompanying the Y table 131 and is movable in the X direction. The motor is driven by the X table driving unit 134 to rotate the ball screw, and the X table 133 is moved by sliding the X table 133 along with the entire set.

  The laser processing apparatus 100 includes a processing control unit 101 that controls the apparatus in a programmable manner. The processing control unit 101 includes a laser oscillator 102, a galvano scanner 105, an X table driving unit 134, a Y table driving unit 132, a pressing unit driving cylinder 119, a movable mounting unit elevating cylinder 118, and other intake and exhaust of suction holes. Control the operation of the processing equipment.

  FIG. 5 is a layout diagram showing an example of setting of the processing area in the present embodiment. The scan range of the galvano scanner 105 for accurately positioning the irradiation position of the laser beam 103 is smaller than the area of the workpiece 111. Therefore, the workpiece 111 is divided into a plurality of processing areas 125 and laser processing is performed. In FIG. 5, an area where numbers 1 to 48 are given to the workpiece 111 is a machining area.

  Therefore, each processing area 125 is set within the scan range of the galvano scanner 105, and positioning of laser processing in the processing area 125 is performed by controlling the galvano scanner. Note that the illustrated area is merely an example, and is not limited to this figure.

  The operation of the laser processing apparatus 100 configured as described above will be described.

  FIG. 6 is a partial cross-sectional view seen from the X-axis direction, showing the state of the mounting portion and the movable dust collection unit 123 when the workpiece 111 is mounted.

  In mounting the workpiece 111 on the apparatus, the mounting table is moved to the mounting position of the workpiece 111 by moving the processing table 130. Here, the evacuation of the movable mounting portion suction hole 116 and the outer periphery suction hole 117 is stopped and the suction is stopped. The movable dust collection unit 123 also stops the air flow for dust collection. The jig sheet 122 is previously installed at a predetermined position.

  The movable dust collection unit 123 is positioned at one end of the processing area, and the first type movable placement unit 112b other than the first type movable placement unit 112a located at the position of the movable dust collection unit 123, the second type movable. The placement unit 113 is raised. Further, the work pressing portion 121 is opened by a pressing portion driving cylinder 119.

  As shown in FIG. 7, after the workpiece 111 is mounted on the jig sheet 122 on the mounting portion (first mounting step), the movable mounting portion suction hole 116 and the outer peripheral suction hole 117 are evacuated. Adsorption and holding of the lower surface of the workpiece 111 together with the jig sheet 122 is started. Then, the work holding unit 121 is driven from the opened state to the closed state by the holding unit driving cylinder 119 (first fixing step).

  As shown in FIG. 7, the outer periphery mounting part 114 in which the suction hole is formed, the first type movable mounting part 112b and the second type movable mounting part 113 in which the suction hole is formed, and the movable dust collection unit The workpiece 111 is held together with the jig sheet 122 on 123. The peripheral portion of the workpiece 111 is pressed by the workpiece pressing portion 121 together with the jig sheet 122. A clamp member 120 is provided at a portion of the work pressing portion 121 that is in contact with the workpiece 111 to generate a pressing force against the workpiece 111 and prevent a slippage of the workpiece 111. As a result, the flat surface of the workpiece 111 is held by the outer periphery mounting portion 114 and the work pressing portion 121.

  After holding the workpiece 111 is completed, the following operations are performed.

  The suction by the movable placement portion suction holes 116 of the first type movable placement portion 112b and the second type movable placement portion 113 is stopped, and the suction fixation of the area is released. After releasing the suction fixation, the first type movable mounting part 112b and the second type movable mounting part 113 that have been lifted are lowered to a predetermined position (first second type movable mounting part lowering step). The state is shown in FIG.

  After the above operation is performed, or in parallel with the above operation, the movement of the processing table is started in order to move the placement unit holding the workpiece 111 to the first processing area (first region). . The machining head 109 located at the origin position moves to a focal position optimum for machining the workpiece 111 and enters a laser machining preparation state.

  At this time, the movable dust collection unit 123 is located on the lower surface of the row including the first processing area. Air is supplied from one of the U-shaped spaces of the movable dust collecting unit 123, and air is discharged from the other. By creating a push-pull air flow in this way, the pressure can be controlled so as not to affect the flatness of the workpiece 111, and a stable laminar flow can be obtained, so that the workpiece is not vibrated.

