JP5691004B2 - Laser processing apparatus and laser processing method - Google Patents

Description

  The present invention relates to a laser processing apparatus that performs processing by irradiating a workpiece with a laser, and more particularly to a laser processing apparatus that performs through-hole processing (through-hole processing).

  In recent years, with the miniaturization, high integration, and modularization of parts, drilling of the base material of those components has become increasingly smaller, and it has become difficult to cope with this reduction in diameter using conventional processing methods. I came. In order to solve these problems and cope with the reduction in diameter, drilling using a laser is increasing. There are two types of drilling of a workpiece by laser, which are roughly classified into two types: through-hole processing for forming a through hole in the workpiece and blind hole processing for forming a non-through hole in the workpiece.

  FIG. 10 is a side view showing the configuration of the workpiece mounting portion of the first example of the laser processing apparatus according to the prior art.

  As shown in FIG. 10, the workpiece 811 is placed on the upper part of the divided placing portion 821. The divided mounting portion 821 has a structure that can be individually moved in the vertical direction, and is moved up and down by an elevation drive unit (not shown) such as an air cylinder.

  At the time of blind hole processing, the mounting portion 821 is in a state where all the suction portions are raised. Then, the work piece 811 is sucked and fixed using the entire surface of the mounting portion 821 and processed. At the time of through-hole processing, as shown in FIG. 10, laser processing is performed in a state where only the divided mounting portion 821 corresponding to the lower portion of the portion 812 that is the processing target of the workpiece 811 is lowered. .

  With the configuration described above, damage to the mounting portion 821 due to laser during through-hole processing is prevented while maintaining the flatness of the workpiece 811 (see, for example, Patent Document 1).

  FIG. 11 is a perspective view showing a configuration of a second example of the laser processing apparatus according to the related art.

  As shown in FIG. 11, the chuck 902 sandwiches and holds a thin plate-shaped workpiece 901 formed of a soft member on two sides. A tension device 903 applies a tensile force to the workpiece 901 sandwiched by the chuck 902. The workpiece 901 is held by the chuck 902 and the tension device 903. The moving device 904 moves the workpiece 901. The dust collecting device 905 is provided on the back side of the surface irradiated with the laser beam with a size covering the entire processing region, and has a stop device 906 for stopping the gas flow inside the dust collecting device 905. The two holding devices 907 respectively hold the sides of the workpiece 901 in the direction perpendicular to the side on which the tensile force by the tensioning device 903 acts. The adjusting device 908 moves one of the holding devices 907 in a direction perpendicular to the tensile force.

  With the above-described configuration, the workpiece 901 is pulled by the holding device 903 and the holding device 907 to maintain a flat surface while applying a tensile force to the workpiece 901. The workpiece 901 is moved to the machining area while being held by the pulling device 903 and the holding device 907. Thereby, the laser processing can be performed while maintaining the flat surface without touching the back surface of the through-hole processing portion of the workpiece 901 (for example, see Patent Document 2).

  In recent years, for more precise processing and higher integration, the thickness of plate-like workpieces has become thinner, and the diameter of holes to be processed has also become smaller. For example, a resin film having a thickness of about 100 μm or a metal foil having a thickness of several tens of μm is a processing target.

  In the configuration of the laser processing apparatus according to the prior art of the first example described above, during the through hole processing, the laser processing is performed in a state where the suction portion corresponding to the lower part of the processing of the workpiece is lowered. Although the target, the workpiece is not held flat.

  Therefore, although the mounting portion is not damaged by the laser, in the case of a thin sheet-like or foil-like workpiece as described above, a dent is generated so that the corresponding portion hangs down due to its own weight. As a result, the flatness of the processed part is deteriorated. Deterioration of flatness results in deviation of laser focus and machining position, which hinders precise machining. That is, the desired precision processing cannot be performed.

  In the configuration of the laser processing apparatus according to the second example of the related art, the plane is held by pulling two opposite sides of the workpiece. As described above, in the case of a thin sheet-like or foil-like workpiece, the material is stretched by being pulled. As a result, the processing position of the workpiece is shifted or wrinkles are generated, and precise processing is difficult as in the first example.

International Publication No. 2009/001497 JP 2009-006356 A

  The present invention provides a laser processing apparatus and a laser processing method capable of performing highly accurate laser processing even for a sheet-like workpiece having a very thin thickness.

A laser processing apparatus according to the present invention includes a machining head unit that laser-processes a workpiece, a mounting unit that has a plurality of divided movable mounting units that move up and down, and holds the workpiece. A processing table that drives the mounting unit in the X direction and the Y direction, an upper surface suction device that is located above the workpiece and sucks the upper surface of the workpiece, and a drive unit that drives the upper surface suction device up and down And a pair of the upper surface adsorption devices are provided, and each of them is driven up and down independently, and the longitudinal direction of the upper surface adsorption device is perpendicular to the longitudinal direction of the movable mounting portion. And the size of the upper surface suction device in the longitudinal direction is set larger than the width of the movable mounting portion . In addition, the laser processing apparatus of the present invention includes a processing head unit that performs laser processing on a workpiece, a mounting unit that has a plurality of divided movable mounting units that move up and down, and holds the workpiece. A processing table for driving the mounting portion in the X direction and the Y direction, an upper surface suction device that is positioned above the workpiece and sucks the upper surface of the workpiece, and the upper surface suction device is driven up and down. A pair of upper surface adsorption devices, and each of them is moved up and down independently.
The upper surface adsorption device is configured to be driven so that the longitudinal direction of the upper surface adsorption device is perpendicular to the longitudinal direction of the movable placement portion, and the size of the upper surface adsorption device in the longitudinal direction of the movable placement portion is set. The configuration is set to be small with respect to the width.

