JP2001138095A - Machining table and laser beam machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To adsorb even a thin material by a proper force without causing ruggedness. SOLUTION: A machining table 3 on which a planar or a sheet-like workpiece can be placed is equipped with a porous plate 7 arranged at the side for placing the workpiece and with a sucking means for adsorbing the workpiece on the placing surface of the porous plate 7 through the holes of this porous plate 7. Consequently, when the workpiece is put on the placing surface of the porous plate 7, it is adsorbed through the free small holes of the porous part. Since the hole diameter of the porous part is sufficiently small as compared with the thickness of the workpiece, the sucking force of one hole is weak enough to cause a dent on the workpiece. In addition, even if each hole has a weak sucking force, owing to the large numbers of holes, there is a force strong enough to adsorb the entire workpiece. Further, an automatic control device 6 is provided which controls the sucking force of the sucking means in accordance with at least one of the kind, the shape or the dimension of the workpiece, so that the adsorption can be performed by a proper sucking force.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing table and a laser processing machine capable of sucking a workpiece such as a thin plate.

[0002]

2. Description of the Related Art FIG. 7 shows a conventional example of a method for adsorbing a workpiece. A large number of holes 52 having a diameter of 2 to 3 mm are formed on the upper surface of the processing table 50, and a vacuum pump 51 is connected to a space (room) inside the table connected to all the holes 52. The vacuum pump 51 is constantly operating during use of the processing machine, and when the workpiece is loaded, the valve in the flow path from the vacuum pump 51 to the space opens to vacuum-adsorb the workpiece.

[0003]

When a sheet-like thin workpiece is attracted to a processing table, if the attracting force is too strong, the workpiece is dented at the suction hole. In the case of processing with a printed circuit board laser drilling machine, a focus position shift corresponding to the depth of the dent occurs at the dent part, so the diameter of the processing hole increases with the increase of the irradiation beam diameter, and the sharpness due to the decrease of the irradiation power density decreases. Processing quality is degraded due to deterioration, inclination of a processing hole due to inclination of a processing surface, and the like. Also, if wrinkles are formed on the workpiece at the time of suction, the quality of the processed hole in the wrinkled portion deteriorates for the same reason as described above. Therefore, it is necessary to adsorb the workpiece with an appropriate adsorption pressure to prevent the occurrence of unevenness. The appropriate suction pressure varies depending on the material and thickness of the workpiece, and the softer and thinner the material, the lower the suction pressure must be. For proper suction, it is necessary to reduce the suction hole by reducing the diameter of the suction hole and increase the number of holes to secure the suction force as a whole. In order to adsorb a sheet-like material with a thickness of about several tens of microns so as not to have irregularities, tens of thousands of holes with a diameter of 1 mm or less must be drilled on a metal processing table with a thickness of about 10 mm. It is quite difficult in terms of breakage and life. Further, as the flow resistance per hole increases and the number of holes increases, the evacuation capacity required for the vacuum evacuation apparatus increases drastically, and a large output is required.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a processing table and a laser processing machine capable of adsorbing even a thin material with an appropriate force so as not to cause unevenness.

[0005]

According to a first aspect of the present invention, there is provided a machining table on which a plate-shaped or sheet-shaped workpiece can be placed. The apparatus includes a porous portion disposed on a side on which an object is placed, and suction means for sucking a workpiece onto a mounting surface of the porous portion by sucking through each hole of the porous portion.

[0006] As described above, by suctioning through the porous portion disposed on the side on which the workpiece is placed and the holes of the porous portion, the workpiece is placed on the mounting surface of the porous portion. Since the suction means is provided for suctioning, when the workpiece is placed on the mounting surface of the porous portion and sucked, the workpiece is sucked through the infinitely wide and narrow holes of the porous portion. Since the pore diameter of the porous portion is sufficiently smaller than the thickness of the workpiece, the suction force of one hole is sufficiently weak, and the workpiece does not dent. Further, even if the suction force of one hole is weak, the number of holes is very large, so that the force for sucking the whole workpiece is sufficient.

According to a second aspect of the present invention, there is provided a processing table on which a plate-shaped or sheet-shaped workpiece can be placed, and a porous portion disposed on a side on which the workpiece is placed; A suction unit that sucks the workpiece to the mounting surface of the porous unit by suctioning through each hole of the porous unit, and a suction unit according to at least one of the type, shape, and size of the workpiece. A control unit for controlling the suction force.

