CN103492118B - Laser processing device and laser processing method - Google Patents
Laser processing device and laser processing method Download PDFInfo
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- CN103492118B CN103492118B CN201380001036.5A CN201380001036A CN103492118B CN 103492118 B CN103492118 B CN 103492118B CN 201380001036 A CN201380001036 A CN 201380001036A CN 103492118 B CN103492118 B CN 103492118B
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- collecting unit
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
In order to prevent deterioration of the flatness of a sheet-form workpiece, this laser processing device is provided with a work table, an outer periphery mounting unit (114), a first movable mounting unit (112), a second movable mounting unit (113), a workpiece restraining unit (121), a processing head unit (109), and a movable dust collection unit (123). The first movable mounting unit (112) and second movable mounting unit (113) are provided on the work table and inside of the outer periphery mounting unit (114), and can move vertically. The workpiece restraining unit (121) is provided on the outer periphery mounting unit (114), and the processing head unit (109) is provided above the first movable mounting unit (112) or the second movable mounting unit (113). The movable dust collection unit (123) is provided inside of the outer periphery mounting unit (114) and can move horizontally. This laser processing method involves a first laser processing step, a first step for lowering the second movable mounting unit, a first step for moving the dust collection unit, a first step for raising the first movable mounting unit, and a second laser processing step.
Description
Technical field
The present invention relates to the laser processing device irradiating laser and carrying out and process, particularly relate to the laser processing device and laser processing that carry out through hole processing (through hole processing).
Background technology
In recent years, along with miniaturization, highly integrated, the compound die blocking of parts, become the perforation processing also path of their basic base material, be difficult to realize with existing processing method.In order to solve the problem, increase the perforation processing using laser gradually.Two classes should be roughly divided into the hole machined of machined object: the through hole processing of offering through hole on machined object based on laser; Machined object is offered the blind hole processing of non-through hole.
Figure 26 is the sectional view of the structure of the first case representing existing laser processing device.
As shown in figure 26, machined object 811 is placed in the top of divided mounting portion 812.Divided mounting portion 812 separately can carry out action in the vertical direction, utilizes the lifting drive divisions such as cylinder and carries out knee-action.
Add man-hour in blind hole, mounting portion 812 is in the state that whole adsorption section rises.Further, at the fixing machined object 811 of whole absorption of mounting portion 812, and Laser Processing is carried out to machined object 811.Add man-hour at through hole, as shown in figure 26, under the state that the mounting portion 812 that the bottom only making to process with through hole is suitable declines, Laser Processing is carried out to machined object 811.
As mentioned above, can prevent while the flatness maintaining machined object because through hole adds the laser in man-hour and the damage (for example, referring to patent document 1) of mounting portion 812 that causes.
Figure 27 is the stereogram of the structure of the second case representing existing laser processing device.
As shown in figure 27, chuck 902 utilizes opposed both sides to clamp the machined object 901 of the thin sheet form formed by soft component.Stretching device 903 gives tensile force to the machined object 901 clamped by chuck 902.Utilize chuck 902 and stretching device 903 to keep machined object 901.Mobile device 904 makes machined object 901 move.Dust collect plant 905 is arranged on the rear side in the face irradiated relative to laser of machined object 901 with the size in the whole region throughout multiple machining area.Dust collect plant 905 has the arresting stop 906 that air-flow is stopped in inside.Two holding devices 907 keep opposed limit that is orthogonal with the limit that the tensile force produced by stretching device 903 acts on, machined object 901 respectively.Adjusting device 908 makes a side of holding device 907 move towards the direction at a right angle with tensile force.
As mentioned above, utilize and give tensile force to machined object 901 and keep the stretching device 903 of machined object 901 and holding device 907 to stretch machined object 901 and maintain plane.Machined object 901 maintains plane, and moves to machining area with the state be kept.The back side of the through hole working position of machined object 901 does not contact with mounting portion, and machined object 901 maintains plane and carries out Laser Processing (for example, referring to patent document 2).
At first technical literature
Patent document
Patent document 1: No. 2008/084642nd, International Publication
Patent document 2: Japanese Unexamined Patent Publication 2009-006356 publication
Brief summary of the invention
But there is following problem in above-mentioned prior art.
In recent years, along with more accurate processing and highly integrated, the thickness of the machined object of tabular becomes thinner, and the diameter of the hole machined of enforcement also diminishes gradually.Machined object becomes the metal forming of the resin film of the thickness of such as about 100 μm, the thickness of tens of μm.
In the existing laser processing device of above-mentioned first case, add man-hour at through hole, under the state making the adsorption section suitable with the bottom of the processing of machined object decline, Laser Processing is carried out to machined object.Then, by make air processing part circulation discharge dust.
Therefore, when machined object is the sheet or foil-like that thickness is thin as described above, under the effect of deadweight, the processing part of machined object is sagging and become recess.In addition, produce lax because of the pressure oscillation of air of circulating in the processing part of machined object.Consequently, the flatness of processing part worsens.The deterioration of flatness causes the skew of the focus of laser, the skew of Working position, becomes precision machined obstacle.
When the size of the sheet material of machined object is 512mm × 342mm ~ 512mm × 462mm, the most proximad 560mm × 610mm in sheetization, the problems referred to above become more remarkable.
In addition, the dust carried by air stream moves in the movable area of mounting portion.Therefore, dust is attached to drive division, guide portion for sliding, sometimes also causes mechanical damage.
In addition, in the existing laser processing device of above-mentioned second case, be intended to by the opposed both sides of stretching machined object keep plane.As described above, when machined object is the sheet or foil-like that thickness is thin, stretches and cause the material of machined object to produce extension, thus Working position skew or generation gauffer.The problems referred to above become particularly remarkable in the sheet of machined object.The laser processing device of second case is difficult to carry out accurate processing more than the prior art of first case, and then for the machined object of sheet, can be described as can not carry out precision machined.
Summary of the invention
In order to solve above-mentioned problem, laser processing device of the present invention has workbench, periphery mounting portion, the first movable mounting portion, the movable mounting portion of the second, workpiece press section, processing head, movable collecting unit of dust.Workbench drives along horizontal direction.Periphery mounting portion is located on workbench, and has adsorption hole.The first movable mounting portion and the movable mounting portion of the second are located at inner side on workbench, periphery mounting portion, and can move up and down.Periphery mounting portion is located in workpiece press section.Processing head is located at the top of the first movable mounting portion or the movable mounting portion of the second, carries out Laser Processing.Movable collecting unit of dust is located at the inner side of periphery mounting portion, and can move in the horizontal direction.
