CN110220402A - It is a kind of with micropin rib-nanowire structure micro-channel heat exchanger and its manufacturing method - Google Patents
It is a kind of with micropin rib-nanowire structure micro-channel heat exchanger and its manufacturing method Download PDFInfo
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- CN110220402A CN110220402A CN201910462587.0A CN201910462587A CN110220402A CN 110220402 A CN110220402 A CN 110220402A CN 201910462587 A CN201910462587 A CN 201910462587A CN 110220402 A CN110220402 A CN 110220402A
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- microchannel
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- heat exchanger
- channel
- micropin
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/20—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes with nanostructures
Abstract
The invention discloses a kind of with micropin rib-nanowire structure micro-channel heat exchanger and its manufacturing method, the micro-channel heat exchanger includes the upper cover plate to fit together up and down, metallic micro channel substrate, several parallel array microchannels equidistantly arranged are equipped among the metallic micro channel substrate, microchannel wall face has a large amount of micropin rib protrusions, growth has a large amount of nanowire structures in micropin rib protrusion, play the role of good flow-disturbing, and significantly increases heat exchange area, augmentation of heat transfer.Preparation method includes: that first micro- Milling Process goes out microchannel, a large amount of micropin rib protrusions are prepared in microchannel wall face by laser processing again, then dilute hydrochloric acid surface clean is used, thermal oxidative reaction is carried out in Muffle furnace again and generates the microchannel that growth on micropin rib there are a large amount of nano wires, it is finally that micro-channel heat exchanger is hermetically sealed.Operation of the present invention is simple and convenient, it is low in cost, it can be achieved that in microscale channel augmentation of heat transfer structure efficient, inexpensive, secured preparation forming.
Description
Technical field
The present invention relates to a kind of micro-channel heat exchanger and its manufacturing methods, especially relate to a kind of with micropin rib-
The micro-channel heat exchanger and its manufacturing method of nanowire structure.
Background technique
In recent years, electronic equipment is kept updating, so that electronic component is in integrated, miniaturization, but
This is also significantly promoted along with the calorific value in unit area.Especially in microelectronic field, the electronics member of high heat flux density
The heat dissipation problem of device is urgently to be resolved.Micro-channel heat exchanger due to it is small in size, light-weight, be suitable for compact package, thermal diffusivity
It can be high, it is considered to be high heat flux density problem effective solution approach.Common micro-channel heat exchanger is in metal or silicon base
On process the open types microchannel structure such as the rectangles of several parallel arrangements, triangle, trapezoidal, with cover board coupling package at coolant liquid
Fluid channel connect with the external world and forms coolant circuit.The thermal pathways articulamentum that electronic component generates is transmitted to microchannel
Structure is taken away by the coolant liquid flowed in microchannel, to realize the purpose of cooling electronic component.
The parallel microchannels array that current micro-channel heat exchanger mainly uses wall surface smooth.After fluid enters microchannel,
Fluid boundary layer and thermal boundary layer carry out simultaneously.If should during thermal boundary layer non-fully developed region when, Nu Saier coefficient and
Heat transfer coefficient numerical value is larger, good heat dissipation effect.But as time goes by, after thermal boundary layer reaches the region, the two
Numerical value reduce rapidly, heat dissipation effect reduces rapidly, thus is unable to reach high-power electronic component cooling requirements.For this purpose, having
Patent CN200410015286.7 proposes the silicon substrate microchannel heat exchanger with criss-cross microchannel, by lithographic method in silicon
On piece processes the criss-cross micro channel array of longitudinal triangle microchannel, horizontal trapezoid microchannel, by between streamwise
It arranges that intermittent interruption thermal boundary layer is carried out in lateral microchannel with having a rest, achievees the purpose that augmentation of heat transfer.But its vertical and horizontal is micro- logical
Road is the structure (triangle, trapezoidal) of open type, and the heat exchange area of fluid and microchannel is limited, and in silicon substrate using etching plus
Work forms, complex process, higher cost, is unfavorable for the production that inexpensive high-volume carries out micro-channel heat exchanger.
In addition, such as prior art CN201410419030.6 provides a kind of side for improving silicon microchannel plate surface topography
Method the steps include: that (1) after silicon microchannel plate completes etching, is allowed to form the thin rounded flakes of required size using laser cutting；
(2) SiO of upper 300~500nm is successively deposited in the two sides of silicon microchannel plate using PECVD2The Si of layer and 100~200nm3N4
Layer film, double-sided symmetrical uniform thickness；(3) it is aoxidized according to the sequence of the dry dry oxygen of oxygen-wet oxygen-, the temperature of oxidation is 900-1100
DEG C, at 15-20 minutes, the time of wet oxygen was controlled at 40-90 minutes for the time control of dry oxygen；The silicon for obtaining improving surface topography is micro-
Channel plate.This method complex process, higher cost, and it is unfavorable for the generation of micropin rib-nanowire structure.
