CN108453398B - Carrier plate structure of planar marking material, laser equipment and use method thereof - Google Patents
Carrier plate structure of planar marking material, laser equipment and use method thereof Download PDFInfo
- Publication number
- CN108453398B CN108453398B CN201810223561.6A CN201810223561A CN108453398B CN 108453398 B CN108453398 B CN 108453398B CN 201810223561 A CN201810223561 A CN 201810223561A CN 108453398 B CN108453398 B CN 108453398B
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- Prior art keywords
- wire
- plastic chassis
- carrying
- ribs
- wires
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- 239000000463 material Substances 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 9
- 230000002093 peripheral effect Effects 0.000 claims abstract description 5
- 239000002699 waste material Substances 0.000 claims description 18
- 230000000149 penetrating effect Effects 0.000 claims description 9
- 238000002955 isolation Methods 0.000 claims description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical group [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 238000010330 laser marking Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000010009 beating Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a carrying disc structure of a plane marking material, laser equipment and a using method thereof, comprising a plastic chassis, wherein a placing disc covering the upper surface of the plastic chassis is arranged on the plastic chassis, the placing disc comprises a wire frame and carrying wires, the wire frame is fixedly arranged on the plastic chassis, a plurality of carrying wires are equidistantly arranged on one side surface of the wire frame in a net-shaped form, one end of the plastic chassis is opened, the opening is connected with the placing disc, and the peripheral edge of the opening extends upwards to form a surrounding groove wrapping the peripheral edge of the outer end of the wire frame so as to solve the defects that a common carrying disc cannot be matched with a linear motor and the moving speed is too slow.
Description
Technical Field
The invention relates to the technical field of laser marking equipment, in particular to a carrier disc structure of a planar marking material, laser equipment and a using method thereof.
Background
The laser marking equipment is to make permanent marks on the surfaces of different substances with laser beams, and make the surface layer substances evaporate to expose deep layer substances with laser beams, or to cause chemical and physical changes of the surface layer substances to mark marks, or to burn out part of the substances with light energy to show the needed etched patterns and characters. As in chinese patent CN 202656617U, an automatic laser marking machine is disclosed, in which a marking material is placed on a transmission mechanism, and then the marking material is moved by a transmission rod, although such a structure has a certain automaticity, the transmission mechanism has a slow moving speed, and cannot adapt to various operation requirements, especially when the marking material is paper, the paper needs to be quickly moved to avoid defective products or defective products due to thinner paper, meanwhile, the laser has a certain range limitation, if the moving speed of the paper is too slow, the marking effect is affected, and the marking precision is affected, while other marking devices in the prior art have a heavy structure of a carrier disc, the transmission mechanism is very complex, and the moving speed of the transmission mechanism is affected, and in addition, if the moving speed of the carrier disc is too fast, the generated waste is unfavorable for collecting, the scattered waste pollutes the environment, and the mechanical structure is possibly damaged.
Disclosure of Invention
The invention is made in view of the above problems, and by providing a carrying disc structure, the carrying disc structure is combined with a linear motor, the effect of rapid movement of the carrying disc structure under the drive of the linear motor is realized, and the collecting and centralized processing of waste materials are facilitated.
Preferably, the wire frame is regular quadrangle or round, the wire frame is provided with wire holes corresponding to the wire carrying positions, and the wire holes are vertically arranged on the wire frame in a manner of penetrating through the end faces of two sides of the wire frame.
Specifically, the wire hole of above-mentioned structure has guaranteed to carry the connection that the line can be fastened on the wire frame to, a plurality of wire holes are adjacent to be arranged and to be arranged stable in structure for a plurality of lines that carry on the one hand, and a plurality of lines that carry of on the other hand stable arrangement also can make wire frame overall structure more firm, and the vertical setting in line hole is also guaranteeing to carry the line and connects stable basis in addition.
Preferably, two ends of the carrying wire respectively pass through two wire holes corresponding to the positions of the carrying wire and are fixedly connected with the wire holes.
Specifically, the structure ensures that a plurality of carrying wires respectively penetrate through a plurality of wire holes, the tensioning degree of each carrying wire is identical, the stable structure of the placing plate is ensured, and in addition, the structure can fix the carrying wires in the wire holes, so that the service life of the placing plate is ensured.
