CN102216023B - Laser machining apparatus, laser machining method, machining control apparatus and machining control method - Google Patents
Laser machining apparatus, laser machining method, machining control apparatus and machining control method Download PDFInfo
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- CN102216023B CN102216023B CN200980145692.6A CN200980145692A CN102216023B CN 102216023 B CN102216023 B CN 102216023B CN 200980145692 A CN200980145692 A CN 200980145692A CN 102216023 B CN102216023 B CN 102216023B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
Abstract
A machining control apparatus (103) controls a machining table, which fixes the bottom surface of a work by suction by means of a suction hole, and a laser machining mechanism (101A) for making a hole on the work by irradiating the work with a laser beam. The machining control apparatus is provided with an extracting section (16) which extracts a machining hole which is to be positioned on an upper side of a suction area of the machining table; and a first time machining hole setting section (14), which sets, as holes to be machined for a first time, the machining holes other than the machining hole extracted by the extracting section (16) from among the machining holes to be machined. The machining controls apparatus controls the laser machining mechanism (101A) to perform the first time hole making machining.
Description
Technical field
The present invention relates to a kind of laser processing device, laser processing, Working control device and processing control method that workpiece is carried out to Laser Processing when absorption is fixing.
Background technology
As one of device that the workpiece such as printed base plate (workpiece) are processed, there is the laser processing device that carries out perforate processing to workpiece irradiation laser.In this laser processing device, owing to adding man-hour in perforate, if workpiece movable, the position of machining hole is offset, so must in advance workpiece be fixed on processing work platform.
, there is following method in the method as for fixation workpiece on processing work platform, that is, workpiece is positioned in to the adsorption hole top being arranged on processing work platform, and makes adsorption hole decompression.In the method, by a plurality of adsorption holes are set on processing work platform, can when preventing workpiece bending etc., to workpiece, carry out Laser Processing (for example,, with reference to patent documentation 1).
Patent documentation 1: TOHKEMY 2000-334593 communique
Summary of the invention
But, in above-mentioned prior art, there is following problems, that is,, in the situation that overlapping machining hole place and the machining hole place in the machining hole of workpiece and the nonoverlapping situation of adsorption hole on processing work platform of adsorption hole on the machining hole of workpiece and processing work platform, processing quality is different.In one of the position that has adsorption hole reason different with the position processing quality that there is no adsorption hole, it is the mode to back of work conduction heat.The different reason of mode to back of work conduction heat is, having the position of adsorption hole and there is no the position of adsorption hole, and the heat of Laser Processing is different to the phenomenon of the conduction of processing work platform bulk storage.Therefore, even if adopt in the situation that do not have on the processing work platform of adsorption hole workpiece process the processing conditions (energy value, number of pulses) that can not make the material of workpiece lower surface break, in the situation that the workpiece above adsorption hole is processed, sometimes also can make the material of workpiece lower surface break.
Therefore, there is following problems, that is, sometimes in order to be identified for making the position and the identical processing conditions of position processing quality that there is no adsorption hole there being adsorption hole, need a large amount of time.In addition, in order to make there is being the position of adsorption hole and do not having the position of adsorption hole to obtain identical processing quality, existence weakens laser power at the position that has adsorption hole and the method for repeatedly irradiating, but for the method, exists Laser Processing to need the problem of long period.
The present invention is exactly In view of the foregoing and proposes, and its object is, obtain a kind of at short notice on workpiece perforate process laser processing device, laser processing, Working control device and the processing control method of the machining hole of processing quality homogeneous.
In order to solve above-mentioned problem, achieve the goal, the invention is characterized in to have: processing work platform, it loads the workpiece as workpiece, and utilizes the adsorption hole that the bottom surface of loaded described workpiece is adsorbed, the fixing described workpiece of absorption; Laser Processing portion, it irradiates laser to the described workpiece being absorbed and fixed on described processing work platform, thereby described workpiece is carried out to the perforate processing of machining hole; And Working control device, it is by controlling described processing work platform and described Laser Processing portion, make thus workpiece on described processing work platform and the relative position between the irradiation position of described laser move, described Working control device has: extraction unit, and it is that the described machining hole of the upside of binding domain extracts for upload the prescribed limit being positioned at be equipped with described workpiece in the situation that with respect to described adsorption hole at described processing work platform; And the 1st configuration part, it will remove the residue machining hole after the machining hole being extracted by described extraction unit the machining hole from as processing object, be set as i.e. the 1st machining hole of the 1st perforate processing object, described Laser Processing portion carries out perforate processing as the 1st perforate processing and to the 1st machining hole of being set by described the 1st configuration part.
The effect of invention
Because laser processing device involved in the present invention is by the residue machining hole of uploading at processing work platform outside the machining hole that is positioned at adsorption hole upside be equipped with workpiece in the situation that, as the 1st perforate processing object, carry out perforate processing, so there is following effect, that is, can on workpiece, process at short notice the machining hole of processing quality homogeneous.
Accompanying drawing explanation
Fig. 1 means the figure of a part for the laser processing device that embodiment is related.
Fig. 2 means the block diagram of the structure of the laser processing device that embodiment is related.
Fig. 3 is for the figure of workpiece and processing work platform is described.
Fig. 4 is for the figure of the position relationship of machining hole and adsorption hole is described.
Fig. 5 is the A-A profile of Fig. 4.
Fig. 6 carries out for illustrating the figure that the 1st perforate adds the machining hole in man-hour and the position relationship of adsorption hole.
Fig. 7 carries out for illustrating the figure that the 2nd perforate adds the machining hole in man-hour and the position relationship of adsorption hole.
Fig. 8 is the figure processing at the workpiece movable that the 2nd machining hole implemented to carry out before perforate is processed for illustrating.
Fig. 9 is for the figure of the processing handling process of the 1st machining hole is described.
Figure 10 is the figure for illustrating that workpiece movable is processed.
Figure 11 means the figure of workpiece movable handling process.
Figure 12 is for binding domain on processing work platform and the figure of non-binding domain are described.
Figure 13 is the figure that uses the processing work platform shown in Figure 12 to carry out perforate processing for illustrating.
Figure 14 means that binding domain limits the figure of the structure of perforate mould (jig).
Figure 15 is used the binding domain shown in Figure 14 to limit the figure that perforate mould carries out perforate processing for illustrating.
Figure 16 means the figure of the structure example of the laser processing mechanism that makes laser multiaxis.
