KR101251084B1 - Laser machining apparatus, laser machining method, machining control apparatus and machining control method - Google Patents

Abstract

The processing table 103 which adsorbs and fixes the bottom of the workpiece to the adsorption hole and the processing control device 103 which controls the laser processing mechanism 101A for irradiating the workpiece with laser light to perform perforation processing are located above the suction area of the processing table. The extraction part 16 which extracts the process hole to be made, and the remaining process hole except the process hole which the extraction part 16 extracted from the process hole used as a process object as the 1st process hole which is the 1st drilling object. The first processing hole setting unit 14 to be set is provided, and the laser processing mechanism 101A is subjected to the drilling of the first processing hole.

Description

Laser processing equipment, laser processing method, processing control device and processing control method {LASER MACHINING APPARATUS, LASER MACHINING METHOD, MACHINING CONTROL APPARATUS AND MACHINING CONTROL METHOD}

The present invention relates to a laser processing apparatus, a laser processing method, a processing control device, and a processing control method for performing laser processing while adsorbing and fixing a workpiece.

As one of the apparatuses for processing a workpiece (a workpiece) such as a printed circuit board, there is a laser processing apparatus that performs a perforation process by irradiating a laser beam onto the workpiece. In such a laser processing apparatus, the position of the processing hole is shifted when the workpiece is moved during the punching process. Therefore, it is necessary to fix the workpiece on the processing table.

As a method for fixing a work on a work table, there is a method of placing a work on a suction hole provided on the work table and depressurizing the suction hole. In this method, by providing a plurality of suction holes on the processing table, the workpiece can be laser processed while preventing warping of the workpiece (for example, see Patent Document 1).

[Patent Document 1] Japanese Patent Application Laid-Open No. 2000-334593

However, in the above conventional technique, the processing quality is different in the processing hole when the processing hole of the workpiece overlaps with the suction hole on the processing table and the processing hole when the processing hole of the workpiece does not overlap with the suction hole on the processing table. There was a problem. There is a method in which heat is transferred to the back surface of the work as one of the causes of the different processing quality at a location with suction holes and a location without suction holes. The reason why the heat is transferred to the back surface of the work is different because the phenomenon that the heat of laser processing escapes along the processing table at a location with suction holes and a location without suction holes is different. For this reason, when the workpiece is processed on a machining table without suction holes, the material of the workpiece bottom is simple when the workpiece on the suction hole is processed, even if the workpiece condition is such that the material on the lower surface of the workpiece is not damaged. It may be broken easily.

For this reason, there existed a problem that a large time may be needed for determination of the processing conditions for making the processing quality the same in the location with an adsorption hole, and the location without an adsorption hole. In addition, in order to make the processing quality the same in the place with the adsorption hole and the place without the adsorption hole, there is a method in which the laser power is weakened and irradiated plural times, but this method requires a long time for laser processing. There was problem to say.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to obtain a laser processing apparatus, a laser processing method, a processing control device and a processing control method for drilling a processing hole of uniform processing quality into a workpiece in a short time.

MEANS TO SOLVE THE PROBLEM In order to solve the above-mentioned subject and achieve the objective, this invention provides the processing table which adsorbs and fixes the said workpiece by the adsorption hole which adsorb | sucks the bottom surface of the said workpiece | work which the workpiece | work which is a workpiece is placed, and the said processing, The laser processing part which irradiates a laser beam to the said workpiece fixedly adsorbed on the table, and performs the perforation processing of a processing hole to the said workpiece, and controls the said processing table and the said laser processing part, And a processing control device for moving a position relative to the irradiation position, wherein the processing control device is located above the suction area within a predetermined range from the suction hole when the workpiece is placed on the processing table. The extraction part for extracting the processing hole and the processing hole to be processed; And a first machining hole setting section for setting the remaining machining holes except the additionally extracted machining holes to the first machining hole that is the first punching machining target, and the laser machining section sets the first machining hole as the first punching machining. It is characterized by performing perforation processing of the additionally set first machining hole.

In the laser processing apparatus according to the present invention, when the workpiece is placed on the machining table, the remaining machining holes except for the machining holes located above the suction hole are subjected to the punching process as the first punching target. It produces the effect that it becomes possible to process a process hole of uniform processing quality to a workpiece in a short time.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows a part of laser processing apparatus concerning embodiment.
2 is a block diagram showing a configuration of a laser processing apparatus according to the embodiment.
3 is a view for explaining the workpiece and the machining table.
4 is a view for explaining the positional relationship between the processing hole and the suction hole.
5 is a cross-sectional view taken along line AA of FIG. 4.
Fig. 6 is a diagram for explaining the positional relationship between the processing hole and the suction hole when the first punching process is performed.
FIG. 7 is a view for explaining the positional relationship between the processing hole and the suction hole when performing the second punching operation. FIG.
FIG. 8 is a view for explaining the movement processing of the work performed before the second hole is drilled. FIG.
9 is a view for explaining the processing sequence of the first machining hole.
10 is a diagram for explaining the movement processing of the work.
11 is a diagram illustrating a moving process procedure of the work.
12 is a view for explaining an adsorption zone and a non-adsorption zone on the processing table.
It is a figure for demonstrating the drilling process using the machining table shown in FIG.
It is a figure which shows the structure of a adsorption area limiting fixture.
It is a figure for demonstrating the drilling process using the adsorption | suction area limiting jig | tool shown in FIG.
It is a figure which shows the structural example of the laser processing mechanism which multiaxialized the laser beam.

EMBODIMENT OF THE INVENTION Below, the laser processing apparatus, laser processing method, processing control apparatus, and processing control method which concern on embodiment of this invention are demonstrated in detail based on drawing. In addition, this invention is not limited by this embodiment.

Embodiment.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows a part of laser processing apparatus concerning embodiment. In FIG. 1, as a part of a laser processing apparatus (laser drilling machine), the structure of 101 A of laser processing mechanisms (laser processing part) which performs the drilling process of the workpiece | work (process object) 31 is shown.

The laser processing apparatus 101A includes a galvano scanner mirror 2a, 2b, a galvano scanner 3a, 3b, a fθ lens 4, and a work table on which the work 31 is placed. 21). 101 A of laser processing mechanisms adsorb | suck and fix the workpiece | work 31 by the suction hole 22H provided in the whole surface of the processing table 21, and irradiate a laser beam to this workpiece | work 31, and the hole of the workpiece | work 31 is carried out. Bet processing is performed. The suction hole 22H is a hole for sucking the bottom of the work 31 and fixing it to the machining table 21. The work table 21 puts the work 31 on, and then depressurizes the suction hole 22H to suck the bottom surface of the work 31 onto the top surface of the work table 21.

