WO2010100727A1

WO2010100727A1 - Laser machining apparatus, laser machining method, machining control apparatus and machining control method

Info

Publication number: WO2010100727A1
Application number: PCT/JP2009/054066
Authority: WO
Inventors: 俊博森
Original assignee: 三菱電機株式会社
Priority date: 2009-03-04
Filing date: 2009-03-04
Publication date: 2010-09-10
Also published as: JPWO2010100727A1; KR101251084B1; CN102216023A; TW201032937A; CN102216023B; TWI378840B; JP5230796B2; KR20110059736A

Abstract

A machining control apparatus (103) controls a machining table, which fixes the bottom surface of a work by suction by means of a suction hole, and a laser machining mechanism (101A) for making a hole on the work by irradiating the work with a laser beam. The machining control apparatus is provided with an extracting section (16) which extracts a machining hole which is to be positioned on an upper side of a suction area of the machining table; and a first time machining hole setting section (14), which sets, as holes to be machined for a first time, the machining holes other than the machining hole extracted by the extracting section (16) from among the machining holes to be machined. The machining controls apparatus controls the laser machining mechanism (101A) to perform the first time hole making machining.

Description

Laser processing apparatus, laser processing method, processing control apparatus, and processing control method

The present invention relates to a laser processing apparatus, a laser processing method, a processing control apparatus, and a processing control method for performing laser processing while attracting and fixing a workpiece.

As one of apparatuses that process a workpiece (processing object) such as a printed circuit board, there is a laser processing apparatus that performs drilling by irradiating the workpiece with laser light. In such a laser processing apparatus, if the workpiece moves during drilling, the position of the machining hole is shifted, so the workpiece needs to be fixed on the machining table.

As a method for fixing the work on the processing table, there is a method of placing the work on a suction hole provided on the processing table and decompressing the suction hole. In this method, by providing a plurality of suction holes on the processing table, it is possible to perform laser processing on the workpiece while preventing warping of the workpiece (see, for example, Patent Document 1).

JP 2000-334593 A

However, in the above conventional technique, the processing hole when the workpiece processing hole overlaps the suction hole on the processing table, and the processing hole when the workpiece processing hole does not overlap with the suction hole on the processing table, There was a problem that processing quality was different. One of the causes of the difference in processing quality between a portion with a suction hole and a portion without a suction hole is the way heat is transmitted to the back surface of the workpiece. The reason why heat is transferred to the back surface of the workpiece is different because the phenomenon that the heat of laser processing escapes through the processing table is different between the portion having the suction hole and the portion having no suction hole. For this reason, when machining a workpiece on a machining table without suction holes, even when machining the workpiece on the suction holes, even if the machining conditions (energy amount, number of pulses) do not break the material on the lower surface of the workpiece. In some cases, the material on the lower surface of the workpiece can be easily broken.

For this reason, there has been a problem that it takes a lot of time to determine the processing conditions for making the processing quality the same in the portion with the suction hole and the portion without the suction hole. In addition, in order to make the processing quality the same between the part with the suction hole and the part without the suction hole, there is a method of irradiating multiple times with weak laser power at the part with the suction hole. There was a problem that it took a long time.

This invention is made in view of the above, Comprising: Obtaining the laser processing apparatus, the laser processing method, the processing control apparatus, and the processing control method which drill a processing hole of uniform processing quality in a workpiece | work in a short time. Objective.

In order to solve the above-described problems and achieve the object, the present invention suctions and fixes the workpiece by a suction hole that sucks the bottom surface of the workpiece that is placed while the workpiece that is the workpiece is placed. By controlling the processing table, the laser processing unit that irradiates the work fixed to the processing table with a laser beam and irradiates the work with a processing hole, and controls the processing table and the laser processing unit. A machining control device that moves a relative position between the workpiece on the machining table and the irradiation position of the laser beam, and the machining control device absorbs the workpiece when the workpiece is placed on the machining table. An extraction unit that extracts the processed hole that is located above the suction region within a predetermined range from the hole, and the extraction from the processed hole to be processed A first setting unit that sets the remaining processed hole excluding the processed hole extracted by the unit as the first processed hole to be processed for the first time, and the laser processed unit performs the first drilling The first drilling hole set by the first setting unit is drilled as the machining.

The laser processing apparatus according to the present invention drills the remaining processing holes excluding the processing holes that are positioned above the suction holes when a workpiece is placed on the processing table as the first drilling target. Therefore, there is an effect that it is possible to machine a machining hole with uniform machining quality into a workpiece in a short time.

FIG. 1 is a diagram illustrating a part of a laser processing apparatus according to an embodiment. FIG. 2 is a block diagram showing the configuration of the laser processing apparatus according to the embodiment. FIG. 3 is a diagram for explaining a workpiece and a machining table. FIG. 4 is a diagram for explaining the positional relationship between the machining hole and the suction hole. FIG. 5 is a cross-sectional view taken along the line AA in FIG. FIG. 6 is a diagram for explaining the positional relationship between the processing hole and the suction hole when performing the first drilling process. FIG. 7 is a diagram for explaining the positional relationship between the processing hole and the suction hole when performing the second drilling process. FIG. 8 is a diagram for explaining a workpiece moving process performed before the second machining hole is drilled. FIG. 9 is a diagram for explaining the processing procedure of the first processing hole. FIG. 10 is a diagram for explaining the workpiece movement process. FIG. 11 is a diagram illustrating a workpiece movement processing procedure. FIG. 12 is a diagram for explaining an adsorption area and a non-adsorption area on the processing table. FIG. 13 is a diagram for explaining drilling using the processing table shown in FIG. FIG. 14 is a diagram showing the configuration of the suction area limiting jig. FIG. 15 is a view for explaining drilling using the suction area limiting jig shown in FIG. 14. FIG. 16 is a diagram illustrating a configuration example of a laser processing mechanism in which laser beams are multi-axial.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1

Laser beam

2a, 2b Galvano

scan mirror

3a, 3b Galvano scanner 4 f (theta) lens 7 Scan area 8 Spectrometer 9a, 9b Laser head 11 Input part 12 Data conversion part 13 Suction hole coordinate memory | storage part 14 1st process hole setting part 15 2 Second processing hole setting unit 16 Extraction unit 19

Control unit

21, 21X Processing table 22H,

41h Suction hole

25A,

45A Non-arrangement area

25B, 45B Suction hole arrangement area 31 Work 32a First processing hole 32b Second processing hole 33

Positioning mark

35A , 35B area 40 Suction area limiting jig 41 Arm 100

Laser processing device

101A, 101B Laser processing mechanism 102 Conveying device 103 Processing control device

Hereinafter, a laser processing apparatus, a laser processing method, a processing control apparatus, and a processing control method according to an embodiment of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment.
FIG. 1 is a diagram illustrating a part of a laser processing apparatus according to an embodiment. FIG. 1 shows a configuration of a laser processing mechanism (laser processing unit) 101A that performs a drilling process of a workpiece (processing object) 31 as a part of a laser processing apparatus (laser drilling machine).