In addition, laser processing of the present invention comprises the first mounting operation, the first fixed work order, the first laser machining process, first the second movable mounting portion decline operation, the first collecting unit of dust mobile process, first the first movable mounting portion rising operation, second laser machining process.First mounting operation is the operation loading the first machined object on periphery mounting portion, the movable mounting portion of the second, movable collecting unit of dust.Periphery mounting portion has adsorption hole, and the movable mounting portion of the second is located at the inner side of periphery mounting portion, can move up and down, and have adsorption hole.Movable collecting unit of dust is located at the inner side of periphery mounting portion, and can move in the horizontal direction.First fixed work order is the operation utilizing the workpiece press section being located at periphery mounting portion to press the first machined object.First laser machining process be to the top being positioned at movable collecting unit of dust, the first area of the first machined object carries out the operation of Laser Processing.First the second movable mounting portion decline operation is the operation that the movable mounting portion of the second is moved down.First collecting unit of dust mobile process makes movable collecting unit of dust along the operation of the first horizontal direction movement.First the first movable mounting portion rising operation is the operation that the first movable mounting portion is moved up, and this first movable mounting portion is located at the inner side of periphery mounting portion, can move up and down, and have adsorption hole.Second laser machining process be to the top being positioned at movable collecting unit of dust, the second area of the first machined object carries out the operation of Laser Processing.
Laser processing device of the present invention and laser processing are by being set to said structure, even if when be not held in machined object laser processing area bottom component through hole processing, also can guarantee sufficiently high plane precision, unnecessary vibration can not be produced.Therefore, even the machined object of the very thin sheet of thickness, also the high Laser Processing of precision can be carried out.
Accompanying drawing explanation
Fig. 1 is the stereogram of the Sketch of the laser processing device represented involved by embodiments of the present invention.
Fig. 2 is the partial sectional view observing the laser processing device involved by embodiments of the present invention from X-direction.
Fig. 3 A is the stereogram of the movable collecting unit of dust involved by embodiments of the present invention.
Fig. 3 B is the sectional view of the movable collecting unit of dust involved by embodiments of the present invention.
Fig. 4 is the stereogram of the movable collecting unit of dust drive division involved by embodiments of the present invention.
Fig. 5 is the allocation plan of an example of the setting of the machining area of the machined object represented involved by embodiments of the present invention.
The partial sectional view of state when Fig. 6 is the machined object supply of the laser processing device represented involved by embodiments of the present invention.
Fig. 7 is the partial sectional view of the machined object hold mode of the laser processing device represented involved by embodiments of the present invention.
Fig. 8 is the partial sectional view of the position relationship of the movable collecting unit of dust under Laser Processing SBR represented involved by embodiments of the present invention.
The partial sectional view of the position relationship of movable collecting unit of dust when Fig. 9 is the Laser Processing represented involved by embodiments of the present invention.
The partial sectional view of the position relationship of movable collecting unit of dust when Figure 10 is the Laser Processing of the different machining area represented involved by embodiments of the present invention.
The partial sectional view of the position relationship of movable collecting unit of dust when Figure 11 is the Laser Processing of the machining area of the final row represented involved by embodiments of the present invention.
Figure 12 is the partial sectional view of the position relationship of movable mounting portion after the Laser Processing of the whole machining area represented involved by embodiments of the present invention terminates.
The partial sectional view of state when Figure 13 is the machined object discharge of the laser processing device represented involved by embodiments of the present invention.
Figure 14 be represent involved by embodiments of the present invention processing sequence is set as the supply machined object of rightabout Laser Processing time state, the partial sectional view observed from X-direction.
Figure 15 is the allocation plan processing sequence of the machining area of machined object being set as rightabout example represented involved by embodiments of the present invention.
Figure 16 be represent involved by embodiments of the present invention processing sequence is set as the maintenance machined object of rightabout Laser Processing time the partial sectional view of state.
Figure 17 is the partial sectional view of the position relationship of the movable collecting unit of dust under the SBR that processing sequence is set as rightabout Laser Processing represented involved by embodiments of the present invention.
Figure 18 be represent involved by embodiments of the present invention processing sequence is set as rightabout Laser Processing time the partial sectional view of position relationship of movable collecting unit of dust.
Figure 19 be represent involved by embodiments of the present invention processing sequence is set as the Laser Processing of rightabout different machining area time the partial sectional view of position relationship of movable collecting unit of dust.
Figure 20 be represent involved by embodiments of the present invention processing sequence is set as the Laser Processing of the machining area of rightabout final row time the partial sectional view of position relationship of movable collecting unit of dust.
Figure 21 be represent involved by embodiments of the present invention processing sequence is set as the Laser Processing of rightabout whole machining area terminate after the partial sectional view of position relationship of movable mounting portion.
Figure 22 is the partial sectional view of state of machined object processing sequence being set as rightabout laser processing device representing involved by embodiments of the present invention when discharging.
Figure 23 A is the sectional view of the different structure of the movable collecting unit of dust represented involved by embodiments of the present invention.
Figure 23 B is the sectional view of the different structure of the movable collecting unit of dust represented involved by embodiments of the present invention.
Figure 24 is the figure of the effect of the different structure of the movable collecting unit of dust represented involved by embodiments of the present invention.
Figure 25 A is the figure of the state of the machined object represented when not have fixture sheet material (jig sheet) in the movable collecting unit of dust involved by an example of embodiments of the present invention.
Figure 25 B is the figure of the state of the machined object represented when to have fixture sheet material in the movable collecting unit of dust involved by an example of embodiments of the present invention.
Figure 26 is the sectional view of the structure of the mounting portion of the laser processing device represented involved by prior art.
Figure 27 is the stereogram of the hold mode of the machined object of the laser processing device represented involved by prior art.
Detailed description of the invention
By reference to the accompanying drawings laser processing device of the present invention and laser processing are described.XYZ axle shown in figure is mutually orthogonal separately.XY axle is and horizontal direction suitable all around, and Z axis is and vertical suitable up and down.The reference axis of each figure is described in the mode corresponding with the direction in each visual field.In addition, in all of the figs, identical Reference numeral is marked to identical inscape.
(embodiment)
Fig. 1 is the stereogram of the Sketch of the laser processing device 100 involved by an example representing embodiments of the present invention.In FIG, machined object and fixture sheet material described later is removed for the ease of the structure of visual confirmation device.In addition, in order to detailed structure is described, Fig. 2 is the sectional view observing laser processing device 100 from X-direction.
In Fig. 1 and Fig. 2, laser beam 103 is penetrated by laser oscillator 102, and is directed to the optical system 104 with speculum, lens.Optical system 104 carries out the adjustment of the density (laser path) of laser beam 103, the shaping of shape, the suppression etc. of veiling glare, makes laser beam 103 towards the direction of regulation.