The explanation of label
1 laser
2a, 2b electric scanning speculum
3a, 3b electrical scanner
4f θ lens
7 scanning areas
8 optical splitters
9a, 9b laser head
11 input parts
12 data transformation portions
13 adsorption hole coordinate storage parts
14 the 1st machining hole configuration parts
15 the 2nd machining hole configuration parts
16 extraction units
19 control parts
21,21X processing work platform
22H, 41h adsorption hole
The non-configuring area of 25A, 45A
25B, 45B adsorption hole configuring area
31 workpiece
The 1st machining hole of 32a
The 2nd machining hole of 32b
33 telltale marks
35A, 35B region
40 binding domains limit perforate mould
41 arms
100 laser processing devices
101A, 101B laser processing mechanism
102 Handling devices
103 Working control devices
The specific embodiment
Below, based on accompanying drawing, describe related laser processing device, laser processing, Working control device and the processing control method of embodiments of the present invention in detail.In addition, the present invention is not limited by present embodiment.
Embodiment
Fig. 1 means the figure of a part for the laser processing device that embodiment is related.In Fig. 1, as a part for laser processing device (laser beam drilling processing machine), show the structure of laser processing mechanism (Laser Processing portion) 101A of the perforate processing processing of carrying out workpiece (workpiece) 31.
Electric scanning speculum 2a is the 1st electric scanning speculum receiving by omitting the laser 1 of illustrated laser oscillator output.Electric scanning speculum 2a is connected with the driving shaft of electrical scanner 3a, and the driving shaft of electrical scanner 3a is towards Z-direction.The reflecting surface of electric scanning speculum 2a is accompanied by the rotation of electrical scanner 3a driving shaft and is subjected to displacement, and makes the optical axis of the laser 1 of incident for example, carry out deflection scanning along the 1st direction (X-direction), and sends to electric scanning speculum 2b.
Electric scanning speculum 2b is the 2nd electric scanning speculum receiving from the laser 1 of electric scanning speculum 2a.Electric scanning speculum 2b is connected with the driving shaft of electrical scanner 3b, and the driving shaft of electrical scanner 3b is towards X-direction.The reflecting surface of electric scanning speculum 2b is accompanied by the rotation of electrical scanner 3b driving shaft and is subjected to displacement, make incident laser 1 optical axis along with the 1st direction roughly the 2nd direction (for example Y direction) of quadrature carry out deflection scanning, and send to f θ lens 4.
F θ lens 4 by the laser 1 that carries out two-dimensional scan in XY face to focus irradiation on workpiece 31.The workpiece 31 such as printed base plate material or ceramic green sheet (ceramic green sheet) have flat shape, and processing work platform 21 loads workpiece 31 in XY plane.
In laser processing mechanism 101A, processing work platform 21 is moved in XY plane, and utilize electrical scanner 3a, 3b to make laser 1 carry out two-dimensional scan.Thus, utilizing electrical scanner 3a, 3b to make laser 1 carry out in the scope of two-dimensional scan, be in scanning area 7, on workpiece 31, form (perforate processing) 1～a plurality of machining hole 32h.
Fig. 2 means the block diagram of the structure of the laser processing device that embodiment is related.Laser processing device 100 has: Working control device 103, laser processing mechanism 101A, Handling device 102.
Working control device 103 is connected with laser processing mechanism 101A and Handling device 102, is the devices such as computer that laser processing mechanism 101A and Handling device 102 are controlled.Working control device 103 has: input part 11, data transformation portion 12, the 13, the 1st machining hole configuration part 14 of adsorption hole coordinate storage part, the 2nd machining hole configuration part 15, extraction unit 16, control part 19.
The coordinate data in input part 11 inputs hole of perforate processing on workpiece 31, the various indication informations relevant to workpiece 31 being carried out to perforate processing etc.12 pairs, data transformation portion inputs to the coordinate data of input part 11 and carries out data transformation, is transformed to Laser Processing data.Laser Processing data are to add in perforate the coordinate data of being used by Working control device 103 man-hour, are expressed as processing work number of units certificate and electric scanning data (galvano data).Owing to offering a plurality of holes on workpiece 31, so the position in each hole is by processing work number of units certificate and the electric scanning data representation of the position for each hole.Processing work number of units is according to being the relative coordinate between processing work platform 21 and processing head, for example, be the data (coordinate) that make the position that processing work platform 21 moves to.Electric scanning data are to utilize the irradiation position (coordinate) of the laser that electric scanning speculum 2a, 2b, electrical scanner 3a, 3b adjust.Coordinate in electric scanning data representation scanning area 7.
Adsorption hole coordinate storage part 13 is memories etc. that storage is arranged on the position (hereinafter referred to as adsorption hole coordinate) of the adsorption hole 22H on processing work platform 21.Adsorption hole coordinate is centre coordinate and the diameter of adsorption hole 22H, as the intrinsic numerical value of laser processing device 100 and pre-stored in adsorption hole coordinate storage part 13.
The adsorption hole coordinate of extraction unit 16 based on storage in adsorption hole coordinate storage part 13 and by the Laser Processing data after data transformation portion 12 conversion, is extracted in the machining hole 32h that is positioned at adsorption hole 22H top in the machining hole 32h offering on workpiece 31.
The 1st time the machining hole 32h being extracted by extraction unit 16 is removed in machining hole configuration part 14 from Laser Processing data, and use the Laser Processing data of removing after machining hole 32h, from the machining hole 32h offering at workpiece 31, set the hole (the 1st machining hole 32a described later) that utilizes the 1st (the first circulation) perforate processing to offer.In other words, the 1st machining hole configuration part 14 generates for offering the Laser Processing data of the 1st machining hole 32a.
The 2nd time the machining hole 32h being extracted by extraction unit 16 is used in machining hole configuration part 15, sets the hole (the 2nd machining hole 32b described later) that utilizes the 2nd (the second circulation) perforate processing to offer from the machining hole 32h offering at workpiece 31.In other words, the 2nd machining hole configuration part 15 generates for offering the Laser Processing data of the 2nd machining hole 32b.Thus, the 2nd machining hole configuration part 15, from the machining hole 32h offering at workpiece 31, is set as machining hole 32b the 2nd time by the machining hole 32h that is positioned at adsorption hole 22H top.19 pairs of input parts 11 of control part, data transformation portion 12, the 13, the 1st machining hole configuration part 14 of adsorption hole coordinate storage part, the 2nd machining hole configuration part 15, extraction unit 16 are controlled.
In the present embodiment, the machining hole 32h by not being positioned at when initial workpiece 31 loads on processing work platform 21 above adsorption hole 22H, is set as machining hole 32a the 1st time, carries out the perforate processing of the 1st machining hole 32a.Then, by workpiece 31 is moved on processing work platform 21, thereby the relative position between workpiece 31 and processing work platform 21 is moved.Now, so that be positioned at the 2nd machining hole 32b above adsorption hole 22H when initial workpiece 31 loads on processing work platform 21, be no longer positioned at the mode above adsorption hole 22H, workpiece 31 is moved on processing work platform 21.Then, carry out the perforate processing of the 2nd machining hole 32b.Thus, laser processing device 100 for the 1st machining hole 32a and the 2nd machining hole 32b the two, perforate processing is carried out in the position above they are not positioned at adsorption hole 22H.