The galvano scanner mirror 2a is a first galvano scanner mirror that receives the laser light 1 output from the laser oscillator, not shown. The galvano scanner mirror 2a is connected to the drive shaft of the galvano scanner 3a, and the drive shaft of the galvano scanner 3a faces the Z-axis direction. The mirror surface of the galvano scanner mirror 2a displaces with rotation of the drive shaft of the galvano scanner 3a, and deflects the optical axis of the incident laser light 1 in the first direction (for example, the X axis direction). Scanning is carried out to the galvano scanner mirror 2b.

The galvano scanner mirror 2b is a second galvano scanner mirror that receives the laser light 1 from the galvano scanner mirror 2a. The galvano scanner mirror 2b is connected to the drive shaft of the galvano scanner 3b, and the drive shaft of the galvano scanner 3b faces the X-axis direction. The mirror surface of the galvano scanner mirror 2b is displaced with the rotation of the drive shaft of the galvano scanner 3b, and the second direction (for example, orthogonal to the optical axis of the incident laser light 1) is substantially perpendicular to the first direction. For example, deflective scanning in the Y-axis direction is sent to the fθ lens 4.

The fθ lens 4 condenses and irradiates the laser beam 1 two-dimensionally scanned on the XY plane onto the work 31. The work 31, such as a printed circuit board material and a ceramic green sheet, has a planar shape, and the processing table 21 mounts the work 31 in XY plane.

In the laser processing mechanism 101A, the processing table 21 is moved within the XY plane, and the laser beam 1 is scanned two-dimensionally by the galvano scanners 3a and 3b. As a result, one to a plurality of processing holes 32h are formed in the workpiece 31 in the scan area 7 within the range in which the laser beam 1 can be two-dimensionally scanned by the galvano scanners 3a and 3b. (Puncture process).

2 is a block diagram showing a configuration of a laser processing apparatus according to the embodiment. The laser processing apparatus 100 has the processing control apparatus 103, 101 A of laser processing mechanisms, and the conveying apparatus 102.

The processing control apparatus 103 is connected to the laser processing mechanism 101A and the conveying apparatus 102, and is an apparatus, such as a computer which controls the laser processing mechanism 101A and the conveying apparatus 102. As shown in FIG. The processing control device 103 includes an input unit 11, a data conversion unit 12, a suction hole coordinate storage unit 13, a first processing hole setting unit 14, a second processing hole setting unit 15, and an extraction unit. (16) and a control unit (19).

The input unit 11 inputs coordinate data of a hole to be punched into the work 31, various pieces of instruction information about the punching process to the work 31, and the like. The data conversion unit 12 converts the coordinate data input to the input unit 11 into laser processing data. Laser processing data are coordinate data used by the processing control apparatus 103 at the time of drilling, and are represented by processing table data and galvano data. Since a plurality of holes are drilled in the work 31, the positions of the holes are represented by machining table data and galvano data for each position of the holes. The machining table data is relative coordinates between the machining table 21 and the machining head, and is, for example, data (coordinates) at a position for moving the machining table 21. The galvano data is the irradiation position (coordinate) of the laser beam adjusted by the galvano scanner mirrors 2a and 2b and the galvano scanners 3a and 3b. The galvano data represents the coordinates in the scan area 7.

The suction hole coordinate storage unit 13 is a memory for storing the position of the suction hole 22H (hereinafter, referred to as suction hole coordinates) provided on the machining table 21. The suction hole coordinates are the central coordinates and the diameter of the suction holes 22H, and are stored in the suction hole coordinate storage unit 13 in advance as numerical values inherent in the laser processing apparatus 100.

The extraction part 16 is based on the adsorption hole coordinates memorize | stored by the adsorption hole coordinate memory part 13, and the laser processing data which the data conversion part 12 converted, and is among the process holes 32h drilled in the workpiece | work 31. The processing hole 32h located on the suction hole 22H is extracted (extraction step).

The first machining hole setting unit 14 excludes the machining hole 32h extracted by the extraction unit 16 from the laser machining data, and uses the laser machining data after removing the machining hole 32h, and thus, the workpiece 31 The hole (the 1st process hole 32a of the following description) opened by the 1st (1st order) punching process is set out from the process hole 32h drilled in the). In other words, the first processing hole setting unit 14 generates laser processing data for opening the first processing hole 32a.

The second processing hole setting unit 15 uses the processing hole 32h extracted by the extraction unit 16 to perform the second (second order) drilling process among the processing holes 32h drilled into the workpiece 31. A hole to be opened (second process hole 32b described later) is set. In other words, the second processing hole setting unit 15 generates laser processing data for opening the second processing hole 32b. As a result, the second machining hole setting unit 15 moves the machining hole 32h positioned on the suction hole 22H from the machining hole 32h drilled into the workpiece 31 as the second machining hole 32b. Set it. The control unit 19 includes an input unit 11, a data conversion unit 12, a suction hole coordinate storage unit 13, a first processing hole setting unit 14, a second processing hole setting unit 15, and an extraction unit 16. ).

In the present embodiment, when the work 31 is first placed on the machining table 21, the machining hole 32h which does not become on the suction hole 22H is set as the first machining hole 32a ( Setting Step) The first punching hole 32a is drilled (processing step). After that, by moving the work 31 on the work table 21, the relative position between the work 31 and the work table 21 is moved. At this time, when the workpiece 31 is first placed on the machining table 21, the workpiece 31 is processed so that the second machining hole 32b on the suction hole 22H does not become on the suction hole 22H. It moves on the table 21. Then, the hole punching process of the second hole 32b is performed. Thereby, the laser processing apparatus 100 drills a hole in both the 1st process hole 32a and the 2nd process hole 32b in the position which does not become on the suction hole 22H.

The laser processing apparatus 100 detects an alignment mark (positioning mark) previously provided on the workpiece 31 using a CCD (Charge Coupled Device) camera or the like, and processes the workpiece 31 and the workpiece 31 based on the position of the alignment mark. The relative position with the table 21 is corrected. And the laser processing apparatus 100 performs the perforation process to the workpiece | work 31 based on the coordinate of the workpiece | work 31 after correction | amendment.

