JP2011067848A - Implement and apparatus for laser beam machining - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an implement for laser beam machining allowing holes to be formed in a workpiece by laser beam machining having excellent positional accuracy. <P>SOLUTION: The implement 10 for laser beam machining comprises a holding plate 1 on which holds a workpiece 5 with the holes 5a to be formed by the laser beam L, in a state wherein the workpiece 5 is placed on the holding plate, a frame-shaped support 2 for supporting the holding plate 1 at the upper part of the support 2, a plate-like base body 3 which is arranged beneath the support 2 and forms a space in the inner side together with the holding plate 1 and the support 2, and a laser beam absorber 4 arranged on a part immediately below through-holes 1a above the base body 3. The base body 3 has base body side suction holes 3a located around the laser beam absorber 4. The laser beam absorber 4 and the base body 3 are air-cooled by the flow of air to be sucked through the base body side suction holes 3a, suppress thermal expansion of the holding plate 1 and elongation of the workpiece 5. Thus, the positional accuracy of the holes 5a formed in the workpiece 5 becomes excellent and highly precise. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention is used in, for example, a manufacturing process of a ceramic multilayer wiring board or an organic build-up board, or a manufacturing process of an electronic component such as a multilayer capacitor, and uses a laser beam on a workpiece to be an insulating layer such as a ceramic green sheet. The present invention relates to a laser processing jig for processing a through hole for establishing conduction between layers, and a laser processing apparatus using the same.

  In recent years, along with the miniaturization of patterns formed on semiconductor elements or the narrowing of the pitch of electrodes, miniaturization of wiring conductors and through conductors have also been applied to ceramic multilayer wiring boards or organic build-up boards for mounting the semiconductor elements. In addition, a narrow pitch of electrode pads has been demanded.

  As a method of forming a through conductor in an insulating layer of a ceramic multilayer wiring board, conventionally, a processing method called a hard processing, in which a mold is pressed against a ceramic green sheet as a workpiece, a through hole is mainly used. I came. However, in this hard processing, since the unit price of a mold having a fine structure is increasing, and it is necessary to prepare a mold every time the size and arrangement of the through holes are changed, in recent years, laser light or the like is used. Soft processing, which is the processing method used, has attracted attention. Among the soft processing, laser processing changes the shape and dimensional accuracy of the through-hole formed in the workpiece depending on the structure, shape, material and size of the lower jig for holding the workpiece in a predetermined position. Therefore, various structures have been proposed for the lower jig.

  For example, the example of the laser processing apparatus disclosed by patent document 1 is shown with a longitudinal cross-sectional view in FIG. In the example shown in FIG. 4, 101 indicates a processed member, 101a indicates an opening, 102 indicates a space, 103 indicates an absorption layer, 104 indicates a processing table, and L indicates laser light (represented by a white arrow). In this example, an absorption layer 103 that absorbs the laser light L that has passed through the opening 101 a of the processing member 101 is provided in the space 102 of the processing table 104. According to this, it is possible to provide a laser processing apparatus capable of realizing processing with good parallelism and penetrability with high accuracy.

  Moreover, the example of the laser processing apparatus disclosed by patent document 2 is shown with a longitudinal cross-sectional view in FIG. In FIG. 5, 201 is a suction plate, 202 is a holding base, 203 is a workpiece, L is a laser beam (represented by a white arrow), 205 is a through-hole directly under the laser processing portion, and 206 is a through-hole other than the laser processing portion. Hole, 207 is a carrier film, 209 is an upper surface of the suction plate, 210a and 210b are suction portions, 211 is an upper surface of the suction holes of the holding table 202, 212 is a laser processing portion, 213 is irradiated with laser light L just below the laser processing portion The portion of the through-hole not to be shown is shown. This example is a laser processing apparatus that includes a suction plate 201 on which a workpiece 203 is placed and a holding base 202 that holds the suction plate 201 and performs processing by irradiating the workpiece 203 with laser light L. In addition, through holes 205 are provided in a plurality of portions of the suction plate 201 corresponding to the portion immediately below the workpiece 203 irradiated with the laser light L, and through holes 206 are formed in a plurality of portions of the suction plate 201 not irradiated with the laser light L. The suction portion 210a for the plurality of through-holes 205 provided in the suction plate 201 corresponding to the workpiece 203 to which the laser beam L is irradiated and the suction plate 201 that is not irradiated with the laser beam L are provided. The suction portions 210b for the plurality of through holes 206 are independent from each other. As a result, there is obtained a laser processing apparatus that does not damage the workpiece 203 and can perform fine precision processing such as drilling, groove formation or marking with high accuracy even with a thin polymer film.

JP-A-8-66788 JP 2003-71585 A

  However, in the conventional laser processing apparatus shown in FIG. 4, the structure in which the absorption layer 103 that absorbs the laser beam L that has passed through the opening 101a of the processing member 101 is provided in the space 102 of the processing table 104 has a processing table. Since 104 and the absorbing layer 103 are in contact with each other, the heat generated in the absorbing layer 103 by absorbing the laser light L is conducted to the processing table 104, and the processing table 104 is thermally expanded to the processing table 104. Since the opening 101a that is a through hole is formed in a state where the mounted processing member 101 is also extended, the opening formed in the processing member 101 that returns to the original state when the processing base 104 is radiated and contracted after processing. There was a problem that the positional accuracy of 101a deteriorated.