  With this configuration, the vicinity of the processing area of the work piece is held above the upper surface adsorption device, so that even highly thin sheet-like work pieces can be processed with high precision and with very little deflection. It can be performed. Thereby, the processing defect accompanying the accuracy defect can be reduced.

The laser processing method of the present invention is a laser processing method for processing a workpiece using the laser processing apparatus described above, and moves the processing area of the workpiece by driving the mounting portion with a processing table. In this case, the method includes a step of raising and lowering the upper surface adsorption device.

  By this method, even a sheet-like workpiece having a very thin thickness can be subjected to highly accurate laser processing with very little deflection.

The laser processing method of the present invention is a laser processing method for processing a workpiece using the laser processing apparatus described above, and moves the processing area of the workpiece by driving the mounting portion with a processing table. When laser processing is performed with the upper surface suction device disposed at least in the traveling direction of the processing area lowered until all of the processing area where one of the plurality of movable mounting parts is lowered is laser processed. This is a laser processing method.

  By this method, even a sheet-like workpiece having a very thin thickness can be subjected to highly accurate laser processing with very little deflection.

The laser processing method of the present invention is a laser processing method for processing a workpiece using the laser processing apparatus described above, and moves the processing area of the workpiece by driving the mounting portion with a processing table. In this case, the upper surface adsorption device is arranged at least in the traveling direction of the machining area until all of the machining area immediately before the machining area in which one of the plurality of movable mounting parts is lowered is completely laser machined. The laser processing is performed in a state where the laser processing is performed while the laser processing is performed with the upper surface suction device being lifted.

  By this method, even a sheet-like workpiece having a very thin thickness can be subjected to highly accurate laser processing with very little deflection.

  By setting it as such a structure or method, the process area vicinity of a workpiece is hold | maintained above an upper surface adsorption | suction apparatus. As a result, even a sheet-like workpiece having a very thin thickness can be subjected to highly accurate laser processing with very little deflection, and processing defects due to poor accuracy can be reduced.

The perspective view which shows schematic structure of the laser processing apparatus which concerns on an example of Embodiment 1 of this invention. The side view which looked at the laser processing apparatus which concerns on an example of Embodiment 1 of this invention from the Y direction The side view which looked at the laser processing apparatus which concerns on an example of Embodiment 1 of this invention from the X direction The side view which shows the raising / lowering state of the upper surface adsorption | suction apparatus which concerns on an example of Embodiment 1 of this invention. The side view which shows the raising / lowering state of the upper surface adsorption | suction apparatus which concerns on an example of Embodiment 1 of this invention. The side view which shows the detailed structure of the upper surface adsorption | suction apparatus which concerns on an example of Embodiment 1 of this invention. The side view which shows the detailed structure of the upper surface adsorption | suction apparatus which concerns on an example of Embodiment 1 of this invention. The side view which shows the detail of a different structure of the upper surface adsorption | suction apparatus which concerns on an example of Embodiment 1 of this invention. The side view which shows the detail of a different structure of the upper surface adsorption | suction apparatus which concerns on an example of Embodiment 1 of this invention. The figure which shows the effect of the upper surface adsorption | suction of the upper surface adsorption | suction apparatus which concerns on an example of Embodiment 1 of this invention. The figure which shows the effect of the upper surface adsorption | suction of the upper surface adsorption | suction apparatus which concerns on an example of Embodiment 1 of this invention. The layout which shows an example of the setting of the processing area of the to-be-processed object which concerns on Embodiment 2 of this invention The layout which shows an example of the setting of the processing area of the to-be-processed object which concerns on Embodiment 2 of this invention The side view which shows the raising / lowering state from which the upper surface adsorption | suction apparatus which concerns on an example of Embodiment 2 of this invention differs. The side view which shows the raising / lowering state from which the upper surface adsorption | suction apparatus which concerns on an example of Embodiment 2 of this invention differs. The side view which shows the raising / lowering state from which the upper surface adsorption | suction apparatus which concerns on an example of Embodiment 2 of this invention differs. Side view showing the configuration of the mounting portion of the laser processing apparatus according to the prior art The perspective view which shows the holding state of the workpiece of the laser processing apparatus which concerns on a prior art

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same components are denoted by the same reference numerals, and the description thereof may be omitted.

(Embodiment 1)
FIG. 1 is a perspective view showing a schematic configuration of a laser processing apparatus 100 according to an example of Embodiment 1 of the present invention. 2 is a side view of the laser processing apparatus 100 as viewed from the Y direction, and FIG. 3 is a side view of the laser processing apparatus 100 as viewed from the X direction.

  As shown in FIG. 1, the laser oscillator 101 emits a laser 102 by emitting a laser therein. The traveling direction of the emitted laser 102 is changed by a mirror 103. A collimator lens 104 for adjusting the beam diameter of the laser 102 is disposed in the traveling direction of the laser 102 whose traveling direction has been changed by the mirror 103. Further, a mask 105 for shaping the beam shape of the laser 102 that has passed through the collimator lens 104 and an iris 106 for suppressing the miscellaneous light of the laser 102 that has passed through the mask 105 are arranged.

  The laser beam 102 that has passed through the iris 106 is processed by a galvano X mirror 109 for oscillating in the X axis direction and a galvano Y mirror 110 for oscillating the laser beam 102 reflected by the galvano X mirror 109 in the Y axis direction. Positioned on the position to be irradiated on 111. Further, the laser processing apparatus 100 is configured such that the laser 102 reflected by the galvano Y mirror 110 is condensed by the fθ lens 107 and irradiated to the processing point of the workpiece 111.