The conveying apparatus 102 is an apparatus (loader / unloader) which carries in / out of the workpiece | work 31 on the machining table 21. As shown in FIG. The conveying apparatus 102 of this embodiment carries out the perforation process of the 1st process hole 32a, and moves the workpiece | work 31 into the process table 21 so that the 2nd process hole 32b may not become on the suction hole 22H. Move on).

The processing control apparatus 103 moves the conveyance apparatus 102 relative position of the workpiece | work 31 and the processing table 21 by the predetermined | prescribed coordinate based on a suction hole coordinate and laser processing data. In addition, the processing control device 103 controls the laser processing mechanism 101A to perform drilling processing at a predetermined coordinate position based on the suction hole coordinates and the laser processing data.

The processing control device 103 is configured to include a central processing unit (CPU), a read only memory (ROM), and a random access memory (RAM). In the processing control device 103, the CPU reads out various control programs and application programs stored in the ROM by input from the input unit by the user, expands them into the program storage area in the RAM, and executes various processes. Various data generated at the time are temporarily stored in the data storage area formed in the RAM to control the laser processing apparatus 100. The program executed by the CPU is a program for setting the first machining hole 32a or the second machining hole 32b, a program for calculating the machining procedure of the first machining hole 32a, and the machining of the second machining hole 32b. Programs for calculating the order, programs for calculating the movement amount of the machining table 21 when the relative position between the workpiece 31 and the machining table 21 are moved.

In addition, you may perform the mounting of the workpiece | work 31 on the processing table 21, and the movement of the workpiece | work 31 on the processing table 21 manually. In this case, the laser processing apparatus 100 does not need to have the conveying apparatus 102.

Next, the laser processing method of the laser processing apparatus 100 which concerns on this embodiment is demonstrated. The laser processing apparatus 100 eliminates the machining quality difference between the processing hole 32h on the suction hole 22H and the processing hole 32h at positions other than the suction hole 22H. The hole with a hole is not drilled, but the hole is drilled at a position other than the suction hole 22H. Specifically, the processing control device 103 skips the drilling process without performing the drilling operation on the hole of the laser processing data corresponding to the suction hole 22H.

3 is a view for explaining the workpiece and the machining table. In FIG. 3, the perspective view of the workpiece | work 31 and the processing table 21 is shown. One to the plurality of suction holes 22H are provided on the processing table 21, and when the workpiece 31 is placed on the processing table 21, the workpiece 31 is processed by the suction holes 22H. It is fixed on). And the laser processing apparatus 100 performs the drilling process of the process hole 32h in the state which fixed the workpiece | work 31 on the processing table 21. As shown in FIG. The workpiece 31 has a rectangular shape, for example, and the positioning marks 33 are provided at four corners on the upper surface side.

When the laser processing apparatus 100 performs the perforation processing of the processing hole 32h, the exact position of the workpiece | work 31 is judged using the positioning mark 33. As shown in FIG. Specifically, the CCD camera which the laser processing apparatus 100 has recognizes the positioning mark 33 of the workpiece | work 31, and specifies the position which should be punched out as a position inherent to the laser processing apparatus 100. do. In other words, the data conversion unit 12 of the processing control device 103 has an algorithm inherent in the laser processing device 100 in accordance with the arrangement (rotation, expansion, etc.) of the work 31.

The CCD camera picks up the positioning marks 33 arranged at four corners of the work 31 after the work 31 is fixed to the machining table 21. Thereafter, the laser beam 1 is emitted from the processing head of the laser processing apparatus 100 to perform the drilling process at a predetermined position. In the case of punching the workpiece 31, the punching is performed in the order according to the laser processing data. At that time, in order to perform the punching work in accordance with the rotation and expansion and contraction of the work 31, the processing control device 103 specifies the target position of the punching work while performing the correction calculation of the position of the work 31.

When the workpiece 31 is fixed on the work table 21, the work hole 32h and the suction hole 22H may overlap. 4 is a view for explaining the positional relationship between the processing hole and the suction hole. In FIG. 4, the case where the workpiece | work 31 and the processing table 21 were seen from the upper surface is shown. It is necessary to form a plurality of processing holes 32h in the work 31, and a plurality of suction holes 22H are provided on the processing table 21. For this reason, if the bottom surface of the workpiece 31 is fixed to the upper surface of the processing table 21, the processing hole 32h located on the suction hole 22H and the processing hole 32h located other than on the suction hole 22H will be given. ) Will exist.

5 is a cross-sectional view taken along line A-A of Fig. The workpiece 31 has a two-layer structure, for example, the upper layer side is formed of a resin material, for example, and the lower layer side is formed of, for example, copper or the like. And when the laser processing apparatus 100 performs the drilling process of the workpiece | work 31, the process hole 32h is formed only in the upper layer side of the workpiece | work 31 so that the lower layer side of the workpiece | work 31 may not penetrate. By the way, when the processing hole 32h to be processed is located above the suction hole 22H, the lower layer side of the work 31 may be damaged due to the heat of laser processing.

In this embodiment, since the perforation process is not performed on the suction hole 22H, the extraction part 16 is the laser processing apparatus 100 after the data conversion part 12 calculates the target position of the process hole 32h. Is judged whether or not the position of the unique processing hole 32h is the position on the suction hole 22H, and the processing hole 32h on the suction hole 22H is extracted. When the extraction part 16 determines that the target position of the processing hole 32h is on the suction hole 22H, the 1st processing hole setting part 14 of the processing control apparatus 103 has a laser in this processing hole 32h. Do not issue an investigation order.

Further, the extraction section 16 determines whether the position of the processing hole 32h is the position on the suction hole 22H as the suction area within a predetermined range from the center of each suction hole 22H. On the basis of whether or not the position of the processing hole 32h is in the upper part, it is determined whether the position of each processing hole 32h is the position on the suction hole 22H (hole information input step). For example, the extraction part 16 determines whether the position of each processing hole 32h is a position on the suction hole 22H, and the whole area of the processing hole 32h for each processing hole 32h is the suction hole 22H. The determination may be made based on whether or not it is in the upper part, or may be determined based on whether a part of the processing hole 32h is on the suction hole 22H for each processing hole 32h. Moreover, the extraction part 16 provides the area | region larger than each suction hole 22H by a predetermined | prescribed size, and processes it based on whether the process hole 32h is located in the area | region larger than this suction hole 22H. For each of the holes 32h, it may be determined whether the position of the processing hole 32h is the position on the suction hole 22H.

FIG. 6 is a view for explaining the positional relationship between the processing hole and the suction hole when performing the first punching operation, and FIG. 7 shows the positional relationship between the processing hole and the suction hole when performing the second punching process. It is a figure for demonstrating. 6 and 7 show perspective views of the workpiece 31 and the machining table 21.