Galvo-scanner 105 is directed to by the laser beam 103 after optical system 104.Laser beam 103 is by the X speculum 106 for carrying out scanning in X-direction with for the laser beam 103 after being reflected by X speculum 106 is carried out the Y speculum 107 that scans and by Scan orientation in Y direction.Then, utilize f θ lens 108 optically focused by the laser beam 103 after Y speculum 107 reflects, and be irradiated to the processing stand of assigned position.
As shown in Figure 2, galvo-scanner 105 and f θ lens 108 are arranged at processing head 109.Galvo-scanner 105 has X speculum 106 and Y speculum 107, reflects and control irradiation position to laser beam 103.The direction that f θ lens 108 make the direction of laser beam 103 become vertical with the face of machined object 111, and carry out optically focused.Processing head 109 is installed on Z slide block (not shown), and processing head 109 is configured on the above-below direction of Z-direction, i.e. Fig. 2 movable.
Mounting keeps the mounting portion of machined object 111 of sheet to comprise periphery mounting portion 114, is provided with multiple movable mounting portions 115, movable collecting unit of dust 123, multiple workpiece press section 121.
The first movable mounting portion 112 that movable mounting portion 115 is divided into action different and the movable mounting portion 113 of the second.In the present embodiment, the movable mounting portion 113 of the second is arranged at the component with larger face carrying out action near mounting portion central authorities.The first movable mounting portion 112 lays respectively at the opposed both sides of the movable mounting portion of the second 113, is to carry out the less component of two of action independently of each other.
Two the first movable mounting portions 112 are supported by a pair movable mounting portion lifting work cylinder 118 respectively with the movable mounting portion 113 of the second.Movable mounting portion lifting work cylinder 118 uses by the cylinder of air-pressure controlling in the present embodiment, and two the first movable mounting portions 112 can be made to be elevated independently with the movable mounting portion 113 of the second.
The first movable mounting portion 112 with the movable mounting portion of the second 113 are respectively equipped with multiple movable mounting portion adsorption hole 116.In addition, periphery adsorption hole 117 is also provided with in periphery mounting portion 114.By carrying out vacuum draw to movable mounting portion adsorption hole 116 and periphery adsorption hole 117, thus machined object 111 is kept by absorption.
Workpiece press section 121 is at least provided with a pair on the both sides parallel with the long side direction of movable mounting portion 115.In the present embodiment, be still provided with a pair on the parallel both sides of the short side direction of movable mounting portion 115, thus be arranged at whole four limits of movable mounting portion 115.The mode that workpiece press section 121 can rotate with the fulcrum by being arranged on the component being located at periphery mounting portion 114 is installed, and drives working cylinder 119 to carry out opening and closing by press section.
Workpiece press section 121 is formed by the metallic object of the more rectangular tabular of the restriction of the size than Z-direction, is provided with clamping component 120 in the face opposed with machined object of workpiece press section 121.Clamping component 120 is formed by the organic matter elastomer as polyurethane rubber, silicon rubber.Thus, damage can not be caused when contacting with machined object produce pressing force, and, the skew caused because of the slip of machined object can be prevented.
Movable collecting unit of dust 123 is can arrange with the mode of contrary side, the i.e. lower side of processing head movement in the horizontal direction relative to machined object.Dust when movable collecting unit of dust 123 is collected and discharges the Laser Processing of machined object 111.
Fig. 3 A is the stereogram of the basic configuration of movable collecting unit of dust 123, and Fig. 3 B is the sectional view of movable collecting unit of dust 123.As shown in figures 3 a and 3b, the section shape of the movable collecting unit of dust 123 roughly ㄩ shape that is the support 302 and air circulation portion 303 with machined object.By being blown into air blast from a side in air circulation portion 303 and attracting (plug-type (push-pull)) to ventilate from the opposing party, thus collect and discharge dust.
Fig. 4 is the partial perspective view of an example of the driving part structure representing movable collecting unit of dust 123.As shown in Figure 4, CD-ROM drive motor 200 is set near mounting portion, utilizes CD-ROM drive motor 200 that driving transfer part 201 i.e. ball-screw is rotated, movable collecting unit of dust 123 can be made thus to slide mobile.
Or, as an example of other structures, also guiding piece and band (not shown) can be set at movable collecting unit of dust 123, the rotation of CD-ROM drive motor 200 be passed to and be with and movable collecting unit of dust 123 is slided movement.
Fixture sheet material 122 is pre-arranged in the position clamped by machined object 111 and mounting portion, is the component of the sheet formed by flame-retardant porous material.Flame-retardant porous material is that the fire retardant such as by phosphorus compound system was carried out the paper pulp fiber of flame treatment as base material, and adds adhesive and be formed as the non-woven fabrics of sheet.
About anti-flammability, identically with common anti-flammability material, the oneself's fire extinguishing property not making burning spread is possessed.In addition, the fire retardant of interpolation is also not limited to phosphorus compound system, can use bromine compounds, chlorine compound or have the phosphate of halogen, or use metal hydroxides etc. as inorganic material.
Base material is not limited to paper pulp fiber, can add above-mentioned anti-flammability, as long as have the Porous for attracting to make gas pass through.Base material preferably has the material of effect of heat insulation as the non-woven fabrics of the organic material such as paper pulp fiber, synthetic resin fiber.
As shown in Figure 2, with can the machine table 130 that arranges of the mode of movement in the horizontal direction by Y platform 131 and these roughly two module compositions of X platform 133.
Y platform 131 is placed with the first movable mounting portion 112, the movable mounting portion of the second 113, periphery mounting portion 114, movable collecting unit of dust 123, workpiece press section 121 and the incidental a whole set of structure of above-mentioned component, is formed in mode movable in the Y direction.By utilizing Y platform drive division 132 to carry out CD-ROM drive motor, make ball-screw rotate thus, the component loaded with the whole series makes Y platform 131 slide accordingly, carries out the movement of Y-direction thus.
X platform 133 is also placed with Y platform 131 and its incidental a whole set of structure, is formed in mode movable in the X direction.By utilizing X platform drive division 134 to carry out CD-ROM drive motor, make ball-screw rotate thus, the component loaded with the whole series makes X platform 133 slide accordingly, carries out the movement of X-direction thus.
It should be noted that, laser processing device 100 has the machining control portion 101 of the control programmably carrying out device.Machining control portion 101 to comprising laser oscillator 102, galvo-scanner 105, X platform drive division 134, Y platform drive division 132, press section drive the air-breathing exhaust of working cylinder 119, movable mounting portion lifting work cylinder 118, other adsorption holes, the action of laser processing device controls.
Fig. 5 is the allocation plan of an example of the setting of the machining area represented in present embodiment.The sweep limits of the galvo-scanner 105 of the irradiation position of locating laser bundle 103 is less than the area of machined object 111 accurately.Therefore, machined object 111 is split into multiple machining area 125 and carries out Laser Processing.In Figure 5, the region of the numbering of 1 ~ 48 is had to be machining area to machined object 111 mark.