[0008] As described above, the suction means for sucking the workpiece to the mounting surface of the porous portion by sucking through each hole of the porous portion, and at least one of the type, shape and size of the workpiece. And a control unit for controlling the suction force of the suction means in accordance with the type of the workpiece. In addition to the operation and effect of claim 1, the suction force for preventing the workpiece from being dented at the time of suction is increased. Even if they differ depending on the thickness, shape and dimensions, if they are divided into several stages and the suction force is set in advance according to each division, suction based on the data such as the material and thickness of the processed substrate The suction force of the means is controlled so that appropriate suction is performed and dents in the workpiece can be prevented.

According to a third aspect of the present invention, there is provided a processing table on which a plate-shaped or sheet-shaped workpiece can be placed, and a porous portion disposed on a side on which the workpiece is placed; A suction unit is provided for sucking the workpiece on the mounting surface of the porous portion by sucking the workpiece through the holes of the porous portion with a pump device, and an adjusting unit for adjusting the suction force of the suction unit.

As described above, the suction means for sucking the workpiece to the mounting surface of the porous part by sucking the work through the holes of the porous part by the pump device, and the adjustment for adjusting the suction force of the suction means. Means, the pump device is used as the suction means, and the workpiece is adjusted by the suction force adjusting means provided between the pump device and the porous portion or in the pump device. Can be suctioned with an appropriate suction force, and dents in the workpiece can be prevented.

According to a fourth aspect of the present invention, there is provided a processing table on which a plate-shaped or sheet-shaped workpiece can be placed, and a porous portion disposed on a side on which the workpiece is placed; Suction means for sucking the workpiece on the mounting surface of the porous part by suctioning the workpiece with the pump device through each hole of the porous part; adjusting means for adjusting the suction force of the suction means; and A control unit for controlling the adjusting means in accordance with at least one of the type, shape, and size.

As described above, the suction means for sucking the workpiece on the mounting surface of the porous part by sucking the work with the pump device through each hole of the porous part, and the adjustment for adjusting the suction force of the suction means. Since means and a control unit for controlling the adjusting means in accordance with at least one of the type, shape and size of the workpiece are provided, in addition to the effect of claim 1, a pump device is used as a suction means, By controlling the suction force adjusting means provided between the pump device and the porous portion or the suction device provided in the pump device by the control unit, suction can be performed with the suction force according to the material, thickness, shape, and dimension of the workpiece. In addition, dents in the workpiece can be prevented.

According to a fifth aspect of the present invention, there is provided a machining table.
In 4 or 4, the adjusting means is a flow rate adjusting solenoid valve provided between the pump device and the porous portion. in this way,
Since the adjusting means is a flow rate adjusting solenoid valve provided between the pump device and the porous portion, by adjusting the flow rate with the flow rate adjusting solenoid valve, the suction can be performed with an appropriate suction force, and the dent of the workpiece can be reduced. Can be prevented.

According to a sixth aspect of the present invention, there is provided a machining table according to the third aspect.
In 4 or 4, the adjusting means is an air release adjusting valve provided between the pump device and the porous portion. in this way,
Since the adjusting means is an air release adjusting valve provided between the pump device and the porous portion, by adjusting the flow rate with the air release adjusting valve, the suction can be performed with an appropriate suction force and the dent of the workpiece can be reduced. Can be prevented.

According to a seventh aspect of the present invention, there is provided the machining table according to the third, fourth, fifth or sixth aspect, wherein two or more flow paths are provided between the pump device and the porous portion, and the flow path is selected as an adjusting means. Means were provided. As described above, since two or more flow paths are provided between the pump device and the porous portion and the selection means for selecting the flow path is provided as the adjustment means, the flow path to be connected is selected from the plurality of flow paths. At this time, the connection is switched to one or more of the plurality of flow paths connected in parallel by the selection means. Since the flow rate is proportional to the total cross-sectional area of the selected flow path, by appropriate flow path selection according to the workpiece, suction can be performed with an appropriate suction force, and dent of the workpiece can be prevented.

According to an eighth aspect of the present invention, in the processing table according to the third, fourth, fifth, or sixth aspect, a plurality of flow paths having different areas of a connection portion with the porous portion are provided from a pump device, and the flow table is used as an adjusting means. Selection means for selecting a road is provided. As described above, a plurality of flow paths having different areas of the connection portion with the porous portion are provided from the pump device, and the selection means for selecting the flow path is provided as the adjustment means. Select and connect an appropriate flow path from the flow paths. At this time, the suction force can be adjusted by switching and connecting a plurality of flow paths having different cross-sectional areas of the flow paths connected in parallel by the selection means. Since the flow rate is proportional to the total cross-sectional area of the selected flow path, by appropriate flow path selection according to the workpiece, suction can be performed with an appropriate suction force, and dent of the workpiece can be prevented.