Working control device 103 utilizes Handling device 102, according to the regulation coordinate based on adsorption hole coordinate and Laser Processing data, the relative position between workpiece 31 and processing work platform 21 is moved.In addition, 103 couples of laser processing mechanism 101A of Working control device control, and with the regulation coordinate position place based on adsorption hole coordinate and Laser Processing data, carry out perforate processing.
Working control device 103 comprises CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory) and forms.In Working control device 103, the input that CPU carries out to input part according to user, read the various control programs that are stored in ROM and application program etc., in program storage area in RAM, launch and carry out various processing, the various data that produce during by this processing are temporarily stored in the data storage areas being formed in RAM, and laser processing device 100 is controlled.The performed program of CPU has: set the program of the 1st machining hole 32a and the 2nd machining hole 32b, calculate the processing sequence of the 1st machining hole 32a program, calculate the program etc. of the amount of movement of the program of the processing sequence of the 2nd machining hole 32b, the processing work platform 21 when calculating the relative position making between workpiece 31 and processing work platform 21 and moving.
In addition, also can manually carry out workpiece 31 to mounting and the movement of workpiece 31 on processing work platform 21 on processing work platform 21.In the case, laser processing device 100 also can not have Handling device 102.
Below, the laser processing of the related laser processing device of present embodiment 100 is described.For the processing quality of eliminating between the machining hole 32h of adsorption hole 22H top and the machining hole 32h of the position beyond adsorption hole 22H poor, laser processing device 100 is not implemented perforate processing at the part place that has adsorption hole 22H, and carries out perforate processing in adsorption hole 22H position in addition.Specifically, Working control device 103 with adsorption hole 22H above the place, hole of corresponding Laser Processing data do not carry out perforate processing, skip over this perforate processing.
Fig. 3 is for the figure of workpiece and processing work platform is described.In Fig. 3, the oblique view of workpiece 31 and processing work platform 21 is shown.On processing work platform 21, be provided with 1～a plurality of adsorption hole 22H, if load workpiece 31 on processing work platform 21, utilize adsorption hole 22H that workpiece 31 is fixed on processing work platform 21.Then, laser processing device 100 is fixed on the perforate processing of carrying out machining hole 32h under the state on processing work platform 21 at workpiece 31.In addition, workpiece 31 for example forms rectangular shape, at four jiaos of upper surface side etc., locates to be provided with telltale mark 33.
The perforate of carrying out machining hole 32h at laser processing device 100 adds man-hour, uses telltale mark 33, the accurate location of judgement workpiece 31.Specifically, by the CCD camera being had by laser processing device 100, the telltale mark 33 of workpiece 31 is carried out to image recognition, the location positioning that should carry out thus perforate processing is the intrinsic position of laser processing device 100.In other words, the data transformation portion 12 of Working control device 103 has the laser processing device 100 intrinsic algorithm corresponding with the configuration of workpiece 31 (rotation, flexible etc.).
After workpiece 31 is fixed on processing work platform 21, CCD camera is taken the telltale mark 33 being configured on four jiaos of workpiece 31.Then, from the processing head Emission Lasers 1 of laser processing device 100, in the position of regulation, implement perforate processing.In the situation that carry out the perforate processing of workpiece 31, according to the order of following Laser Processing data, carry out perforate processing.Now, in order to carry out and the rotation of workpiece 31 and the corresponding perforate processing such as flexible, Working control device 103, when the position correction of carrying out workpiece 31 is calculated, is determined the target location of perforate processing.
If workpiece 31 is fixed on processing work platform 21, machining hole 32h and adsorption hole 22H are overlapping sometimes.Fig. 4 is for the figure of the position relationship of machining hole and adsorption hole is described.In Fig. 4, illustrate the situation of observing workpiece 31 and processing work platform 21 of overlooking.Need on workpiece 31, form a plurality of machining hole 32h, in addition, on processing work platform 21, be provided with a plurality of adsorption hole 22H.Therefore,, if the bottom surface of workpiece 31 is fixed on to the upper surface of processing work platform 21, there is the machining hole 32h that is positioned at the machining hole 32h of adsorption hole 22H top and is positioned at position in addition, adsorption hole 22H top.
Fig. 5 is the A-A profile of Fig. 4.Workpiece 31 for example has double-layer structural, and upper layer side is for example formed by resin material, and lower layer side is such as being formed by copper etc.And laser processing device 100 adds man-hour in the perforate of carrying out workpiece 31, only the upper layer side at workpiece 31 forms machining hole 32h, and does not run through the lower layer side of workpiece 31.But in the situation that the machining hole 32h of plan processing is positioned at adsorption hole 22H top, the reason because of the heat of Laser Processing is broken the lower layer side of workpiece 31 sometimes.
In the present embodiment, in order not carry out perforate processing above adsorption hole 22H, thereby in data transformation portion 12, calculate behind the target location of machining hole 32h, whether the position that extraction unit 16 is carried out the intrinsic machining hole 32h of laser processing device 100 is the judgement of the position of adsorption hole 22H top, and extracts the machining hole 32h of adsorption hole 22H top.In the situation that extraction unit 16 is judged as the target location of machining hole 32h, be above adsorption hole 22H, the instruction of irradiating laser is not sent for this machining hole 32h in the 1st machining hole configuration part 14 of Working control device 103.
In addition, extraction unit 16 judges whether the position of machining hole 32h is the position above adsorption hole 22H in the following manner,, in the prescribed limit starting from each adsorption hole 22H center as binding domain, whether the position based on machining hole 32h is positioned at the top of this binding domain, judges whether the position of each machining hole 32h is the position above adsorption hole 22H.For example, whether extraction unit 16 is the judgement of the position of adsorption hole 22H top for the position of each machining hole 32h, can whether be positioned at adsorption hole 22H for the entire area of each machining hole 32h based on machining hole 32h and above judge, also can whether be positioned at adsorption hole 22H for each part of machining hole 32h based on machining hole 32h and above judge.In addition, extraction unit 16 also can arrange than the region of the large given size of each adsorption hole 22H, whether the position based on machining hole 32h is positioned at this than on the larger region of adsorption hole 22H, judges whether the position of machining hole 32h is the position above adsorption hole 22H for each machining hole 32h.
Fig. 6 carries out for illustrating the figure that the 1st perforate adds the machining hole in man-hour and the position relationship of adsorption hole, and Fig. 7 carries out for illustrating the figure that the 2nd perforate adds the machining hole in man-hour and the position relationship of adsorption hole.In Fig. 6 and Fig. 7, show the oblique view of workpiece 31 and processing work platform 21.