  After the above-described operation is completed and the first processing area 125 of the workpiece 111 arrives at a position where the processing head 109 is located, the laser beam 103 starts drilling the first processing area 125 (the first processing area 125). Laser processing step).

  FIG. 9 is a partial cross-sectional view of the state in which the first machining area 125 is laser drilled as viewed from the X-axis direction. There is a movable dust collecting unit 123 at a position corresponding to the processing area, and the first type movable mounting units 112a and 112b and the second type movable mounting unit 113 are all lowered and irradiated with the laser beam 103 to perform hole processing. Is made. The periphery of the workpiece 111 is sucked and held by the outer peripheral suction hole 117 provided in the outer peripheral mounting portion 114 and is pressed by the work pressing portion 121 provided with the clamp member 120. This prevents deflection and misalignment of the workpiece.

  Although the drilling reaches the jig sheet 122, since it is made of a flame-retardant material, even if a slight burn occurs, there is no ignition or damage.

  Further, in the movable dust collection unit 123, an air flow is created by the air circulation unit 303, and the air is discharged to the outside. Therefore, dust generated on the lower surface of the workpiece 111 or the lower surface of the jig sheet 122 is efficiently discharged by the air flow.

  When irradiation with a predetermined laser beam is completed and all holes in the first processing area 125 are completed, the processing table is moved to the next second processing area 125 shown in FIG. In the form, it is moved in the X direction. The state of laser hole machining in the second machining area 125 is also as shown in FIG. In this way, the same operation is repeated until laser processing is completed for all of the row of processing areas (first to eighth processing areas in FIG. 5) where the movable dust collection unit 123 is located.

  When the laser processing of all the areas in one row is completed, the following operation is started.

  First, movement of the machining table in the Y direction is started in order to move the mounting portion on which the workpiece is mounted to the machining area of the next row. At the same time, the movable dust collection unit 123 also moves (first dust collection unit moving step). The first type movable mounting parts 112a and 112b and the second type movable mounting part 113 remain lowered. The state after movement is shown in FIG.

  The movable dust collection unit 123 moves in a position corresponding to the next row of the processing area (the ninth processing area in FIG. 5), that is, in the left direction (first horizontal direction) with respect to the workpiece 111. However, if the machining head is used as a reference, they are approximately at the same position as shown in the figure.

  As described above, after preparation for processing in the processing area (second region) of the row is completed, the galvano scanner 105 is controlled to start irradiation with the laser beam 103 at the hole processing position.

  FIG. 10 is a partial cross-sectional view of the state in which the processing area is laser drilled as viewed from the X-axis direction. With the movable dust collecting unit 123 in a position corresponding to the processing area, the laser beam 103 is irradiated to perform hole processing. In the movable dust collection unit 123, a push-pull air flow is created in which air is supplied from one of the U-shaped spaces and air is discharged from the other.

  When all the machining areas (9th to 16th machining areas in FIG. 5) in the row where the movable dust collecting unit 123 is located are laser-machined, the process moves to the next machining area. Then, the above operation is repeated to process the processing area in a predetermined order.

  FIG. 11 shows a state in which, after the machining areas are sequentially machined, the workpiece 111 is moved to the machining position in the last machining area row (the 41st to 48th machining areas in FIG. 5).

  Similarly, there is a movable dust collecting unit 123 at a position corresponding to the processing area, and a push-pull air flow is created in which air is supplied from one of the U-shaped spaces and air is discharged from the other. In this state, the laser beam 103 is irradiated to make a hole.

  When irradiation with a predetermined laser beam is completed and all holes in the first machining area (41st machining area) of the row are completed, the machining table is moved to the next machining area. In the form, it is moved in the X direction. Similarly, predetermined laser processing is performed. In this way, the same operation is repeated until laser processing is completed for all the processing areas in the row where the movable dust collection unit 123 is located (41st to 48th processing areas in FIG. 5). In this way, the processing of the processing area in the last row is performed, and the processing of the entire surface of the workpiece 111 is completed.

  When the processing of the entire surface of the workpiece 111 is completed, the following operation is started.

  First, in order to start the movement to the workpiece removal position, the movement of the machining table is started. The movement of the machining head 109 to the origin is started.