  Further, in another conventional laser processing apparatus shown in FIG. 5, through holes 205 immediately below the laser processing part are provided in a plurality of portions of the suction plate 201 corresponding to the part 203 immediately below the workpiece 203 irradiated with the laser beam L. In addition, through holes 206 other than the laser processing portion are provided in a plurality of portions of the suction plate 201 that are not irradiated with the laser light L, and are provided in the suction plate 201 corresponding to the portion directly under the workpiece 203 irradiated with the laser light L. A suction portion 210a for the through-hole 205 immediately below the plurality of laser processing portions, and a suction portion 210b for the through-hole 206 other than the plurality of laser processing portions provided in the portion of the suction plate 201 not irradiated with the laser beam L, respectively. In the independent structure, the laser light L passes through the through-hole 205 immediately below the laser processing portion provided in the plurality of portions of the suction plate 201 and is directly irradiated to the upper surface 211 of the suction hole of the holding table 202. , When the holding table 202 is heated and thermally expanded by the irradiation of the laser beam L, the suction plate 201 is expanded, and the laser processing portion 212 which is a through hole is formed in a state where the mounted workpiece 303 is also expanded. Therefore, there is a problem in that the position accuracy of the laser processing portion 212 formed on the workpiece 203 that returns to the original state together with the suction plate 201 deteriorates due to the heat radiation after processing.

  The present invention has been devised in order to solve the above-described problems in the prior art, and the purpose of the present invention is to provide a highly accurate and excellent positional accuracy for the through-hole formed in the workpiece. The object is to provide a laser processing jig capable of performing laser processing. Another object of the present invention is to provide a laser processing apparatus using the laser processing jig of the present invention.

  The jig for laser processing according to the present invention has a diameter larger than the diameter of the hole at a position corresponding to the hole on which a work to be formed with a laser beam is placed and holds the work. A holding plate having a through-hole, a frame-like support that supports the holding plate at the top, and a plate-like substrate that is disposed at the bottom of the support and forms a space inside the holding plate and the support And a laser beam absorber disposed at a position immediately below the through hole on the substrate, the substrate being on the substrate side located around the laser beam absorber It has a suction hole. This is a first laser processing jig.

  Further, the laser processing jig of the present invention is the first laser processing jig, wherein the base is disposed on a portion of the upper surface where the laser light absorber is disposed. It has a projection part which provides a clearance gap between it and an upper surface, and is characterized by it. This is the second laser processing jig.

  The laser processing jig according to the present invention is characterized in that in the second laser processing jig, the base has a second base-side suction hole below the laser light absorber. This is the third laser processing jig.

  The laser processing apparatus of the present invention comprises a laser apparatus, any one of the first to third laser processing jigs, and a suction device connected to the laser processing jig. To do.

  According to the first laser processing jig which is the laser processing jig of the present invention, the workpiece to be formed with the hole by the laser beam is placed and corresponds to the hole for holding the workpiece. A holding plate having a through-hole having a diameter larger than the diameter of the hole at a position, a frame-like support that supports the holding plate at the upper part, and an inner side together with the holding plate and the support member that is disposed at the lower part of the support A laser processing jig comprising a plate-like substrate forming a space and a laser light absorber disposed in a portion immediately below the through hole on the substrate, wherein the substrate is around the laser light absorber Since the substrate side suction hole is located on the substrate, when the laser light absorber is irradiated with the laser light, the laser light absorber absorbs the laser light, so that the laser light is reflected and the reflected laser light is reflected on the substrate. And thermal expansion due to heat generated by absorption by the holding plate The heat accumulated in the laser light absorber when the laser light absorber absorbs the laser light and generates heat, and the laser light absorber and the substrate are cooled by the air flow sucked from the substrate side suction hole. By doing so, it is possible to suppress conduction from the substrate to the holding plate via the support, and thus it is possible to suppress thermal expansion of the holding plate. Therefore, since the extension of the workpiece placed on the holding plate can be suppressed, the positional accuracy of the holes formed in the workpiece can be made good and highly accurate.

  Further, since the base-side suction hole is positioned so as to surround the laser light absorber, the holes (through holes) formed in the work piece from the laser light incident side toward the emission side, and the holding plate Since the air flow is generated in the order of the through hole, the space inside the support, and the suction hole on the substrate side, the heat of the laser light absorber that has been heated to a high temperature by the laser beam can be effectively cooled by air. The thermal expansion of the support and the holding plate can be suppressed, and the position accuracy of the holes formed in the workpiece can be made good and highly accurate.

  Further, according to the second laser processing jig which is the laser processing jig of the present invention, the laser beam absorber is placed on the upper surface of the substrate at the site where the laser beam absorber is disposed on the upper surface. Since the protrusion is supported with a gap between them, the contact area between the laser light absorber and the substrate is small, and the heat accumulated in the laser light absorber due to laser light irradiation absorbs the laser light. Since conduction from the body to the holding plate via the base and the support can be effectively suppressed, the thermal expansion of the base is suppressed, and the support and the holding plate are thermally expanded to extend the workpiece. It is possible to suppress the positional accuracy of the holes formed in the workpiece to be stable and good and highly accurate.

  According to the third laser processing jig as the laser processing jig of the present invention, since the base has the second base side absorption hole below the laser light absorber, The heat accumulated in the laser light absorber by irradiation can be effectively cooled on the surface of the laser light absorber by the flow of air from the periphery of the laser light absorber to the lower second substrate side absorption hole. In combination with the reduction of the contact area between the laser light absorber and the substrate, it is possible to effectively suppress the heat conduction from the laser light absorber to the substrate. Since the thermal expansion of the plate can be effectively suppressed, it is possible to effectively suppress the expansion of the work piece due to the thermal expansion of the base, the support and the holding plate, and the positional accuracy of the holes formed in the work piece. Can be made stable and good with high accuracy.