The laser processing mechanism 101A includes

galvano scan mirrors

2a and 2b,

galvano scanners

3a and 3b, an fθ lens 4, and a processing table 21 on which the work 31 is placed. The laser processing mechanism 101A sucks and fixes the workpiece 31 through suction holes 22H provided on the entire surface of the processing table 21, and irradiates the workpiece 31 with laser light to perform drilling of the workpiece 31. The suction hole 22 H is a hole for sucking the bottom surface of the work 31 and fixing it to the processing table 21. After the workpiece 31 is placed on the machining table 21, the suction hole 22 H is depressurized so that the bottom surface of the workpiece 31 is attracted to the upper surface of the machining table 21.

The galvano scan mirror 2a is a first galvano scan mirror that receives the laser beam 1 output from a laser oscillator (not shown). The galvano scan mirror 2a is connected to the drive shaft of the galvano scanner 3a, and the drive shaft of the galvano scanner 3a faces the Z-axis direction. The mirror surface of the galvano scan mirror 2a is displaced as the drive shaft of the galvano scanner 3a rotates, and the optical axis of the incident laser beam 1 is deflected and scanned in a first direction (for example, the X-axis direction). Send to mirror 2b.

The galvano scan mirror 2b is a second galvano scan mirror that receives the laser beam 1 from the galvano scan mirror 2a. The galvano scan mirror 2b is connected to the drive shaft of the galvano scanner 3b, and the drive shaft of the galvano scanner 3b faces the Y-axis direction. The mirror surface of the galvano scan mirror 2b is displaced in accordance with the rotation of the drive shaft of the galvano scanner 3b, and the second direction (for example, the Y-axis direction) is substantially perpendicular to the optical axis of the incident laser beam 1 in the first direction. Are deflected and scanned and sent to the fθ lens 4.

The fθ lens 4 condenses and irradiates the workpiece 31 with the laser beam 1 that is two-dimensionally scanned in the XY plane. A work 31 such as a printed circuit board material or a ceramic green sheet has a planar shape, and the processing table 21 places the work 31 in the XY plane.

In the laser processing mechanism 101A, the processing table 21 is moved in the XY plane, and the laser beam 1 is two-dimensionally scanned by the

galvano scanners

3a and 3b. As a result, one to a plurality of machining holes 32h are formed (drilling) in the work 31 in the scan area 7 that is within the range in which the laser light 1 can be two-dimensionally scanned by the

galvano scanners

3a and 3b.

FIG. 2 is a block diagram showing the configuration of the laser processing apparatus according to the embodiment. The laser processing apparatus 100 includes a processing control apparatus 103, a laser processing mechanism 101A, and a transport apparatus 102.

The processing control device 103 is connected to the laser processing mechanism 101A and the transport device 102, and is a device such as a computer that controls the laser processing mechanism 101A and the transport device 102. The processing control device 103 includes an input unit 11, a data conversion unit 12, a suction hole coordinate storage unit 13, a first processing hole setting unit 14, a second processing hole setting unit 15, an extraction unit 16, and a control unit 19.

The input unit 11 inputs the coordinate data of the hole to be drilled in the workpiece 31, various instruction information regarding the drilling of the workpiece 31, and the like. The data conversion unit 12 converts the coordinate data input to the input unit 11 into laser processing data. The laser processing data is coordinate data used by the processing control device 103 when drilling, and is expressed by processing table data and galvano data. Since a plurality of holes are formed in the work 31, the position of each hole is represented by processing table data and galvano data for each hole position. The processing table data is a relative coordinate between the processing table 21 and the processing head, and is, for example, data (coordinates) at a position where the processing table 21 is moved. The galvano data is the irradiation position (coordinates) of the laser beam adjusted by the galvano scan mirrors 2a and 2b and the

galvano scanners

3a and 3b. The galvano data represents coordinates in the scan area 7.

The suction hole coordinate storage unit 13 is a memory or the like that stores the position of the suction hole 22H provided on the processing table 21 (hereinafter referred to as suction hole coordinates). The suction hole coordinates are the center coordinates and diameter of the suction hole 22H, and are stored in advance in the suction hole coordinate storage unit 13 as numerical values unique to the laser processing apparatus 100.

Based on the suction hole coordinates stored in the suction hole coordinate storage unit 13 and the laser processing data converted by the data conversion unit 12, the extraction unit 16 places the suction hole 22 H on the suction hole 22 H. The processing hole 32h located is extracted.

The first machining hole setting unit 14 excludes the machining hole 32h extracted by the extraction unit 16 from the laser machining data, and uses the laser machining data after removing the machining hole 32h to define the machining hole 32h to be opened in the workpiece 31. A hole to be opened in the first (first round) drilling process from the inside (first-processed hole 32a described later) is set. In other words, the first machining hole setting unit 14 generates laser machining data for opening the first machining hole 32a.

The second machining hole setting unit 15 uses the machining hole 32h extracted by the extraction unit 16 to open a hole (2 described later) from the machining hole 32h opened in the work 31 by the second (second round) drilling process. The second machining hole 32b) is set. In other words, the second machining hole setting unit 15 generates laser machining data for opening the second machining hole 32b. Thereby, the second machining hole setting unit 15 sets the machining hole 32h positioned on the suction hole 22H from the machining holes 32h opened in the workpiece 31 as the second machining hole 32b. The control unit 19 controls the input unit 11, the data conversion unit 12, the suction hole coordinate storage unit 13, the first machining hole setting unit 14, the second machining hole setting unit 15, and the extraction unit 16.