Thus, each machining area 125 is set in the sweep limits of galvo-scanner 105, and being located through of the Laser Processing in machining area 125 controls galvo-scanner and carry out.It should be noted that, illustrated region is only an example, is not limited to this figure.
The action of the laser processing device 100 formed as mentioned above is described.
Fig. 6 be represent the state of mounting portion when carrying machined object 111 and movable collecting unit of dust 123, the partial sectional view observed from X-direction.
When machined object 111 is equipped on device, by making machine table 130 move, mounting portion is made to move to the loading position of machined object 111.At this, stop the vacuum draw of movable mounting portion adsorption hole 116 and periphery adsorption hole 117 and be in the state of not adsorbing.In addition, movable collecting unit of dust 123 also stops the air stream being used for control of dust.Fixture sheet material 122 is pre-set at assigned position.
Make movable collecting unit of dust 123 be positioned at the end of a side of machining area, make the first the movable mounting portion 112b beyond the first the movable mounting portion 112a of the position being positioned at movable collecting unit of dust 123, the movable mounting portion 113 of the second rises in advance.In addition, workpiece press section 121 drives working cylinder 119 by press section and is in the state opened.
As shown in Figure 7, after machined object 111 being carried on the fixture sheet material 122 in mounting portion (the first mounting operation), movable mounting portion adsorption hole 116 and periphery adsorption hole 117 are carried out to vacuum draw and start the lower surface of machined object 111 and fixture sheet material 122 to adsorb maintenance in the lump.Then, utilize press section to drive working cylinder 119, workpiece press section 121 is urged to closed condition (the first fixed work order) from open mode.
As shown in Figure 7, machined object 111 and fixture sheet material 122 remain on the periphery mounting portion 114 being formed with adsorption hole, the first the movable mounting portion 112b being formed with adsorption hole and the movable mounting portion of the second 113 and movable collecting unit of dust 123 in the lump.Periphery and the fixture sheet material 122 of machined object 111 are pressed by workpiece press section 121 accordingly.Be provided with clamping component 120 in the part connected with machined object 111 of workpiece press section 121, produce pressing force to machined object 111, and the skew preventing the slip of machined object 111 and cause.Thus, utilize periphery mounting portion 114 and workpiece press section 121 to keep the plane of machined object 111.
Following action is carried out after the maintenance of machined object 111 terminates.
Stop the attraction of the movable mounting portion adsorption hole 116 based on the first movable mounting portion 112b and the movable mounting portion of the second 113, and the absorption discharging this region is fixed.After liberation absorption is fixing, the first movable mounting portion 112b of rising and the movable mounting portion of the second 113 is made to drop to the position (first the second movable mounting portion decline operation) of regulation.Fig. 8 illustrates this state.
After having carried out above-mentioned action, or with above-mentioned action concurrently, start the movement of machine table to make the mounting portion of maintenance machined object 111 move to the first machining area (first area).The processing head 109 being positioned at origin position carries out the moving and enter the SBR of Laser Processing of focal position to the processing being most suitable for machined object 111.
Now, movable collecting unit of dust 123 is positioned at the lower surface of the row comprising the first machining area.From side's air supply in the space of the ㄩ shape of movable collecting unit of dust 123, discharge air from the opposing party.The air stream that making like this is plug-type, can control as not to the pressure that the flatness of machined object 111 impacts thus, and, owing to obtaining stable laminar flow, machined object therefore also can not be made to vibrate.
After the first machining area 125 of above-mentioned release, machined object 111 arrives the position residing for processing head 109, laser beam 103 is utilized to start the hole machined (the first laser machining process) of the first machining area 125.
Fig. 9 observes from X-direction the partial sectional view the first machining area 125 being carried out to the state of laser hole processing.In the position corresponding with machining area, there is movable collecting unit of dust 123, illuminating laser beam 103 under the state that the movable mounting portion 113 of the first movable mounting portion 112a, 112b and the second all declines and carry out hole machined.The periphery of machined object 111 is kept by absorption by the periphery adsorption hole 117 being located at periphery mounting portion 114, and the workpiece press section 121 being provided with clamping component 120 presses.Thus, can prevent the flexure of machined object and position from offseting.
Although hole machined arrives fixture sheet material 122, owing to being formed by the material of anti-flammability, even if therefore generation being charred slightly, but do not produce on fire, damaged yet.
In addition, in movable collecting unit of dust 123, manufacture air stream by air circulation portion 303, air is externally discharged.Therefore, the dust produced at the lower surface of machined object 111 or the lower surface of fixture sheet material 122 is discharged by air stream efficiently.
Terminating in the irradiation of laser beam of regulation, after whole hole machined in the first machining area 125 terminates, in order to move to next shown in Fig. 5 second machining area 125, machine table in the present embodiment X-direction being moved.About the state of the laser hole processing in the second machining area 125, also as shown in Figure 9.Thus, before end is to the Laser Processing of whole machining areas (first in Fig. 5 ~ the 8th machining area) of the row residing for movable collecting unit of dust 123, identical action is repeated.
After the Laser Processing of the Zone Full of end one row, start following action.
First, in order to the machining area making the mounting portion being equipped with machined object move to next column, start the movement of machine table to Y-direction.Meanwhile, movable collecting unit of dust 123 also carries out moving (the first collecting unit of dust mobile process).The movable mounting portion 113 of the first movable mounting portion 112a, 112b and the second keeps the state declined.Figure 10 illustrates the state after moving.
With machined object 111 for benchmark, movable collecting unit of dust 123 moves to the position corresponding with the machining area of next column (the 9th machining area in Fig. 5), namely left direction (the first horizontal direction) is mobile, if but be benchmark with processing head, be then positioned at roughly the same position as illustrated.
As mentioned above, after the processing in the machining area (second area) of these row is ready to complete, controls galvo-scanner 105, and hole machined position is started to the irradiation of laser beam 103.
Figure 10 is the partial sectional view observing the state of machining area being carried out to laser hole processing from X-direction.Illuminating laser beam 103 under the state that movable collecting unit of dust 123 is positioned at the position corresponding with machining area and carry out hole machined.Movable collecting unit of dust 123 manufactures the side's air supply from the space of ㄩ shape and discharges the plug-type air stream of air from the opposing party.
When terminating the Laser Processing to whole machining areas (the 9th ~ the 16 machining area in Fig. 5) of the row residing for movable collecting unit of dust 123, similarly move to next machining area.Then, repeat above-mentioned action and sequentially machining area processed according to the rules.
Figure 11 illustrates the state of the Working position of the row (in Fig. 5 the 41 ~ the 48 machining area) moving to the last machining area of machined object 111 after processing machining area successively.