By the 1st machining hole configuration part 14, being set as carrying out the machining hole 32h that the 1st perforate processed, is not overlapping with the adsorption hole 22H machining hole 32h of machining hole 32h in the situation that workpiece 31 is loaded on processing work platform 21, hereinafter referred to as the 1st machining hole 32a.In Fig. 6, by the 1st machining hole 32a being carried out to perforate and add the allocation position (peripheral part of workpiece 31) of the workpiece 31 on the processing work platform 21 in man-hour, be expressed as allocation position P1.In addition, in Fig. 6, by the positional representation that becomes the 1st machining hole 32a bottom in the position on processing work platform 21, be position 22a, by the positional representation that becomes the 2nd machining hole 32b bottom in the position on processing work platform 21, be position 22b.
In addition, by the 2nd machining hole configuration part 15, be set as carrying out the machining hole 32h (not being set as carrying out the machining hole 32h of the 1st perforate processing) that the 2nd perforate processed, machining hole 32h and the overlapping machining hole 32h of adsorption hole 22H in the situation that workpiece 31 is loaded on processing work platform 21, hereinafter referred to as the 2nd machining hole 32b.
In the present embodiment, the 1st machining hole 32a carried out after perforate processing, by workpiece 31 is moved in XY plane, thus the relative position between the 2nd machining hole 32b of change and adsorption hole 22H.In Fig. 7, to the 1st machining hole 32a be carried out to perforate and add the position of the workpiece 31 on the processing work platform 21 in man-hour, with end, P1 illustrates, and will the 2nd machining hole 32b be carried out to perforate and add the allocation position of the workpiece 31 on the processing work platform 21 in man-hour, and with allocation position, P2 illustrates.In addition, in Fig. 7, the positional representation that becomes the 2nd machining hole 32b bottom in the position on processing work platform 21 is position 22c.In addition, the moving direction of workpiece 31 can be both only along X-direction, to move, and can be also only along Y direction, to move.In addition, the moving direction of workpiece 31 can be also incline direction (X-direction and Y direction).
Fig. 8 is the figure processing at the workpiece movable that the 2nd machining hole implemented to carry out before perforate is processed for illustrating.The situation of observing workpiece 31 of overlooking shown in Figure 8, in Fig. 8, the figure in left side represents the 1st machining hole 32a to carry out the position that perforate adds the workpiece 31 in man-hour, and in Fig. 8, the figure on right side represents the 2nd machining hole 32b to carry out the position that perforate adds the workpiece 31 in man-hour.
After the 1st machining hole 32a carried out to perforate processing (s1), while changing the relative position between the 2nd machining hole 32b and adsorption hole 22H, so that not being positioned at the mode of adsorption hole 22H top, all the 2nd machining hole 32b do not make workpiece 31 move (s2).Now, the 1st of completion of processing the machining hole 32a can be positioned at adsorption hole 22H top.
If the 1st time machining hole configuration part 14 has been set machining hole 32a the 1st time, carry out the perforate processing of the 1st machining hole 32a and process.Now, the 1st time machining hole configuration part 14 makes laser processing mechanism 101A carry out in the following manner perforate processing,, only the 1st machining hole 32a is carried out to perforate processing that is, skips over machining hole 32b the 2nd time.
Fig. 9 is for the figure of the processing handling process of the 1st machining hole is described.In Fig. 9, the figure in left side is illustrated in the situation that machining hole 32h is all the 1st machining hole 32a, the processing handling process of the 1st machining hole, in Fig. 9, the figure on right side is illustrated in the situation that comprises the 2nd machining hole 32b in machining hole 32h, the processing handling process of the 1st machining hole.
If being carried out the machining hole 32h of perforate processing by laser processing device 100 is all the 1st machining hole 32a,, according to procedure originally, successively the 1st machining hole 32a (machining hole 32h) carried out to perforate processing.For example, in the situation that the processing sequence of the 1st machining hole 32a is the order of the 1st machining hole 32a (1), 32a (2), 32a (3), 32a (4), 32a (5), 32a (6), 32a (7), 32a (8), 32a (9), laser processing device 100 sequentially makes the irradiation position of laser 1 move to each the 1st machining hole 32a with this.
In these cases, if for example comprise machining hole 32b the 2nd time in machining hole 32h,, by except the 2nd machining hole 32b, only the 1st machining hole 32a carried out to perforate processing successively.For example, if the 1st machining hole 32a (6) is the 2nd machining hole 32b, laser processing device 100 is by except the 1st machining hole 32a (6) and each the 1st machining hole 32a carried out to perforate processing.Specifically, in order to make the processing sequence of the 1st machining hole 32a become the order of the 1st machining hole 32a (1), 32a (2), 32a (3), 32a (4), 32a (5), 32a (7), 32a (8), 32a (9), carry out perforate processing, thereby the irradiation position of laser 1 is moved to each the 1st machining hole 32a with this order.In other words, the 1st machining hole 32a (5) carried out after perforate processing, do not making the irradiation position of laser 1 move to the position of the 1st machining hole 32a (6), and the irradiation position of laser 1 is moved to the position of the 1st machining hole 32a (7).
Below, mobile process of workpiece 31 on processing work platform 21 is described.Figure 10 is the figure for illustrating that workpiece movable is processed, and Figure 11 means the figure of workpiece movable handling process.
Specifically, as shown in figure 11, the 1st machining hole 32a carried out after perforate processing, Handling device 102 makes arm 41 move to workpiece 31 tops (ST1).Then, arm 41 is declined, by making the end pad of arm 41 and the upper surface of workpiece 31 bonding, and by arm 41 fixation workpieces 31.Then, by the decompression of adsorption hole 22H is stopped, removing thus fixing (ST2) of the workpiece 31 being undertaken by processing work platform 21.
Then, Handling device 102 makes arm 41 rise to the height of regulation, then makes arm 41 keep out of the way (ST6) from workpiece 31 tops.Arm 41 is kept out of the way above workpiece 31, laser processing device 100 irradiates laser 1 to the 2nd machining hole 32b, and the 2nd machining hole 32b carried out to perforate processing (ST7).Laser processing device 100 adds man-hour the 2nd machining hole 32b carried out to perforate, make after the CCD camera movement distance corresponding with the displacement of workpiece 31, the position of workpiece 31 to be detected, based on testing result, the 2nd machining hole 32b carried out to perforate processing.
In addition, in the present embodiment, illustrated to utilize in real time and processed machining hole 32h is set as to the situation of the 1st machining hole 32a and the 2nd machining hole 32b, but also can preset the 1st machining hole 32a and the 2nd machining hole 32b.For example, not skew of mounting position at from workpiece 31 to mounting on processing work platform 21, and in advance in the situation of the mounting position of known workpiece 31, laser processing device 100 also can be at workpiece 31 to before mounting on processing work platform 21, the position that calculating processing hole 32h and adsorption hole 22H overlap.Thus, by workpiece 31 to before mounting on processing work platform 21, just can set the 1st machining hole 32a and the 2nd machining hole 32b.