  According to the laser processing apparatus of the present invention, the laser processing apparatus includes the laser apparatus, the laser processing jig of any one of the first to third aspects of the present invention, and the suction device connected to the laser processing jig. Thus, it is possible to obtain a laser processing apparatus capable of making the position accuracy of the hole formed in the workpiece to be good and highly accurate.

An example of embodiment of the laser processing jig of the present invention is shown, (a) is a sectional view, and (b) is a plan view. The other example of embodiment of the jig | tool for laser processing of this invention is shown, (a) is sectional drawing, (b) is a top view. The further another example of embodiment of the jig for laser processing of this invention is shown, (a) is sectional drawing, (b) is a top view. It is sectional drawing which shows the example of the conventional laser processing apparatus. It is sectional drawing which shows the other example of the conventional laser processing apparatus.

  Hereinafter, an example of an embodiment of a laser processing jig according to the present invention will be described with reference to the accompanying drawings.

  FIG. 1 shows an example of an embodiment of a laser processing jig according to the present invention, where (a) is a cross-sectional view and (b) is a plan view. This example corresponds to the first laser processing jig of the present invention. In FIG. 1, 10 represents the whole laser processing jig, 1 is a holding plate, 1a is a through hole formed in the holding plate 1, 2 is a frame-like support, 3 is a base, 3a is a base side Suction hole (first substrate side suction hole), 4 is a laser beam absorber, 5 is a workpiece, 5a is a hole (through hole) formed in the workpiece 5, and L is a laser beam (white arrow) Represent).

  The first laser processing jig of the present invention corresponds to a workpiece 5 in which a hole is formed by the laser beam L and a hole on which the workpiece 5 is placed and holds the workpiece 5. A holding plate 1 having a through-hole 1a having a diameter larger than the diameter of the hole at a position, a frame-like support 2 that supports the holding plate 1 at an upper portion, and a holding plate 1 and a support that are disposed below the support 2 It comprises a plate-like base 3 that forms a space inside with the body 2 and a laser light absorber 4 disposed at a position directly below the through hole 1 a on the base 3. The base-side suction hole (first base-side suction hole) 3a is formed at a position that does not overlap the laser light absorber 4 around the laser light absorber 4 when viewed from the incident side of the laser light L. The base body 3 has the base-side suction holes 3a positioned around the laser light absorber 4, so that the laser light absorber 4 absorbs the laser light L when the laser light absorber 4 is irradiated with the laser light L. As a result, the laser beam L is reflected, and the reflected laser beam L is absorbed by the substrate 3 and the holding plate 5 to generate heat, thereby suppressing the thermal expansion of the substrate 3 and the holding plate 5 and absorbing the laser beam. When the body 4 absorbs the laser beam L and generates heat, the heat accumulated in the laser beam absorber 4 is cooled by the air flow sucked from the substrate-side suction hole 3a, and the laser beam absorber 4 and the substrate 3 are cooled by air. Accumulated in the laser light absorber 4 Since heat can be prevented from conducting to the holding plate 1 through the support 2 from the substrate 3, it can suppress thermal expansion of the holding plate 1. Accordingly, since the extension of the workpiece 5 placed on the holding plate 1 can be suppressed, the positional accuracy of the holes 5a formed in the workpiece 5 can be made good and highly accurate. Become.

  The substrate 3 is made of metal such as stainless steel or ceramics, or plastic such as tetrafluoroethylene, and the size is the same as or larger than the holding plate 1 and the support 2 based on the size of the workpiece 5. The size should be. Further, since it is necessary to move the base 3 at high speed when performing laser processing, it is desirable to reduce the weight while providing necessary functions. Moreover, the thickness of the base | substrate 3 should just be about 10 mm-20 mm. When the thickness of the substrate 3 is smaller than 10 mm, the support 3, the holding plate 1 and the workpiece 5 cannot be stably held by the substrate 3, and the through-hole 5 a formed in the workpiece 5. The position accuracy tends to deteriorate. On the other hand, if the thickness of the substrate 3 exceeds 20 mm, it tends to be difficult to form the substrate-side suction hole 3a and a second substrate-side suction hole 3c described later in the substrate 3.

  The substrate-side suction hole 3a formed in the substrate 3 so as to be positioned around the laser light absorber 4 is based on the total surface area of the substrate 3 according to the dimensional accuracy required for the hole 5a of the workpiece 5. It is desirable to adjust the ratio, arrangement, diameter size, number and shape of the opening area.

If the ratio of the opening area of the substrate-side suction hole 3a to the surface area (upper surface area) of the substrate 3 is, for example, about 30 to 70%, the laser light absorber is caused by the flow of air sucked from the substrate-side suction hole 3a. 4 and the substrate 3 are preferably air-cooled, and the laser light absorber 4 can be held on the upper surface of the substrate 3 so as to absorb the laser light L, which is preferable. Further, for example, when the size of the workpiece 5 is 320 mm □, the size of the holding plate 1 and the substrate 3 is 320 mm □, the size of the laser light absorber 4 is 260 mm □, and the diameter of the substrate side suction hole 3a is 5 mmφ. The total opening area of the base-side suction holes 3a is preferably about 3,000 to 7,000 mm ² (about 15 to 36 as the number of base-side suction holes 3a). In this case, if the opening area of the base-side suction holes 3a is smaller than 3,000 mm ^{2 in} total, the heat of the laser light absorber 4 due to the irradiation of the laser light L is conducted to the base 3 and the base 3 is thermally expanded. The support 2 and the holding plate 1 are also thermally expanded, and the hole 5a is formed in a state where the workpiece 5 placed on the holding plate 1 is stretched. The positional accuracy of the hole 5a formed in the workpiece 5 that contracts and returns to the original state together with the holding plate 1 deteriorates. Further, if the opening area of the base-side suction holes 3a greatly exceeds 7,000 mm ² in total, the laser light absorber 4 can be stably held on the upper surface of the base 3 so as to absorb the laser light L. It will disappear.