At this, in the same manner, movable collecting unit of dust 123 is positioned at the position corresponding with machining area, manufacture have side's air supply in the space from ㄩ shape, the state of plug-type air stream of discharging air from the opposing party, illuminating laser beam 103 and carry out hole machined.
Terminating in the irradiation of laser beam of regulation, after whole hole machined in the initial machining area (the 41 machining area) of these row terminates, in order to move to next machining area, machine table in the present embodiment X-direction being moved.Then the Laser Processing specified similarly is carried out.Thus, before terminating the Laser Processing of whole machining areas (in Fig. 5 the 41 ~ the 48 machining area) of the row residing for movable collecting unit of dust 123, identical action is repeated.So, carry out the processing of the machining area of last row, thus terminate the processing of whole of machined object 111.
After the process finishing of whole of machined object 111, start following action.
First, the movement of machine table is started in order to the movement started to machined object extracting position.Start the movement to initial point of processing head 109.
As shown in figure 12, movable collecting unit of dust 123 is positioned at the end of opposition side when processing starts.The first movable mounting portion 112a except the first movable mounting portion 112b of the part residing for movable collecting unit of dust 123, the movable mounting portion of the second 113 rise (first the first movable mounting portion rising operation).After rising terminates to being located at the first movable mounting portion 112a, the movable mounting portion adsorption hole 116 of the movable mounting portion of the second 113 carries out vacuum draw, thus absorption keeps machined object 111 and fixture sheet material 122 again.Above-mentioned action walks abreast.
After above-mentioned whole releases, machine table move to machined object extracting position, as shown in figure 13, make press section drive working cylinder 119 action, make workpiece press section 121 become the state opened.Then, whole movable mounting portion adsorption holes 116 and the vacuum draw of whole periphery adsorption holes 117 is stopped.Then, confirm that machined object 111 is not kept by absorption, machined object withdrawing device (not shown) takes out machined object 111 from mounting portion, thus terminates the laser hole processing of machined object.Above the first movable mounting portion 112a, the movable mounting portion of the second 113 and movable collecting unit of dust 123, remain fixture sheet material 122, use in the processing of upper once machined object.
As mentioned above, in laser processing device of the present invention, the movable collecting unit of dust 123 forming stable air stream is positioned at the bottom of the machining area carrying out Laser Processing all the time as lower movable mounting portion.Movable collecting unit of dust 123 is collected and is discharged the dust produced because of processing.Thus, realize high efficiency control of dust, prevent dust to be attached to the movable part of device in addition.
In addition, carry out by the absorption of the machined object 111 based on periphery mounting portion 114 and the fixing of workpiece press section 121 maintenance bending few machined object.Further, the support 302 of the machined object of movable collecting unit of dust 123 is all the time from the machining area that lower support one arranges.Therefore, even machined object that the is large stretch of and sheet that thickness is very thin, also can carry out bending considerably less high-precision Laser Processing.
Then, the action carrying out the situation of above-mentioned a series of Laser Processing to again carrying machined object 111 from the state of having discharged machined object 111 shown in Figure 13 is described.In this case, also the order of the processing of the machining area of machined object 111 can be set as rightabout.
Partial sectional view that Figure 14 is state when representing the supply machined object processing sequence of the Laser Processing based on laser processing device of the present invention be set as in rightabout situation, that observe from X-direction.
When machined object 111 is equipped on device, till machine table 130 moves to the loading position of machined object 111.Stop the vacuum draw of movable mounting portion adsorption hole 116 and periphery adsorption hole 117 and be pre-formed the state of not adsorbing.In addition, movable collecting unit of dust 123 also stops the air stream being used for control of dust.Fixture sheet material 122 is pre-set at assigned position.
Movable collecting unit of dust 123 is positioned at the end of a side of machining area, and the movable mounting portion 113 of the first the movable mounting portion 112a except the first the movable mounting portion 112b residing for movable collecting unit of dust 123, the second rises.In addition, workpiece press section 121 drives working cylinder 119 by press section and is in open mode.
The state of the structure during supply of the machined object 111 shown in Figure 14 is positioned in this point of opposition side different from the state shown in described Fig. 6 in the position of movable collecting unit of dust 123.Be accompanied by this, also become different with the state shown in described Fig. 6 in contrary this point at the first movable mounting portion 112a from the first movable mounting portion 112b upper-lower position separately.
The speciality of setting said apparatus action is, comprise the position relationship of movable collecting unit of dust 123 and the first movable mounting portion 112a, 112b, the position relationship of the structure during supply of the position relationship of structure of being correlated with of the machine table during discharge of the machined object 111 shown in Figure 13 with the machined object 111 shown in Figure 14 is identical.Thus, after discharging machined object, only make the machine table mobile supply preparation that just promptly can realize machined object 111 in the X-axis direction.
Figure 15 is the allocation plan processing sequence of machining area being set as rightabout machined object.The order of processing and the machining area of Fig. 5 are Mirror Symmetry relative to Y-axis.
As shown in figure 16, after machined object 111 (the second machined object) being equipped on the fixture sheet material 122 in mounting portion (the second mounting operation), vacuum draw is carried out to movable mounting portion adsorption hole 116 and periphery adsorption hole 117, starts the lower surface of machined object 111 and fixture sheet material 122 to adsorb maintenance in the lump.Then, press section is utilized to drive working cylinder 119, by workpiece press section 121 from the state-driven opened to the state (the second fixed work order) of closing.
As shown in figure 16, machined object 111 and fixture sheet material 122 remain on the periphery mounting portion 114 being formed with adsorption hole, the first the movable mounting portion 112a multiple being formed with adsorption hole and the movable mounting portion of the second 113 and movable collecting unit of dust 123 in the lump.Periphery and the fixture sheet material 122 of machined object 111 are pressed by workpiece press section 121 accordingly.Be provided with clamping component 120 in the part connected with machined object 111 of workpiece press section 121, produce pressing force to machined object 111, and the skew preventing the slip of machined object 111 and cause.Thus, utilize periphery mounting portion 114 and workpiece press section 121 to keep the plane of machined object 111.
The action illustrated in above action and Fig. 7 does not change especially
Following action is carried out after the maintenance of machined object 111 terminates.
Stop the attraction of the movable mounting portion adsorption hole 116 based on the first movable mounting portion 112a and the movable mounting portion of the second 113, the absorption discharging this region is fixed.After liberation absorption is fixing, the first movable mounting portion 112a of rising and the movable mounting portion of the second 113 is made to drop to the position (the movable mounting portion manufacturing procedure of second the second) of regulation.Figure 17 illustrates this state.
After having carried out above-mentioned action, or with above-mentioned action concurrently, start the movement of machine table to make the mounting portion maintaining machined object 111 move to the first machining area.The processing head 109 being positioned at origin position carries out the moving and enter the SBR of Laser Processing of focal position to the processing being most suitable for machined object 111.