In addition, also can be a plurality of regions by the Region Segmentation on processing work platform 21, using each region as the region (adsorption hole configuring area 25B described later) of configuration adsorption hole 22H or do not configure the region (non-configuring area 25A described later) of adsorption hole 22H.In the case, first on non-configuring area 25A, machining hole 32h is carried out to perforate processing, then, the machining hole 32h being positioned on adsorption hole configuring area 25B is moved to non-configuring area 25A above, and carry out perforate processing.
Figure 12 is for binding domain on processing work platform and the figure of non-binding domain are described.In Figure 12, the oblique view of processing work platform 21X and workpiece 31 is shown.Region on processing work platform 21X is for example split into the striated parallel with X-direction or the striated parallel with Y direction.In Figure 12, show the situation for the striated parallel with Y direction by the Region Segmentation on processing work platform 21X.
In region on being split into the processing work platform 21X of striated, in adsorption hole configuring area 25B, dispose adsorption hole 22H, in non-configuring area 25A, do not configure adsorption hole 22H.In addition, the adsorption hole 22H forming in adsorption hole configuring area 25B is not limited to adsorption hole 22H to be configured to the situation of 1 row, can be to configure arbitrarily (for example configuring 2 row).In Figure 12, show adsorption hole configuring area 25B and non-configuring area 25A respectively with the interval of width L1 along the continuously arranged situation of X-direction.
Figure 13 is the figure that uses the processing work platform shown in Figure 12 to carry out perforate processing for illustrating.Figure 13 illustrates the profile in the situation that processing work platform 21X and workpiece 31 are cut off along X-direction.Illustrating of the upside of Figure 13 carrying out to the 1st machining hole 32a the laser irradiating position that perforate adds man-hour, and illustrating of the downside of Figure 13 carrying out to the 2nd machining hole 32b the laser irradiating position that perforate adds man-hour.
First laser processing device 100 carries out perforate processing to the 1st the machining hole 32a being positioned on the 35A of region, skips over the perforate processing that is positioned at the 2nd machining hole 32b on the 35B of region.Then, after being positioned at the perforate process finishing of the 1st machining hole 32a on the 35A of region, make region 35B (the 2nd machining hole 32b on the 35B of region) move to non-configuring area 25A upper, the 2nd machining hole 32b on the 35B of region carried out to perforate processing.In the situation that region 35B is moved, by making region 35B, along X-direction, the width L1 with binding domain 25B moves, thereby region 35B is moved on non-configuring area 25A.Thus, can make region 35B move efficiently.The in the situation that of Figure 12, by making processing work platform 21X edge+directions X move L1, thereby can utilize the 2nd perforate processing to carry out perforate to all the 2nd machining hole 32b.
As noted above, in the situation that be the perforate processing that 35AHe region, region 35B carries out the 1st machining hole 32a and the 2nd machining hole 32b by the Region Segmentation on workpiece 31, the Laser Processing data of using Laser Processing data that the 1st machining hole 32a use and the 2nd machining hole 32b to use are carried out perforate processing.
In addition, in Figure 12, illustrate processing work platform 21X and workpiece 31 forms same size, but workpiece 31 can be arbitrary dimension.In addition, in Figure 12, the situation that processing work platform 21X is divided into striated has been described, but also processing work platform 21X can be divided into clathrate, so that adsorption hole configuring area 25B and the adjacent mode of non-configuring area 25A are configured to check shape by adsorption hole configuring area 25B and non-configuring area 25A.
In addition, in Figure 13, illustrated at the 1st the machining hole 32a in the 35A of region and carried out after perforate processing, processing work platform 21 is moved after the distance of L1 the situation that the 2nd time in the 35B of region machining hole 32b carries out perforate processing, but the displacement of processing work platform 21 has been not limited to L1.As long as make the distance that processing work platform 21 moves be, laser processing device 100 is processed by the 1st perforate processing and the 2nd perforate, can at interior all machining hole 32h, carry out perforate processing to comprising the 1st machining hole 32a and the 2nd machining hole 32b.
In addition, in the present embodiment, illustrated that extraction unit 16 is the situation of 35AHe region, region 35B by the Region Segmentation on workpiece 31, but can by the Region Segmentation on workpiece 31, be also 35AHe region, region 35B by the 1st machining hole configuration part 14 and the 2nd machining hole configuration part 15.
In addition, in Figure 12, the width that adsorption hole configuring area 25B and non-configuring area 25A have been described is the situation of same widths L1, but the width of adsorption hole configuring area 25B and non-configuring area 25A can be also different width.For example, by making the width of adsorption hole configuring area 25B narrower than the width of non-configuring area 25A, thereby can carry out efficiently perforate processing.
In addition, the width L1 of adsorption hole configuring area 25B and non-configuring area 25A can be also size arbitrarily.For example, the width L1 of adsorption hole configuring area 25B and non-configuring area 25A is set as to the identical size of X-direction width of the scanning area that forms with electrical scanner 3a, 3b.Thus, the mobile number of times of processing work platform 21 tails off, and can carry out efficiently perforate processing.In addition, also the X-direction width of scanning area can be set as to the size corresponding with the width L1 of adsorption hole configuring area 25B and non-configuring area 25A.In the case, also can make the mobile number of times of processing work platform 21 tail off, can carry out efficiently perforate processing.
In Figure 12, the situation that adsorption hole configuring area 25B and non-configuring area 25A are set in processing work platform 21X has been described, but also can, on the illustrated processing work platform 21 of Fig. 3, the perforate mould (binding domain described later limits perforate mould 40) of the regulation corresponding with adsorption hole configuring area 25B and non-configuring area 25A be installed.
Figure 14 means that binding domain limits the figure of the structure of perforate mould.In Figure 14, show the oblique view that binding domain limits perforate mould 40.It is the principal plane of principal plane same size and the plates of fine heat radiation property (copper coin etc.) that have with processing work platform 21 that binding domain limits perforate mould 40, forms substantially planar.Binding domain limits perforate mould 40 only at the adsorption hole configuring area 45B place corresponding with adsorption hole configuring area 25B, on the position identical with adsorption hole configuring area 25B, adsorption hole 41h is set, on the non-configuring area 45A corresponding with non-configuring area 25A, adsorption hole 41h is not set.This binding domain limits perforate mould 40 by being positioned on processing work platform 21, is absorbed and fixed at thus on processing work platform 21.And, by limiting on perforate mould 40 and load workpiece 31 at binding domain, thereby workpiece 31 is absorbed and fixed to binding domain, limit on perforate mould 40.Non-configuring area 45A is the region identical with the region that is set as non-configuring area 25A, does not configure adsorption hole 41h in its underpart.In addition, adsorption hole configuring area 45B is the region identical with the region that is set as adsorption hole configuring area 25B, disposes adsorption hole 41h in its underpart.