According to a ninth aspect of the present invention, in the processing table according to the first, second, third, fourth, fifth, sixth or seventh aspect, the suction means divides the porous portion into a plurality of sections and divides the porous section into each section. It has a plurality of connected flow paths and selection means for selecting the flow paths. As described above, the suction unit includes the plurality of flow paths connected to each of the divided sections by dividing the porous portion into a plurality of sections, and the selection means for selecting the flow path. It can be switched and connected to each compartment. Therefore, by selecting an appropriate flow path according to the workpiece from the flow paths connected to the plurality of divided sections, the workpiece can be adsorbed in the minimum necessary number of sections.

According to a tenth aspect of the present invention, in the processing table according to the ninth aspect, the selection means is configured to expand the selection from the section corresponding to the central portion of the workpiece placed on the porous portion to the section corresponding to the peripheral portion. A control unit for controlling the control is provided. As described above, since the control unit that controls the selection unit is provided so as to expand the selection from the section corresponding to the central portion of the workpiece placed on the porous portion to the section corresponding to the peripheral portion, the control unit is divided into a plurality. In the flow path connected to the section, the suction is started by first selecting the flow path of the section corresponding to the center of the workpiece, and thereafter,
By gradually expanding the selection range of the flow path from the center to the peripheral section, the workpiece is sucked from the center to the outer periphery of the workpiece. Therefore, the workpiece does not sag and wrinkles can be prevented.

According to the eleventh aspect of the present invention, there is provided a machining table according to any one of the first, second, third, fourth, fifth, sixth, seventh, eighth, ninth and tenth aspects according to at least one of the type, shape, and size of the workpiece. After driving the suction means with a suction force lower than the suction force
A control unit is provided for driving the suction means with a suction force corresponding to at least one of the type, shape, and size of the workpiece. In this manner, after driving the suction unit with a suction force lower than the suction force corresponding to at least one of the type, shape, and size of the workpiece,
Since the control unit that drives the suction means with the suction force according to at least one of the type, shape, and size of the workpiece is provided, first, the suction is performed with a force smaller than the suction force corresponding to the workpiece. Thereby, the deflection of the workpiece is eliminated. Next, the workpiece is attracted by a suction force corresponding to the workpiece so that wrinkles do not occur.

The processing table according to claim 12 is the processing table according to claim 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, or 11.
In the description, a sensor for detecting the surface shape of the workpiece at the time of suction, and a determination unit that generates a caution signal when the absolute value of the value indicating the surface shape detected by the sensor is greater than a threshold value . As described above, the sensor includes the sensor that detects the surface shape of the workpiece at the time of suction, and the determination unit that generates a caution signal when the absolute value of the value indicating the surface shape detected by the sensor is larger than the threshold value. Therefore, the thickness of the workpiece is detected by the sensor, and the detected value is compared with the set threshold value. If the detected value exceeds the threshold, a warning signal is issued.

According to a thirteenth aspect of the present invention, there is provided a laser processing machine, comprising: a processing table according to the first, second, third, fourth, fifth, sixth, seventh, eighth, ninth, tenth, and twelfth aspects; And an external optical system for guiding laser light from the laser oscillator to the workpiece. As described above, since the laser beam processing apparatus includes the processing table according to any one of claims 1 to 12, a laser oscillator that generates a laser, and an external optical system that guides laser light from the laser oscillator to a workpiece. At this time, the workpiece is attracted to the processing table with an appropriate force, so that the focus position does not shift and the processing quality is improved.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a conceptual diagram of a processing table and a laser processing machine according to a first embodiment of the present invention. In FIG. 1, 1 is a carbon dioxide laser launcher, 2 is an external optical system, 3 is a processing table on which a plate-shaped or sheet-shaped workpiece can be placed, 4 is a Z-axis that moves integrally with an fθ lens and a galvanomirror, Is a vacuum pump (pump device) for adsorption, 6 is an automatic control device, 7 is a porous plate (porous portion)
It is.

The porous plate 7 has a thickness of several millimeters and is normally held on the table body 3a of the processing table 3 on the side on which the workpiece is mounted, and is adsorbed on the processing table 3 when the workpiece is processed. You. In this case, the workpiece is a sheet-like substrate 10.
It is. Porous materials include sintered metal filters, foamed glass, foamed plastic, lightweight castables, fire-resistant insulated bricks, new ceramics, and the like. Use both surfaces of the porous material after finishing such as grinding to obtain flatness. The processing table 3 is configured such that the table body 3a is movable in the X-axis and Y-axis directions. Further, the substrate 10 is made porous by sucking through each hole of the porous plate 7 by a suction means including a vacuum pump 5 and a flow path 8 arranged between the vacuum pump 5 and the porous plate 7. It adsorbs on the mounting surface of the plate 7.