  A control controller 108 for controlling the galvano X mirror 109, the galvano Y mirror 110, and the laser oscillator 101 is provided.

  A plurality of workpieces 111 are placed on a plurality of movable placement parts 121 and outer circumference placement parts 123. The mounting unit 120 includes the movable mounting unit 121 and the outer peripheral mounting unit 123. The movable mounting portion 121 is provided with a plurality of mounting portion suction holes 122, and the outer peripheral mounting portion 123 is also provided with an outer peripheral suction hole 124. The workpiece 111 is sucked and held by evacuating from the lower portion of the placement portion 120 by the placement portion suction hole 122 and the outer periphery suction hole 124.

  The movable mounting parts 121 are each supported by a pair of movable mounting part lifting cylinders 125. In this embodiment, the movable mounting unit elevating cylinder 125 uses an air cylinder controlled by air pressure, and the individual movable mounting units 121 of the plurality of movable mounting units 121 can be moved up and down independently. it can.

  As shown in FIG. 2, a space between the movable mounting portion 121 that holds the workpiece 111 and the processing table 115 is a lower dust suction device 112, and the air flow 113 causes the workpiece 111 to be processed during laser processing. It has the function of collecting the processing waste generated in the lower part.

  An upper dust suction device 130 is installed on the laser irradiation surface side above the workpiece 111. The upper dust suction device 130 is provided so as to surround the irradiation range of the laser 102 controlled by the galvano X mirror 109 and the galvano Y mirror 110. The upper dust suction device 130 collects and discharges processing waste generated at the upper part of the workpiece 111 during laser processing by sucking the air inside through a hole provided in a part thereof.

  A pair of upper surface suction devices 131 and 132 and an upper surface suction device elevating cylinder 133 for moving the upper surface suction devices 131 and 132 up and down are attached to the upper dust suction device 130. In the present embodiment, the upper surface suction device elevating cylinder 133 is configured so that the individual upper surface suction devices 131 and 132 can be moved up and down independently using an air cylinder.

  The configuration of the laser processing apparatus 100 according to the present embodiment will be described in more detail with reference to FIGS.

  First, as shown in FIG. 2, the processing table 115 is mainly composed of two blocks, a Y table 116 and an X table 118.

  The Y table 116 is configured to mount the movable mounting portion 121, the outer peripheral mounting portion 123, the lower dust suction device 112, and a set of configurations associated therewith, and to move in the Y direction. The movement in the Y direction is performed by driving the Y-axis movement motor 117 to rotate the ball screw and sliding the Y table 116 along with the entire set mounted thereon.

  The X table 118 is configured to further mount the Y table 116 and a set of components mounted thereon and move in the X direction. The movement in the X direction is performed by driving the X axis movement motor 119 to rotate the ball screw and sliding the X table 118 along with the entire set mounted thereon.

  Next, as shown in FIG. 3, the direction of the galvano X mirror 109, the galvano Y mirror 110, and the laser 102 that reflects the laser 102 and controls the irradiation position is set to be perpendicular to the surface of the workpiece 111. The light fθ lens 107 is installed in the processing head unit 135.

  The machining head unit 135 is attached to a Z slider 136, and the Z slider 136 is movable in the Z direction, that is, the vertical direction by driving a Z axis movement motor 137. The Z slider 136 and the Z axis movement motor 137 are installed on the main body frame 140.

  The upper dust absorber 130 is also fixed to the main body frame 140. For this reason, the positional relationship between the upper dust suction device 130 and the device main body is fixed. The upper surface suction device elevating cylinder 133 is fixed to the upper dust suction device 130, and the upper surface suction devices 131 and 132 can be moved up and down by controlling the air pressure.

  The upper surface suction devices 131 and 132 are configured to be able to suck the workpiece 111 from the laser irradiation surface side of the workpiece 111, that is, from the upper surface. For example, in the present embodiment, the workpiece 111 is configured to be sucked from the upper surface by providing suction holes on the surface in contact with the workpiece 111 and performing vacuuming. The driving unit 150 that drives the upper surface suction devices 131 and 132 to move up and down includes an upper surface suction device lifting cylinder, a Z slider 136, and a Z axis moving motor 137.

  The operation of the laser processing apparatus 100 configured as described above will be described.

  In mounting the workpiece 111 on the laser processing apparatus 100, first, the mounting portion suction hole 122 and the outer peripheral suction hole 124 are stopped by being evacuated, and the movable placement portion 121 and the upper surface suction device 131 are not sucked. , 132 are all raised. And the mounting part 120 is moved to the mounting position of a workpiece by moving the processing table 115.

  After the workpiece 111 is mounted on the mounting portion 120, the mounting portion suction hole 122 and the outer periphery suction hole 124 are evacuated to suck and hold the lower surface of the workpiece 111.

  After holding the workpiece 111 is completed, the following operation is started. The movement of the machining table is started in order to move the mounting portion 120 holding the workpiece 111 to the first machining area. The movement of the processing head unit 135 at the origin position to the focal position is started. Here, the machining head unit 135 moves only along the Z-axis direction. Only the movable mounting portion 121 on the lower surface of the first processing area is switched to blow to evacuate the mounting portion suction hole 122 provided in the movable mounting portion 121, and the lower surface of the workpiece 111 at the corresponding portion is switched to blow. The suction holding is stopped and the movable mounting portion 121 is lowered. These operations are performed in parallel.