The machining hole 32h set by the first machining hole setting unit 14 in the first drilling operation is sucked by the machining hole 32h when the workpiece 31 is placed on the machining table 21. It is the process hole 32h which does not overlap with the hole 22H, and below is called the 1st process hole 32a. In FIG. 6, the arrangement position (outer peripheral part of the workpiece 31) of the workpiece | work 31 on the machining table 21 at the time of punching the 1st process hole 32a is shown by arrangement position P1. In addition, in FIG. 6, the position which becomes the lower part of the 1st process hole 32a among the positions on the process table 21 is shown by position 22a, and becomes the lower part of the 2nd process hole 32b of the position on the process table 21. The position is shown by the position 22b.

Moreover, the process hole 32h (the process hole 32h which was not set by the 1st hole process) set by the 2nd process hole setting part 15 by the 2nd hole process is the workpiece | work 31 Is a processing hole 32h in which the processing hole 32h overlaps with the suction hole 22H when it is placed on the processing table 21, hereinafter referred to as a second processing hole 32b.

In this embodiment, after drilling the 1st processing hole 32a, the relative position of the 2nd processing hole 32b and the suction hole 22H is changed by moving the workpiece | work 31 on an XY plane. In FIG. 7, the position of the workpiece | work 31 on the machining table 21 at the time of punching the 1st process hole 32a is shown by the edge part P1, and the process at the time of punching the 2nd process hole 32b is shown. Arrangement position of the workpiece | work 31 on the table 21 is shown by arrangement position P2. In addition, in FIG. 7, the position which becomes the lower part of the 2nd process hole 32b among the positions on the process table 21 is shown by the position 22c. In addition, the movement direction of the workpiece 31 may be a movement only in the X-axis direction, or may be a movement only in the Y-axis direction. In addition, the movement direction of the workpiece 31 may be an inclination direction (X-axis direction and Y-axis direction).

FIG. 8 is a view for explaining the movement processing of the work performed before the second hole is drilled. FIG. In FIG. 8, the case where the workpiece | work 31 was seen from the upper surface is shown, the figure of the left side of FIG. 8 shows the position of the workpiece | work 31 at the time of punching the 1st process hole 32a, and FIG. The figure on the right has shown the position of the workpiece | work 31 at the time of punching the 2nd process hole 32b.

After the first machining hole 32a is drilled (s1), when the relative position between the second machining hole 32b and the suction hole 22H is changed, all the second machining holes 32b are the suction holes ( The workpiece 31 is moved so as not to be in phase 22H) (s2). At this time, the first processing hole 32a, which has been processed, may be on the suction hole 22H.

When the first processing hole setting unit 14 sets the first processing hole 32a, the perforation processing of the first processing hole 32a is performed. At this time, the first processing hole setting unit 14 drills only the first processing hole 32a and drills the laser processing mechanism 101A so as to skip the second processing hole 32b.

9 is a view for explaining the processing sequence of the first machining hole. 9 shows the processing sequence of the first processing hole when all the processing holes 32h are the first processing holes 32a, and the drawing on the right side of FIG. 9 shows the second processing hole 32h. The processing procedure of the first processing hole in the case where the processing hole 32b is included is shown.

If all of the machining holes 32h to be drilled by the laser processing apparatus 100 are the first machining holes 32a, the first machining holes 32a (the machining holes 32h) are sequentially turned in accordance with the original machining program. Process the hole. For example, the processing sequence of the first machining hole 32a is the first machining hole 32a (1), 32a (2), 32a (3), 32a (4), 32a (5), 32a (6), 32a. In the order of (7), 32a (8) and 32a (9), the laser processing apparatus 100 moves the irradiation position of the laser beam 1 to each 1st process hole 32a in this order.

In such a case, if the second processing hole 32b is included in the processing hole 32h, for example, only the first processing hole 32a is sequentially drilled except for the second processing hole 32b. Processing. For example, if the first machining hole 32a (6) is the second machining hole 32b, the laser processing apparatus 100 drills each first machining hole 32a except for the first machining hole 32a (6). I process it. Specifically, the processing sequence of the first machining hole 32a is the first machining hole 32a (1), 32a (2), 32a (3), 32a (4), 32a (5), 32a (7), In order to drill a hole in the order of 32a (8) and 32a (9), the irradiation position of the laser beam 1 is moved to each 1st process hole 32a in this order. In other words, after drilling the first machining hole 32a (5), the first machining hole 32a (7) is not moved to the position of the first machining hole 32a (6) without moving the irradiation position of the laser beam 1. The irradiation position of the laser beam 1 is moved to the position of.

Next, the movement process on the machining table 21 of the workpiece | work 31 is demonstrated. FIG. 10 is a view for explaining a process of moving a work, and FIG. 11 is a diagram showing a procedure for moving a work.

The conveying apparatus 102 is equipped with the arm 41 which carries in the workpiece | work 31 on the processing table 21, and carries out the workpiece | work 31 from the processing table 21. The arm 41 has a pad in the lower part, and this pad is adhere | attached on the upper surface of the workpiece | work 31, and it is set as the structure which can raise the workpiece | work 31. The arm 41 lifts up the workpiece 31 after the first hole 32a is drilled, and the position where the workpiece 31 is placed at the time of punching the first hole 32a (end portion). The workpiece 31 is moved from P1 to the position (end P2) where the workpiece 31 is placed during the punching of the second machining hole 32b.

Specifically, as shown in FIG. 11, after the 1st process hole 32a is punched out, the conveying apparatus 102 moves the arm 41 on the workpiece 31 (ST1). Thereafter, the arm 41 is lowered and the pad of the arm 41 is adhered to the upper surface of the work 31, so that the arm 41 fixes the work 31. Then, the pressure reduction of the suction hole 22H is stopped to release the fixation of the workpiece 31 by the machining table 21 (ST2).

The conveying apparatus 102 raises the workpiece | work 31 by raising the arm 41 (ST3). Then, the processing control device 103 moves the processing table 21 by predetermined coordinates based on the suction hole coordinates and the laser processing data (ST4). At this time, the laser processing apparatus 100 may move the processing table 21 or may move the workpiece 31. After moving the relative position of the workpiece | work table 21 and the workpiece | work 31, the conveying apparatus 102 lowers the arm 41, and places the workpiece | work 31 on the workpiece | work table 21. As shown in FIG. Further, the machining control device 103 may move the machining table 21 by a predetermined distance (designated shift amount) set in advance. For example, the processing control apparatus 103 sets a predetermined shift amount such as several mm (X ± ○. ○○○ mm, Y ± ○. ○○○ mm) in a predetermined direction.