In the present embodiment, when the work 31 is first placed on the processing table 21, the processing hole 32h that does not become on the suction hole 22H is set as the first processing hole 32a and the first processing hole 32a is drilled. Do. Thereafter, the relative position between the workpiece 31 and the machining table 21 is moved by moving the workpiece 31 on the machining table 21. At this time, the work 31 is moved on the processing table 21 so that the second processing hole 32b that was on the suction hole 22H when the work 31 is first placed on the processing table 21 is not on the suction hole 22H. And the drilling process of the 2nd process hole 32b is performed. As a result, the laser processing apparatus 100 drills both the first processed hole 32a and the second processed hole 32b at positions that do not become above the suction holes 22H.

The laser processing apparatus 100 detects an alignment mark (positioning mark) provided in advance on the work 31 by using a CCD (Charge Coupled Device) camera or the like, and based on the position of the alignment mark, the work 31 and the processing table 21 are detected. Correct the relative position of. Then, the laser processing apparatus 100 performs a drilling process on the workpiece 31 based on the corrected coordinates of the workpiece 31.

The transfer device 102 is a device (loader / unloader) that loads and unloads the workpiece 31 onto and from the processing table 21. After carrying out the drilling process of the first process hole 32a, the transfer apparatus 102 of the present embodiment moves the work 31 on the process table 21 so that the second process hole 32b does not become on the suction hole 22H.

The machining control device 103 moves the relative position between the workpiece 31 and the machining table 21 by a predetermined coordinate based on the suction hole coordinates and the laser machining data. Further, the processing control device 103 controls the laser processing mechanism 101A so as to perform drilling processing at a predetermined coordinate position based on the suction hole coordinates and the laser processing data.

The machining control device 103 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). In the processing control device 103, the CPU reads various control programs and application programs stored in the ROM in response to an input from the input unit by the user, develops them in a program storage area in the RAM, and executes various processes. Various data generated during processing is temporarily stored in a data storage area formed in the RAM, and the laser processing apparatus 100 is controlled. The program executed by the CPU is a program for setting the first machining hole 32a and the second machining hole 32b, a program for calculating the machining order of the first machining hole 32a, a program for calculating the machining order of the second machining hole 32b, a workpiece A program for calculating the amount of movement of the machining table 21 when the relative position between the machining table 21 and the machining table 21 is moved.

It should be noted that the placement of the workpiece 31 on the machining table 21 and the movement of the workpiece 31 on the machining table 21 may be performed manually. In this case, the laser processing apparatus 100 does not have to include the transport apparatus 102.

Next, a laser processing method of the laser processing apparatus 100 according to the present embodiment will be described. In order to eliminate the difference in processing quality between the processing hole 32h on the suction hole 22H and the processing hole 32h located at a position other than the suction hole 22H, the laser processing apparatus 100 performs a drilling process on a portion having the suction hole 22H. First, drilling is performed at a position other than the suction holes 22H. Specifically, the machining control device 103 skips the drilling process without performing the drilling process on the hole of the laser machining data corresponding to the suction hole 22H.

FIG. 3 is a diagram for explaining the workpiece and the machining table. In FIG. 3, the perspective view of the workpiece | work 31 and the process table 21 is shown. One to a plurality of suction holes 22H are provided on the processing table 21, and when the work 31 is placed on the processing table 21, the work 31 is fixed on the processing table 21 by the suction holes 22H. And the laser processing apparatus 100 performs the drilling of the process hole 32h in the state which fixed the workpiece | work 31 on the process table 21. FIG. The work 31 has a rectangular shape, for example, and positioning marks 33 are provided at four corners on the upper surface side.

When the laser processing apparatus 100 performs the drilling of the processing hole 32h, the accurate position of the workpiece 31 is determined using the positioning mark 33. Specifically, the CCD camera included in the laser processing apparatus 100 identifies the position to be drilled as a position unique to the laser processing apparatus 100 by recognizing an image of the positioning mark 33 of the workpiece 31. In other words, the data conversion unit 12 of the machining control device 103 has an algorithm unique to the laser machining device 100 according to the arrangement (rotation, expansion / contraction, etc.) of the work 31.

The CCD camera images the positioning marks 33 arranged at the four corners of the work 31 after the work 31 is fixed to the processing table 21. Thereafter, the laser beam 1 is emitted from the processing head of the laser processing apparatus 100, and drilling is performed at a predetermined position. When drilling the workpiece 31, the holes are drilled in the order according to the laser processing data. At that time, in order to perform drilling according to the rotation or expansion / contraction of the workpiece 31, the machining control device 103 specifies the target position of the drilling while executing the correction calculation of the position of the workpiece 31.

When the work 31 is fixed on the processing table 21, the processing hole 32h and the suction hole 22H may overlap each other. FIG. 4 is a diagram for explaining the positional relationship between the machining hole and the suction hole. In FIG. 4, the case where the workpiece | work 31 and the process table 21 are seen from the upper surface is shown in figure. It is necessary to form a plurality of processing holes 32h in the work 31, and a plurality of suction holes 22H are provided on the processing table 21. For this reason, when the bottom surface of the work 31 is fixed to the upper surface of the processing table 21, there are a processing hole 32h positioned on the suction hole 22H and a processing hole 32h positioned on the suction hole 22H.

FIG. 5 is a cross-sectional view taken along the line AA in FIG. The work 31 has, for example, a two-layer structure, and the upper layer side is made of, for example, a resin material, and the lower layer side is made of, for example, copper. And when the laser processing apparatus 100 drills the workpiece 31, the machining hole 32h is formed only on the upper layer side of the workpiece 31 so as not to penetrate the lower layer side of the workpiece 31. However, when the processing hole 32h to be processed is above the suction hole 22H, the lower layer side of the workpiece 31 may be torn due to the heat of laser processing.

In the present embodiment, in order not to perform the drilling process on the suction hole 22H, the extraction unit 16 calculates the target position of the processing hole 32h after the data conversion unit 12 calculates the target position of the processing hole 32h. Is a position on the suction hole 22H, the processed hole 32h on the suction hole 22H is extracted. When the extraction unit 16 determines that the target position of the processing hole 32h is on the suction hole 22H, the first processing hole setting unit 14 of the processing control device 103 does not issue a laser irradiation command to the processing hole 32h.