  Each processing area is set within the scan range of the galvanometer mirror (galvano X mirror 109 and galvano Y mirror 110), and laser processing positioning in the area is performed by controlling the galvanometer mirror.

  After the above operation is completed and the first processing area of the workpiece 111 arrives at a position where the processing head unit 135 and the upper dust suction device 130 are located, the upper surface suction devices 131 and 132 are moved down to Adhere to the surface.

  4A and 4B are side views showing the up-and-down state of the upper surface adsorption device according to an example of Embodiment 1 of the present invention. 5A and 5B are side views showing a detailed configuration of the upper surface adsorption device according to an example of Embodiment 1 of the present invention. 6A and 6B are side views showing details of different configurations of the upper surface adsorption device according to an example of Embodiment 1 of the present invention.

  The state shown in FIG. 4A is a state where the upper surface adsorption devices 131 and 132 are raised, and the state shown in FIG. 4B is a state where the upper surface adsorption devices 131 and 132 are lowered and are brought into close contact with the surface of the workpiece 111.

  When the upper surface adsorption devices 131 and 132 are lowered as shown in FIG. 4B, the upper surface adsorption of the workpiece 111 is started. The detailed configuration and operation are shown in FIG.

  5A is a side view of the state in which the upper surface adsorption devices 131 and 132 are lowered from the Y direction, and FIG. 5B is a side view of the state in which the upper surface adsorption devices 131 and 132 are lowered from the X direction. A pair of upper surface suction device lifting cylinders 133 provided in a pair are fixed to the upper dust suction device 130. The upper surface adsorption device lifting / lowering cylinder 133 is constituted by an air cylinder, and the upper surface adsorption devices 131 and 132 can be moved up and down by controlling the air pressure via the air tube 141. Here, the upper surface suction devices 131 and 132 are both lowered.

  The upper surface adsorption devices 131 and 132 are provided with upper surface adsorption holes 142 so that the workpiece 111 can be adsorbed from the surface of the workpiece 111 on the laser irradiation side, that is, the upper surface. After lowering the upper surface adsorption devices 131 and 132, the workpiece 111 is adsorbed from the upper surface by evacuating through the air tube 143.

  As shown in FIG. 5A, the longitudinal direction of the outer shape of the upper surface suction devices 131 and 132 is provided in a direction perpendicular to the longitudinal direction of the movable mounting portion 121. In the present embodiment, the longitudinal direction of the upper surface suction devices 131 and 132 is the X-axis direction, and the longitudinal direction of the movable mounting portion 121 is the Y-axis direction.

  And it is good to set the magnitude | size of the longitudinal direction of the upper surface adsorption | suction apparatuses 131 and 132 slightly smaller than the width | variety of the one movable mounting part 121. FIG. In this way, when the upper surface suction devices 131 and 132 are lowered, the workpiece 111 is sandwiched between the movable mounting portion 121 and the upper surface suction devices 131 and 132 without being deformed or damaged. Surface accuracy around the upper surface suction devices 131 and 132 on the upper surface of the workpiece 111 can be ensured.

  Here, the slightly smaller setting may be set within a range in which the workpiece 111 is not damaged due to the driving accuracy of the laser processing apparatus 100, the thickness of the workpiece 111, and variations thereof. For example, if the width of the movable mounting portion 121 is set to 50 mm, a range from 47 mm to 49 mm, particularly 48 mm may be set as the reference dimension.

  Alternatively, as shown in FIGS. 6A and 6B, the size of the upper surface suction devices 131 and 132 in the longitudinal direction can be set larger than the width of the movable mounting portion 121. In this way, it is necessary to raise the upper surface suction devices 131 and 132 each time the workpiece 111 moves, but the amount of lowering of the upper surface suction devices 131 and 132 is not precisely controlled until the workpiece 111 comes into contact with the workpiece 111. Lower and start adsorption. Only in this way, the surface accuracy around the upper surface suction devices 131 and 132 of the workpiece 111 can be ensured.

  7A and 7B are diagrams showing the effect of upper surface adsorption of the upper surface adsorption device according to an example of Embodiment 1 of the present invention. FIG. 7A shows the operation of the upper surface adsorption devices 131 and 132 configured as shown in FIGS. 5A and 5B or FIGS. 6A and 6B. FIG. 7A shows a state of the workpiece 111 when the upper surface suction devices 131 and 132 are not provided. For example, consider a case where the workpiece 111 is a sheet-like substrate having a thickness of 100 μm or less in which glass epoxy is sandwiched between PET (polyethylene terephthalate) films. In this case, if the width of the movable mounting portion 121 is 50 mm, the deformation amount is on the order of several tens of μm, and the focus shift in the Z-axis direction and the positions in the X-axis direction and the Y-axis direction corresponding to this deformation amount. The deviation has a great influence on precision machining. That is, these deviations in focus or misalignment hinder precise machining and cause machining defects.

  However, in the laser processing apparatus 100 of the present invention, as shown in FIG. 7B, the upper surface suction devices 131 and 132 suck the upper surface of the workpiece 111 in the vicinity of the processing area. Thereby, even if the movable mounting part 121 is absent in the processing area, the deformation of the workpiece 111 can be prevented.

  As described above, after the preparation in the first processing area is completed, the galvano X mirror 109 and the galvano Y mirror 110 are controlled to start irradiation of the laser 102 at the hole processing position. When irradiation with a predetermined laser is completed and all holes in the first processing area are completed, evacuation of the upper surface suction hole 142 is stopped and suction holding of the workpiece 111 is stopped. Thereafter, the upper surface adsorption devices 131 and 132 are raised to return to the state shown in FIG. 4A.