The laser processing apparatus 100 places the workpiece | work 31 on the processing table 21, depressurizes the suction hole 22H, and fixes the workpiece | work 31 on the processing table 21. As shown in FIG. Then, by removing the pad of the arm 41 from the upper surface of the work 31, the fixing of the work 31 by the arm 41 is released (ST5).

Thereafter, the conveying apparatus 102 raises the arm 41 to a predetermined height, and thereafter, the arm 41 is retracted from the work 31 (ST6). After retracting the arm 41 from the work 31, the laser processing apparatus 100 irradiates the laser beam 1 to the second processing hole 32b to drill the hole into the second processing hole 32b. (ST7). When the laser processing apparatus 100 drills the second processing hole 32b, the CCD camera is moved by a distance corresponding to the movement distance of the workpiece 31 to detect the position of the workpiece 31, and the detection result is determined. On the basis, the perforation processing to the second processing hole 32b is performed.

In addition, in this embodiment, the case where the processing hole 32h sets the 1st process hole 32a and the 2nd process hole 32b by the real-time process was demonstrated, However, 1st process hole 32a and 2 previously were demonstrated. You may set the 1st process hole 32b. For example, when there is no difference in the mounting position of the workpiece 31 on the machining table 21, and the mounting position of the workpiece 31 is known in advance, the laser processing apparatus 100 moves the workpiece 31. Before mounting on the processing table 21, you may calculate the position where the processing hole 32h and the suction hole 22H overlap. As a result, the first machining hole 32a and the second machining hole 32b can be set even before the work 31 is placed on the machining table 21.

In addition, the area on the machining table 21 is divided into a plurality of areas, and each area is not arranged with the area for arranging the suction holes 22H (the suction hole arranging area 25B described later) or the suction holes 22H. The non-located area 25A described later may be used. In this case, first, the machining hole 32h is drilled on the non-arrangement area 25A, and then the machining hole 32h on the suction hole arrangement area 25B is moved onto the non-location area 25A. To perform the perforation process.

12 is a view for explaining an adsorption zone and a non-adsorption zone on the processing table. In FIG. 12, the perspective view of the machining table 21X and the workpiece | work 31 is shown. The area on the machining table 21X is divided into, for example, a stripe shape parallel to the X axis direction and a stripe shape parallel to the Y axis direction. In FIG. 12, the case where the area | region on the processing table 21X is divided | segmented into stripe form parallel to a Y-axis direction is shown.

Among the areas on the work table 21X divided into stripe shapes, the suction holes 22H are arranged in the suction hole arrangement area 25B, and the suction holes 22H are not disposed in the non-arrangement area 25A. The adsorption holes 22H formed in the adsorption hole arrangement region 25B are not limited to the case where the adsorption holes 22H are arranged in one row, but may be any other arrangement (for example, two rows arrangement). In FIG. 12, the adsorption | suction hole arrangement area | region 25B and the non-arrangement area | region 25A are shown lined up continuously in the X-axis direction at the interval of width L1, respectively.

The extraction part 16 divides the area | region on the workpiece | work 31 previously into stripe shape parallel to a Y-axis direction. At this time, the extraction part 16 divides the area | region on the workpiece | work 31 in stripe shape based on the arrangement | positioning of the adsorption hole arrangement area | region 25B and the non-arrangement area | region 25A on the processing table 21X. Specifically, the extraction part 16 divides the area | region on the workpiece | work 31 so that the boundary line of the adsorption hole arrangement | positioning area | region 25B and the non-positioning area | region 25A may become a stripe boundary on the workpiece | work 31. As shown in FIG. And the extraction part 16 sets the area | region of the workpiece | work 31 on the non-arrangement area | region 25A to the area | region 35A for the 1st process hole 32a, and the workpiece | work 31 on the adsorption hole arrangement area | region 25B. ) Is set to the area 35B for the second processing hole 32b. As a result, the regions 35A and 35B are continuously arranged in the X-axis direction at intervals of the width L1, respectively, similarly to the arrangement of the suction hole arranging region 25B and the non-arrangement region 25A.

It is a figure for demonstrating the drilling process using the machining table shown in FIG. 13 is a sectional view when the machining table 21X and the workpiece 31 are cut in the X-axis direction. The upper figure of FIG. 13 shows the laser irradiation position at the time of punching the 1st process hole 32a, The lower figure of FIG. 13 shows the laser irradiation at the time of punching the 2nd process hole 32b. The location is shown.

The laser processing apparatus 100 first drills the first machining hole 32a on the region 35A and skips the drilling of the second machining hole 32b on the region 35B. . Then, after the punching of the first machining hole 32a on the region 35A is finished, the region 35B (the second machining hole 32b on the region 35B) is not placed 25A. It moves to the upper side and drills the 2nd process hole 32b on the area | region 35B. When the area 35B is moved, the area 35B is moved onto the non-arranged area 25A by moving the area 35B in the X-axis direction by the width L1 of the adsorption area 25B. This makes it possible to efficiently move the region 35B. In the case of Fig. 12, by shifting the machining table 21X by L1 in the + X direction, it becomes possible to drill all the second machining holes 32b by the second drilling.

Thus, when the area | region on the workpiece | work 31 is divided into the area | region 35A and the area | region 35B, and the perforation process of the 1st process hole 32a and the 2nd process hole 32b is performed, the 1st process hole ( Hole drilling is performed using the laser machining data for 32a) and the laser machining data for the second machining hole 32b.

In addition, although the processing table 21X and the workpiece | work 31 were shown as the same size in FIG. 12, the workpiece | work 31 may be any size. In addition, although the case where the process table 21X was divided | segmented into stripe shape was demonstrated in FIG. 12, the process table 21X is divided | segmented into a grid | lattice form, and the suction hole arrangement area | region 25B and the non-arrangement area | region 25A mutually differ from each other. The suction hole arranging area 25B and the non-arranging area 25A may be arranged in a grid pattern so as to be adjacent to each other.

In Fig. 13, after drilling the first machining hole 32a in the region 35A, the machining table 21 is shifted by a distance of L1, and the second machining hole 32b in the region 35B is drilled. Although the case of betting process was demonstrated, the movement distance of the machining table 21 is not limited to L1. The laser processing apparatus 100 can drill all the processing holes 32h of the 1st processing hole 32a and the 2nd processing hole 32b by the 1st punching process and the 2nd punching process. The machining table 21 may be moved by the distance.