The extraction unit 16 determines whether or not the position of the processing hole 32h is a position on the suction hole 22H, using a predetermined range from the center of each suction hole 22H as an adsorption region, and an upper portion in the suction region. Based on whether or not there is a position of the machining hole 32h, it is determined whether or not the position of each machining hole 32h is a position on the suction hole 22H. For example, the extraction unit 16 determines whether or not the position of each processing hole 32h is a position on the suction hole 22H, and whether or not the entire area of the processing hole 32h is on the suction hole 22H for each processing hole 32h. It may be determined on the basis of whether or not a part of the processing hole 32h is on the suction hole 22H for each processing hole 32h. Further, the extraction unit 16 provides an area larger than each suction hole 22H by a predetermined size, and for each processing hole 32h based on whether the position of the processing hole 32h is on an area larger than the suction hole 22H. It may be determined whether or not the position of the processing hole 32h is a position on the suction hole 22H.

FIG. 6 is a diagram for explaining the positional relationship between the processing hole and the suction hole when performing the first drilling process, and FIG. 7 is the position of the processing hole and the suction hole when performing the second drilling process. It is a figure for demonstrating a relationship. 6 and 7 show perspective views of the work 31 and the processing table 21. FIG.

The machining hole 32h set for the first drilling by the first machining hole setting unit 14 is a machining hole 32h in which the machining hole 32h does not overlap the suction hole 22H when the work 31 is placed on the machining table 21. In the following, it will be referred to as a first processed hole 32a. In FIG. 6, the arrangement position of the work 31 (the outer peripheral part of the work 31) on the machining table 21 when the first machining hole 32a is drilled is indicated by the arrangement position P1. Further, in FIG. 6, the position below the first machining hole 32 a among the positions on the machining table 21 is indicated by a position 22 a, and the position below the second machining hole 32 b among the positions on the machining table 21 is positioned. This is indicated by 22b.

Further, the machining hole 32h set in the second drilling process by the second machining hole setting unit 15 (the machining hole 32h not set in the first drilling process) places the workpiece 31 on the machining table 21. In this case, the processing hole 32h is a processing hole 32h that overlaps the suction hole 22H, and is hereinafter referred to as a second processing hole 32b.

In the present embodiment, after the first machining hole 32a is drilled, the relative position between the second machining hole 32b and the suction hole 22H is changed by moving the workpiece 31 on the XY plane. In FIG. 7, the position of the workpiece 31 on the machining table 21 when the first machining hole 32a is drilled is indicated by an end P1, and the position of the workpiece 31 on the machining table 21 when the second machining hole 32b is drilled. The arrangement position is indicated by an arrangement position P2. Moreover, in FIG. 7, the position used as the lower part of the 2nd process hole 32b among the positions on the process table 21 is shown by the position 22c. Note that the movement direction of the work 31 may be movement only in the X-axis direction or movement only in the Y-axis direction. Further, the moving direction of the workpiece 31 may be an oblique direction (X-axis direction and Y-axis direction).

FIG. 8 is a diagram for explaining a workpiece movement process performed before the second machining hole is drilled. FIG. 8 illustrates a case where the workpiece 31 is viewed from above, and the left drawing in FIG. 8 shows the position of the workpiece 31 when the first machining hole 32a is drilled, and the right drawing in FIG. The position of the workpiece | work 31 at the time of drilling the 2nd process hole 32b is shown.

After the first machining hole 32a has been drilled (s1), when changing the relative position between the second machining hole 32b and the suction hole 22H, the workpiece should be placed so that all the second machining holes 32b are not on the suction hole 22H. 31 is moved (s2). At this time, the processed first hole 32a may be on the suction hole 22H.

When the first machining hole setting unit 14 sets the first machining hole 32a, the first machining hole 32a is drilled. At this time, the first machining hole setting unit 14 drills only the first machining hole 32a, and causes the laser machining mechanism 101A to drill the second machining hole 32b.

FIG. 9 is a diagram for explaining the processing procedure of the first processing hole. The diagram on the left side of FIG. 9 shows the processing procedure of the first processing hole when all the processing holes 32h are the first processing hole 32a, and the diagram on the right side of FIG. 9 shows the second processing in the processing hole 32h. The processing procedure of the 1st processing hole in case the hole 32b is included is shown.

If all the processing holes 32h to be drilled by the laser processing apparatus 100 are the first processing holes 32a, the first processing holes 32a (processing holes 32h) are sequentially drilled according to the original processing program. For example, the processing order of the first processing holes 32a is the first processing holes 32a (1), 32a (2), 32a (3), 32a (4), 32a (5), 32a (6), 32a (7). , 32a (8), 32a (9), the laser processing apparatus 100 moves the irradiation position of the laser beam 1 to each first processing hole 32a in this order.

In such a case, for example, if the second processed hole 32b is included in the processed hole 32h, the second processed hole 32b is excluded and only the first processed hole 32a is sequentially drilled. For example, if the first processed hole 32a (6) is the second processed hole 32b, the laser processing apparatus 100 excludes the first processed hole 32a (6) and performs each first processed hole 32a. Specifically, the processing order of the first processing holes 32a is changed to the first processing holes 32a (1), 32a (2), 32a (3), 32a (4), 32a (5), 32a (7), 32a. (8) In order to perform drilling in the order of 32a (9), the irradiation position of the laser beam 1 is moved to each first processing hole 32a in this order. In other words, after the first processed hole 32a (5) is drilled, the position of the first processed hole 32a (7) is moved without moving the irradiation position of the laser beam 1 to the position of the first processed hole 32a (6). The irradiation position of the laser beam 1 is moved.

Next, the movement process of the workpiece 31 on the machining table 21 will be described. FIG. 10 is a diagram for explaining the workpiece movement process, and FIG. 11 is a diagram illustrating the procedure of the workpiece movement process.

The transfer device 102 includes an arm 41 that carries the workpiece 31 onto the machining table 21 and carries the workpiece 31 out of the machining table 21. The arm 41 has a pad at the lower part, and the pad 31 is bonded to the upper surface of the work 31 so that the work 31 can be lifted. The arm 41 lifts the workpiece 31 after the first machining hole 32a is drilled, and the second machining hole from the position (end portion P1) where the workpiece 31 is placed when the first machining hole 32a is drilled. The workpiece 31 is moved to a position (end portion P2) where the workpiece 31 is placed during the drilling of 32b.