  As shown in FIG. 12, the movable dust collection unit 123 is located at the end on the opposite side to that at the start of processing. The first type movable mounting unit 112a and the second type movable mounting unit 113 excluding the first type movable mounting unit 112b of the portion where the movable dust collecting unit 123 is located rise (first first type (Moving platform raising process). When the ascent is completed, the movable placement portion suction holes 116 provided in the first type movable placement portion 112a and the second type movable placement portion 113 are evacuated, and the workpiece 111 and the jig sheet 122 are again sucked and held. These operations are performed in parallel.

  When all the operations described above are completed and the processing table is moved to the workpiece take-out position, as shown in FIG. 13, the pressing portion drive cylinder 119 is operated to bring the workpiece pressing portion 121 into an open state. Then, evacuation of all the movable mounting portion suction holes 116 and all the outer peripheral suction holes 117 is stopped. Then, it is confirmed that the workpiece 111 is not sucked and held, and a workpiece take-out device (not shown) takes out the workpiece 111 from the mounting portion, thereby completing the laser hole machining of the workpiece. . The jig sheet 122 remains above the first type movable mounting part 112a, the second type movable mounting part 113, and the movable dust collecting unit 123, and is used for processing the next workpiece.

  As described above, in the laser processing apparatus of the present invention, the movable dust collection unit 123 that always forms a stable air flow is positioned as the lower movable mounting portion in the lower portion of the processing area where laser processing is performed. The movable dust collection unit 123 collects and discharges dust generated by processing. Thereby, efficient dust collection is realized, and dust is prevented from adhering to the movable part of the apparatus.

  Further, the work piece with less deflection is held by the adsorption of the work piece 111 by the outer periphery mounting part 114 and the fixing of the work pressing part 121. And the support part 302 of the to-be-processed object of the movable dust collection unit 123 always supports the row of process areas from the lower part. Therefore, even a large and very thin sheet-like workpiece can be subjected to highly accurate laser processing with very little deflection.

  Next, the operation in the case where the workpiece 111 is mounted again and the above-described series of laser processing is performed from the state where the workpiece 111 shown in FIG. 13 is discharged will be described. In this case, the processing order of the processing area of the workpiece 111 may be set in the reverse direction.

  FIG. 14 is a partial cross-sectional view seen from the X-axis direction showing a state when a workpiece is supplied when the processing order of laser processing by the laser processing apparatus of the present invention is set in the reverse direction.

  In mounting the workpiece 111 on the apparatus, the processing table 130 is moved to the mounting position of the workpiece 111. The evacuation of the movable mounting portion suction hole 116 and the outer periphery suction hole 117 is stopped so that the suction is not performed. The movable dust collection unit 123 also stops the air flow for dust collection. The jig sheet 122 is previously installed at a predetermined position.

  The movable dust collection unit 123 is located at one end of the processing area, and the first type movable placement unit 112 a other than the first type movable placement unit 112 b where the movable dust collection unit 123 is located, The two-type movable mounting portion 113 is raised. Further, the work pressing portion 121 is opened by the pressing portion driving cylinder 119.

  14 is different from the state shown in FIG. 6 in that the movable dust collecting unit 123 is located on the opposite side when the workpiece 111 is supplied. As a result, the vertical positions of the first type movable mounting part 112a and the first type movable mounting part 112b are also opposite to the state shown in FIG.

  The feature of setting the apparatus operation is related to the processing table at the time of discharging the workpiece 111 shown in FIG. 13 including the positional relationship between the movable dust collecting unit 123 and the first type movable mounting portions 112a and 112b. And the positional relationship of the configuration when supplying the workpiece 111 shown in FIG. 14 are the same. Thereby, the supply of the workpiece 111 can be quickly prepared by simply moving the processing table in the X-axis direction after discharging the workpiece.

  FIG. 15 is a layout diagram of workpieces in which the machining order of the machining areas is set in the reverse direction. The processing order is mirror-symmetric with respect to the Y axis with respect to the processing area of FIG.

  As shown in FIG. 16, after mounting the workpiece 111 (second workpiece) on the jig sheet 122 on the mounting portion (second mounting step), the movable mounting portion suction hole 116 and the outer periphery The suction hole 117 is evacuated to start sucking and holding the lower surface of the workpiece 111 together with the jig sheet 122. Then, the workpiece pressing portion 121 is driven from the open state to the closed state by the pressing portion driving cylinder 119 (second fixing step).