Summary of the invention
It is an object of the invention to overcome the above-mentioned deficiency of existing micro-channel heat exchanger, providing one kind, there is micropin rib-to receive
The micro-channel heat exchanger of nanowire structure can significantly improve the heat exchange area of microchannel, increase the boiling nucleus of boiling, enhanced heat exchange.
The present invention also provides a kind of simple process, equipment requirement is low, low-cost there is micropin rib-nanowire structure microchannel to change
The manufacturing method of hot device.
The present invention is achieved through the following technical solutions:
It is a kind of with micropin rib-nanowire structure micro-channel heat exchanger, the micro-channel heat exchanger includes fitting up and down
Upper cover plate, metallic micro channel substrate together, be equipped among the metallic micro channel substrate it is several equidistantly arrange it is parallel
Array microchannel, one end of the microchannel connect the entrance of cooling working medium, and the other end of the microchannel connects cooling working medium
Outlet；The microchannel wall face has a large amount of micropin rib protrusions, and growth has a large amount of nanowire structures in the micropin rib protrusion.
As a preferred technical solution of the present invention, the micropin rib is sharp cone distal or water chestnut column construction.
As a preferred technical solution of the present invention, the microchannel is V-arrangement, trapezoidal, semicircular in shape.
As a preferred technical solution of the present invention, the microchannel material is copper or aluminium or stainless steel.
As a preferred technical solution of the present invention, the groove depth H size range of microchannel is between 0.4~1mm, two sides
The angle a range formed between wall surface is between 45~90 °.
Another object of the present invention is to provide a kind of above-mentioned with micropin rib-nanowire structure micro-channel heat exchanger
Manufacturing method, comprising the following steps:
1) sheet metal of two pieces of cleaned decontamination, drying is chosen as upper cover plate, metallic micro channel substrate；
2) it by one of sheet metal clamping to micro- milling machine tool, is processed equidistantly using micro- method for milling
Reservoir before and after the parallel array microchannel of arrangement and microchannel.
3) microchannel substrate is sequentially placed into the supersonic wave cleaning machine for filling dehydrated alcohol and deionized water, is cleaned
And it dries；
4) microchannel substrate is placed on to position on the workbench of low power pulse laser and is clamped, open laser,
Laser processing path is drawn in laser software, controls the moving area of laser facula, and laser is carried out to microchannel wall surface and is added
Work prepares the microchannel that wall surface has a large amount of micropin rib protrusions；
5) the microchannel substrate after laser processing is first placed in the supersonic wave cleaning machine for filling dilute hydrochloric acid and distilled water
It is cleaned, removes slag, then dry；
6) microchannel substrate is placed in Muffle furnace and is heated, cooled to room temperature with the furnace after keeping the temperature a period of time, obtain wall surface
Growth has the microchannel of a large amount of nano wires on micropin rib；
7) obtained microchannel substrate is attached with upper cover plate by soldering, and is connect with external adapter tube and water pump
At an entirety, a forced circulation circuit is formed, complete micro-channel heat exchanger is obtained.
As a preferred technical solution of the present invention, in step 4), the laser processing is to be in laser power
20~30W, scanning speed are 50~150mm/s, the process conditions that sweep span 5-20um, scanning times are 20~100 times
Under, first edge is parallel to the scanning of micro-tunnel length direction, then scans along perpendicular to micro-tunnel length direction, and obtaining wall surface has largely
The microchannel of micropin rib protrusion.
As a preferred technical solution of the present invention, in step 5), the microchannel plate after laser processing is first placed in
Fill and clean 20-50s in the supersonic wave cleaning machine of 0.8~1.2mol/L dilute hydrochloric acid, then by clean microchannel plate be placed in from
10~20min is cleaned in sub- water, is then placed in vacuum oven dry.
As a preferred technical solution of the present invention, in step 6), the microchannel substrate heats in Muffle furnace
To 300~700 DEG C, heating time is 60~75min, and soaking time is 6~8h.
Compared with prior art, the present invention its remarkable advantage is:
(1) the micropin rib structure that microchannel wall face generates destroys the normal development in boundary layer, plays good flow-disturbing and makees
With.Microchannel wall surface micropin rib-nano wire superposition micron and nanometer composite structure, significantly increases heat exchange area, significantly improves
The boiling nucleus of boiling, thus significant augmentation of heat transfer.