Specifically, as shown in FIG. 11, after the first machining hole 32a has been drilled, the transfer device 102 moves the arm 41 onto the workpiece 31 (ST1). Thereafter, the arm 41 is lowered and the pad of the arm 41 is adhered to the upper surface of the work 31, so that the arm 41 fixes the work 31. And the fixation of the workpiece | work 31 by the process table 21 is cancelled | released by stopping pressure reduction of the suction hole 22H (ST2).

The transport apparatus 102 lifts the work 31 by raising the arm 41 (ST3). Then, the machining control device 103 moves the machining table 21 by a predetermined coordinate based on the suction hole coordinates and the laser machining data (ST4). At this time, the laser processing apparatus 100 may move the processing table 21 or the workpiece 31. After moving the relative position between the processing table 21 and the work 31, the transfer device 102 lowers the arm 41 and places the work 31 on the processing table 21. Note that the machining control device 103 may move the machining table 21 by a predetermined distance (specified shift amount) set in advance. For example, a specified shift amount is set in the machining control device 103 in a predetermined direction such as how many mm (X ± ○. ○○○ mm, Y ± ○. ○○○ mm).

The laser processing apparatus 100 places the workpiece 31 on the processing table 21, then depressurizes the suction hole 22 H, and fixes the workpiece 31 on the processing table 21. And the fixation of the workpiece | work 31 by the arm 41 is cancelled | released by removing the pad of the arm 41 from the upper surface of the workpiece | work 31 (ST5).

Thereafter, the transfer device 102 raises the arm 41 to a predetermined height, and then retracts the arm 41 from the work 31 (ST6). After the arm 41 is retracted from the workpiece 31, the laser processing apparatus 100 irradiates the second processing hole 32b with the laser beam 1 to perform the second processing hole 32b (ST7). When drilling the second machining hole 32b, the laser processing apparatus 100 detects the position of the work 31 by moving the CCD camera by a distance corresponding to the movement distance of the

work

31, and 2 based on the detection result. Drilling is performed on the second processed hole 32b.

In this embodiment, the case has been described in which the processing hole 32h sets the first processing hole 32a and the second processing hole 32b by real-time processing. However, the first processing hole 32a and the second processing hole 32b are set in advance. You may set it. For example, when there is no deviation in the work 31 placement position on the processing table 21 and the placement position of the work 31 is known in advance, the laser processing apparatus 100 before the work 31 is placed on the processing table 21. The position where the processing hole 32h and the suction hole 22H overlap may be calculated. Thereby, even before the work 31 is placed on the processing table 21, the first processing hole 32a and the second processing hole 32b can be set.

In addition, the area on the processing table 21 is divided into a plurality of areas, and each area is divided into an area where suction holes 22H are arranged (a suction hole arrangement area 25B described later) or an area where suction holes 22H are not arranged (a non-arrangement area described later). 25A). In this case, the processing hole 32h is first drilled on the non-arrangement area 25A, and then the processing hole 32h on the suction hole arrangement area 25B is moved onto the non-arrangement area 25A to perform drilling.

FIG. 12 is a diagram for explaining an adsorption area and a non-adsorption area on the processing table. In FIG. 12, the perspective view of the process table 21X and the workpiece | work 31 is shown. The area on the processing table 21X is divided into, for example, a stripe shape parallel to the X-axis direction and a stripe shape parallel to the Y-axis direction. FIG. 12 shows a case where the area on the processing table 21X is divided into stripes parallel to the Y-axis direction.

Of the areas on the processing table 21X divided into stripes, the suction holes 22H are arranged in the suction hole arrangement area 25B, and the suction holes 22H are not arranged in the non-arrangement area 25A. The suction holes 22H formed in the suction hole arrangement area 25B are not limited to the case where the suction holes 22H are arranged in one row, and may be any arrangement (for example, two rows). FIG. 12 shows a case where the suction hole arrangement area 25B and the non-arrangement area 25A are continuously arranged in the X-axis direction at intervals of the width L1.

The extraction unit 16 previously divides the area on the work 31 into stripes parallel to the Y-axis direction. At this time, the extraction unit 16 divides the area on the work 31 into stripes based on the arrangement of the suction hole arrangement area 25B and the non-arrangement area 25A on the processing table 21X. Specifically, the extraction unit 16 divides the area on the workpiece 31 so that the boundary line between the suction hole arrangement area 25 B and the non-placement area 25 A becomes a stripe boundary on the workpiece 31. Then, the extraction unit 16 sets the area of the work 31 on the non-arrangement area 25A as the area 35A for the first machining hole 32a, and sets the area of the work 31 on the suction hole arrangement area 25B as the second machining hole 32b. Is set in the area 35B. Thereby, the area 35A and the area 35B are continuously arranged in the X-axis direction at intervals of the width L1, similarly to the arrangement of the suction hole arrangement area 25B and the non-arrangement area 25A.

FIG. 13 is a diagram for explaining drilling using the processing table shown in FIG. FIG. 13 shows a cross-sectional view when the machining table 21X and the workpiece 31 are cut in the X-axis direction. The upper diagram in FIG. 13 shows the laser irradiation position when the first machining hole 32a is drilled, and the lower diagram in FIG. 13 shows the laser irradiation position when the second machining hole 32b is drilled. Yes.

The laser processing apparatus 100 first drills the first processed hole 32a on the area 35A and skips the drilling of the second processed hole 32b on the area 35B. Then, after the drilling of the first processed hole 32a on the area 35A is completed, the area 35B (the second processed hole 32b on the area 35B) is moved onto the non-arranged area 25A, and the second on the area 35B is moved. The processing hole 32b is drilled. When moving the area 35B, the area 35B is moved on the non-arranged area 25A by moving the area 35B in the X-axis direction by the width L1 of the suction area 25B. Thereby, the area 35B can be moved efficiently. In the case of FIG. 12, by shifting the machining table 21X by L1 in the + X direction, it is possible to drill all the second machining holes 32b by the second drilling.

Thus, when the area on the work 31 is divided into the area 35A and the area 35B and the first machining hole 32a and the second machining hole 32b are drilled, the laser machining data for the

first machining hole

32a and 2 Drilling is performed using the laser processing data for the second processed hole 32b.