  Further, the base-side suction holes 3a are preferable because the same size of the base-side suction holes 3a are arranged around the laser light absorber 4 at equal intervals so that the whole base 3 is uniformly air-cooled together with the laser light absorber 4. It will be a thing. In order to adjust the ratio of the opening area of the substrate side suction hole 3a to the total surface area of the substrate 3, the size of the diameter of the substrate side suction hole 3a is such that the heat generated in the laser light absorber 4 and the heat transfer to the substrate 3 are It is adjusted in consideration of the degree of air cooling by the substrate side suction hole 3a. In the above example, the base side suction hole 3a is preferably formed with a diameter of about 1 to 10 mmφ. In this case, if the diameter of the base-side suction hole 3a is smaller than 1 mmφ, the momentum of air flowing into the base-side suction hole 3a is weakened, the amount is reduced, and sufficient air cooling cannot be performed, and the workpiece 5 Since the scraps and the like of the workpiece 5 generated when the is processed are easily clogged, air cooling becomes difficult. On the other hand, if the diameter of the base-side suction hole 3a greatly exceeds 10 mmφ, the cooling efficiency of the base 3 and the laser light absorber 4 by the air sucked from the base-side suction hole 3a is lowered. The heat generated in the laser light absorber 4 due to the irradiation with the laser light L is transferred from the base 3 to the holding plate 1 through the support 2, and the positional accuracy of the holes 5 a formed in the workpiece 5 is deteriorated. It becomes like this.

  Further, when a plurality of base-side suction holes 3a are formed, it goes without saying that they may be arranged in a line along the outer periphery of the laser light absorber 4 as shown in FIG. May be arranged in two or three rows so as to be double or triple. Furthermore, when the substrate-side suction holes 3a in the outer row are arranged so as to be positioned between the rows of the substrate-side suction holes 3a in the inner row, the substrate-side suction holes 3a in the substrate 3 are alternately arranged in a so-called zigzag shape. Since the heat transfer path from the inner side to the outer side of the array becomes longer and the efficiency of air cooling in the array of the base-side suction holes 3a is improved, the base body 3 and the laser light absorber 4 are easily air-cooled. preferable.

  The support 2 maintains a state in which the holding plate 1 and the workpiece 5 are perpendicular to the traveling direction of the laser light L, and forms a space together with the base 3 and the holding plate 1 inside the support 2. In this space, the laser light absorber 4 is arranged separately from the holding plate 1. When the laser light absorber 4 and the holding plate 1 come into contact with each other, the heat generated by the laser light L that has passed through the through hole 1 a being absorbed by the laser light absorbent 4 is transferred from the holding plate 1 to the workpiece 5. Heating causes the position accuracy of the hole 5a to be processed into the workpiece 5 to deteriorate. Further, since the laser light absorber 4 cannot be air-cooled, the heat generated in the laser light absorber 4 is more easily transferred to the holding plate 1.

  The support 2 is not particularly limited as long as it can support the holding plate 1 and the workpiece 5 and form a space between the support 3 and the substrate 3. Such a composite material may be used.

  Regarding the height and thickness of the support 2, the workpiece 5 and the holding plate 1 are kept in a vertical state, and the laser light absorber 4 disposed on the base 3 inside the support 2 is the holding plate. The height and thickness may be such that the laser processing region is ensured so as not to reach the through hole 1 a of the holding plate 1. For example, the thickness of the support 2 may be about 1 to 10 mm, and the height of the support 2 may be about 10 mm. As a result, when the laser processing jig 10 is moved according to the position of the hole 5a to be processed during laser processing, the workpiece 5 and the holding plate 1 are inclined and the hole 5a is inclined. It is possible to prevent the moving speed of the laser processing jig 10 from being lowered by increasing the weight of the laser processing jig 10.

  Further, the size of the support 2 may be larger than the holding plate 1 as long as the holding plate 1 can be stably supported at the outer peripheral portion, but considering the downsizing and weight reduction of the laser processing jig 10. The size of the holding plate 1 is preferably the same.

  The laser light absorber 4 is disposed on a portion of the substrate 3 that covers a region immediately below the through hole 1a of the holding plate 1 and forms a hole 5a in the workpiece 5 so as to penetrate the holding plate 1. The laser beam L that has passed through the hole 1a is absorbed. The material of the laser light absorber 4 has a high absorptivity of the laser light L and is resistant to heat so that a melt of the laser light absorber 4 is not generated by heat generated when the laser light L is absorbed. Some are preferable. For example, when a UV-YAG laser (wavelength 0.36 μm) is used as the laser, aluminum oxide, aluminum nitride, or the like can be raised.

  The thickness of the laser light absorber 4 is arranged at a position directly below the through hole 1a on the base 3 in the space surrounded by the holding plate 1, the support 2 and the base 3, and from the base side suction hole 3a. As a result of this suction, a space for air to flow through the hole 5a formed in the workpiece 5 and the through hole 1a formed in the holding plate 1 is secured, and the effect of air cooling by suction from the base side suction hole 3a is obtained. It is sufficient that the thickness is such that it is not damaged by the heat generated when the laser beam L is absorbed. For example, if the material is aluminum oxide, the thickness of the laser light absorber 4 may be about 1 mm. Further, the shape and size of the laser light absorber 4 may be any as long as it has a shape and size corresponding to the range in which the holes 1a formed in the workpiece 5 are distributed.