(2) there is micropin rib-nanowire structure microchannel, utilize the three-dimensional needlepoint-concave shape and great Bi of micropin rib
Face area, it can be achieved that nano surface line secured growth, effectively inhibit its nano surface line in micro-channel heat exchanger longtime running
Falling off in the process, thus steadily augmentation of heat transfer.
(3) using laser processing and the thermal oxidation process of low cost, it can be achieved that augmentation of heat transfer structure in microscale channel
Efficiently, low cost, securely preparation forming, to effectively compensate for the defect of traditional augmentation of heat transfer structure processing method.
Detailed description of the invention:
Fig. 1 is the schematic diagram of micro-channel heat exchanger.
Fig. 2 is the microchannel cross section dimensional drawing of different cross section shape.Wherein (a) is V-arrangement, (b) is trapezoidal, (c) is semicircle
Shape (d) is polygon.
Fig. 3 is the manufacturing method flow chart with micropin rib-nanowire structure micro-channel heat exchanger.
Fig. 4 is the schematic diagram that microchannel laser machines micropin rib.
Fig. 5 is the schematic diagram that the surface thermal oxide of microchannel micropin rib generates nano wire.
Fig. 6 is the SEM figure with micropin rib-nanowire structure microchannel.
Wherein, 11- upper cover plate, the microchannel 12- substrate, 131- micropin rib, 132- nano wire；21- laser beam, 22- are saturating
Mirror, 23- optically focused hot spot；31- Muffle furnace, 32- Muffle furnace pedestal.
Specific embodiment
Following embodiment will the present invention is further illustrated in conjunction with attached drawing, but the present invention is not limited to this.
As shown in connection with fig. 1, of the invention a kind of with micropin rib-nanowire structure micro-channel heat exchanger, it is described micro- logical
Road heat exchanger includes the upper cover plate 11 to fit together up and down, metallic micro channel substrate 12, in the metallic micro channel substrate 12
Between be equipped with several parallel array microchannels 13 equidistantly arranged, one end of the microchannel 13 connects the entrance of cooling working medium,
The other end of the microchannel connects the outlet of cooling working medium.The microchannel wall face has a large amount of micropin rib protrusions 131, described
Growth has a large amount of nanowire structures 132 in micropin rib protrusion.
Preferably, the micropin rib is sharp cone distal, water chestnut column construction.
Preferably, the microchannel is V-arrangement, trapezoidal, semicircle or polygonal shape.As shown in Fig. 2, the groove depth of microchannel
The angle a range that H size range is formed between 0.4~1mm, between two side walls between 45~90 °, specific size according to
Applicable situation is selected.
Preferably, the microchannel material is copper or aluminium or stainless steel.
In conjunction with Fig. 3, Fig. 4, Fig. 5, the present invention prepares a kind of system with micropin rib-nanowire structure micro-channel heat exchanger
Make method, comprising the following steps:
1) two block sizes of election are long 30mm × wide 15mm × high 1mm and long 30mm × wide 15mm × high 3mm copper plate, and
Cleaned decontamination, drying.Wherein having a size of long 30mm × wide 15mm × high 1mm copper plate as the upper of micro-channel heat exchanger
Cover board 11, long 30mm × wide 15mm × high 3mm copper plate is as microchannel substrate 12.
2) prepared by microchannel: by microchannel substrate 12 clamping to micro- milling machine tool, then using diameter for 0.1-
The slotting cutter of 0.3mm is in the parameter that feed speed is 100mm/min, back engagement of the cutting edge 0.1mm, the speed of mainshaft are 15000r/min
Under, 1.5mm, width 1.13mm, the parallel array V-arrangement microchannel structure that V-arrangement angle is 60 °, Yi Jiwei are divided between processing
Reservoir before and after channel.Wherein the size of parallel microchannels is long 20mm × wide 12mm.
3) it is cleaned and dried: the microchannel substrate after processing being sequentially placed into the supersonic wave cleaning machine for fill dehydrated alcohol and divided
Not Qing Xi 15min, then put it into vacuum oven dry；
4) it laser machines: microchannel substrate is fixed on the fixture of low power pulse laser, pass through laser beam 21
After lens 22 focus, the side wall surface that hot spot 23 projects V-arrangement microchannel is formed.Processing road is then drawn in corresponding software
Diameter controls the moving area of laser facula, and making laser path, first edge is parallel to micro-tunnel length direction scanning machining, then along vertical
In micro-tunnel length direction scanning machining, the microchannel structure that wall surface has micropin rib is obtained.The laser power of selection be 20~
30W, scanning speed are 50~150mm/s, and sweep span 5-20um, scanning times are 20~100 times.It is preferred that power is 21W,
Scanning speed is 100mm/s, and sweep span 5um, scanning times are 60 times.