  As shown in FIG. 16, the outer periphery mounting part 114 in which the suction holes are formed, the plurality of first type movable mounting parts 112a and second type movable mounting parts 113 in which the suction holes are formed, and the movable collection The workpiece 111 is held together with the jig sheet 122 on the dust unit 123. The peripheral portion of the workpiece 111 is pressed by the workpiece pressing portion 121 together with the jig sheet 122. A clamp member 120 is provided at a portion of the work pressing portion 121 that is in contact with the workpiece 111 to generate a pressing force against the workpiece 111 and prevent a slippage of the workpiece 111. As a result, the flat surface of the workpiece 111 is held by the outer periphery mounting portion 114 and the work pressing portion 121.

  The above operation is not particularly different from the operation described in FIG.

  After holding the workpiece 111 is completed, the following operations are performed.

  The suction by the movable placement portion suction holes 116 of the first type movable placement portion 112a and the second type movable placement portion 113 is stopped, and the suction fixation of the area is released. After releasing the suction fixation, the first type movable mounting part 112a and the second type movable mounting part 113 that have been lifted are lowered to a predetermined position (second second type movable mounting part processing step). The state is shown in FIG.

  After performing the above operation, or in parallel with the above operation, the processing table starts to move in order to move the mounting portion holding the workpiece 111 to the first processing area. The machining head 109 located at the origin position moves to a focal position optimum for machining the workpiece 111 and enters a laser machining preparation state.

  The above operation is basically the same as the operation described with reference to FIG. 8, but the amount of movement in the Y-axis direction is different because the first processing area is mirror-symmetrical with respect to the Y-axis.

  At this time, the movable dust collection unit 123 is located on the lower surface of the row including the first processing area. Air is supplied from one of the U-shaped spaces of the movable dust collecting unit 123, and air is discharged from the other. By creating a push-pull air flow in this way, the pressure can be controlled so as not to affect the flatness of the workpiece 111, and a stable laminar flow can be obtained, so that the workpiece is not vibrated.

  After the above operation is completed and the first processing area 125 of the workpiece 111 arrives at a position where the processing head 109 is located, the laser beam 103 starts drilling the first processing area 125.

  FIG. 18 is a partial cross-sectional view of the state in which the first machining area 125 (third region) is laser drilled (third laser machining step) as seen from the X-axis direction. There is a movable dust collecting unit 123 at a position corresponding to the processing area, and the first type movable mounting units 112a and 112b and the second type movable mounting unit 113 are all lowered and irradiated with the laser beam 103 to perform hole processing. Is made. The periphery of the workpiece 111 is sucked and held by the outer peripheral suction hole 117 provided in the outer peripheral mounting portion 114 and is pressed by the work pressing portion 121 provided with the clamp member 120. This prevents deflection and misalignment of the workpiece.

  As described above, in the movable dust collection unit 123, an air flow is created by the air circulation unit 303, and the air is discharged to the outside. Therefore, dust generated on the lower surface of the workpiece 111 or the lower surface of the jig sheet 122 is efficiently discharged by the air flow.

  When irradiation with a predetermined laser beam is completed and all holes in the first processing area 125 are completed, the processing table is moved in the X direction in this embodiment in order to move to the second processing area 125. Let The state of laser hole machining in the second machining area 125 is also as shown in FIG. In this way, the same operation is repeated until laser processing is completed for all the processing areas in the row where the movable dust collection unit 123 is located (the first to eighth processing areas in FIG. 15).

  When the laser processing of all the areas in one row is completed, the following operation is started.

  First, movement of the machining table in the Y direction is started in order to move the mounting portion on which the workpiece is mounted to the machining area of the next row. At the same time, the movable dust collection unit 123 also moves (second dust collection unit moving step). The first type movable mounting parts 112a and 112b and the second type movable mounting part 113 remain lowered. The state after the movement is shown in FIG.

  The movable dust collection unit 123 moves in a position corresponding to the next row of the processing area (the ninth processing area in FIG. 15), that is, in the right direction (second horizontal direction) with respect to the workpiece 111. However, if the machining head is used as a reference, they are approximately at the same position as shown in the figure.

  As described above, after processing preparation in the processing area (fourth region) of the row is completed, the galvano scanner 105 is controlled to start irradiation with the laser beam 103 at the hole processing position (fourth laser processing step). ).

  FIG. 19 is a partial cross-sectional view of the state in which the processing area is laser drilled as viewed from the X-axis direction. With the movable dust collecting unit 123 in a position corresponding to the processing area, the laser beam 103 is irradiated to perform hole processing. In the movable dust collection unit 123, a push-pull air flow is created in which air is supplied from one of the U-shaped spaces and air is discharged from the other.