In addition, although the extraction part 16 demonstrated the case where the area | region on the workpiece | work 31 divided into the area | region 35A and the area | region 35B in this embodiment, the 1st process hole setting part 14 and the 2nd process are described. The hole setting part 15 may divide the area | region on the workpiece | work 31 into the area | region 35A and the area | region 35B.

In addition, although the case where the width | variety of the suction hole arrangement | positioning area | region 25B and the non-arrangement area | region 25A was the same width L1 was demonstrated, the width | variety of the suction hole arrangement | positioning area | region 25B and the non-arrangement area | region 25A is different. It may be width. For example, by making the width of the suction hole arranging area 25B narrower than the width of the non-arrangement area 25A, it becomes possible to perform the drilling process efficiently.

The width L1 of the suction hole arranging area 25B and the non-arranging area 25A may be any size. For example, the width L1 of the suction hole arranging area 25B and the non-arranging area 25A is set to the same size as the width in the X-axis direction of the scan area by the galvano scanners 3a and 3b. As a result, the number of movements of the machining table 21 is reduced, and the punching process can be performed efficiently. Further, the width in the X-axis direction of the scan area may be a size corresponding to the width L1 of the suction hole arranging area 25B and the non-arrangement area 25A. Also in this case, the number of movements of the machining table 21 is reduced, and the punching process can be performed efficiently.

In FIG. 12, the case where the suction hole arranging area 25B and the non-arrangement area 25A are provided in the machining table 21X is described. However, the predetermined corresponding to the suction hole arranging area 25B and the non-arrangement area 25A is described. Jig (adsorption area limiting jig 40 described later) may be attached to the machining table 21 described in FIG.

It is a figure which shows the structure of an adsorption area limitation tool. In FIG. 14, the perspective view of the adsorption | suction area limiting fixture 40 is shown. The adsorption area limiting jig 40 is a heat-dissipating plate (copper plate, etc.) having a main surface of approximately the same size as the main surface of the machining table 21, and has a substantially flat plate shape. In the adsorption area limiting fixture 40, the adsorption hole 41h is provided at the same position as the adsorption hole arrangement area 25B only in the adsorption hole arrangement area 45B corresponding to the adsorption hole arrangement area 25B. The suction hole 41h is not provided in the non-arrangement area 45A corresponding to 25A. The adsorption area limiting fixture 40 is mounted on the machining table 21 to be sucked and fixed on the machining table 21. Then, by placing the work 31 on the adsorption area limiting jig 40, the work 31 is adsorbed and fixed to the adsorption area limiting jig 40. The non-located area 45A is the same area as the area in which the non-located area 25A is set, and the suction hole 41h is not disposed below. The adsorption hole arrangement region 45B is the same region as the region in which the adsorption hole arrangement region 25B is set, and the adsorption hole 41h is disposed below.

It is a figure for demonstrating the drilling process using the adsorption | suction area limiting jig | tool shown in FIG. The laser processing apparatus 100 first drills the first machining hole 32a of the region 35A on the non-arrangement region 45A, and then of the region 35B on the suction hole arrangement region 45B. The hole drilling of the second machining hole 32b is skipped.

The laser processing apparatus 100 moves the area | region 35B on the non-arrangement area | region 45A after completion | finish of the punching | drilling process of the 1st process hole 32a on the non-arrangement area | region 45A, and the area | region ( The first machining hole 32a on 35B) is punched out. In the case of moving the region 35B, the region 35B is moved onto the non-arrangement region 45A by moving the region 35B in the X-axis direction by the width L1 of the suction hole arrangement region 45B. This makes it possible to efficiently move the region 35B. In the case of Fig. 14, by shifting the machining table 21X by L1 in the + X direction, it becomes possible to drill all the second machining holes 32b by the second drilling.

The adsorption area limiting fixture 40 is not limited to the configuration shown in FIG. 14 and may be other configurations. For example, when the adsorption area limiting fixture 40 is placed on the machining table 21, the adsorption area limiting fixture 40 is formed on the entire surface of the adsorption area limiting fixture 40 so as to overlap the adsorption holes 41h on all the adsorption holes 22H. The suction hole 41h having a smaller hole diameter than the suction hole 22H may be provided.

In addition, the position and size of the suction hole 22H used in the case where the work 31 is drilled using the machining table 21X or the suction area limiting fixture 40 described with reference to FIGS. The position and size of the 41h may be input to the laser processing apparatus 100 by an operator (processing operator) or may be registered in advance in the laser processing apparatus 100.

Although the case where the extraction part 16 extracts the process hole 32h located on the adsorption hole 22H among the process hole 32h formed in the workpiece | work 31 was demonstrated, the operator performed the adsorption hole 22H. You may extract the process hole 32h located in the image. For example, in the case of using the machining table 21X described with reference to FIG. 12 or the adsorption area limiting fixture 40 described with reference to FIG. 14, as long as the mounting position of the work 31 can be known, a certain machining hole 32h is adsorbed. It can be seen that it is located on the hole 22H. Therefore, the operator uses the first machining program and the second machining hole 32b to be used when machining the first machining hole 32a based on the position of the machining hole 32h not positioned on the suction hole 22H. What is necessary is just to create the 2nd machining program used when machining a process. The operator processes the first machining hole 32a by the first machining program, and then moves the workpiece 7 to machine the second machining hole 32b by the second machining program. Thereby, the laser processing mechanism 101A can drill all the processing holes 32h on the workpiece 7 at positions other than on the suction holes 22H without having the extraction portion 16.

The first machining program and the second machining program may be created by a device other than the machining control device 103. In this case, the laser processing apparatus externally inputs the first machining program or the second machining program created by another apparatus from the input unit 11, and uses the first machining program or the second machining program to input the workpiece 31. Punching is performed.

In addition, in this embodiment, the case where the laser processing mechanism 101A drills the workpiece | work 31 using one laser beam 1 was demonstrated, but the workpiece | work (using the several laser beam 1) You may apply the laser processing method of this embodiment to the laser processing mechanism which can process 31).