Figure 15 is used the binding domain shown in Figure 14 to limit the figure that perforate mould carries out perforate processing for illustrating.First laser processing device 100 carries out perforate processing to being positioned at the 1st the machining hole 32a of the region 35A on non-configuring area 45A, skips over the perforate processing of the 2nd the machining hole 32b of the region 35B being positioned on adsorption hole configuring area 45B.
In addition, binding domain limits perforate mould 40 and is not limited to the structure shown in Figure 14, can be also other structures.For example, also can on binding domain limits whole of perforate mould 40, the adsorption hole 41h that aperture is less than adsorption hole 22H be set, so that when binding domain being limited to perforate mould 40 and load on processing work platform 21, overlapping on all adsorption hole 22H have an adsorption hole 41h.
In addition, in the situation that use Figure 12 and illustrated processing work platform 21X or the binding domain of Figure 14 to limit the perforate processing that perforate mould 40 carries out workpiece 31, the position of the position of the adsorption hole 22H using and size, adsorption hole 41h and size can be inputed in laser processing device 100 by operating personnel (process operation personnel), also can login in advance in laser processing device 100.
Illustrated that extraction unit 16 extracts the situation that is positioned at the machining hole 32h above adsorption hole 22H from the machining hole 32h offering at workpiece 31, but also can extract the machining hole 32h that be positioned at adsorption hole 22H top by operating personnel.For example, in the situation that use the illustrated processing work platform 21X of Figure 12 or the illustrated binding domain of Figure 14 to limit perforate mould 40, if the mounting position of known workpiece 31, known which machining hole 32h is positioned at adsorption hole 22H top.Therefore, as long as operating personnel is the position based on not being positioned at the machining hole 32h of adsorption hole 22H top, is created on the 1st procedure to using in the situation that the 1st time machining hole 32a processes and the 2nd procedure using in the situation that the 2nd machining hole 32b processed.Operating personnel utilizes the 1st procedure to process the 1st machining hole 32a, then, workpiece 31 is moved, and utilizes the 2nd procedure to process the 2nd machining hole 32b.Thus, even if laser processing mechanism 101A does not have extraction unit 16, also can, in the position outside above adsorption hole 22H, to all machining hole 32h on workpiece 31, carry out perforate processing.
In addition, the 1st procedure and the 2nd procedure also can be generated by the device outside Working control device 103.In the case, the 1st procedure and the 2nd procedure that utilize input part 11 to be generated by other devices from outside input, laser processing device is used the 1st procedure and the 2nd procedure of inputting, and carries out the perforate processing of workpiece 31.
In addition, in the present embodiment, the situation that laser processing mechanism 101A is used 1 pair of workpiece of 1 bundle laser 31 to carry out perforate processing has been described, but for the laser processing mechanism that can use 1 pair of workpiece 31 of multiple laser to process, also can have applied the laser processing of present embodiment.
Figure 16 means the figure of the structure example of the laser processing mechanism that makes laser multiaxis.Laser processing mechanism 101B is configured to has optical splitter 8 and 2 groups of laser head 9a, 9b.Laser head 9a, 9b have respectively: electric scanning speculum 2a, 2b, electrical scanner 3a, 3b and f θ lens 4.The laser 1 that laser oscillator is exported carries out light splitting by optical splitter 8, and the laser after light splitting 1 is supplied with to laser head 9a, 9b simultaneously.And the laser 1 irradiating from laser head 9a, 9b is implemented perforate processing on each workpiece 31 simultaneously.In addition, in Figure 16, the laser processing mechanism 101B with 2 laser heads has been described, but laser processing mechanism 101B also can have and is more than or equal to 4 laser heads.
For example, in the situation that 2 workpiece are carried out to perforate processing by the laser processing mechanism 101B with 2 laser heads, sometimes because the mounting position of workpiece 31 is different, cause a workpiece 31 different with the machining hole 32h that is positioned at adsorption hole 22H top in another workpiece 31.In other words, even identical machining hole 32h also can be positioned at above adsorption hole 22H sometimes in a workpiece 31, in another workpiece 31, be not positioned at above adsorption hole 22H.Therefore, laser processing mechanism 101B extracts respectively the machining hole 32h being positioned at above adsorption hole 22H in laser head 9a side and laser head 9b side.
In the situation that the machining hole 32h of laser head 9a side above being positioned at adsorption hole 22H with laser head 9b side is different, laser processing mechanism 101B cannot carry out identical action in laser head 9a side and laser head 9b side.Therefore, the position of machining hole 32h outside being present in above adsorption hole 22H in a workpiece 31, and in the situation that in another workpiece 31 machining hole 32h be present in the position above adsorption hole 22H, to another workpiece 31, do not irradiate laser 1.In the situation that do not irradiate laser 1 (skipping over processing) to the machining hole 32h of another workpiece 31, such as in laser head 9a, 9b, set in advance for block laser 1 can freely openable photochopper (not shown) etc., by closed this photochopper, block laser 1.In addition, in the situation that the machining hole 32h (arbitrary axis) in any one workpiece 31 is for to skip over object, also can skip over the Ear Mucosa Treated by He Ne Laser Irradiation towards these two workpiece 31, skip over thus left and right both sides' perforate processing.
In addition, in Figure 16, illustrated that laser processing mechanism 101B utilizes 8 pairs of laser of optical splitter 1 to carry out light splitting, and the situation that the laser after light splitting 1 is supplied with to laser head 9a, 9b simultaneously, but the laser 1 of supplying with to laser head 9a, 9b needn't be supplied with simultaneously.Laser processing mechanism 101B also can be for example by laser 1 to laser head 9a, 9b alternate allocation.Specifically, by laser 1 timesharing is supplied with to laser head 9a, 9b, make thus laser 1 branch in turn 2 light paths.And, utilize laser head 9a and laser head 9b, to the processing work platform 21 (workpiece 31 in left side) of a side and the processing work platform 21 (workpiece 31 on right side) of opposite side, alternately irradiate laser.
In addition, owing to adding in the processing work platform 21 in man-hour and the unsuitable situation of relative position between workpiece 31 the 2nd perforate, even add and also do not carry out Ear Mucosa Treated by He Ne Laser Irradiation to the 2nd machining hole 32b man-hour the 2nd perforate.Therefore, preferably whether laser processing device 100 has to operating personnel and notifies finally all machining hole 32hs corresponding with Laser Processing data have been carried out to the function (such as display units such as liquid crystal displays) that this content is processed in perforate.In addition, also can be so that laser processing device 100, in the situation that utilizing the 1st time and the 2nd perforate processing does not complete all perforate processing, carries out the 3rd time and follow-up perforate processing.For example, laser processing device 100 moves the position of workpiece 31, so that be all positioned at the machining hole 32h above adsorption hole 22H in this twice processing processed in the 1st time and the 2nd perforate, is not positioned at above adsorption hole 22H in the 3rd perforate processing.