  When all the processing areas (the ninth to sixteenth processing areas in FIG. 15) in the row where the movable dust collection unit 123 is positioned are laser-processed, the process moves to the next processing area. Then, the above operation is repeated to process the processing area in a predetermined order.

  FIG. 20 shows a state in which, after the processing areas are sequentially processed, they are moved to the processing positions in the last processing area row (the 41st to 48th processing areas in FIG. 15) of the workpiece 111.

  Similarly, there is a movable dust collecting unit 123 at a position corresponding to the processing area, and a push-pull air flow is created in which air is supplied from one of the U-shaped spaces and air is discharged from the other. In this state, the laser beam 103 is irradiated to make a hole.

  When irradiation with a predetermined laser beam is completed and all holes in the first machining area (41st machining area) of the row are completed, the machining table is moved to the next machining area. In the form, it is moved in the X direction. Similarly, predetermined laser processing is performed. In this way, the same operation is repeated until laser processing is completed for all the processing areas in the row where the movable dust collection unit 123 is located (the 41st to 48th processing areas in FIG. 15). In this way, the processing of the processing area in the last row is performed, and the processing of the entire surface of the workpiece 111 is completed.

  When the processing of the entire surface of the workpiece 111 is completed, the following operation is started.

  First, in order to start the movement to the workpiece removal position, the movement of the machining table is started. The movement of the machining head 109 to the origin is started.

  As shown in FIG. 21, the movable dust collection unit 123 is located at the end opposite to the processing start time (FIG. 18). The first type movable mounting unit 112b and the second type movable mounting unit 113 excluding the first type movable mounting unit 112a of the portion where the movable dust collection unit 123 is located are raised (second type 1). (Moving platform raising process). When the ascent is completed, the movable placement portion suction holes 116 provided in the first type movable placement portion 112b and the second type movable placement portion 113 are evacuated, and the workpiece 111 and the jig sheet 122 are again sucked and held. These operations are performed in parallel.

  At this time, since the machining area of the last row is at a different position in the X-axis direction, the movement amount in the X-axis direction is different from that in the machining order of the machining areas in FIG.

  When all the operations described above are completed and the processing table is moved to the workpiece take-out position, as shown in FIG. 22, the pressing portion drive cylinder 119 is operated to bring the workpiece pressing portion 121 into an open state. Then, evacuation of all the movable mounting portion suction holes 116 and all the outer peripheral suction holes 117 is stopped. Then, it is confirmed that the workpiece 111 is not sucked and held, and a workpiece take-out device (not shown) takes out the workpiece 111 from the mounting portion, thereby completing the laser hole machining of the workpiece. .

  The positional relationship of the configuration at the time of discharging the workpiece 111 shown in FIG. 22 includes the positional relationship between the movable dust collection unit 123 and the first type movable mounting portions 112a and 112b, and the workpiece shown in FIG. This is the same as the positional relationship of the configuration related to the machining table when 111 is supplied. Accordingly, the workpiece 111 can be quickly prepared for supply simply by moving the processing table in the X-axis direction after discharging the workpiece and moving to the supply position of the workpiece 111. Thereafter, by alternately repeating the processing order shown in FIG. 5 and the processing order shown in FIG. .

  As described above, even when processing is performed by reciprocating the processing order of the processing areas, the movable dust collection unit 123 that always forms a stable air flow is formed in the lower part of the processing area where laser processing is performed in exactly the same manner as described above. It is located as a lower movable mounting part. The movable dust collection unit 123 collects and discharges dust generated by processing. Thereby, efficient dust collection is realized, and dust is prevented from adhering to the movable part of the apparatus.

  Further, the work piece with less deflection is held by the adsorption of the work piece 111 by the outer periphery mounting part 114 and the fixing of the work pressing part 121. And the support part 302 of the to-be-processed object of the movable dust collection unit 123 always supports the row of process areas from the lower part. Therefore, even a large and very thin sheet-like workpiece can be subjected to highly accurate laser processing with very little deflection.

  Next, as an example of a preferred embodiment of the present invention, an example of a different configuration of the movable dust collection unit 123 will be described with reference to FIGS. 23A and 23B.