  It is preferable to use the workpiece 5 having a high absorbability of the laser beam L depending on the type of the laser beam L to be used, because the hole 5a is easily processed. For example, if a ceramic green sheet or the like is used as the work 5, it is preferable to support and use a carrier film with good absorption of the laser light L. A ceramic green sheet is obtained by adding a solvent and a dispersant to a ceramic powder and an organic binder and mixing them to obtain a slurry-like material called a slurry, which is then applied onto a carrier film, for example, a doctor blade method, a calendar method, a reverse method. It is formed by forming into a sheet by a coater method and drying. As a carrier film, when UV-YAG is used as the laser beam L, a carrier film containing a UV absorber is a laminate of a ceramic green sheet to be processed 5 and a carrier film. The hole 5a can be formed more efficiently, which is preferable.

  Here, as the absorbent for the laser beam L, a pigment such as carbon black or an inorganic material such as titanium oxide or zinc oxide can be used. These absorbents may be coated on the surface of the carrier film or contained in the carrier film component. The material of the carrier film may be a resinous film, for example, a polyethylene terephthalate (PET) resin, a polyethylene naphthalate (PEN) resin, a polyfluorinated ethylene resin, a cellulose resin, or an acrylic resin. It consists of a plastic film and has a role to support ceramic green sheets. Among these, a PET film is preferable because it is inexpensive and has sufficient strength. Examples of the material for the ceramic powder include aluminum oxide, aluminum nitride, silicon carbide, silicon nitride, mullite, and glass ceramics. For example, if a ceramic multilayer wiring board is produced using a ceramic green sheet as the workpiece 5, it can be fired simultaneously with a low-resistance wiring conductor and has a low dielectric loss. Glass ceramics are often used. Here, it is preferable to add a UV absorber as an absorber for the laser light L in the ceramic green sheet because the workability is further improved.

  As the sheet-like workpiece 5, in addition to the ceramic green sheet, an organic insulating material such as polyimide, epoxy resin, fluororesin, polynorbornene or benzocyclobutene, or inorganic insulating powder such as ceramic powder is used as epoxy resin or the like. It may be a sheet made of an electrically insulating material such as a composite insulating material mixed with the thermosetting resin. For example, when the workpiece 5 is made of a composite insulating material, an insulating layer made of a thermosetting epoxy resin mixed with ceramic powder or a glass epoxy resin impregnated with an epoxy resin in a cloth woven with glass fibers. It is formed by applying a liquid resin precursor on the upper surface by a spin coating method or a curtain coating method and subjecting this to a pre-thermosetting treatment.

  The holding plate 1 is a plate-like member that is disposed on the frame-like support 2 to place and hold the workpiece 5, and the holding plate 1 is formed in the hole 5 a formed in the workpiece 5. A through hole 1a having a diameter larger than the diameter of the hole 5a is provided at a corresponding position. Thereby, since the laser beam L penetrating through the hole 5a of the workpiece 5 passes through the through hole 1a formed in the holding plate 1, it is possible to suppress the laser beam L from being absorbed by the holding plate 1, so that the laser The lower surface of the workpiece 5 is fused to the upper surface of the holding plate 1 due to the heat effect of the light L, and the position accuracy of the hole 5a is prevented from deteriorating when the workpiece 5 is removed after forming the through hole 5a. Can do.

  The size of the holding plate 1 may be any size as long as the workpiece 5 can be placed and stably held, so that the size of the holding plate 1 may be the same as or slightly larger than the workpiece 5. In view of the reduction in size and weight, it is preferable to set the same size as the workpiece 5 in consideration of the ease of alignment when the workpiece 5 is placed. The thickness of the holding plate 1 is set in consideration of the focal point of the laser beam L and the holding property of the workpiece 5, and is preferably about 0.5 mm to 10 mm. When the thickness of the holding plate 1 is 0.5 mm or less, it becomes difficult to keep the workpiece 5 perpendicular to the incident direction of the laser beam L, and the position accuracy of the through hole 5a formed in the workpiece 5 is deteriorated. There is a tendency to end up. Further, if the thickness of the holding plate 1 exceeds 10 mm, it tends to be difficult to form the through hole 1 a in the holding plate 1.

  As the material of the holding plate 1, a material having a high absorption rate of the laser light L and having a rigidity enough to hold the workpiece 5 is used. For example, when a UV-YAG laser is used as the laser light L, a phenol resin, an acrylic resin containing a UV absorber, polyimide, or the like can be used.

  Since the through-hole 1a formed in the holding plate 1 has a diameter larger than the diameter of the hole 5a formed in the workpiece 5, the laser light L that has passed through the hole 5a enters the holding plate 1. Since it is not absorbed, the workpiece 5 and the holding plate 1 are melt-bonded during processing by the laser beam L, and the workpiece 5 is deformed when the workpiece 5 is removed from the holder 1 after processing. It can suppress that the positional accuracy of the hole 5a deteriorates by this.

  The diameter of the through hole 1a of the holding plate 1 is larger than the diameter of the hole 5 formed in the workpiece 5 so that the laser beam L that has passed through the hole 5a is not absorbed by the inner surface of the through hole 1a. Therefore, it is sufficient that the adhesion is not caused by melting between the lower surface of the workpiece 5 and the upper surface of the holding plate 1 and the adjacent through holes 1a are not connected.