Above action is substantially identical with the action illustrated in Fig. 8, but due to the first machining area be Mirror Symmetry relative to Y-axis, therefore the amount of movement of Y direction is different.
Now, movable collecting unit of dust 123 is positioned at the lower surface of the row comprising the first machining area.From side's air supply in the space of the ㄩ shape of movable collecting unit of dust 123, discharge air from the opposing party.The air stream that manufacture like this is plug-type, can control as not to the pressure that the flatness of machined object 111 impacts thus, and, due to can stable laminar flow be obtained, machined object therefore also can not be made to vibrate.
After the first machining area 125 of above-mentioned release, machined object 111 arrives the position residing for processing head 109, laser beam 103 is utilized to start the hole machined of the first machining area 125.
Figure 18 observes from X-direction the partial sectional view the first machining area 125 (the 3rd region) being carried out to the state of laser hole processing (the 3rd laser machining process).In the position corresponding with machining area, there is movable collecting unit of dust 123, illuminating laser beam 103 under the state that the movable mounting portion 113 of the first movable mounting portion 112a, 112b and the second all declines and carry out hole machined.The periphery of machined object 111 is kept by absorption by the periphery adsorption hole 117 being located at periphery mounting portion 114, and the workpiece press section 121 being provided with clamping component 120 presses.Thus, can prevent the flexure of machined object and position from offseting.
As described above, in movable collecting unit of dust 123, manufacture air stream by air circulation portion 303, air is externally discharged.Therefore, the dust produced at the lower surface of machined object 111 or the lower surface of fixture sheet material 122 is discharged by air stream efficiently.
Terminating in the irradiation of laser beam of regulation, after whole hole machined in the first machining area 125 terminates, in order to move to the second machining area 125, machine table in the present embodiment X-direction being moved.About the state of the laser hole processing in the second machining area 125, as shown in Figure 18.So, before terminating the Laser Processing of whole machining areas (first in Figure 15 ~ the 8th machining area) of the row residing for movable collecting unit of dust 123, identical action is repeated.
After the Laser Processing of the Zone Full of end one row, start following action.
First, in order to the machining area making the mounting portion being equipped with machined object move to next column, start the movement of machine table to Y-direction.Meanwhile, movable collecting unit of dust 123 also carries out moving (the second collecting unit of dust mobile process).The movable mounting portion 113 of the first movable mounting portion 112a, 112b and the second keeps the state declined.Figure 19 illustrates the state after moving.
With machined object 111 for benchmark, movable collecting unit of dust 123 moves to the position corresponding with the machining area of next column (the 9th machining area in Figure 15), namely right direction (the second horizontal direction) is mobile, if but be benchmark with processing head, be then positioned at roughly the same position as illustrated.
As mentioned above, after the processing in the machining area (the 4th region) of these row is ready to complete, controls galvo-scanner 105, start the irradiation (the 4th laser machining process) of the laser beam 103 to hole machined position.
Figure 19 is the partial sectional view observing the state of machining area being carried out to laser hole processing from X-direction.Illuminating laser beam 103 under the state that movable collecting unit of dust 123 is positioned at the position corresponding with machining area and carry out hole machined.Movable collecting unit of dust 123 manufactures the side's air supply from the space of ㄩ shape and discharges the plug-type air stream of air from the opposing party.
When terminating the Laser Processing to whole machining areas (the 9th ~ the 16 machining area in Figure 15) of the row residing for movable collecting unit of dust 123, similarly move to next machining area.Then, repeat above-mentioned action and sequentially machining area processed according to the rules.
Figure 20 illustrates the state of the Working position of the row (in Figure 15 the 41 ~ the 48 machining area) moving to the last machining area of machined object 111 after processing machining area successively.
At this, in the same manner, movable collecting unit of dust 123 is positioned at the position corresponding with machining area, manufacture have side's air supply in the space from ㄩ shape, the state of plug-type air stream of discharging air from the opposing party, illuminating laser beam 103 and carry out hole machined.
Terminating in the irradiation of laser beam of regulation, after whole hole machined in the initial machining area (the 41 machining area) of these row terminates, in order to move to next machining area, machine table in the present embodiment X-direction being moved.Then the Laser Processing specified similarly is carried out.So, before terminating the Laser Processing of whole machining areas (the 41 ~ the 48 machining area in Figure 15) of the row residing for movable collecting unit of dust 123, identical action is repeated.So, carry out the processing of the machining area of last row, thus terminate to be added the processing of whole of two thing 111.
After the process finishing of whole of machined object 111, start following action.
First, the movement of machine table is started in order to the movement started to machined object extracting position.Start the movement to initial point of processing head 109.
As shown in figure 21, movable collecting unit of dust 123 is positioned at the end of the opposition side of (Figure 18) when processing starts.The first movable mounting portion 112b except the first movable mounting portion 112a of the part residing for movable collecting unit of dust 123, the movable mounting portion of the second 113 rise (second the first movable mounting portion rising operation).After rising terminates to being located at the first movable mounting portion 112b, the movable mounting portion adsorption hole 116 of the movable mounting portion of the second 113 carries out vacuum draw, thus absorption keeps machined object 111 and fixture sheet material 122 again.Above-mentioned action walks abreast.
Now, the machining area of last row is positioned at different positions in the X-axis direction, and therefore the amount of movement of X-direction is different from the situation of the processing sequence of the machining area of Fig. 5.
After above-mentioned whole releases, machine table move to machined object extracting position, as shown in figure 22, make press section drive working cylinder 119 action, make workpiece press section 121 become the state opened.Then, whole movable mounting portion adsorption holes 116 and the vacuum draw of whole periphery adsorption holes 117 is stopped.Then, confirm that machined object 111 is not kept by absorption, machined object withdrawing device (not shown) takes out machined object 111 from mounting portion, thus terminates the laser hole processing of machined object.
Comprise the position relationship of movable collecting unit of dust 123 and the first movable mounting portion 112a, 112b, the position relationship of the structure that the machine table during supply of the position relationship of structure during the discharge of the machined object 111 shown in Figure 22 with the machined object 111 shown in Fig. 6 is correlated with is identical.Therefore, machine table is only made after machined object to move and the supply that the supply position moving to machined object 111 just promptly can realize machined object 111 prepares in X-direction discharging.After, as long as alternately repeat the processing sequence of Fig. 5 and the processing sequence of Figure 15, even if then carry out the processing of multi-disc machined object, also the loss of productive temp can be suppressed for minimum, thus realize high efficiency processing.