  As shown in FIG. 23A, in this different configuration, the support portion is configured as a support portion bar 301 which is a separate member from the U-shaped member. Thereby, the precision of the location which contact | connects the to-be-processed object 111 or the jig sheet 122 can be made very high. When the U-shaped press product is used as it is, the flatness formed by the support portion can be easily obtained with high accuracy when formed as a separate member. For example, in the present embodiment, even when the length of the support bar 301 exceeds 500 mm, the flatness can be suppressed to 50 μm or less.

  FIG. 23B shows an example in which the support bar 301 is configured to be movable up and down. The operation of the support bar 301 configured as described above is shown in FIG. When the movable dust collecting unit 123 is in the vicinity of the center where it does not interfere with the outer periphery mounting portion 114, the pair of support portion bars 301 are in close contact with the jig sheet 122 in a state where both protrude from the upper portion. Therefore, it is possible to maintain the flatness of the processing area of the workpiece 111 and to stably collect and discharge the air flow without leakage. When processing a processing area near the outer periphery, only one of the support bars 301 can be stored on the U-shaped main body side to prevent interference with the outer periphery mounting portion 114. This state is indicated by dotted lines on the left and right in the figure. Thereby, it can contribute to reducing as much as possible the area of the outer periphery of the to-be-processed object 111 which cannot be processed. In addition, since the up-and-down movement of the support part bar 301 is performed in relation to the outer periphery mounting part 114, it can be realized by providing an appropriate guide and a cam plate (not shown).

  In the present embodiment, the case where the jig sheet 122 is installed in advance and laser processing is performed has been described. However, even if the jig sheet 122 is not used, the flat surface can be maintained with high accuracy by the adsorption of the workpiece 111 by the outer periphery mounting portion 114, the fixing of the workpiece pressing portion 121, and the lower support of the workpiece by the movable dust collecting unit 123. it can. In addition, dust on the lower side of the workpiece 111 can be efficiently discharged.

  However, holding the workpiece 111 together with the jig sheet 122 increases the overall rigidity of the plane. Further, the support portion of the movable dust collection unit 123 always supports a row of processing areas from below. Therefore, even a large-sized and very thin sheet-like workpiece can be subjected to highly accurate laser processing with very little deflection. FIG. 25A shows a state of the workpiece 111 when the jig sheet 122 is not present. FIG. 25B shows the state of the workpiece 111 when the jig sheet 122 is present. 25A and 25B qualitatively emphasize the state of the workpiece 111.

  Further, when the movable dust collection unit 123 moves to the processing area of the next row, the back surface of the workpiece 111 is protected when the jig sheet 122 is installed. Therefore, it is possible to eliminate a slight probability that the workpiece 111 is scratched by the movable dust collection unit 123.

  In the present embodiment, the second type movable mounting unit 113 is a member having a relatively large surface that is installed and operates near the center of the mounting unit, and the two first type movable mounting units 112 An example is shown in which the two types of movable mounting portions 113 are configured as small members that are positioned on two opposite sides and can be operated independently. As described above, the first type movable mounting unit 112 is a movable mounting unit corresponding to the position of the movable dust collection unit when the movable mounting unit is raised when the workpiece is mounted. . In this embodiment, since the movable dust collecting units are located at two positions on the left and right as viewed from the X axis, an example in which they are installed on two opposite sides is shown.

  Naturally, the movable dust collecting unit can be positioned at a different location depending on the laser processing control procedure. If the movable mounting portion is divided at the corresponding position, it is the first type movable mounting portion.

  Further, the second type movable mounting portion refers to a movable mounting portion at a position that does not interfere with the position of the movable dust collection unit. As in this embodiment, the second type movable mounting portion may have one large surface, or may be divided into a plurality of movable mounting portions, and is not limited to the size or number. .

  In the present embodiment, specific numerical values are shown for convenience of illustration such as the number of processing areas. However, these specific values may be determined by design requirements such as the size of the workpiece and the size of the apparatus, and are not limited to this example.

  The laser processing apparatus according to the present invention can achieve high processing accuracy by maintaining the flatness of the workpiece while preventing damage to the mounting portion in the hole processing by laser. Further, dust generated during laser processing can be efficiently collected and discharged, and dust can be prevented from adhering to the movable part of the apparatus. Therefore, it is useful in a laser processing apparatus that performs through-hole processing.