  Next, in order to move to the second machining area, the machining table 115 is moved in the Y direction in the present embodiment. In the second processing area, the procedure of a series of operations from the lowering of the upper surface adsorption devices 131 and 132, the adsorption, the laser hole machining, the suspension of the adsorption, and the raising of the upper surface adsorption devices 131 and 132 is as described above. As described above, the processing is repeated until the laser processing is completed for all the processing areas where one movable mounting portion 121 is lowered.

  When the laser processing of all the processing areas in which one movable mounting portion 121 of the plurality of movable mounting portions 121 is lowered is finished, the vacuum suction of the upper surface suction hole 142 is stopped and the workpiece 111 is sucked and held. Stop. Thereafter, the upper surface adsorption devices 131 and 132 are raised and returned to the state shown in FIG. 4A.

  When the upper surface suction devices 131 and 132 are in the raised state shown in FIG. 4A, the following operation is started. First, in order to move the mounting unit 120 to the next processing area, the processing table 115 starts to move in the X direction. The movable mounting portion 121 is raised while stopping the blow of the movable mounting portion 121 that has already been lowered. When the ascent is completed, the placement portion suction hole 122 provided in the movable placement portion 121 is evacuated, and the workpiece 111 is sucked and held again. The evacuation of the placement portion suction hole 122 provided in the movable placement portion 121 at a position corresponding to the next processing area is switched to blow. When the lower surface of the workpiece 111 at that location is no longer held, the movable mounting portion 121 at that location is lowered. These operations are performed in parallel.

  Then, after the workpiece 111 arrives at the processing area, the upper surface suction devices 131 and 132 are moved down and brought into close contact with the surface of the workpiece 111, and suction of the upper surface of the workpiece 111 is started.

  As described above, after the preparation in the processing area is completed, the galvano X mirror 109 and the galvano Y mirror 110 are controlled to start irradiation of the laser 102 at the hole processing position.

  The above operation is repeated to process all the predetermined processing areas of the workpiece 111. When all the processing in the predetermined processing area is completed, the vacuum suction of the upper surface suction hole 142 is stopped and the suction holding of the workpiece 111 is stopped. Thereafter, the upper surface adsorption devices 131 and 132 are raised and returned to the state shown in FIG. 4A.

  When the upper surface suction devices 131 and 132 are in the raised state shown in FIG. 4A, the following operation is started. First, in order to start moving the workpiece 111 to the take-out position, the processing table 115 starts to move. The movement of the machining head unit 135 to the origin is started. The movable mounting portion 121 is raised while stopping the blow of the movable mounting portion 121 that has already been lowered. When the ascent is completed, the placement portion suction hole 122 provided in the movable placement portion 121 is evacuated, and the workpiece 111 is sucked and held again. These operations are performed in parallel.

  When all the operations described above are completed, evacuation of all the placement portion suction holes 122 and all the outer periphery suction holes 124 is stopped. Then, it is confirmed that the workpiece 111 is no longer held by suction, and the workpiece 111 take-out device (not shown) takes out the workpiece 111 from the mounting portion 120.

  That is, the laser processing apparatus 100 of the present invention includes a processing head unit 135, a mounting unit 120, a processing table 115, upper surface suction devices 131 and 132, and a driving unit 150. Here, the processing head unit 135 performs laser processing on the workpiece 111. The placement unit 120 includes a plurality of divided movable placement units 121 that move up and down, and holds the workpiece 111. The processing table 115 drives the placement unit 120 in the X direction and the Y direction. The upper surface adsorption devices 131 and 132 are located above the workpiece 111 and adsorb the upper surface of the workpiece 111. The drive unit 150 drives the upper surface adsorption devices 131 and 132 up and down.

  With this configuration, the vicinity of the processing area of the workpiece 111 is held above the upper surface suction devices 131 and 132, so that even the sheet-shaped workpiece 111 having a very thin thickness has very little deflection. Highly accurate laser processing can be performed. Thereby, the processing defect accompanying the accuracy defect can be reduced.

  Also, a pair of upper surface suction devices 131 and 132 are provided, and each is configured to be driven up and down independently.

  With this configuration, even a sheet-shaped workpiece 111 having a very thin thickness can perform highly accurate laser processing with very little deflection.

  Further, the upper surface adsorption devices 131 and 132 are installed so that the longitudinal direction of the upper surface adsorption devices 131 and 132 is perpendicular to the longitudinal direction of the movable placement unit 121, and the size of the upper surface adsorption devices 131 and 132 in the longitudinal direction is the width of the movable placement unit 121. The configuration is set to be larger than the above.

  With this configuration, even a sheet-shaped workpiece 111 having a very thin thickness can perform highly accurate laser processing with very little deflection.

  Further, the upper surface suction devices 131 and 132 may be formed of an electrostatic chuck that sucks the workpiece 111 by applying a voltage.

  With this configuration, even a sheet-shaped workpiece 111 having a very thin thickness can perform highly accurate laser processing with very little deflection.

  Further, suction holes are provided in the surface of the upper surface suction devices 131 and 132 that are in contact with the surface of the workpiece 111, and the workpiece 111 is sucked by the sucked air pressure.

  With this configuration, even a sheet-shaped workpiece 111 having a very thin thickness can perform highly accurate laser processing with very little deflection.