It is a figure which shows the structural example of the laser processing mechanism which multiaxialized the laser beam. The laser processing mechanism 101B is equipped with the spectroscope 8 and two sets of laser heads 9a and 9b. The laser heads 9a and 9b have galvano scanner mirrors 2a and 2b, galvano scanners 3a and 3b and an fθ lens 4, respectively. The laser light 1 output by the laser oscillator is spectroscopically by the spectroscope 8, and the spectroscopic laser light 1 is simultaneously supplied to the laser heads 9a and 9b. Then, the laser beam 1 irradiated from the laser heads 9a and 9b simultaneously performs perforation processing on the respective workpieces 31. In addition, although the two-head laser processing mechanism 101B was demonstrated in FIG. 16, the laser processing mechanism 101B may be four heads or more.

For example, when performing the drilling of two workpieces by the two-head laser processing mechanism 101B, one workpiece | work 7 and the other workpiece | work 7 are dependent on the mounting position of the workpiece | work 7. ), The processing hole 32h located on the suction hole 22H may be different. In other words, even the same processing hole 32h may be located on the suction hole 22H in one work 7 and not on the suction hole 22H in the other work 7. For this reason, the laser processing mechanism 101B extracts the processing hole 32h located on the suction hole 22H from the laser head 9a side and the laser head 9b, respectively.

When the processing hole 32h located on the suction hole 22H is different from the laser head 9a side and the laser head 9b, the laser processing mechanism 101B is arranged on the laser head 9a side and the laser head 9b. You cannot do the same on. For this reason, in one workpiece | work 7, the processing hole 32h exists in the position other than the suction hole 22H, and on the other workpiece | work 7, the processing hole 32h is located in the position on the suction hole 22H. If there is, the other workpiece 7 is not irradiated with the laser light 1. When the laser beam 1 is not irradiated to the processing hole 32h of the other workpiece 7 (when processing is skipped), for example, the laser beam 1 is blocked by the laser heads 9a and 9b. A shutter capable of opening and closing (not shown) or the like is provided, and the laser beam 1 is blocked by closing the shutter. In addition, when the processing hole 32h (either axis) to one of the workpieces 7 is a skip target, the laser beam irradiation to both of the workpieces 7 is skipped, whereby the drilling of both the right and left sides is performed. You may skip it.

In addition, in FIG. 16, the laser processing mechanism 101B speculates the laser beam 1 with the spectroscope 8, and supplies the spectroscopic laser beam 1 to the laser heads 9a and 9b simultaneously. However, the laser light 1 supplied to the laser heads 9a and 9b does not need to be supplied at the same time. The laser processing mechanism 101B may, for example, alternately disseminate the laser light 1 to the laser heads 9a and 9b. Specifically, by dividing the laser light 1 into the laser heads 9a and 9b, the laser light 1 is sequentially branched into two optical paths. Then, the laser head 9a and the laser head 9b alternate with one processing table 21 (work 7 on the left) and the processing table 21 (work 7 on the right). The laser beam is irradiated with

By the way, if the relative position between the machining table 21 and the workpiece 31 at the time of the second hole drilling is inappropriate, the laser beam irradiation to the second hole 32b is performed even at the time of the second hole drilling. Will not be. For this reason, the laser processing apparatus 100 finally notifies a worker whether or not the hole 32h corresponding to all laser processing data can be punched out (for example, display means such as a liquid crystal monitor). You may be provided. In addition, when all the boring processes are not completed by the 1st and 2nd boring processes, the laser processing apparatus 100 may perform the 3rd or later boring process. For example, in the laser processing apparatus 100, the processing hole 32h, which has been formed on the suction hole 22H in both the first and second hole drilling operations, is formed on the suction hole 22H by the third drilling operation. The position of the workpiece 31 is moved so as not to.

Thus, according to embodiment, since only the 1st processing hole 32a is drilled without processing the 2nd processing hole 32b on the suction hole 22H by the 1st drilling process, it is uniform. It is possible to drill a hole of the work quality into the work 31 in a short time. In addition, the processing table 21 after the drilling of the first processing hole 32a is completed without processing the second processing hole 32b on the suction hole 22H by the first drilling operation. Since the relative position between the workpiece and the workpiece 31 is shifted, the second machining hole 32b on the suction hole 22H can be moved to a position not overlapping with the suction hole 22H. Therefore, since the punching process to the processing hole 32h can be performed by shifting the position of the 2nd processing hole 32b on the suction hole 22H, the workpiece | work 31 is made into the hole of uniform processing quality in a short time. It is possible to process the hole in the hole.

Moreover, since the position of the workpiece | work 31 is moved by the conveying apparatus 102, it becomes possible to move the workpiece | work 31 easily. In addition, the processing table 21 has the suction hole arranging area 25B and the non-arrangement area 25A, and the area 35A for the first processing hole 32a and the second time in the area on the workpiece 31. Since the area | region 35B for the process hole 32b is set, it becomes possible to easily perform highly efficient punching process. The suction area limiting jig 40 has a suction hole placement area 45B and a non-arrangement area 45A, and an area 35A for the first machining hole 32a in the area on the work 31. Since the area | region 35B for the 2nd process hole 32b is set, it becomes possible to perform a highly efficient punching process easily. In addition, since the width L1 of the suction hole arrangement area 25B and the non-arrangement area 25A is the same size as the width in the X-axis direction of the scan area 7 by the galvano scanners 3a and 3b, the processing table The number of movements of (21) is reduced, and the punching process can be performed efficiently.

[Industrial Availability]

As described above, the laser processing apparatus, the laser processing method, the processing control device, and the processing control method according to the present invention are suitable for laser processing while the workpiece is fixed by suction.

1 laser light 2a, 2b galvano scanner mirror
3a, 3b galvano scanner 4 fθ lens
7 Scanning Area 8 Spectroscope
9a, 9b laser head 11 inputs
12 Data converter 13 Suction hole coordinate memory
14 1st machining hole setting part 15 2nd machining hole setting part
16 Extractor 19 Control Unit
21, 21X Machining Table 22H, 41h Suction Hole
25A, 45A Non-located Area 25B, 45B Suction Hole Placement Area
31 Workpiece 32a first machining hole
32b 2nd machining hole 33 Positioning mark
35A, 35B Area 40 Adsorption Area Limited Fixture
41 Arm 100 Laser Processing Equipment
101A, 101B Laser Processing Machine 102 Carrier
103 Machining Control

Claims (13)