  For example, when the diameter of the hole 5a of the workpiece 5 is φ40 μm and the interval (pitch) is 175 μm, the diameter of the through hole 1a formed in the holding plate 1 may be about 100 to 150 μm. . At this time, if the diameter of the through hole 1a is smaller than 100 μm, the laser beam L that has passed through the hole 5a is absorbed by the inner surface of the through hole 1a, and the lower surface of the workpiece 5 and the upper surface of the holding plate 1 are bonded by melting. When the workpiece 5 is removed after laser processing, the positional accuracy of the hole 5a of the workpiece 5 may be deteriorated. On the other hand, if the diameter of the through-hole 1a exceeds 150 μm, the adjacent through-holes 1a are connected to each other, which causes bending due to suction on the through-hole 1a to which the workpiece 5 is connected. There may be a large deviation or variation from the design value of the diameter of the hole 5a of the workpiece 5.

  Moreover, it is preferable to change the magnitude | size of the diameter of the through-hole 1a of the holding plate 1 according to the magnitude | size of the hole 5a of the workpiece 5 processed. For example, when the material of the workpiece 5 is a polyester film having a thickness of about 50 μm, if the diameters of the two types of holes 5a to be processed are φ40 μm and φ90 μm, respectively, these correspond to the holes 5a to be processed. By setting the diameters of the through holes 1a to about φ80 μm and φ150 μm, respectively, there is no adhesion due to melting of the workpiece 5 and the holding plate 1, and deviations and variations from the design values of the diameters of the holes 5a occur. No good laser processing can be performed.

  The processing for forming the through hole 1a in the holding plate 1 may be performed by changing the conditions according to the size of the diameter with the same apparatus as the hole 5a of the workpiece 5. By doing so, after the through hole 1a is formed in the holding plate 1, the workpiece 5 is placed on the upper surface of the holding plate 1 without removing the holding plate 1 from the laser processing jig 10. Since the hole 5a can be formed in the workpiece 5, the positional deviation between the hole 5a of the workpiece 5 and the through hole 1a of the holding plate 1 can be reduced, and the diameter of the through hole 1a can be reduced accordingly. Can be small.

As the laser beam L, a laser beam suitable for laser processing of the workpiece 5 may be selected, and examples thereof include a laser beam such as a CO ₂ laser (wavelength 1.06 μm) or a UV-YAG laser (wavelength 0.36 μm). In particular, in order to form the hole 5a having a fine diameter of about φ30 μm accompanying the recent narrowing of the holes 5a, it is preferable to use a UV-YAG laser having a shorter wavelength as the laser light L.

  Next, FIG. 2 shows another example of the embodiment of the laser processing jig of the present invention, in which (a) is a sectional view and (b) is a plan view. This example corresponds to the second laser processing jig of the present invention. In FIG. 2, the same reference numerals as those in FIG.

  In the example shown in FIG. 2, the base 3 has a protrusion 3 b that supports the laser light absorber 4 with a gap between the top surface of the base 3 and a portion where the laser light absorber 4 is disposed on the top surface. is doing. The base 3 has such a protrusion 3b, and the laser light absorber 4 is placed on and supported by the upper surface of the base 3 on the protrusion 3b, so that the laser The contact area between the light absorber 4 and the base 3 is reduced, and the heat generated and accumulated in the laser light absorber 4 by irradiation with the laser light L is transmitted from the laser light absorber 4 through the base 3 and the support 2. Therefore, it is possible to suppress the thermal expansion of the base 3 and to improve the positional accuracy of the holes 5a formed in the workpiece 5 with high accuracy. Become.

  In the case where a plurality of protrusions 3b are arranged at a portion of the substrate 3 where the laser light absorber 4 is arranged, the height of the protrusions 3b is the same, so that the laser light absorber 4 is stably held. Thus, the main surface can be kept perpendicular to the irradiation of the laser beam L, and reflection of the laser beam L can be suppressed, which is preferable. Furthermore, it is preferable to arrange small protrusions 3 b at positions corresponding to the four corners of the laser light absorber 4. It should be noted that the size of the head portion where the projection 3b is in contact with the laser beam absorber 4 is about 1 to 20 mmφ so that the main surface of the laser beam L is supported while stably supporting the laser beam absorber 4. This is preferable because the heat generated in the laser light absorber 4 can be prevented from being transferred to the substrate 3 while being kept perpendicular to the irradiation.

  There is no restriction | limiting in particular in the shape of the projection part 3b, For example, what is necessary is just a cone shape, and a cylinder shape or a polygonal column shape etc. may be sufficient as it.

  The protrusion 3 b may be formed integrally with the base 3, or may be joined to at least one of the base 3 and the laser light absorber 4, and is joined to both the base 3 and the laser light absorber 4. It does not have to be. In addition, when the projection part 3b is not joined with the laser beam absorber 4, it is preferable because the laser beam absorber 4 can be easily replaced as compared with the case where it is joined.

  Next, FIG. 3 shows still another example of the embodiment of the laser processing jig of the present invention, (a) is a cross-sectional view, and (b) is a plan view. This example corresponds to the third laser processing jig of the present invention. In FIG. 3, the same reference numerals are used for the same reference numerals as those in FIG. 1 and FIG.

  In the example shown in FIG. 3, the base 3 has a second base-side suction hole 3 c below the laser light absorber 4. The second base-side suction hole 3c overlaps with the laser light absorber 4 while the base-side suction hole 3a is positioned around the laser light absorber 4 as the first base-side suction hole. And is located immediately below the laser light absorber. In the example shown in FIG. 3, the second base-side suction hole 3 c is formed so that its position overlaps the center of the laser light absorber 4.