  As described above, in the laser processing apparatus 100 of the present invention, the movable mounting portion 121 at a position where the penetrating laser 102 can reach is positioned below the other mounting portions to be removed from the focusing range of the laser 102. As a result, the laser 102 is prevented from being damaged, and other processing areas are held by suction. At the same time, the upper surface suction devices 131 and 132 are held upward in the vicinity of the processing area where the movable mounting portion 121 is lowered. As a result, even a sheet-like workpiece 111 having a very thin thickness can perform highly accurate laser processing with very little deflection.

  This can have a special effect as long as it can be held by suction so as to be sandwiched from above and below in the vicinity of the processing area of the workpiece 111. By combining the upper surface adsorption devices 131 and 132 and the mounting unit 120 with the laser processing apparatus 100 divided into the movable mounting unit 121, a higher effect can be obtained.

  In the present embodiment, the example in which the suction of the workpiece 111 of the upper surface suction devices 131 and 132 is realized by evacuation has been described, but the present invention can also be realized by using different suction means. For example, an electrostatic chuck may be used. This is because the upper surface adsorption devices 131 and 132 are formed of a dielectric material in which electrodes are embedded, and a sheet as a workpiece can be adsorbed through the dielectric material by applying a voltage to the electrodes. Any dielectric material may be used as long as it has both a high withstand voltage and a high dielectric constant. For example, ceramic materials such as silicon carbide, alumina, and aluminum nitride are excellent. The electrostatic chuck has a remarkably fast response speed of adsorption / desorption compared to the adsorption by vacuum drawing, and the use of the electrostatic chuck for the upper surface adsorption devices 131 and 132 can shorten the entire processing time.

  That is, the upper surface attracting devices 131 and 132 are configured by electrostatic chucks that attract the workpiece 111 by applying a voltage.

  With this configuration, even a sheet-shaped workpiece 111 having a very thin thickness can perform highly accurate laser processing with very little deflection.

  Further, the upper surface adsorption devices 131 and 132 may be formed of stainless steel subjected to nitride film treatment, and at least a surface in contact with the surface of the workpiece 111 may be polished.

  With this configuration, even a sheet-shaped workpiece 111 having a very thin thickness can perform highly accurate laser processing with very little deflection.

  In the present embodiment, the description has been made with reference to a diagram in which six movable mounting parts 121 are installed. However, the number of movable mounting parts 121 is determined by design requirements such as the size of the laser processing apparatus 100. The present invention is not limited to this example.

(Embodiment 2)
Next, a different example of the processing method using the laser processing apparatus 100 of the present invention will be described. The configuration of the laser processing apparatus 100 shown in FIGS. 1, 2, and 3 is the same as that of the first embodiment. Similarly, the upper dust suction device 130 is provided with a pair of upper surface suction devices 131 and 132 and an upper surface suction device lifting / lowering cylinder 133 that moves the upper surface suction devices 131 and 132 up and down. In the second embodiment, the upper surface suction device elevating cylinder 133 is configured so that the individual upper surface suction devices 131 and 132 can be moved up and down independently using an air cylinder.

  8A, 8B, and FIGS. 9A to 9C are layout diagrams illustrating an example of setting of the processing area of the workpiece 111 according to Embodiment 2 of the present invention. 9A, FIG. 9B, and FIG. 9C are side views showing different lifting states of the upper surface adsorption device according to an example of Embodiment 2 of the present invention.

  8A and 8B show an example of the allocation of the processing area of the workpiece 111, and numbers 1, 2, ..., 48 are assigned in the order of processing. Although it is assigned to six columns in the Y direction, this corresponds to the number of divisions of the movable mounting portion 121. The number of machining areas such as 6 rows and 48 is set for convenience of explanation in the second embodiment, and is not limited to this number in actual machining.

  The operation of the laser processing apparatus 100 configured as described above will be described.

  The workpiece 111 is mounted on the apparatus, the workpiece 111 is sucked and held, and the machining table 115 is moved. Only the movable mounting part 121 on the lower surface of the first processing area is switched to blow for evacuation of the mounting part suction hole 122 provided in the movable mounting part 121, and the lower surface of the workpiece 111 at the corresponding part is sucked. The operations until the holding is stopped and the movable mounting portion 121 is lowered are the same as those in the first embodiment.

  The difference is that when the above operation is completed and the first processing area of the workpiece 111 arrives at the position where the processing head unit 135 and the upper dust suction device 130 are arranged, the upper surface suction device is lowered. Only the upper surface suction device 132 installed on the second processing area side is lowered and brought into close contact with the surface of the workpiece 111. FIG. 9A shows a state in which only the upper surface adsorption device 132 is in close contact with the surface of the workpiece 111. This corresponds to bringing only the upper surface adsorption device 132 on the processing advance direction 144 side into close contact with the workpiece 111.

  When the upper surface adsorption device 132 is lowered as shown in FIG. 9A, the upper surface adsorption of the workpiece 111 is started. The suction may be performed by evacuation through an air tube as in the first embodiment, or may be performed by an electrostatic force using an electrostatic chuck.

  As in the first embodiment, the upper surface suction device 132 sucks the upper surface of the workpiece 111 in the vicinity of the processing area, thereby preventing the workpiece 111 from being deformed even when the movable mounting portion 121 is not present in the processing area. can do.

  Thereafter, the drilling of the first processing area is the same as that of the first embodiment. The difference is that even if all the holes in the first processing area are completed, the upper surface suction device 132 is kept lowered without stopping the suction holding of the workpiece 111 by the upper surface suction device 132. It is in.