Preferably, the carrying wire comprises a transverse carrying wire and a longitudinal carrying wire, a plurality of transverse carrying wires are arranged on the wire frame at equal intervals, a plurality of longitudinal carrying wires are arranged on the wire frame at equal intervals, the transverse carrying wires and the longitudinal carrying wires are distributed on the wire frame in a mutually perpendicular mode, and the transverse carrying wires are all located above or below the longitudinal carrying wires.
Specifically, the carrier wire of above-mentioned structure, under the structural support of horizontal carrier wire and indulging the carrier wire, can be stable support marking material, and mutually perpendicular distribution's setting is on the wire frame, in order to reduce the reflection furthest when laser beam is beaten the mark, reduce the defect that influences the marking effect, simultaneously, equidistant setting also is in order to reduce the laser beam refraction harm marking material's defect, and horizontal carrier wire all is located the top or the below of indulging the carrier wire, the stability of whole connection structure has been promoted, also guarantee when laser beam beaten, the laser beam of shining on horizontal carrier wire or indulging the carrier wire, can not be on refracting other indulging carrier wire or horizontal carrier wire, the secondary refraction has been avoided.
Preferably, the carrier wire is molybdenum wire.
Preferably, the diameter of the carrier wire is 0.3-1mm.
Specifically, the structure ensures that the whole weight of the placing plate is light, the placing plate can move quickly under the movement of the linear motor, the movement and the service life of the linear motor cannot be influenced by the weight, and meanwhile, enough supporting force is also provided.
Preferably, the intersections of the plurality of carrier wires form a carrier area for carrying the marking material, and the gaps between the plurality of carrier wires form a blanking area.
Specifically, above-mentioned structure, when marking, the finished product can be detained in carrying the thing district, gets into next process, and the waste material will fall into blanking district, guarantees the overall efficiency of equipment to owing to induced draft mechanism's effect, the waste material can get into the waste material chamber through blanking district, has also avoided the influence of waste material to equipment life and harm to external environment.
The invention also provides laser equipment, in particular, the laser equipment is provided with the carrier disc structure.
Preferably, the laser device comprises a frame body, a laser is arranged on the frame body, the carrier disc structure is arranged on the frame body below the laser, a linear motor is arranged below the carrier disc structure, the linear motor comprises a rotor and a stator, and the carrier disc structure is fixedly connected with the rotor;
the lower part of the carrying disc structure is provided with an air suction mechanism, the air suction mechanism is communicated with the inside of the carrying disc structure, and the lower part of the air suction mechanism is provided with a waste cavity.
Further, the invention also provides an operation step of the laser device with the tray structure, which comprises the following steps,
s1, sequentially penetrating a plurality of carrier wires through wire holes corresponding to the positions of the carrier wires, and fixedly connecting the carrier wires with the wire holes, wherein the carrier wires are fixed on the wire holes and combined with a regular quadrilateral or circular wire frame to form a net-shaped placing disc;
s2, placing the marking material on a placing disc, starting an air suction mechanism, and tightly adsorbing the marking material on the placing disc;
s3, operating a laser to process the marking material, and simultaneously, driving the carrier disc structure to move back and forth on the frame body by the linear motor;
s4, adsorbing the finished product of the marking material on the surface of the placing plate by an air suction mechanism, adsorbing the waste product of the marking material by the air suction mechanism, penetrating through the inside of the plastic chassis, entering a waste cavity, and finishing marking.
Advantageous effects
Above-mentioned year dish structure, overall structure is firm, and light in weight places the structure setting of dish, can guarantee to beat the mark material and put on placing the dish, also can guarantee under the effect of mechanism that induced drafts, beat the mark material steady and adsorb on placing the dish, simultaneously, after beating the mark, the waste material can be adsorbed to in the plastic chassis by the mechanism that induced drafts and enter into the waste material chamber.
The molybdenum wire carrying wire of the plastic chassis of the carrying disc structure is combined, so that the overall weight is reduced, and the carrying disc structure can move along with the linear motor conveniently.
Drawings
Fig. 1 is a perspective view showing a carrier tray structure of an embodiment.