  In the second base-side suction hole 3c, the flow of air to the base-side suction hole 3a, which is the first base-side suction hole, is the flow of air passing from the upper surface of the laser light absorber 4 to the side surface. Thus, it is possible to create a flow of air that circulates from the side surface to the lower surface side of the laser light absorber 4, thereby increasing the surface area of the laser light absorber 4 in contact with the air flow. The heat generated and accumulated in the laser light absorber 4 by the irradiation of L can be air-cooled more efficiently.

  The diameter of the second base-side suction hole 3 c may be a size that does not overlap with the protrusion 3 b provided on the upper surface of the base 3. For example, if the diameter of the second base-side suction hole 3c is about 1 to 30 mmφ, the force of air flowing into the second base-side suction hole 3c is so weak that the laser light absorber 4 cannot be cooled sufficiently. In addition, it is possible to prevent the laser beam absorber 4 from being clogged with clogging of the workpiece 5 generated when the workpiece 5 is processed. The laser beam absorber 4 can be efficiently air-cooled while being stably held on the substrate 3 to provide a laser processing jig 10 having a high positional accuracy of the hole 5a of the workpiece 5.

  The shape of the second base-side suction hole 3c may be any of a circle, a triangle, an ellipse, a rectangle, or a square. Moreover, the 2nd base | substrate side suction hole 3c may be comprised from the several hole with a small diameter. Further, the arrangement and the number of the second base-side suction holes 3c are arranged so as not to overlap with the protrusion 3b when viewed from the side on which the laser beam L is incident. For example, the protrusion 3b is 4 of the laser light absorber 4. If a small object is arranged at a position corresponding to the corner, the second substrate-side suction having a diameter that is approximately the length obtained by subtracting the diameter of the protrusion 3b from the distance of the protrusion 3b located diagonally. It is preferable to arrange one hole 3c at the center of the laser light absorber 4 because the air flow on the lower surface side of the laser light absorber 4 is improved and the laser light absorber 4 can be air-cooled more efficiently. Alternatively, the second substrate-side suction holes 3c having a smaller diameter may be arranged as much as possible in the area surrounded by the four corners of the laser light absorber 4. In this case, the second base-side suction holes 3c may be arranged in a so-called staggered pattern.

  The laser processing apparatus of the present invention is connected to the laser apparatus for irradiating the laser beam L, the first to third laser processing jigs 10 of the present invention, and the laser processing jig 10. A suction device. For example, a vacuum pump that is a suction device is connected to the first and second substrate-side suction holes 3a and 3c provided in the substrate 3 via a suction hose, and is processed using a difference in pressure generated by suction. The object 5 is sucked and held on the holding plate 1.

  The suction force when sucking and holding the workpiece 5 on the holding plate 1 is adjusted to a pressure of about −5 to −55 kPa. When the suction force increases below -55 kPa, the workpiece 5 is drawn too much into the through hole 1a formed in the holding plate 1 so that the workpiece 5 is bent and the focal depth of the laser beam L is shifted. As a result, the shape of the hole 5a is deformed or the position accuracy is deteriorated. Further, when the suction force becomes smaller than −5 kPa, the air flow is weakened at the same time, and the power to air-cool the laser light absorber 4 heated to high temperature by the irradiation of the laser light L is weakened. The processing scrap generated when the hole 5a is formed in the workpiece 5 is less likely to be sucked into the base-side suction hole 3a and the removal force is reduced, and the rate of adhesion to the inner surface of the hole 5a formed in the workpiece 5 Will increase.

  In the laser processing apparatus of the present invention, the laser processing jig 10 may be fixed to itself and moved in accordance with the processing of the hole 5a in the workpiece 5. It may be fixed and move itself. When the laser processing jig 10 itself is moved, the region for processing the hole 5a formed in the workpiece 5 exceeds the region where the laser beam L reaches by a mirror (not shown) called a galvano. Even when it becomes large, it becomes possible to perform favorable processing with high positional accuracy of the holes 5a formed in the workpiece 5. For example, even if the area of the workpiece 5 where the hole 5a is to be processed is 250 mm □ and the galvano scan area is 200 mm □, the laser processing jig 10 itself moves to place the workpiece 5. The hole 5a can be processed without reworking.

  According to the above-described laser processing jig and laser processing apparatus of the present invention, high-precision laser processing with excellent positional accuracy can be performed on the hole 5a which is a through hole formed in the workpiece 5.

  Examples of the laser processing jig of the present invention will be described below.

  First, an organic binder and a solvent were added to glass ceramic powder and mixed for 24 hours by a ball mill to prepare a ceramic slurry. The ceramic slurry is applied to a PET carrier film with a thickness of 50 μm by a lip coater method, formed into a sheet shape, and dried with a hot air dryer, so that the ceramic green sheet as the workpiece 5 having a thickness of 129 μm Was cut into a size of 320 mm □. A region where the hole 5a is formed by the laser beam L on the workpiece 5 is set to a range of 260 mm □ at the center.

Next, the sum of the opening areas of the base-side suction holes 3a arranged around the laser light absorber 4 to be placed, which is a constituent member of the laser processing jig 10, is 9400, 6500, 4400, 3500 and 2200 mm. ² was prepared. The base-side suction holes 3a are arranged in a square lattice shape with the diameter of the base-side suction holes 3a being 1 mmφ and the distance between adjacent base-side suction holes 3a being 5 mm. The substrate 3 is made of plastic, has a thickness of 20 mm, and has a size of 320 mm □ in accordance with the size of the workpiece 5.