  Next, in order to move to the second machining area, the machining table 115 is moved in the Y direction in the present embodiment. Laser beam machining is performed immediately after positioning in the second machining area. When all the holes in the second machining area are completed, the upper surface suction device 132 is moved down to move to the third machining area. As described above, the process is repeated until all the areas where one movable mounting portion 121 is lowered are laser processed. In the present embodiment, the eighth processing area corresponds.

  When the laser processing of all the eighth processing areas is finished, the suction holding of the workpiece 111 of the upper surface suction device 132 is stopped. Then, the upper surface adsorption | suction apparatus 132 is raised and it returns to the state shown to FIG. 9B.

  When the upper surface suction devices 131 and 132 are in the raised state shown in FIG. 9B, the following operation is started. First, in order to move the mounting unit 120 to the next processing area, the processing table 115 starts to move in the X direction. While the movable mounting portion 121 that has already been lowered is blown, the movable mounting portion 121 is lifted, and when the lifting is completed, the mounting portion suction hole 122 provided in the movable mounting portion 121 is evacuated. Then, the workpiece 111 is again sucked and held. The evacuation of the placement portion suction hole 122 provided in the movable placement portion 121 at a position corresponding to the next processing area is switched to blow. When the lower surface of the workpiece 111 at that location is no longer held, the movable mounting portion 121 at that location is lowered. These operations are performed in parallel.

  Then, after the workpiece 111 arrives at the ninth machining area, only the upper surface suction device 131 is lowered and brought into close contact with the surface of the workpiece 111 to start sucking the upper surface of the workpiece 111. This state is shown in FIG. 9C. The upper surface suction device 131 to be lowered is different from that in the case of the first processing area, but is the same in that only the upper surface suction device 131 on the machining progress direction 144 side is brought into close contact with the workpiece.

  Laser processing in a state where the upper surface adsorption device 131 is lowered until laser processing has been completed for all the processing areas in which one movable mounting portion 121 is lowered, in this figure, from the ninth processing area to the sixteenth processing area. repeat.

  Next, after moving to the 17th processing area, the same operation as in the first processing area is performed. By repeating the above operation, all the predetermined processing areas of the workpiece 111 are processed. When all the processing in the predetermined processing area is completed, the suction holding of the workpiece 111 by the upper surface suction devices 131 and 132 is stopped. Thereafter, both the upper surface adsorption devices 131 and 132 are returned to the raised state.

  Thereafter, the same operations as those in the first embodiment from the movement of the machining table 115, the return of the origin of the machining head unit 135, the stop of the holding of the workpiece 111 of the mounting unit 120, and the removal of the workpiece 111 from the mounting unit 120. It is.

  That is, the laser processing method of the present invention is a laser processing method for processing the workpiece 111 using the laser processing apparatus 100 described above, and when the processing area of the workpiece 111 is moved by the processing table 115. , A method including a step of raising and lowering the upper surface adsorption devices 131 and 132.

  By this method, even a sheet-like workpiece 111 having a very thin thickness can be subjected to highly accurate laser processing with very little deflection.

  Further, the laser processing method of the present invention is a laser processing method for processing the workpiece 111 using the laser processing apparatus 100 described above, and a case where the processing area of the workpiece 111 is moved by the processing table 115. Think. In this case, the upper surface adsorption devices 131 and 132 arranged at least in the traveling direction 144 of the machining area are lowered until all of the machining area in which one of the plurality of movable mounting parts 121 is lowered is laser processed. This is a laser processing method in which laser processing is performed in a state in which the laser is processed.

  By this method, even a sheet-like workpiece 111 having a very thin thickness can be subjected to highly accurate laser processing with very little deflection.

  The laser processing method of the present invention is a laser processing method for processing the workpiece 111 using the laser processing apparatus 100 described above, and considers a case where the processing area of the workpiece 111 is moved by a processing table. . In this case, at least the upper surface disposed in the traveling direction 144 of the processing area until the laser processing is completed up to the processing area immediately before the processing area where one of the plurality of movable mounting portions 121 is descending. Laser processing is performed with the suction devices 131 and 132 lowered. The processing area where laser processing is finally performed is a laser processing method in which laser processing is performed in a state where the upper surface suction devices 131 and 132 are raised.

  By this method, even a sheet-like workpiece 111 having a very thin thickness can be subjected to highly accurate laser processing with very little deflection.

  As described above, according to the laser processing apparatus 100 and the laser processing method according to this embodiment, the vicinity of the processing area where the movable mounting portion 121 is lowered is attracted to the upper surface while preventing damage by the penetrating laser 102. Either device 131 or 132 is held upward. As a result, even a sheet-like workpiece 111 having a very thin thickness can be processed with high accuracy with very little deflection.

  Furthermore, since the number of operations of raising and lowering the upper surface suction devices 131 and 132 can be extremely reduced, the processing time can be shortened.

  In the present embodiment, one of the upper surface suction devices 131 and 132 is moved down to move the processing area while moving the processing table 115 while adsorbing the workpiece 111, thereby moving the processing area. At this time, the upper surface suction devices 131 and 132 to be lowered are the upper surface suction devices 131 and 132 in the traveling direction 144 of the processing area. Therefore, even if the upper surface suction devices 131 and 132 rub against the surface of the workpiece 111, the surface of the workpiece 111 is not damaged because it is still an unprocessed processing area.

  Further, when carrying out such a laser processing method, the material and surface treatment of the upper surface adsorption devices 131 and 132 may be appropriate for rubbing the surface of the workpiece 111. For example, stainless steel is used as a base material, and after surface roughness is reduced by buffing, a nitride film treatment is performed. Further, the surface that touches the surface of the workpiece 111 is buffed to give a mirror finish. By doing in this way, the surface which rubs the surface of the to-be-processed object 111 can be hard and slippery, and it can be made not to produce abrasion.