In FIG. 12, the machining table 21X and the work 31 are illustrated as having the same size, but the work 31 may have any size. In FIG. 12, the processing table 21X is divided into stripes. However, the processing table 21X is divided into a grid and the suction hole placement area 25B is adjacent to the suction hole placement area 25B and the non-placement area 25A. The non-arrangement area 25A may be arranged in a checkered pattern.

In FIG. 13, the first machining hole 32a in the area 35A is drilled, and then the machining table 21 is shifted by the distance L1 to drill the second machining hole 32b in the area 35B. The moving distance of the processing table 21 is not limited to L1. The laser processing apparatus 100 sets the processing table 21 by a distance that can drill all the processing holes 32h of the first processing hole 32a and the second processing hole 32b by the first drilling process and the second drilling process. Move it.

Further, in the present embodiment, the case where the extraction unit 16 divides the area on the work 31 into the area 35A and the area 35B has been described, but the first machining hole setting unit 14 and the second machining hole setting unit 15 are used as the work 31. The upper area may be divided into an area 35A and an area 35B.

In FIG. 12, the suction hole arrangement area 25B and the non-arrangement area 25A have the same width L1, but the suction hole arrangement area 25B and the non-arrangement area 25A may have different widths. . For example, by making the width of the suction hole arrangement area 25B narrower than the width of the non-arrangement area 25A, it becomes possible to perform drilling efficiently.

Further, the width L1 of the suction hole arrangement area 25B and the non-arrangement area 25A may be any size. For example, the width L1 of the suction hole placement area 25B and the non-placement area 25A is set to the same size as the width in the X-axis direction of the scan area by the

galvano scanners

3a and 3b. As a result, the number of movements of the machining table 21 is reduced, and it is possible to perform drilling efficiently. Further, the width of the scan area in the X-axis direction may be a size corresponding to the width L1 of the suction hole arrangement area 25B and the non-arrangement area 25A. Also in this case, the number of movements of the machining table 21 is reduced, and it is possible to perform drilling efficiently.

In FIG. 12, the case where the suction hole placement area 25B and the non-placement area 25A are provided in the processing table 21X has been described. However, a predetermined jig (a suction area described later) corresponding to the suction hole placement area 25B and the non-placement area 25A is described. The limiting jig 40) may be attached to the processing table 21 described with reference to FIG.

FIG. 14 is a diagram showing the configuration of the suction area limiting jig. FIG. 14 shows a perspective view of the suction area limiting jig 40. The suction area limiting jig 40 is a plate (such as a copper plate) having a heat dissipation property having a main surface substantially the same size as the main surface of the processing table 21 and has a substantially flat plate shape. The suction area limiting jig 40 is provided with suction holes 41h at the same position as the suction hole arrangement area 25B only in the suction hole arrangement area 45B corresponding to the suction hole arrangement area 25B. The placement area 45A is not provided with the suction hole 41h. The suction area limiting jig 40 is sucked and fixed onto the processing table 21 by being placed on the processing table 21. Then, by placing the work 31 on the suction area limiting jig 40, the work 31 is suction fixed to the suction area limiting jig 40. The non-arrangement area 45A is the same area as the area where the non-arrangement area 25A was set, and the suction hole 41h is not disposed below the non-arrangement area 45A. Further, the suction hole arrangement area 45B is the same area as the area where the suction hole arrangement area 25B was set, and the suction hole 41h is arranged in the lower part thereof.

FIG. 15 is a diagram for explaining drilling using the suction area limiting jig shown in FIG. The laser processing apparatus 100 first drills the first processed hole 32a in the area 35A on the non-arranged area 45A, and skips the drilling of the second processed hole 32b in the area 35B on the suction hole arranged area 45B.

The laser processing apparatus 100 moves the area 35B onto the non-arrangement area 45A after the drilling of the first process hole 32a on the non-arrangement area 45A, and drills the first processing hole 32a on the area 35B. Process. When moving the area 35B, the area 35B is moved onto the non-arranged area 45A by moving the area 35B in the X-axis direction by the width L1 of the suction hole arrangement area 45B. Thereby, the area 35B can be moved efficiently. In the case of FIG. 14, by shifting the machining table 21X by L1 in the + X direction, it is possible to drill all the second machining holes 32b by the second drilling.

The suction area limiting jig 40 is not limited to the configuration shown in FIG. For example, when the suction area limiting jig 40 is placed on the processing table 21, the diameter of the suction area limiting jig 40 is larger than that of the suction holes 22H so that the suction holes 41h overlap all the suction holes 22H. A small suction hole 41h may be provided.

The position and size of the suction hole 22H and the position and size of the suction hole 41h used when drilling the workpiece 31 using the processing table 21X and the suction area limiting jig 40 described in FIGS. An operator (processing operator) may input to the laser processing apparatus 100 or may be registered in the laser processing apparatus 100 in advance.

The case where the extraction unit 16 extracts the machining hole 32h located on the suction hole 22H among the machining holes 32h opened in the workpiece 31 has been described. However, the operator extracts the machining hole 32h located on the suction hole 22H. Also good. For example, when the processing table 21X described in FIG. 12 or the suction area limiting jig 40 described in FIG. 14 is used, which processing hole 32h is positioned on the suction hole 22H if the placement position of the work 31 is known. I understand. Therefore, the operator uses the first machining program used when machining the first machining hole 32a and the second machining hole 32b based on the position of the machining hole 32h not located on the suction hole 22H. A second machining program may be created. The operator causes the first machining hole 32a to be machined by the first machining program, and then moves the workpiece 7 to machine the second machining hole 32b by the second machining program. Accordingly, the laser processing mechanism 101A can drill all the processing holes 32h on the workpiece 7 at a position other than the suction hole 22H even without the extraction unit 16.

Note that the first machining program and the second machining program may be created by a device other than the machining control device 103. In this case, the laser machining apparatus externally inputs a first machining program or a second machining program created by another apparatus from the input unit 11, and uses the inputted first machining program or second machining program for the workpiece 31. Drill holes.

In the present embodiment, the case where the laser processing mechanism 101A drills the workpiece 31 using one laser beam 1 has been described. However, a laser capable of processing the workpiece 31 using a plurality of laser beams 1 is used. The laser processing method of the present embodiment may be applied to the processing mechanism.