DESCRIPTION OF SYMBOLS 100 Laser processing apparatus 101 Processing control part 102 Laser oscillator 103 Laser beam 104 Optical system 105 Galvano scanner 106 X mirror 107 Y mirror 108 f (theta) lens 109 Processing head 111,811,901 Workpiece 112,112a, 112b 1st type movable mounting Placement part 113 Type 2 movable placement part 114 Outer circumference placement part 115 Movable placement part 116 Movable placement part suction hole 117 Perimeter suction hole 118 Movable placement part elevating cylinder 119 Holding part drive cylinder 120 Clamp member 121 Work holding part 122 Jig sheet 123 Movable dust collecting unit 125 Processing area 130 Processing table 131 Y table 132 Y table drive unit 133 X table 134 X table drive unit 200 Drive motor 201 Drive transmission unit 301 Support unit bar 30 Support portion 303 air circulation unit

Claims (11)

A work table driven in a horizontal direction;
An outer periphery mounting portion provided on the work table and having suction holes;
A first-type movable mounting portion which is provided on the work table and inside the outer peripheral mounting portion, is movable up and down, and has suction holes;
A second-type movable mounting portion that is provided on the work table and inside the outer peripheral mounting portion, is movable up and down, and has suction holes;
A work pressing part provided in the outer periphery mounting part;
A processing head unit that is provided above the first type movable mounting unit or the second type movable mounting unit and performs laser processing;
A laser processing apparatus comprising: a movable dust collection unit that is provided inside the outer periphery mounting portion and is movable in a horizontal direction.   2. The laser processing apparatus according to claim 1, wherein a cross-sectional shape of the movable dust collecting unit is an approximately U shape with an upper opening.   The laser processing apparatus according to claim 2, wherein the movable dust collection unit further includes a support bar made of a member different from the U-shaped portion.   The laser processing apparatus according to claim 3, wherein the support bar is vertically movable.   The laser processing apparatus according to any one of claims 1 to 4, wherein the first type movable mounting portion is positioned so as to correspond to a position of the movable dust collection unit. There are a plurality of the first type movable mounting parts,
The laser processing apparatus according to claim 5, wherein at least two of the first type movable placement units are positioned so as to sandwich the second type movable placement unit.   The laser processing apparatus according to claim 1, wherein the work pressing portion is provided on all four sides of the outer periphery mounting portion.   The laser processing apparatus according to any one of claims 1 to 7, further comprising a sheet formed of a flame-retardant porous material on the first type movable mounting unit and the second type movable mounting unit. .   The laser processing apparatus according to claim 8, wherein the sheet is made of an organic fiber nonwoven fabric to which a flame retardant is added. An outer periphery mounting portion having suction holes, a second type movable mounting portion that is provided inside the outer periphery mounting portion and is movable up and down, and has suction holes, and provided inside the outer periphery mounting portion. A first placing step of placing the first workpiece on the movable dust collecting unit movable in the horizontal direction;
A first fixing step of pressing the first workpiece by a workpiece pressing portion provided on the outer periphery mounting portion;
A first laser processing step of performing laser processing on a first region of the first workpiece located above the movable dust collection unit;
A first second-type movable mounting portion lowering step for moving the second-type movable mounting portion downward;
A first dust collection unit moving step of moving the movable dust collection unit in a first horizontal direction;
A first type first movable mounting unit raising step that is provided inside the outer peripheral mounting unit, is movable up and down, and moves the first type movable mounting unit having suction holes upward;
And a second laser processing step of performing laser processing on a second region of the first workpiece located above the movable dust collection unit. After laser processing the first workpiece,
A second placing step of placing a second workpiece on the outer circumference placing portion, the second type movable placing portion, and the movable dust collecting unit;
A second fixing step of pressing the second workpiece by a workpiece pressing portion provided on the outer periphery mounting portion;
A third laser processing step for performing laser processing on a third region of the second workpiece located above the movable dust collection unit;
A second type 2 movable mounting part lowering step of moving the second type movable mounting part downward;
A second dust collection unit moving step of moving the movable dust collection unit in a second horizontal direction;
A second first-type movable mounting unit raising step that is provided inside the outer peripheral mounting unit, is movable up and down, and moves the first-type movable mounting unit having suction holes upward;
A fourth laser processing step for performing laser processing on a fourth region of the second workpiece, which is located above the movable dust collection unit,
The laser processing method according to claim 10, wherein the first horizontal direction is opposite to the second horizontal direction.