5) the microchannel substrate after laser processing surface clean: is put into the ultrasound for filling 0.8~1.2mol/L dilute hydrochloric acid
20-50s is cleaned in wave cleaning machine, removes the oxide layer and impurity of microchannel surface.Again by clean microchannel plate be placed in from
10~20min is cleaned in sub- water, is then put it into vacuum oven and is taken out for use after drying.It is preferred that using 1mol/L is filled
20s is cleaned in the supersonic wave cleaning machine of dilute hydrochloric acid, sample is then taken out and is placed in the supersonic wave cleaning machine for fill deionized water clearly
Wash 20min.
6) thermal oxidative reaction: microchannel substrate is placed on the pedestal 32 of Muffle furnace 31, in air atmosphere, with 5-10
DEG C/rate of heat addition of min is heated to 300~700 DEG C, soaking time is 6~8h, then cools to room temperature with the furnace, obtains wall surface
Growth has the microchannel of a large amount of nano wires on micropin rib.It is preferred that being warming up to 500 DEG C with 8 DEG C/min, furnace cooling after 6h is kept the temperature.
7) micro-channel heat exchanger encapsulates: the upper surface of the lower surface of upper cover plate 11 and microchannel substrate 12 is fitted in one
It rises, encapsulation is sealed by soldering.The adapter tube and water pump that outside is connected on upper cover plate 11 connect into an entirety, form one
A forced circulation circuit, obtains complete micro-channel heat exchanger.
Fig. 6 is the micro- SEM figure with micropin rib-nanowire structure microchannel prepared, and wherein microchannel is V
Shape.It can be seen that generating a large amount of nanowire structures on micropin rib surface, good attachment is formed with micropin rib surface.
This is with micropin rib-nanowire structure micro-channel heat exchanger, the micropin rib structure generated due to microchannel wall face
The normal development for destroying boundary layer plays the role of good flow-disturbing.Microchannel wall surface micropin rib-nano wire superposition is micro-nano
Composite construction significantly increases heat exchange area, significantly improves the boiling nucleus of boiling, thus significant augmentation of heat transfer.In addition, sharp
With three-dimensional needlepoint-concave shape and the big wall surface area of micropin rib, it can be achieved that the secured growth of nano surface line, effectively inhibits it
Nano surface line falling off in micro-channel heat exchanger During Process of Long-term Operation, thus steadily augmentation of heat transfer.Utilize low cost
Laser processing and thermal oxidation process, it can be achieved that in microscale channel augmentation of heat transfer structure it is efficient, inexpensive, be securely prepared into
Shape, to effectively compensate for the defect of traditional augmentation of heat transfer structure processing method.
The present invention is not limited to the above embodiments, other are any without departing from spiritual essence and principle of the invention, right
The present invention carry out any simplification, modification be being included within the scope of the present invention for substitute mode.
Claims (9)
1. a kind of with micropin rib-nanowire structure micro-channel heat exchanger, it is characterised in that: the micro-channel heat exchanger includes
Upper cover plate, the metallic micro channel substrate to fit together up and down, the metallic micro channel substrate centre are equipped with several equidistant rows
The parallel array microchannel of column, one end of the microchannel connect the entrance of cooling working medium, the other end connection of the microchannel
The outlet of cooling working medium；The microchannel wall face has a large amount of micropin rib protrusions, and there is growth in the micropin rib protrusion largely receives
Nanowire structure.
2. as described in claim 1 a kind of with micropin rib-nanowire structure micro-channel heat exchanger, it is characterised in that: institute
Stating micropin rib is sharp cone distal or water chestnut column construction.
3. as described in claim 1 a kind of with micropin rib-nanowire structure micro-channel heat exchanger, it is characterised in that: institute
Stating microchannel is V-arrangement, trapezoidal, semicircle or polygonal shape.
4. as described in claim 1 a kind of with micropin rib-nanowire structure micro-channel heat exchanger, it is characterised in that: institute
Stating microchannel material is copper or aluminium or stainless steel.
5. as described in claim 1 a kind of with micropin rib-nanowire structure micro-channel heat exchanger, it is characterised in that: micro-
The angle a range that the groove depth H size range in channel is formed between 0.4~1mm, between two side walls is between 45~90 °.