Fig. 2 is a perspective view showing a placement tray of the embodiment.
Fig. 3 is an internal structure showing an enlarged view at a in fig. 2.
FIG. 4 is a schematic view showing the structure of a plastic chassis according to an embodiment.
Fig. 5 is a side view of a plastic chassis showing an embodiment.
Fig. 6 is a top view showing the plastic chassis of the embodiment.
Fig. 7 is an enlarged view showing a position B in fig. 4.
Fig. 8 is a schematic view showing the structure of the standing plate of the embodiment.
Fig. 9 is a schematic diagram showing a laser apparatus of an embodiment.
Detailed Description
The following is a further description of embodiments of the invention, taken in conjunction with the accompanying drawings:
examples
As shown in fig. 1 to 8, this embodiment provides a tray structure of planar marking material, including plastic chassis 1, be equipped with on the plastic chassis 1 and cover the tray 2 of placing of plastic chassis 1 upper surface, place tray 2 includes wire frame 21 and year line 22, wire frame 21 is fixed to be set up on the plastic chassis 1, a plurality of with the form equidistance of netted between carrying line 2 is established on one side surface of wire frame 21, plastic chassis 1 one end opening, the opening part is connected with placing tray 2, opening peripheral reason upwards extends the surrounding groove 11 that forms parcel wire frame 21 outer end edge.
The wire frame 21 is in a regular quadrilateral shape, the wire frame 21 is provided with a wire hole 23 corresponding to the position of the wire 22, and the wire hole 23 is vertically arranged on the wire frame 21 in a manner of penetrating through the end surfaces of two sides of the wire frame 21.
The two ends of the carrying wire 22 respectively pass through two wire holes 23 corresponding to the positions of the carrying wire and are fixedly connected with the wire holes 23.
The carrying wires 22 comprise transverse carrying wires 24 and longitudinal carrying wires 25, a plurality of transverse carrying wires 24 are equidistantly arranged on the wire frame 21, a plurality of longitudinal carrying wires 25 are equidistantly arranged on the wire frame 21, the transverse carrying wires 24 and the longitudinal carrying wires 25 are distributed on the wire frame 21 in a mutually perpendicular mode, and the transverse carrying wires 24 are located below the longitudinal carrying wires 25.
The carrier wire 22 is molybdenum wire. The carrier wire 22 has a diameter of 0.3-1mm, preferably 0.5mm, 0.7mm.
The intersections of the carrier wires 22 form a carrier region 26 for carrying the marking material, and the gaps between the carrier wires 22 form a blanking region 27.
As shown in the figure, the inner surface of the plastic chassis 1 is provided with a separation plate 12 in a manner of separating laser beams, the inner surface of the plastic chassis 1 is provided with a plurality of reinforcing ribs 13 in a manner of fixing the structure of the plastic chassis 1, and the bottom surface of the plastic chassis 1 is symmetrically provided with two air inlet holes 14.
The plastic chassis 1 is regular quadrangle, the strengthening rib 13 comprises a plurality of transverse ribs 131 and longitudinal ribs 132 which are perpendicularly and cross-connected, the transverse ribs 131 and the longitudinal ribs 132 are respectively and sequentially arranged on the bottom surface of the plastic chassis 1, the transverse ribs 131 and the longitudinal ribs 132 are respectively and simultaneously connected with the bottom surface and the side surface of the plastic chassis 1, the outer side of the plastic chassis 1 is provided with connecting ribs 15 corresponding to the positions of the transverse ribs 131 and the longitudinal ribs 132, and the connecting ribs 15 are simultaneously connected with the outer side surface of the plastic chassis 1 and the surrounding groove 11.
The intersection point of the transverse ribs 131 and the longitudinal ribs 132 is provided with a columnar connection point 133, and the distance between two adjacent connection points 133 is at least the same as the distance between the intersection points of the adjacent three transverse ribs 131 and the longitudinal ribs 132.
The isolation plate 12 is arranged on the plastic chassis 1 in a mode of being fixedly connected with the connecting point 133, and the isolation plate 12 is arranged above the transverse ribs 131 and the longitudinal ribs 132.