As noted above, according to present embodiment, owing to the 2nd the machining hole 32b being positioned at above adsorption hole 22H not processed in the 1st perforate processing, and only carry out the perforate processing of the 1st machining hole 32a, so can be at short notice on workpiece 31 perforate process the machining hole of processing quality homogeneous.In addition, owing to the 2nd the machining hole 32b being positioned at above adsorption hole 22H not processed in the 1st perforate processing, after the perforate of the 1st machining hole 32a machines, relative position between processing work platform 21 and workpiece 31 is moved, thus can make to be originally positioned at the 2nd machining hole 32b of adsorption hole 22H top move to not with the overlapping position of adsorption hole 22H on.Therefore, the position that can make to be originally positioned at the 2nd machining hole 32b of adsorption hole 22H top is moved and rear machining hole 32h is carried out to perforate processing, thus can be at short notice on workpiece 31 perforate process the hole of processing quality homogeneous.
In addition, owing to utilizing Handling device 102 that the position of workpiece 31 is moved, so can easily carry out the movement of workpiece 31.In addition, because processing work platform 21 has adsorption hole configuring area 25B and non-configuring area 25A, and in the region on workpiece 31, be set with the region 35B that region 35A that the 1st machining hole 32a use and the 2nd machining hole 32b use, so can be easily and carry out efficiently perforate processing.In addition, because limiting on perforate mould 40, binding domain there is adsorption hole configuring area 45B and non-configuring area 45A, and in the region on workpiece 31, be set with the region 35B that region 35A that the 1st machining hole 32a use and the 2nd machining hole 32b use, so can be easily and carry out efficiently perforate processing.In addition, due to the width L1 of adsorption hole configuring area 25B and non-configuring area 25A is set as, the identical size of width in the X-direction of the scanning area 7 forming with electrical scanner 3a, 3b, thus can make the mobile number of times of processing work platform 21 tail off, thus carry out perforate processing efficiently.
Industrial applicibility
As noted above, laser processing device involved in the present invention, laser processing, Working control device and processing control method, be applicable to the Laser Processing of carrying out in absorption fixation workpiece.
Claims (13)
1. a laser processing device, is characterized in that, has:
Processing work platform, it loads the workpiece as workpiece, and utilizes the adsorption hole that the bottom surface of loaded described workpiece is adsorbed, the fixing described workpiece of absorption;
Laser Processing portion, it irradiates laser to the described workpiece being absorbed and fixed on described processing work platform, thereby described workpiece is carried out to the perforate processing of machining hole; And
Working control device, it is by controlling described processing work platform and described Laser Processing portion, makes thus workpiece on described processing work platform and the relative position between the irradiation position of described laser move,
Described Working control device has:
Extraction unit, it is that the described machining hole of the upside of binding domain extracts for upload the prescribed limit being positioned at be equipped with described workpiece in the situation that with respect to described adsorption hole at described processing work platform; And
The 1st configuration part, it will remove the residue machining hole after the machining hole being extracted by described extraction unit the machining hole from as processing object, and being set as the 1st perforate processing object is the 1st machining hole,
Described Laser Processing portion carries out perforate processing as the 1st perforate processing and to the 1st machining hole of being set by described the 1st configuration part.
2. laser processing device according to claim 1, is characterized in that,
Described Working control device also has the 2nd configuration part, and it is set as the 2nd perforate processing object after the 1st perforate processing, i.e. the 2nd machining hole by the machining hole being extracted by described extraction unit,
After the perforate processing of described the 1st machining hole, make after described the 2nd machining hole move to the upside that is not positioned at described binding domain, described Laser Processing portion carries out perforate processing as the 2nd perforate processing and to the 2nd machining hole of being set by described the 2nd configuration part.
3. laser processing device according to claim 2, is characterized in that,
Also have Handling device, it is for described workpiece is moved into described processing work platform, and the described workpiece on described processing work platform is taken out of,
After the perforate processing of having carried out described the 1st machining hole, described Handling device moves the relative position between described workpiece and described processing work platform, so that described the 2nd machining hole is not positioned at the upside of described binding domain.
4. laser processing device according to claim 1, is characterized in that,
Described processing work platform is configured to, in the rectangular shaped areas of regulation, load described workpiece, and with a striated that limit is parallel with described rectangular shaped areas, dispose as the adsorption hole configuring area in the region of the described adsorption hole of configuration with as not configuring the non-configuring area in the region of described adsorption hole
Described extraction unit is extracted as by the described machining hole that is positioned at described adsorption hole configuring area upside the machining hole that is positioned at described binding domain upside.
5. laser processing device according to claim 1, is characterized in that,
Also have perforate mould, it is configured between the upper surface of described processing work platform and the bottom surface of described workpiece, a part for inaccessible described adsorption hole, and described processing work platform across described perforate mould, the bottom surface of described workpiece is adsorbed fixing,
Described perforate mould is configured to, in the rectangular shaped areas of regulation, load described workpiece, and with a striated that limit is parallel with described rectangular shaped areas, configuration as dispose described adsorption hole region adsorption hole configuring area and as not configuring the non-configuring area in the region of described adsorption hole
Described extraction unit is extracted as by the described machining hole that is positioned at described adsorption hole configuring area upside the machining hole that is positioned at described binding domain upside.
6. according to the laser processing device described in claim 4 or 5, it is characterized in that,
Described Laser Processing portion has electrical scanner, and it scans the laser irradiating to described workpiece in the machined surface of described workpiece,
The width of fringe of described adsorption hole configuring area and described non-configuring area is identical with the peak width that described electrical scanner scans.
7. laser processing device according to claim 1, is characterized in that,
Described processing work platform has a plurality of and forms, and on each processing work platform, loads described workpiece,
Described Laser Processing portion irradiates laser to each workpiece on described each processing work platform, described each workpiece is carried out to the perforate processing of identical configuration,
Described Working control device is set described the 1st machining hole for workpiece described in each, and described Laser Processing portion is controlled, the machining hole of processing with the same position place on described each workpiece, in the 1st workpiece in a plurality of described workpiece, be set as described the 1st machining hole, and in the situation that be not set as described the 1st machining hole in the 2nd workpiece in a plurality of described workpiece, for the machining hole that is not set as described the 1st machining hole, the irradiation of described laser is blocked, thereby skip over perforate processing.
8. laser processing device according to claim 7, is characterized in that,
Described Working control device is controlled described Laser Processing portion, the machining hole of processing with the same position place on described each workpiece, in the 1st workpiece in a plurality of described workpiece, be set as described the 1st machining hole, and in the situation that be not set as described the 1st machining hole in the 2nd workpiece in a plurality of described workpiece, for be not set as the machining hole of described the 1st machining hole and be set as described the 1st machining hole machining hole the two, the irradiation of described laser is blocked, thereby skip over perforate processing.