As mentioned above, even if make the processing sequence of machining area back and forth process, also with identically above-mentioned, the movable collecting unit of dust 123 forming stable air stream is positioned at the bottom of the machining area carrying out Laser Processing all the time as lower movable mounting portion.Movable collecting unit of dust 123 is collected and is discharged the dust produced because of processing.Thus, realize high efficiency control of dust, prevent dust to be attached to the movable part of device in addition.
In addition, fixedly the maintenance bending few machined object is carried out by the absorption of the machined object 111 based on periphery mounting portion 114 and workpiece press section 121.Further, the support 302 of the machined object of movable collecting unit of dust 123 is all the time from the machining area that lower support one arranges.Therefore, even machined object that the is large stretch of and sheet that thickness is very thin, also can carry out bending considerably less high-precision Laser Processing.
Then, as an example of the preferred mode of the present invention, the example of Figure 23 A and Figure 23 B to the different structure of movable collecting unit of dust 123 is used to be described.
As shown in fig. 23 a, in the structure that these are different, support is configured to the support bar 301 of the component separated with the component of ㄩ shape.Thereby, it is possible to make the precision at the position connected with machined object 111, fixture sheet material 122 very high.Relative to the situation of stamping parts directly using ㄩ shape, the flatness that support is more easily obtains high accuracy when being formed as the component separated.Such as, in the present embodiment, even if the length of support bar 301 is more than 500mm, also flatness can be suppressed below 50 μm.
In addition, support bar 301 is configured to example movable up and down by Figure 23 B.Figure 24 illustrates the action of the support bar 301 so formed.When movable collecting unit of dust 123 is positioned near the central authorities that do not interfere with periphery mounting portion 114, pair of support parts bar 301 is close to the two sides state outstanding towards top and fixture sheet material 122.Thereby, it is possible to maintain the flatness of the machining area of machined object 111, and stable control of dust and discharge can be realized when air stream is not revealed.When processing the machining area near periphery, only a side of support bar 301 is accommodated in the main body side of ㄩ shape, thus can prevent the interference with periphery mounting portion 114.This state left and right is in the drawings illustrated by dotted line.Thereby, it is possible to contribute to the region that cannot process of doing one's utmost the periphery of reducing machined object 111.It should be noted that, the knee-action of support bar 301 carries out according to the relation between periphery mounting portion 114, as long as therefore arrange suitable guiding piece and lobe plate (not shown) then can realize.
It should be noted that, in the present embodiment, the situation of carrying out Laser Processing to pre-setting fixture sheet material 122 is illustrated.But, even if do not use fixture sheet material 122, also can utilize the absorption of the machined object 111 based on periphery mounting portion 114, workpiece press section 121 fixing, based on the bottom of the machined object of movable collecting unit of dust 123 supporting and maintain plane accurately.In addition, the dust of the lower side of machined object 111 can also be discharged efficiently.
But by carrying out the maintenance of machined object 111 in the lump with fixture sheet material 122, the integral rigidity of plane improves.In addition, the support of movable collecting unit of dust 123 is all the time from the machining area that lower support one arranges.Therefore, even machined object that the is large stretch of and sheet that thickness is very thin, also can carry out bending considerably less high-precision Laser Processing.Figure 25 A is the state of the machined object 111 when not having fixture sheet material 122.Figure 25 B is the state of the machined object 111 when having fixture sheet material 122.Figure 25 A and Figure 25 B emphasizes the state of machined object 111 qualitatively.
In addition, when movable collecting unit of dust 123 moves to the machining area of next column, when pre-setting fixture sheet material 122, the back side of protection machined object 111.Therefore, it is possible to eliminate the abrasive tiny probability of the machined object 111 that generation causes because of movable collecting unit of dust 123.
In addition, in the present embodiment, show following example: the movable mounting portion of the second 113 to be formed as being arranged near mounting portion central authorities and to carry out the component with larger face of action, two the first movable mounting portions 112 are positioned at the opposed both sides of the movable mounting portion of the second 113 and be configured to can the primary structural component of action independently.As described above, the first movable mounting portion 112 is movable mounting portions of part corresponding with the position of movable collecting unit of dust movable mounting portion rises when carrying machined object.In the present embodiment, following example is shown: observe from X-axis, movable collecting unit of dust is positioned at two places, left and right, and therefore the first movable mounting portion 112 is arranged at opposed both sides.
Certainly, also movable collecting unit of dust can be made to be positioned at different positions according to the control sequence of Laser Processing, as long as split movable mounting portion in position correspondingly, then it is the first movable mounting portion.
In addition, the movable mounting portion of the second be called not with the movable mounting portion of the position of the location conflicts of movable collecting unit of dust.As in the present embodiment, movable for the second mounting portion can be formed as having the component in a larger face, also can split and form multiple movable mounting portion, being not limited to size, number.
In addition, in the present embodiment, the quantity of machining area etc. illustrate concrete numerical value in order to illustrated convenience.But these concrete numerical value determine according to Design Designations such as the size of machined object, the sizes of device, are not limited to this example.
Utilizability in industry
Laser processing device involved in the present invention can prevent the damage of mounting portion in based on the hole machined of laser, and keeps the flatness of machined object and realize high manufacturing accuracy.In addition, the dust produced when Laser Processing also can be collected efficiently and discharge, and dust can also be prevented to be attached to the movable part of device.Therefore, be useful in laser processing device carrying out through hole processing etc.
Symbol description
100 laser processing devices
101 machining control portions
102 laser oscillators
103 laser beams
104 optical systems
105 galvo-scanner
106X speculum
107Y speculum
108 f θ lens
109 processing heads
111,811,901 machined objects
112, the first movable mounting portion of 112a, 112b
The movable mounting portion of 113 the second
114 periphery mounting portions
115 movable mounting portions
116 movable mounting portion adsorption holes
117 periphery adsorption holes
118 movable mounting portion lifting work cylinders
119 press sections drive working cylinder
120 clamping components
121 workpiece press sections
122 fixture sheet materials
123 movable collecting unit of dust
125 machining areas
130 machine table
131 Y platforms
132 Y platform drive divisions
133 X platforms
134 X platform drive divisions
200 CD-ROM drive motors
201 drive transfer part
301 support bars
302 supports
303 air circulation portions
Claims (11)
1. a laser processing device, wherein, possesses:
Workbench, it drives along horizontal direction;
Periphery mounting portion, it is located on described workbench, and has adsorption hole;
The first movable mounting portion, it to be located on described workbench and to be positioned at the inner side of described periphery mounting portion, can move up and down, and have adsorption hole;
The movable mounting portion of the second, it to be located on described workbench and to be positioned at the inner side of described periphery mounting portion, can move up and down, and have adsorption hole;
Workpiece press section, it is located in the mounting portion of described periphery;
Processing head, it is located at the top of the first movable mounting portion described or the movable mounting portion of described the second, carries out Laser Processing;
Movable collecting unit of dust, it is located at the inner side of described periphery mounting portion, can move in the horizontal direction.