The isolation plate 12 is covered in the plastic chassis 1, and the edge of the isolation plate 12 is attached to the side surface of the plastic chassis 1.
The two end sides of the transverse rib 131 are the forward moving sides 134 of the plastic chassis 1, and the two end sides of the longitudinal rib 132 are the back moving sides 135 of the plastic chassis 1.
The transverse rib 131 near the back moving side 135 is provided with a back rib 136 which simultaneously connects the transverse rib 131 and the side surface of the plastic chassis 1.
The plurality of back ribs 136 are disposed along the length direction of the transverse ribs, and the back ribs 136 are disposed at intervals from the longitudinal ribs 132.
The back ribs 136 are disposed parallel to the longitudinal ribs 132.
As shown in the figure, the plastic chassis 1 is provided with a plurality of vertical plates 16 in a manner of supporting the placement tray 2, the vertical plates 16 are provided with vertical plates 17 in a manner of isolating laser beams, and the bottom surface of the plastic chassis 1 is symmetrically provided with at least two air inlet holes 14.
The riser 16 comprises two longitudinal risers 161 and a transverse riser 162, the transverse riser 162 and the longitudinal riser 161 being cross-connected.
The angle at which the transverse riser 162 intersects the longitudinal riser 161 is 90 °.
The heights of the transverse vertical plate 162 and the longitudinal vertical plate 161 are consistent, and the heights of the transverse vertical plate and the longitudinal vertical plate are consistent with the heights of the grooves in the plastic chassis 1 respectively.
The transverse vertical plate 162 comprises a transverse bottom plate 163 and a transverse top plate 164, the transverse bottom plate 163 is vertically arranged in the groove body and is simultaneously connected with the bottom surface and the side surface of the plastic chassis 1, and the transverse top plate 164 is vertically arranged above the transverse bottom plate 163 and has the same length as the transverse bottom plate 163;
the vertical plate 161 comprises a vertical bottom plate 165 and a vertical top plate 166, the vertical bottom plate 165 is vertically arranged in the groove body and is simultaneously connected with the bottom surface and the side surface of the plastic chassis 1, and the vertical top plate 166 is vertically arranged above the vertical bottom plate 165 and has the same length as the vertical bottom plate 165.
The cross sections of the transverse top plate 164 and the longitudinal top plate 166 are triangular, and the heights of the transverse top plate 164 and the longitudinal top plate 166 respectively correspond to the height of the surrounding groove 11.
The standing plates 17 are in an inverted V shape, the standing plates 17 are respectively buckled on the transverse top plate 164 and the longitudinal top plate 166, the opening ends of the standing plates 17 extend to the bottom of the plastic chassis 1, and a plurality of standing plates 17 are respectively covered on the surfaces of the transverse standing plates 162 and the longitudinal standing plates 161.
The included angle alpha at the top end of the vertical plate 17 is less than or equal to 10 degrees.
Further, as shown in fig. 9, the embodiment further provides a laser device, where the laser device includes a frame 3, a laser 4 is disposed on the frame 3, the carrier disc structure is disposed on the frame 3 below the laser 4, a linear motor 5 is disposed below the carrier disc structure, and the linear motor includes a mover and a stator, and the carrier disc structure is fixedly connected with the mover;
the lower part of the carrying disc structure is provided with an air suction mechanism 6, the air suction mechanism 6 is communicated with the inside of the carrying disc structure, and the lower part of the air suction mechanism 6 is provided with a waste cavity 7.
Further, for better explanation of the present embodiment, the working steps of the above-mentioned laser device are as follows,
s1, sequentially penetrating a plurality of carrying wires 22 through wire holes 23 corresponding to the positions of the carrying wires, and fixedly connecting the carrying wires with the wire holes 23, wherein the carrying wires 22 are fixed on the wire holes 23 and combined with a regular quadrilateral wire frame 21 to form a net-shaped placing disc 2;
s2, placing the marking material on the placing plate 2, starting an air suction mechanism 6, and tightly adsorbing the marking material on the placing plate 2;
s3, the laser 4 operates to process the marking material, and meanwhile, the linear motor 5 drives the carrier disc structure to move back and forth on the frame body 3;
s4, adsorbing the finished product of the marking material on the surface of the placing plate 2 by an air suction mechanism 6, adsorbing the waste product of the marking material by the air suction mechanism 6, penetrating through the inside of the plastic chassis 1 and entering a waste cavity 7, and finishing marking.