9. a laser processing, in the method, by subtend processing work platform and be absorbed and fixed at that workpiece on described processing work platform irradiates laser and the Laser Processing portion that described workpiece carries out the perforate processing of machining hole is controlled, make thus workpiece on described processing work platform and the relative position between the irradiation position of described laser move, wherein, this processing work platform mounting is as the workpiece of workpiece, and utilize the adsorption hole that the bottom surface of loaded described workpiece is adsorbed, the fixing described workpiece of absorption
This laser processing is characterised in that, comprises following step, that is:
Hole input information step, in this step, from input binding domain top, outside machining hole information, this binding domain top machining hole information is uploaded the situation that is equipped with described workpiece for specifying in described processing work platform from described machining hole, and the prescribed limit being positioned at respect to described adsorption hole is the binding domain top machining hole of the upside of binding domain;
Set step, in this step, using the residue machining hole of removing the machining hole from as processing object after the machining hole of described binding domain top, being set as the 1st perforate processing object is the 1st machining hole; And
Procedure of processing, in this step, makes described Laser Processing portion as the 1st perforate processing and the 1st machining hole of being set by described setting step is carried out to perforate processing.
10. laser processing according to claim 9, is characterized in that,
Described binding domain top machining hole information is as described below and generate, that is,
At described processing work platform, in regulation rectangular shaped areas, load described workpiece, and on described processing work platform, usining becomes the mode of the striated parallel with a limit of described rectangular shaped areas and disposes as the adsorption hole configuring area in the region of the described adsorption hole of configuration with as not configuring in the situation of non-configuring area in region of described adsorption hole
The described machining hole that is positioned at described adsorption hole configuring area upside is extracted as to described binding domain top machining hole.
11. laser processings according to claim 9, is characterized in that,
Described binding domain top machining hole information is as described below and generate, that is,
At described processing work platform via being disposed between the upper surface of described processing work platform and the bottom surface of described workpiece and the perforate mould of a part for inaccessible described adsorption hole, the bottom surface of described workpiece is adsorbed fixing, and described perforate mould loads described workpiece in regulation rectangular shaped areas, and on described perforate mould, usining becomes the mode of the striated parallel with a limit of described rectangular shaped areas and disposes as the adsorption hole configuring area in the region of the described adsorption hole of configuration with as not configuring in the situation of non-configuring area in region of described adsorption hole
The described machining hole that is positioned at described adsorption hole configuring area upside is extracted as to described binding domain top machining hole.
12. 1 kinds of Working control devices, it is by subtend processing work platform and be absorbed and fixed at that workpiece on described processing work platform irradiates laser and the Laser Processing portion that described workpiece carries out the perforate processing of machining hole is controlled, make thus workpiece on described processing work platform and the relative position between the irradiation position of described laser move, wherein, this processing work platform mounting is as the workpiece of workpiece, and utilize the adsorption hole that the bottom surface of loaded described workpiece is adsorbed, the fixing described workpiece of absorption
It is characterized in that having:
Extraction unit, it is that the described machining hole of the upside of binding domain extracts for upload the prescribed limit being positioned at be equipped with described workpiece in the situation that with respect to described adsorption hole at described processing work platform; And
Configuration part, it will remove the residue machining hole after the machining hole being extracted by described extraction unit the machining hole from as processing object, and being set as the 1st perforate processing object is the 1st machining hole,
Make described Laser Processing portion as the 1st perforate processing and the set by described configuration part the 1st machining hole carried out to perforate processing.
13. 1 kinds of processing control methods, in the method, by subtend processing work platform and be absorbed and fixed at that workpiece on described processing work platform irradiates laser and the Laser Processing portion that described workpiece carries out the perforate processing of machining hole is controlled, make thus workpiece on described processing work platform and the relative position between the irradiation position of described laser move, wherein, this processing work platform mounting is as the workpiece of workpiece, and utilize the adsorption hole that the bottom surface of loaded described workpiece is adsorbed, the fixing described workpiece of absorption
It is characterized in that, comprise following step, that is:
Extraction step, in this step, is that the described machining hole of the upside of binding domain extracts for upload the prescribed limit being positioned at be equipped with described workpiece in the situation that with respect to described adsorption hole at described processing work platform;
Set step, in this step, will the machining hole from as processing object, remove the residue machining hole after the machining hole being extracted by described extraction step, being set as the 1st perforate processing object is the 1st machining hole; And
Procedure of processing, in this step, makes described Laser Processing portion as the 1st perforate processing and the 1st machining hole of being set by described setting step is carried out to perforate processing.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2009/054066 WO2010100727A1 (en) | 2009-03-04 | 2009-03-04 | Laser machining apparatus, laser machining method, machining control apparatus and machining control method |
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| CN102216023A CN102216023A (en) | 2011-10-12 |
| CN102216023B true CN102216023B (en) | 2014-05-07 |
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| JP (1) | JP5230796B2 (en) |
| KR (1) | KR101251084B1 (en) |
| CN (1) | CN102216023B (en) |
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| WO2013136695A1 (en) * | 2012-03-16 | 2013-09-19 | パナソニック株式会社 | Laser processing device and laser processing method |
| JP2013246885A (en) * | 2012-05-23 | 2013-12-09 | Shin Etsu Polymer Co Ltd | Device for manufacturing conductive pattern formation sheet and method for manufacturing conductive pattern formation sheet |
| CN106404786A (en) * | 2016-11-04 | 2017-02-15 | 中国科学院长春光学精密机械与物理研究所 | Circuit board image scanning device |
| CN107127463A (en) * | 2017-05-27 | 2017-09-05 | 东莞市盛雄激光设备有限公司 | A kind of HDI circuit borings machine |
| CN107734844A (en) * | 2017-09-29 | 2018-02-23 | 奥士康科技股份有限公司 | A kind of printed circuit board (PCB) and its fixing means |
| CN113500313A (en) * | 2021-06-23 | 2021-10-15 | 济南森峰科技有限公司 | Laser high-speed dislocation punching method with dynamic Z-axis movement |
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- 2009-03-04 KR KR1020117007145A patent/KR101251084B1/en not_active IP Right Cessation
- 2009-03-04 CN CN200980145692.6A patent/CN102216023B/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| WO2010100727A1 (en) | 2010-09-10 |
| JPWO2010100727A1 (en) | 2012-09-06 |
| KR101251084B1 (en) | 2013-04-05 |
| CN102216023A (en) | 2011-10-12 |
| TW201032937A (en) | 2010-09-16 |
| TWI378840B (en) | 2012-12-11 |
| JP5230796B2 (en) | 2013-07-10 |
| KR20110059736A (en) | 2011-06-03 |
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