6. a kind of described in any item manufacturers with micropin rib-nanowire structure micro-channel heat exchanger of claim 1-5
Method, which comprises the following steps:
1) sheet metal of two pieces of cleaned decontamination, drying is chosen as upper cover plate, metallic micro channel substrate；
2) by one of sheet metal clamping to micro- milling machine tool, equidistant arrangement is processed using micro- method for milling
Parallel array microchannel and microchannel before and after reservoir；
3) microchannel substrate is sequentially placed into the supersonic wave cleaning machine for filling dehydrated alcohol and deionized water, is cleaned and is dried
It is dry；
4) microchannel substrate is placed on to position on the workbench of low power pulse laser and is clamped, laser is opened, in laser
Laser processing path is drawn in device software, the moving area of laser facula is controlled, microchannel wall surface is laser machined, and is made
Standby wall surface out has the microchannel of a large amount of micropin rib protrusions；
5) the microchannel substrate after laser processing is first placed in the supersonic wave cleaning machine for filling dilute hydrochloric acid and distilled water and is carried out
Cleaning removes slag, then dries；
6) microchannel substrate is placed in Muffle furnace and is heated, cooled to room temperature with the furnace after keeping the temperature some time, obtain wall surface micropin
Growth has the microchannel of a large amount of nano wires on rib；
7) obtained microchannel substrate is attached with upper cover plate by soldering, and connects into one with external adapter tube and water pump
A entirety forms a forced circulation circuit, obtains complete micro-channel heat exchanger.
7. manufacturing method as claimed in claim 6, it is characterised in that: in step 4), the laser processing is in laser
Power is 20~30W, and scanning speed is 50~150mm/s, the work that sweep span 5-20um, scanning times are 20~100 times
Under the conditions of skill, first edge is parallel to the scanning of micro-tunnel length direction, then scans along perpendicular to micro-tunnel length direction, obtains wall surface tool
There is the microchannel of a large amount of micropin rib protrusions.
8. manufacturing method as claimed in claim 6, it is characterised in that: in step 5), by the microchannel plate after laser processing
It is first placed in the supersonic wave cleaning machine for filling 0.8~1.2mol/L dilute hydrochloric acid and cleans 20-50s, then clean microchannel plate is set
10~20min is cleaned in deionized water, is then placed in vacuum oven dry.
9. manufacturing method as claimed in claim 6, it is characterised in that: in step 6), the microchannel substrate is in Muffle furnace
In, 300~700 DEG C are heated to the rate of heat addition of 5-10 DEG C/min, soaking time is 6~8h, then cools to room temperature with the furnace.
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Cited By (8)
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| CN110572990A (en) * | 2019-09-12 | 2019-12-13 | 北京交通大学 | Impact cooling type corrugated surface composite enhanced heat dissipation device |
| CN111707116A (en) * | 2020-04-30 | 2020-09-25 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | Microchannel heat exchanger with multistage microchannels and manufacturing method thereof |
| CN111895814A (en) * | 2020-05-06 | 2020-11-06 | 上海交通大学 | Sine wave-shaped micro-channel heat exchanger with micro-concave-cavity structure and manufacturing method thereof |
| CN111958117A (en) * | 2020-08-26 | 2020-11-20 | 上海新潮雷特汽车科技有限公司 | Rib making method for shaft |
| CN112097545A (en) * | 2020-07-28 | 2020-12-18 | 厦门大学 | Intelligent thin-channel heat exchanger with built-in memory alloy spring |
| CN112484544A (en) * | 2019-10-30 | 2021-03-12 | 株式会社Cgi | Non-directional soaking plate |
| CN113363626A (en) * | 2021-05-19 | 2021-09-07 | 广东省科学院半导体研究所 | Battery and battery phase change heat management system and method |
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| CN111707116A (en) * | 2020-04-30 | 2020-09-25 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | Microchannel heat exchanger with multistage microchannels and manufacturing method thereof |
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| CN111895814A (en) * | 2020-05-06 | 2020-11-06 | 上海交通大学 | Sine wave-shaped micro-channel heat exchanger with micro-concave-cavity structure and manufacturing method thereof |
| CN112097545A (en) * | 2020-07-28 | 2020-12-18 | 厦门大学 | Intelligent thin-channel heat exchanger with built-in memory alloy spring |
| CN111958117A (en) * | 2020-08-26 | 2020-11-20 | 上海新潮雷特汽车科技有限公司 | Rib making method for shaft |
| WO2022095750A1 (en) * | 2020-11-06 | 2022-05-12 | 正海集团有限公司 | Heat dissipation structure of cooling plate for power semiconductor module |
| CN113363626A (en) * | 2021-05-19 | 2021-09-07 | 广东省科学院半导体研究所 | Battery and battery phase change heat management system and method |
| CN113363626B (en) * | 2021-05-19 | 2023-03-10 | 广东省科学院半导体研究所 | Battery and battery phase change heat management system and method |
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