Variations and modifications to the above would be obvious to persons skilled in the art to which the invention pertains from the foregoing description and teachings. Therefore, the invention is not limited to the specific embodiments disclosed and described above, but some modifications and changes of the invention should be also included in the scope of the claims of the invention. In addition, although specific terms are used in the present specification, these terms are for convenience of description only and do not limit the present invention in any way.
Claims (7)
1. The utility model provides a year dish structure of marking material is beaten to plane, includes the plastic chassis, be equipped with the cover on the plastic chassis the placing plate of plastic chassis upper surface, its characterized in that: the placing tray comprises a wire frame and carrying wires, the wire frame is fixedly arranged on the plastic chassis, a plurality of carrying wires are equidistantly arranged on one side surface of the wire frame in a net-shaped mode, one end of the plastic chassis is provided with an opening, the opening is connected with the placing tray, and the peripheral edge of the opening extends upwards to form a surrounding groove for wrapping the peripheral edge of the wire frame;
the wire frame is regular quadrangle or round, the wire frame is provided with a wire hole corresponding to the wire carrying position, and the wire hole is vertically arranged on the wire frame in a manner of penetrating through the end surfaces of two sides of the wire frame;
the two ends of the carrying wire respectively pass through two wire holes corresponding to the positions of the carrying wire and are fixedly connected with the wire holes;
the carrying wires comprise transverse carrying wires and longitudinal carrying wires, a plurality of transverse carrying wires are equidistantly arranged on the wire frame, a plurality of longitudinal carrying wires are equidistantly arranged on the wire frame, the transverse carrying wires and the longitudinal carrying wires are mutually vertically distributed on the wire frame, and the transverse carrying wires are all positioned above or below the longitudinal carrying wires;
the inner surface of the plastic chassis is provided with a separation plate in a mode of separating laser beams, and the inner surface of the plastic chassis is provided with a plurality of reinforcing ribs in a mode of fixing the plastic chassis structure;
the plastic chassis is regular quadrangle, the reinforced ribs comprise transverse ribs and longitudinal ribs which are vertically and cross-connected, a plurality of the transverse ribs and a plurality of the longitudinal ribs are respectively and sequentially arranged on the bottom surface of the plastic chassis, the transverse ribs and the longitudinal ribs are respectively and simultaneously connected with the bottom surface and the side surface of the plastic chassis, the outer side of the plastic chassis is provided with connecting ribs corresponding to the positions of the transverse ribs and the longitudinal ribs, and the connecting ribs are simultaneously connected with the outer side surface and the surrounding groove of the plastic chassis;
a columnar connecting point is arranged at the intersection point of the transverse ribs and the longitudinal ribs, and the distance between two adjacent connecting points is at least the same as the distance between the intersection points of the adjacent three transverse ribs and the longitudinal ribs;
the isolation plate is fixedly connected with the connecting point and arranged on the plastic chassis, and the isolation plate is arranged above the transverse ribs and the longitudinal ribs;
the isolation plate is covered in the plastic chassis, and the edge of the isolation plate is attached to the side face of the plastic chassis;
the plastic chassis is provided with a plurality of vertical plates in a manner of supporting the placing plate, the vertical plates are provided with vertical plates in a manner of isolating laser beams, and at least two air inlet holes are symmetrically formed in the bottom surface of the plastic chassis.
2. The tray structure according to claim 1, wherein: the carrier wire is molybdenum wire.
3. The tray structure according to claim 2, wherein: the diameter of the carrier wire is 0.3-1mm.
4. The tray structure according to claim 1 or 2, wherein: the intersection of a plurality of carrying lines is formed into a carrying area for carrying marking materials, and the gaps among a plurality of carrying lines are formed into blanking areas.
5. A laser device, wherein the laser device is provided with a carrier disc structure of a planar marking material according to claim 1.