FIG. 16 is a diagram showing a configuration example of a laser processing mechanism in which laser beams are multi-axial. The laser processing mechanism 101B includes a spectroscope 8 and two sets of laser heads 9a and 9b. The laser heads 9a and 9b have galvano scan mirrors 2a and 2b,

galvano scanners

3a and 3b, and an fθ lens 4, respectively. The laser beam 1 output from the laser oscillator is split by the spectroscope 8, and the split laser beam 1 is simultaneously supplied to the laser heads 9a and 9b. Then, the laser beam 1 irradiated from the laser heads 9a and 9b simultaneously drills each workpiece 31. In FIG. 16, the two-head laser processing mechanism 101B has been described, but the laser processing mechanism 101B may have four or more heads.

For example, when two workpieces are drilled by the two-head laser processing mechanism 101B, depending on the mounting position of the workpiece 7, the machining hole 32h positioned on the suction hole 22H between the one workpiece 7 and the other workpiece 7 is used. May be different. In other words, even in the same processed hole 32h, one workpiece 7 may be positioned on the suction hole 22H and the other workpiece 7 may not be positioned on the suction hole 22H. For this reason, the laser processing mechanism 101B extracts the processing holes 32h positioned on the suction holes 22H on the laser head 9a side and the laser head 9b, respectively.

When the processing hole 32h positioned on the suction hole 22H is different between the laser head 9a side and the laser head 9b, the laser processing mechanism 101B cannot perform the same operation on the laser head 9a side and the laser head 9b. For this reason, when one workpiece 7 has the machining hole 32h at a position other than on the suction hole 22H and the other workpiece 7 has the machining hole 32h at a position on the suction hole 22H, the other workpiece 7 is subjected to laser. Light 1 is not irradiated. When the laser beam 1 is not irradiated to the machining hole 32h of the other workpiece 7 (when machining is skipped), for example, an openable / closable shutter (not shown) that blocks the laser beam 1 is provided on the laser heads 9a and 9b. The laser beam 1 is blocked by closing this shutter. Further, when the machining hole 32h (any axis) to one of the workpieces 7 is a skip target, the laser beam irradiation to both the workpieces 7 is skipped, and thereby both the left and right drilling machining are skipped. Also good.

In FIG. 16, a case has been described in which the laser processing mechanism 101B splits the laser beam 1 with the spectroscope 8 and supplies the split laser beam 1 to the laser heads 9a and 9b at the same time, but to the laser heads 9a and 9b. The supplied laser beams 1 need not be supplied simultaneously. For example, the laser processing mechanism 101B may alternately distribute the laser beam 1 to the laser heads 9a and 9b. Specifically, the laser beam 1 is divided into two optical paths in order by dividing the laser beam 1 into

laser heads

9a and 9b. Then, the laser head 9a and the laser head 9b alternately irradiate laser light to one processing table 21 (left work 7) and the other processing table 21 (right work 7).

By the way, when the relative position between the machining table 21 and the workpiece 31 in the second drilling process is inappropriate, the second drilling hole 32b is not irradiated with the laser beam even in the second drilling process. It becomes. Therefore, the laser processing apparatus 100 has a function (for example, display means such as a liquid crystal monitor) for notifying the operator whether or not the processing holes 32h corresponding to all the laser processing data have been finally drilled. Also good. Note that the laser processing apparatus 100 may perform the third and subsequent drilling when all the drilling is not completed by the first and second drilling. For example, the laser processing apparatus 100 moves the position of the workpiece 31 so that the processing hole 32h that has been on the suction hole 22H in both the first and second drilling processes does not become on the suction hole 22H in the third drilling process. Let

As described above, according to the embodiment, the second machining hole 32b on the suction hole 22H is not machined by the first drilling process, and only the first machining hole 32a is drilled. A processing hole can be drilled in the work 31 in a short time. In addition, the second processing hole 32b on the suction hole 22H is not processed by the first drilling process, and after the first drilling hole 32a is completed, the relative position between the processing table 21 and the work 31 is shifted. Therefore, the second processed hole 32b on the suction hole 22H can be moved to a position that does not overlap with the suction hole 22H. Accordingly, since the second machining hole 32b on the suction hole 22H can be displaced to perform the drilling into the machining hole 32h, a hole with uniform machining quality can be drilled into the workpiece 31 in a short time. Is possible.

In addition, since the position of the work 31 is moved by the transfer device 102, the work 31 can be easily moved. In addition, the machining table 21 has a suction hole arrangement area 25B and a non-placement area 25A, and an area 35A for the first machining hole 32a and an area 35B for the second machining hole 32a are set in the area on the work 31. Therefore, efficient drilling can be easily performed. Further, the suction area limiting jig 40 has suction hole arrangement areas 45B and non-placement areas 45A, and an area 35A for the first processing hole 32a and an area 35B for the second processing hole 32a are provided on the work 31. Since it is set, efficient drilling can be easily performed. Further, since the width L1 of the suction hole arrangement area 25B and the non-arrangement area 25A is the same size as the width in the X-axis direction of the scan area 7 by the

galvano scanners

3a and 3b, the number of movements of the processing table 21 is reduced and the efficiency It becomes possible to perform drilling well.

As described above, the laser processing apparatus, laser processing method, processing control apparatus, and processing control method according to the present invention are suitable for laser processing while adsorbing and fixing a workpiece.