A processing table on which the workpiece, which is a workpiece, is placed, and which adsorbs and fixes the workpiece by suction holes that suck the bottom surface of the workpiece;
A laser processing portion for irradiating a laser beam to the workpiece adsorbed and fixed on the processing table to perform perforation processing of the processing hole on the workpiece;
And a processing control device for moving the relative position between the workpiece on the processing table and the irradiation position of the laser light by controlling the processing table and the laser processing unit.
The processing control device,
An extraction unit for extracting the processing hole which is located above the suction area within a predetermined range from the suction hole when the workpiece is placed on the processing table;
And a first processing hole setting section for setting the remaining processing holes except the processing holes extracted by the extracting part among the processing holes to be processed as the first processing holes as the first drilling holes,
The laser processing unit,
A laser machining apparatus, as a first boring process, performing boring of the first boring hole set by the first boring hole setting section. The method according to claim 1,
The processing control device,
And further having a second processing hole setting portion for setting the processing hole extracted by the extraction unit to the second processing hole which is the second processing hole after the first drilling operation;
The laser processing unit,
After the first hole is drilled, the second hole is moved so as not to be located above the suction region, and then the second hole is set as the second hole. A laser processing apparatus comprising performing a punching process. The method according to claim 2,
And a conveying apparatus for carrying the work on the work table and carrying out the work on the work table,
The conveying device,
And the relative position between the workpiece and the machining table is moved so that the second machining hole is not located above the suction region after the first boring of the machining hole. The method according to claim 1,
The worktable is placed on the workpiece in a predetermined rectangular area, and the suction hole arrangement area and the suction hole, which are areas where the suction holes are arranged in a stripe shape parallel to one side of the rectangular area, are not arranged. A non-located area that is not an area is placed,
And the extraction unit extracts the processing hole located above the suction hole arranging area as a processing hole located above the suction area. The method according to claim 1,
A jig disposed between an upper surface of the work table and a bottom face of the work is further provided to block a portion of the suction hole, and the work table sucks the bottom of the work through the jig. Fixed,
The jig has the workpiece placed in a predetermined rectangular area, and the suction hole arrangement area and the suction hole where the suction holes are arranged in a stripe shape parallel to one side of the rectangular area are not disposed. An unallocated area that is an area
And the extraction unit extracts the processing hole located above the suction hole arranging area as a processing hole located above the suction area. The method according to claim 4 or 5,
The laser processing part has a galvano scanner which scans the laser light irradiated onto the work by the inside of the processing surface of the work,
And the stripe widths of the suction hole arranging region and the non-arrangement region are equal to the width of the region scanned by the galvano scanner. The method according to claim 1,
The processing table is composed of a plurality, the work is placed on each processing table,
The laser processing unit irradiates laser beams to the respective workpieces on the respective processing tables to perform perforation processing in the same batch on the respective workpieces,
The processing control apparatus sets the first processing hole for each of the workpieces, and sets the first processing hole for one of the workpieces with respect to the processing holes processed at the same positions on the respective workpieces. In the other of the workpieces, when the first processing hole is not set, the processing hole not set as the first processing hole controls the laser processing unit to block the laser beam irradiation and skip the hole processing. Laser processing equipment characterized in that. The method of claim 7,
The processing control apparatus is set to the first processing hole in one of the workpieces, and to the first processing hole in the other of the workpieces, for the processing holes machined at the same positions on the respective workpieces. If it is not set, controlling the laser processing unit to block the laser beam irradiation and skip the hole processing to both the processing hole not set as the first processing hole and the processing hole set as the first processing hole. Laser processing equipment characterized in that. A workpiece is placed on the workpiece and the workpiece is fixed to the workpiece by means of suction holes for absorbing the bottom of the workpiece, and the workpiece fixed to the workpiece is irradiated with a laser beam to the workpiece. In the laser processing method of moving the relative position of the workpiece | work on the said processing table and the irradiation position of the said laser beam by controlling the laser processing part which drills a process hole,
A hole information input step of designating and externally inputting a processing hole on a suction area which is located above the suction area within a predetermined range from the suction hole when the workpiece is placed on the machining table among the processing holes;
A setting step of setting the remaining processing holes except the processing holes on the adsorption area in the processing holes to be processed as the first processing holes to be subjected to the first drilling process;
And a processing step of causing the laser processing portion to perform the drilling of the first processing hole set as the first drilling operation. The method according to claim 9,
The processing hole on the adsorption area is,
An adsorption hole arrangement area which is an area where the suction holes are arranged on the processing table such that the work table is placed in a predetermined rectangular area, and the stripe shape is parallel to one side of the rectangular area; When the non-arrangement area | region which is the area | region where the suction hole is not arrange | positioned,
And the processing hole located above the suction hole arranging area as a processing hole on the suction area. The method according to claim 9,
The processing hole on the adsorption area is,
The work table is disposed between the top face of the work table and the bottom face of the work to suck and fix the bottom face of the work through a jig that blocks a portion of the suction hole, and the jig is within a predetermined rectangular region. The non-arrangement area which is the area where the said adsorption hole is arrange | positioned and the area where the said adsorption hole is not arrange | positioned, in which the said workpiece is put, and the said adsorption hole is arrange | positioned so that it may become stripe parallel with one side of the said rectangular area | region. If is placed,
And the processing hole located above the suction hole arranging area as a processing hole on the suction area. A workpiece is placed on the workpiece and the workpiece is fixed to the workpiece by means of suction holes for absorbing the bottom of the workpiece, and the workpiece fixed to the workpiece is irradiated with a laser beam to the workpiece. In the processing control apparatus which moves the relative position of the workpiece | work on the said processing table and the irradiation position of the said laser beam by controlling the laser processing part which performs the drilling process of a process hole,
An extraction unit for extracting the processing hole which is located above the suction area within a predetermined range from the suction hole when the workpiece is placed on the processing table;
A first machining hole setting section for setting the remaining machining holes except the machining holes extracted by the extracting part among the machining holes to be processed as the first machining holes as the first drilling holes;
And a hole punching processing of the first processing hole set by the first processing hole setting section as the first drilling processing by the laser processing section. A workpiece is placed on the workpiece and the workpiece is fixed to the workpiece by means of suction holes for absorbing the bottom of the workpiece, and the workpiece fixed to the workpiece is irradiated with a laser beam to the workpiece. In the processing control method of moving the relative position of the workpiece | work on the said processing table and the irradiation position of the said laser beam by controlling the laser processing part which drills a process hole,
An extraction step of extracting the processing hole which is located above the suction area within a predetermined range from the suction hole when the workpiece is placed on the processing table;
A setting step of setting the remaining processing holes except the processing holes extracted by the extracting part among the processing holes to be processed as the first processing holes to be subjected to the first drilling operation;
And a processing step of causing the laser processing portion to perform the drilling of the first processing hole set as the first drilling operation.

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