  In addition, in this Embodiment, the example which repeats until the laser processing was completed for all the processing areas where the one movable mounting part 121 descend | falls in the state which the upper surface adsorption | suction apparatus 131 and 132 by the advancing direction 144 side descend | falls was shown. . However, when the laser processing of the previous processing area is completed, the suction holding of the workpiece 111 of the upper surface suction devices 131 and 132 that are descending is stopped. Thereafter, the workpiece 111 is sandwiched between the upper surface adsorption devices 131 and 132 and the outer periphery placement portion 123 by moving the lower surface adsorption devices 131 and 132 to the next processing area after being raised. , Can prevent deformation and scratches. At this time, since the outer periphery mounting portion 123 holds the workpiece 111, even if the upper surface suction devices 131 and 132 are raised, surface accuracy can be ensured.

  Note that whether to select the laser processing method described in Embodiment 1 or the laser processing method described in Embodiment 2 may be changed depending on the material and thickness of the workpiece. In the laser processing apparatus 100 of the present invention, the two upper surface adsorption devices 131 and 132 are configured to be capable of independently moving up and down, so that a laser processing method can be selected.

  Even if only one upper surface suction device is provided instead of one pair, the processing order of the processing areas may be changed so that the upper surface suction device in the traveling direction is always lowered.

  The laser processing apparatus according to the present invention can achieve high processing accuracy by maintaining the flatness of the workpiece while preventing damage to the mounting portion in the hole processing by laser, and performs laser processing for through-hole processing. Useful in devices and the like.

DESCRIPTION OF SYMBOLS 100 Laser processing apparatus 101 Laser oscillator 102 Laser 103 Mirror 104 Collimator lens 105 Mask 106 Iris 107 f (theta) lens 108 Control controller 109 Galvano X mirror 110 Galvano Y mirror 111 Workpiece 112 Lower dust suction apparatus 113 Air flow 115 Processing table 116 Y table 117 Y-axis moving motor 118 X table 119 X-axis moving motor 120 Mounting portion 121 Movable mounting portion 122 Mounting portion suction hole 123 Outer peripheral mounting portion 124 Outer peripheral suction hole 125 Movable mounting portion elevating cylinder 130 Upper dust absorber 131, 132 Upper surface adsorption device 133 Upper surface adsorption device lifting cylinder 135 Machining head portion 136 Z slider 137 Z axis movement motor 140 Main body frame 141 Air tube 142 Upper surface adsorption hole 143 Tube 144 traveling direction 150 driver

Claims (8)

A machining head for laser machining the workpiece;
A plurality of divided movable platforms that move up and down to hold the workpiece;
A machining table for driving the mounting portion in the X and Y directions;
An upper surface adsorption device that is located above the workpiece and adsorbs the upper surface of the workpiece;
A drive unit that drives the upper surface adsorption device up and down,
A pair of the upper surface adsorption devices are provided, each configured to be driven up and down independently,
The longitudinal direction of the upper surface adsorption device is installed so as to be perpendicular to the longitudinal direction of the movable mounting portion,
The laser processing apparatus which set the magnitude | size of the longitudinal direction of the said upper surface adsorption | suction apparatus large with respect to the width | variety of the said movable mounting part. A machining head for laser machining the workpiece;
A plurality of divided movable platforms that move up and down to hold the workpiece;
A machining table for driving the mounting portion in the X and Y directions;
An upper surface adsorption device that is located above the workpiece and adsorbs the upper surface of the workpiece;
A drive unit that drives the upper surface adsorption device up and down,
A pair of the upper surface adsorption devices are provided, each configured to be driven up and down independently,
The longitudinal direction of the upper surface adsorption device is installed so as to be perpendicular to the longitudinal direction of the movable mounting portion,
The laser processing apparatus which set the magnitude | size of the longitudinal direction of the said upper surface adsorption | suction apparatus small with respect to the width | variety of the said movable mounting part.   The laser processing apparatus according to claim 1, wherein the upper surface adsorption device is formed of an electrostatic chuck that adsorbs the workpiece by applying a voltage. 3. The laser processing apparatus according to claim 1, wherein an adsorption hole is provided on a surface of the upper surface adsorption device that contacts the surface of the workpiece, and the workpiece is adsorbed by air pressure to be sucked.   The laser processing apparatus according to claim 4, wherein the upper surface adsorption device is formed of stainless steel subjected to nitride film treatment, and at least a surface in contact with the surface of the workpiece is polished. Further comprising an upper dust collector,
The upper surface suction device collects and exhausts processing waste generated at the upper part of the workpiece during laser processing by sucking air inside through a hole provided in a part of the upper surface suction device. It is provided in
The laser processing apparatus according to claim 1, wherein when the workpiece is laser processed, the upper dust collector is positioned above the workpiece with a certain interval. A laser processing method for processing a workpiece using the laser processing apparatus according to any one of claims 1 to 6,
The laser processing method which has a process of raising / lowering the said upper surface adsorption | suction apparatus, when driving the mounting part with the said process table and moving the processing area of the said workpiece. A laser processing method for processing a workpiece using the laser processing apparatus according to any one of claims 1 to 6,
When moving the processing area of the workpiece by driving the mounting portion with the processing table, until all of the processing area where one of the plurality of movable mounting portions is lowered is laser processed, A laser processing method for performing laser processing in a state in which an upper surface suction device arranged at least in a traveling direction of a processing area is lowered.

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