Claims

A work table on which a work that is a work object is placed, and the work is sucked and fixed by a suction hole that sucks the bottom surface of the work placed;
A laser processing unit that irradiates a laser beam to the work that is suction-fixed on the processing table and performs a hole processing on the work; and
A machining control device that moves the relative position between the workpiece on the machining table and the irradiation position of the laser beam by controlling the machining table and the laser machining unit;
With
The processing control device includes:
An extraction unit that extracts the processing hole that is positioned above the suction region within a predetermined range from the suction hole when the workpiece is placed on the processing table;
A first setting unit that sets the remaining machining hole, excluding the machining hole extracted by the extraction unit from the machining holes to be machined, as a first machining hole that is a first machining target;
Have
The laser processing unit is
A laser processing apparatus for performing drilling processing of a first processing hole set by the first setting unit as the first drilling processing.
The processing control device includes:
A second setting unit for setting the processing hole extracted by the extraction unit as a second drilling hole to be drilled for the second time after the first drilling;
The laser processing unit is
After the first drilled hole is drilled, the second drilled hole is moved so that the second drilled hole is not positioned above the suction region, and then the second drilled hole set by the second setting unit is set as the second drilled hole. The laser processing apparatus according to claim 1, wherein drilling is performed.
The apparatus further includes a transfer device that carries the workpiece onto the machining table and unloads the workpiece on the machining table,
The transfer device
3. The laser according to claim 2, wherein a relative position between the workpiece and the processing table is moved so that the second processing hole is not positioned above the suction region after the first processing hole is drilled. Processing equipment.
The working table places the work in a predetermined rectangular area, and has a suction hole arrangement area, which is an area in which the suction holes are arranged in a stripe shape parallel to one side of the rectangular area. A non-arrangement area that is an area where suction holes are not arranged is arranged,
The laser processing apparatus according to claim 1, wherein the extraction unit extracts the processing hole positioned above the suction hole arrangement region as a processing hole positioned above the suction region.
The jig further includes a jig disposed between the upper surface of the processing table and the bottom surface of the work and closes a part of the suction hole, and the work table sucks and fixes the bottom face of the work through the jig. ,
The jig places the work in a predetermined rectangular area, and the suction hole arrangement area is an area where the suction holes are arranged in a stripe shape parallel to one side of the rectangular area. A non-arrangement area that is an area where suction holes are not arranged is arranged,
The laser processing apparatus according to claim 1, wherein the extraction unit extracts the processing hole positioned above the suction hole arrangement region as a processing hole positioned above the suction region.
The laser processing unit has a galvano scanner that scans the processing surface of the workpiece with laser light applied to the workpiece,
6. The laser processing apparatus according to claim 4, wherein a stripe width of the suction hole arrangement region and the non-arrangement region is the same as a width of a region scanned by the galvano scanner.
The processing table is composed of a plurality, and the workpiece is placed on each processing table,
The laser processing unit irradiates each workpiece on the respective processing table with a laser beam to perform drilling processing of the same arrangement on each workpiece,
The machining control device sets the first machining hole for each workpiece, and for the machining hole machined at the same position on each workpiece, the first machining of the first workpiece among the workpieces. If the second workpiece of the workpiece is not set as the first machining hole, the laser beam irradiation is cut off to the machining hole that is not set as the first machining hole and the hole machining is skipped. The laser processing apparatus according to claim 1, wherein the laser processing unit is controlled to do so.
The machining control device sets the first machining hole in the first workpiece of the workpieces to the machining hole to be machined at the same position on each workpiece, and sets the second workpiece of the workpieces. In the case where the first hole is not set, the laser beam irradiation is cut off for both the hole not set as the first hole and the hole set as the first hole. The laser processing apparatus according to claim 7, wherein the laser processing unit is controlled to do so.
A laser beam is applied to a work table on which a work to be processed is placed and the work is sucked and fixed by a suction hole for sucking the bottom surface of the work placed thereon, and the work that is sucked and fixed on the work table. In the laser processing method of moving the relative position between the workpiece on the processing table and the irradiation position of the laser beam by controlling a laser processing unit that performs irradiation and drilling a processing hole in the workpiece,
Among the processing holes, when the workpiece is placed on the processing table, on the suction area that designates the suction hole on the suction area that is located above the suction area that is within a predetermined range from the suction hole. Hole information input step for externally inputting machining hole information;
A setting step of setting a remaining processing hole excluding the processing hole on the suction region from the processing hole to be processed as a first processing hole to be processed for the first time;
A processing step of causing the laser processing unit to perform a first processing hole drilling set by the setting unit as a first drilling processing;
A laser processing method comprising:
The suction area upper processing hole information,
The work table places the work in a predetermined rectangular area and is a suction area in which the suction holes are arranged in the work table so that the work table has a stripe shape parallel to one side of the rectangular area. When the hole arrangement area and the non-arrangement area, which is an area where the suction holes are not arranged, are arranged,
The laser processing method according to claim 9, wherein the processing hole located above the suction hole arrangement region is information extracted as the processing hole on the suction region.
The suction area upper processing hole information,
The processing table is disposed between the upper surface of the processing table and the bottom surface of the work, and sucks and fixes the bottom surface of the work through a jig that closes a part of the suction hole. The workpiece is placed in a rectangular area, and the suction hole arrangement area and the suction area are areas where the suction holes are arranged in the jig so as to have a stripe shape parallel to one side of the rectangular area. When a non-placed area, which is an area where holes are not placed, is placed,
The laser processing method according to claim 9, wherein the processing hole located above the suction hole arrangement region is information extracted as the processing hole on the suction region.
A laser beam is applied to a work table on which a work to be processed is placed and the work is sucked and fixed by a suction hole for sucking the bottom surface of the work placed thereon, and the work that is sucked and fixed on the work table. In the processing control device that moves the relative position between the workpiece on the processing table and the irradiation position of the laser beam by controlling a laser processing unit that performs irradiation and drilling a processing hole in the workpiece,
An extraction unit that extracts the processing hole that is positioned above the suction region within a predetermined range from the suction hole when the workpiece is placed on the processing table;
A setting unit for setting the remaining machining hole excluding the machining hole extracted by the extraction unit from the machining holes to be machined as the first machining hole to be drilled for the first time;
With
A machining control device that causes the laser machining unit to drill a first machining hole set by the setting unit as a first drilling process.
A laser beam is applied to a work table on which a work to be processed is placed and the work is sucked and fixed by a suction hole for sucking the bottom surface of the work placed thereon, and the work that is sucked and fixed on the work table. In the processing control method of moving the relative position between the workpiece on the processing table and the irradiation position of the laser beam by controlling a laser processing unit that performs irradiation and drilling a processing hole in the workpiece,
An extraction step of extracting the processing hole that will be located above the suction area within a predetermined range from the suction hole when the work is placed on the processing table;
A setting step of setting the remaining machining hole excluding the machining hole extracted by the extraction unit from the machining holes to be machined as the first machining hole to be drilled for the first time;
A processing step of causing the laser processing unit to perform a first processing hole drilling set by the setting unit as a first drilling processing;
The processing control method characterized by including.