6. A laser device as claimed in claim 5, wherein: the laser device comprises a frame body, a laser is arranged on the frame body, the support disc structure is arranged on the frame body below the laser, a linear motor is arranged below the support disc structure, the linear motor comprises a rotor and a stator, and the support disc structure is fixedly connected with the rotor;
the lower part of the carrying disc structure is provided with an air suction mechanism, the air suction mechanism is communicated with the inside of the carrying disc structure, and the lower part of the air suction mechanism is provided with a waste cavity.
7. A method for using a laser device, applied to a laser device as claimed in claim 5 or 6, characterized in that: comprises the steps of,
s1, sequentially penetrating a plurality of carrier wires through wire holes corresponding to the positions of the carrier wires, and fixedly connecting the carrier wires with the wire holes, wherein the carrier wires are fixed on the wire holes and combined with a regular quadrilateral or circular wire frame to form a net-shaped placing disc;
s2, placing the marking material on a placing disc, starting an air suction mechanism, and tightly adsorbing the marking material on the placing disc;
s3, operating a laser to process the marking material, and simultaneously, driving the carrier disc structure to move back and forth on the frame body by the linear motor;
s4, adsorbing the finished product of the marking material on the surface of the placing plate by an air suction mechanism, adsorbing the waste product of the marking material by the air suction mechanism, penetrating through the inside of the plastic chassis, entering a waste cavity, and finishing marking.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810223561.6A CN108453398B (en) | 2018-03-19 | 2018-03-19 | Carrier plate structure of planar marking material, laser equipment and use method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810223561.6A CN108453398B (en) | 2018-03-19 | 2018-03-19 | Carrier plate structure of planar marking material, laser equipment and use method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108453398A CN108453398A (en) | 2018-08-28 |
| CN108453398B true CN108453398B (en) | 2023-11-14 |
Family
ID=63237013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810223561.6A Active CN108453398B (en) | 2018-03-19 | 2018-03-19 | Carrier plate structure of planar marking material, laser equipment and use method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108453398B (en) |
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| CN201346752Y (en) * | 2009-01-22 | 2009-11-18 | 华中科技大学 | Special vacuum chuck for flexible printed circuit (FPC) board |
| CN103492118A (en) * | 2012-03-16 | 2014-01-01 | 松下电器产业株式会社 | Laser processing device and laser processing method |
| CN203739432U (en) * | 2014-03-13 | 2014-07-30 | 广州创乐激光设备有限公司 | Laser marking equipment cabinet |
| CN204584547U (en) * | 2015-01-30 | 2015-08-26 | 深圳市领略数控设备有限公司 | A kind of Flat bed laser marking system |
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| CN208427861U (en) * | 2018-03-19 | 2019-01-25 | 广州新可激光设备有限公司 | A kind of novel carrying disc structure of plane mark material |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6881924B2 (en) * | 2003-07-18 | 2005-04-19 | Great Computer Corp. | Structure of platform and air-collecting bin in a laser-cutting/engraving machine |
| JP2005125359A (en) * | 2003-10-23 | 2005-05-19 | Honda Motor Co Ltd | Groove machining method by laser beam |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4555610A (en) * | 1983-09-13 | 1985-11-26 | Data Card Corporation | Laser machining system |
| US5303081A (en) * | 1992-05-15 | 1994-04-12 | Sumitomo Electric Industries, Ltd. | Laser beam scanner |
| JP2002239774A (en) * | 2001-02-14 | 2002-08-28 | Hitachi Metals Ltd | Tool for laser beam machining |
| CN201346752Y (en) * | 2009-01-22 | 2009-11-18 | 华中科技大学 | Special vacuum chuck for flexible printed circuit (FPC) board |
| CN103492118A (en) * | 2012-03-16 | 2014-01-01 | 松下电器产业株式会社 | Laser processing device and laser processing method |
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| CN204584547U (en) * | 2015-01-30 | 2015-08-26 | 深圳市领略数控设备有限公司 | A kind of Flat bed laser marking system |
| CN105798469A (en) * | 2016-05-16 | 2016-07-27 | 广州广源激光科技有限公司 | Multi-laser-head laser cutting machine |
| CN208427861U (en) * | 2018-03-19 | 2019-01-25 | 广州新可激光设备有限公司 | A kind of novel carrying disc structure of plane mark material |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108453398A (en) | 2018-08-28 |
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