2. laser processing device according to claim 1, wherein,
The section shape of described movable collecting unit of dust is the roughly ㄩ shape of upper opening.
3. laser processing device according to claim 2, wherein,
It is the support bar of different components that described movable collecting unit of dust also possesses from the part of described ㄩ shape.
4. laser processing device according to claim 3, wherein,
Described support bar can move in the vertical direction.
5. laser processing device according to claim 1, wherein,
The first movable mounting portion described is located in the mode corresponding with the position of described movable collecting unit of dust.
6. laser processing device according to claim 5, wherein,
The first movable mounting portion described has multiple,
Locate in the mode clipping the movable mounting portion of described the second at least two in the first movable mounting portion described.
7. laser processing device according to claim 1, wherein,
Whole four limits of described periphery mounting portion are located in described workpiece press section.
8. laser processing device according to any one of claim 1 to 7, wherein,
The sheet material formed by flame-retardant porous material is also possessed on the first movable mounting portion described and the movable mounting portion of described the second.
9. laser processing device according to claim 8, wherein,
Described sheet material is to be added with the non-woven fabrics of the fiber of the organic matter of fire retardant for base material.
10. a laser processing, wherein, possesses:
First mounting operation, in this first mounting operation, the first machined object is loaded on periphery mounting portion, the movable mounting portion of the second, movable collecting unit of dust, described periphery mounting portion has adsorption hole, the movable mounting portion of described the second is located at the inner side of described periphery mounting portion, can move up and down, and have adsorption hole, described movable collecting unit of dust is located at the inner side of described periphery mounting portion, and can move in the horizontal direction;
First fixed work order, in this first fixed work order, utilizes the workpiece press section be located in the mounting portion of described periphery to press described first machined object;
First laser machining process, in this first laser machining process, to be positioned at described movable collecting unit of dust top, the first area of described first machined object carries out Laser Processing;
First the second movable mounting portion decline operation, in this first the second movable mounting portion decline operation, makes the movable mounting portion of described the second move down;
First collecting unit of dust mobile process, in this first collecting unit of dust mobile process, makes described movable collecting unit of dust move along the first horizontal direction;
First the first movable mounting portion rising operation, in this first the first movable mounting portion rising operation, the first movable mounting portion is moved up, and the first movable mounting portion described is located at the inner side of described periphery mounting portion, can move up and down, and there is adsorption hole;
Second laser machining process, in this second laser machining process, to be positioned at described movable collecting unit of dust top, the second area of described first machined object carries out Laser Processing.
11. laser processings according to claim 10, wherein,
After Laser Processing has been carried out to described first machined object, possess:
Second mounting operation, in this second mounting operation, loads the second machined object on described periphery mounting portion, the movable mounting portion of described the second, described movable collecting unit of dust;
Second fixed work order, in this second fixed work order, utilizes the workpiece press section being located at described periphery mounting portion to press described second machined object;
3rd laser machining process, in the 3rd laser machining process, to be positioned at described movable collecting unit of dust top, the 3rd region of described second machined object carries out Laser Processing;
Second the second movable mounting portion decline operation, in this second the second movable mounting portion decline operation, makes the movable mounting portion of described the second move down;
Second collecting unit of dust mobile process, in this second collecting unit of dust mobile process, makes described movable collecting unit of dust move along the second horizontal direction;
Second the first movable mounting portion rising operation, in this second the first movable mounting portion rising operation, the first movable mounting portion is moved up, and the first movable mounting portion described is located at the inner side of described periphery mounting portion, can move up and down, and there is adsorption hole;
4th laser machining process, in the 4th laser machining process, to be positioned at described movable collecting unit of dust top, the 4th region of described second machined object carries out Laser Processing,
Described first horizontal direction is contrary with described second horizontal direction.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-059773 | 2012-03-16 | ||
| JP2012059773 | 2012-03-16 | ||
| PCT/JP2013/001193 WO2013136695A1 (en) | 2012-03-16 | 2013-02-28 | Laser processing device and laser processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103492118A CN103492118A (en) | 2014-01-01 |
| CN103492118B true CN103492118B (en) | 2015-01-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380001036.5A Active CN103492118B (en) | 2012-03-16 | 2013-02-28 | Laser processing device and laser processing method |
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| Country | Link |
|---|---|
| JP (1) | JP5370622B1 (en) |
| CN (1) | CN103492118B (en) |
| TW (1) | TW201343299A (en) |
| WO (1) | WO2013136695A1 (en) |
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| JP6223506B1 (en) * | 2016-06-13 | 2017-11-01 | 日新製鋼株式会社 | Vacuum insulation panel manufacturing equipment |
| JP2019147166A (en) * | 2018-02-27 | 2019-09-05 | 株式会社リコー | Optical processing apparatus and production method for optical work piece |
| CN108436291A (en) * | 2018-03-05 | 2018-08-24 | 深圳吉阳智能科技有限公司 | A kind of dust-extraction unit and method of laser cutting device |
| CN108453398B (en) * | 2018-03-19 | 2023-11-14 | 广州新可激光设备有限公司 | Carrier plate structure of planar marking material, laser equipment and use method thereof |
| DE102019103361A1 (en) * | 2019-02-11 | 2020-08-13 | Theodor Gräbener GmbH & Co. KG | Device and method for producing laser-welded metal sheets, in particular for clocking through such metal sheets and using the device and the method |
| US11351636B2 (en) * | 2019-10-23 | 2022-06-07 | Banyan Imports Corporation | Laser engraving machine |
| CN111185673A (en) * | 2020-01-16 | 2020-05-22 | 济南金威刻科技发展有限公司 | Carving and cutting integrated forming machine |
| CN116851936A (en) * | 2023-08-09 | 2023-10-10 | 合肥市强联磁电科技有限公司 | High-precision cutting device for Ru-Fe-B magnet production and processing and use method |
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- 2013-02-28 CN CN201380001036.5A patent/CN103492118B/en active Active
- 2013-02-28 WO PCT/JP2013/001193 patent/WO2013136695A1/en active Application Filing
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| CN101687281A (en) * | 2007-06-28 | 2010-03-31 | 松下电器产业株式会社 | Laser processing apparatus |
| CN102091869A (en) * | 2009-12-11 | 2011-06-15 | 株式会社迪思科 | Laser processing device |
| CN102294544A (en) * | 2010-06-23 | 2011-12-28 | M&C股份有限公司 | Dedusting suction device and laser machine possessing same |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013136695A1 (en) | 2013-09-19 |
| JP5370622B1 (en) | 2013-12-18 |
| JPWO2013136695A1 (en) | 2015-08-03 |
| TW201343299A (en) | 2013-11-01 |
| CN103492118A (en) | 2014-01-01 |
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