  Then, a laser light absorber 4 made of aluminum oxide and having a size of 260 mm □ and a thickness of 1 mm is formed on the inner portion of the substrate 3 where the substrate-side suction hole 3a is formed, and a hole 5a of the workpiece 5 is formed. It was placed corresponding to the area. The substrate 3 is made of paper phenol, is made of a frame-like support 2 and paper phenol having a size of 320 mm □ and a thickness of 2 mm according to the size of the workpiece 5, and the size is processed. A holding plate 1 having a thickness of 320 mm according to the size of the object 5 and a thickness of 1 mm was installed.

  Next, using a UV-YAG laser processing machine (wavelength 0.36 μm) using third harmonics for the holding plate 1, the laser beam diameter is 25 μm, the output is 5 W, the frequency is 30 kHz, and the number of pulses is 10 About 1000 through-holes 1a having a diameter of 80 μm were formed at intervals of 150 μm under the laser light conditions described above. As a result, the laser processing jig 10 of the present invention was obtained.

  Next, a ceramic green sheet as the workpiece 5 is placed on the holding plate 1 in which the through hole 1a is formed, and the beam diameter of the laser beam L is 12 μm and output using the UV-YAG laser processing machine. Was processed at the same location as the through-hole 1a under the laser beam conditions of 2.5 W, frequency of 30 kHz, and the number of pulses of 1, and about 1000 holes 5a which are through-holes of φ40 μm were formed at intervals of 190 μm.

  And about the ceramic green sheet in which this hole 5a was formed, the distance of the holes 5a and the diameter of the hole 5a were measured using the factory microscope.

  Table 1 shows the measurement results of the positional accuracy of the hole 5a formed in the workpiece 5, the diameter of the hole 5a, and the variation thereof. In the results shown in Table 1, “◯” in the “Position accuracy” column is within ± 15 μm of the design value, indicating that it was excellent. In addition, “Δ” indicates that the design value is ± 15 μm or more, but it has been confirmed that there is no practical problem. In addition, “◯” in the “hole diameter / variation” column indicates that the diameter of the hole 5a and the variation in the diameter are formed within the design value ± 5 μm, which is excellent. Further, “Δ” indicates that it has been confirmed that the hole 5a that is out of the design value ± 5 μm but has no practical problem is formed.

As is clear from the results shown in Table 1, in Examples 1, 2, 3, and 4 in which the sum of the opening areas of the base-side suction holes 3a is larger than 3000 mm ² , the positional accuracy of the holes 5a of the workpiece 5 is designed. With respect to the required value of ± 15 μm, the results satisfying the required value were obtained. On the other hand, in Example 5 in which the sum of the opening areas of the base-side suction holes 3a is smaller than 3000 mm ² , some of the positional accuracy of the holes 5a of the workpiece 5 is less than the required value of the design value ± 15 μm. Although the variation may exceed 15 μm, there is no practical problem, but the required value of the position accuracy was not always satisfied at an excellent level (indicated by “△” in the “Position accuracy” column in Table 1). ). Further, in Examples 2, 3, 4 and 5 in which the sum of the opening areas of the substrate side suction holes 3a is smaller than 7000 mm ² , the diameter of the hole 5a of the workpiece 5 is smaller than the required value of the design value ± 5 μm. All of these results satisfied this (indicated by “◯” in the “pore diameter / variation” column in the table). Furthermore, in Example 1 in which the sum of the opening areas of the base-side suction holes 3a is larger than 7000 mm ² , the variation in the position of the holes 5a was about 4 μm with respect to the required value of the position accuracy of the design value ± 5 μm. However, in some cases, the average value of the diameters of the holes 5a exceeds the set value and is 10 μm or more, so there is no practical problem, but it cannot be said that the required value is always satisfied at an excellent level. did. (Indicated by “Δ” in the “pore diameter / variation” column in the table). According to this result, greater than the sum of the opening areas of the substrate-side suction hole 3a is 3000 mm ^2, the small Examples 2, 3 and 4 than 7000 mm ^2, the holes 5a of the workpiece 5, the position accuracy and through Both the hole diameter / variation satisfied the required values at an excellent level, and excellent laser processing was achieved with high accuracy (indicated by “◯” in the “General Judgment” column in the table).

  The present invention is not limited to the above-described embodiments and examples, and various modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Holding plate 1a ... Through-hole 2 ... Support body 3 ... Base | substrate 3a ... Base | substrate side suction hole (1st board | substrate side suction hole)
3b... Projection 3c... Second substrate side suction hole 4... Laser light absorber 5 .. Workpiece 5a... Hole (through hole)
10 ... Laser processing jig L ... Laser beam

Claims (4)

A holding plate having a through-hole having a diameter larger than the diameter of the hole at a position corresponding to the hole, on which a workpiece in which a hole is formed by laser light is placed to hold the workpiece, and the holding A frame-like support that supports the plate at the upper part, a plate-like base that is disposed at the lower part of the support and forms an internal space with the holding plate and the support, and the through hole on the base A laser processing jig comprising a laser beam absorber disposed immediately below the laser beam, wherein the substrate has a substrate-side suction hole located around the laser beam absorber Processing jig. The said base | substrate has the projection part which provides the clearance gap between the said upper surface of the said base | substrate and the said laser light absorber in the site | part by which the said laser light absorber is arrange | positioned. The jig for laser processing according to 1. The laser processing jig according to claim 2, wherein the base has a second base-side suction hole below the laser light absorber. An apparatus for laser processing, comprising: a laser apparatus; a laser processing jig according to any one of claims 1 to 3; and a suction device connected to the laser processing jig.

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