In the above configuration, the laser beam emitted from the carbon dioxide laser 1 passes through the external optical system 2 including an fθ lens, a galvanometer mirror, a mask, a condenser lens, a reflection mirror, etc., and is biaxial (X, Y). Light is focused on the printed circuit board 10 on the processing table 3 and holes are processed.

As described above, according to the present embodiment, when the substrate 10 is placed on the mounting surface of the porous plate 7 and is adsorbed, the substrate 10 is Adsorbed. Since the hole diameter of the porous plate 7 is sufficiently smaller than the thickness of the substrate 10, the suction force of one hole is sufficiently weak and the substrate 10 does not dent. Further, since the number of holes is very large even if the suction force of one hole is weak, the force for sucking the entire substrate 10 is sufficient.

Incidentally, the porous portion may be embedded in the upper surface of the processing table 3. From the viewpoint of safety, it is desirable to use a material having excellent fire resistance as much as possible. The porous part is
Not only the porous plate 7 but also a hole having a diameter of several hundred microns of 1 cm ²
Any material other than the high-reflective material, such as acrylic, which has been exposed on the entire surface at a density of several tens or more per unit, may be used. Further, a through hole may be formed in a state where the workpiece is adsorbed on the porous portion. Also,
When the small-diameter hole in the porous portion is clogged with dust or the like during processing, the clogging can be eliminated by cleaning with an air nozzle or the like or performing ultrasonic cleaning.

Next, a second embodiment of the present invention will be described. In this embodiment, in the first embodiment, an adjusting unit for adjusting the suction force of the suction unit, and a control unit for controlling the adjusting unit in accordance with at least one of the type, shape, and size of the workpiece. It has. In this case, the workpieces are classified by material, thickness, and dimensions. The material is classified according to the grade of epoxy, glass epoxy, polyimide, etc., and the presence / absence of copper foil. The plate thickness is less than 50 μm,
0 μm, 100-200 μm, 200-400 μ
m, 400 μm or more, and are registered in the automatic control device 6 of the processing machine as a board classification list.

The vacuum pump 5 of the suction means shown in FIG. 1 uses a variable rotation speed type such as an inverter as an adjusting means. The data of the board material, the board thickness and the dimensions in the processing data are collated with the above-mentioned board section list, the frequency of the inverter set to the section to which the board belongs, and the rotation speed of the vacuum pump 5 are designated, and the workpiece Is absorbed with an appropriate suction force.

As described above, according to this embodiment, the vacuum pump 5 is used as the suction means, and the means for adjusting the suction force provided in the vacuum pump 5 is controlled by the automatic control device 6, whereby the material of the workpiece can be obtained. The suction force can be adjusted according to the thickness, shape, and size of the workpiece to prevent dents in the workpiece.

The adjusting means may be provided between the vacuum pump 5 and the porous plate 7. That is, in the third embodiment, an appropriate flow rate is set as a parameter for each of the board sections, and the flow rate is determined by where the material, plate thickness, and dimensional data in the processing data belong to the board section. The flow control solenoid valve provided in the middle of the flow path from the vacuum pump 5 to the processing table 3 receives the command value, controls the adjustment amount, and is sucked with an appropriate suction force. The method of classifying the substrates 10 can change the threshold value and the number of steps according to the material.

In the fourth embodiment, an air release adjusting solenoid valve is provided in the middle of the path from the vacuum pump 5 to the processing table 3. The substrate material and plate thickness data in the processing data are classified according to the above-described classification of the substrate material and plate thickness, and the valve adjustment amount is set according to the classification. FIG. 2 shows an example in which an electromagnetic needle valve is used for adjustment to release to the atmosphere.
As shown in FIG. 2, the electromagnetic valve 12 joined to the flow path 11 on the processing table 3 advances and retreats with respect to the flow path 13 on the vacuum pump 5 side. The overlapping portion between the solenoid valve 12 and the flow path 13 has a tapered surface and can be adjusted to be open to the atmosphere. Note that the air release adjustment valve may be an angle adjustment type.

A fifth embodiment of the present invention will be described with reference to FIG. FIG. 3 is a conceptual diagram of a flow path used for a working table according to a fifth embodiment of the present invention. As the adjusting means of the second embodiment, as shown in FIG. 3, a plurality of flow paths 1 are provided in the middle of the flow path from the vacuum pump 5 to the processing table 3.
5 were connected in parallel, and an electromagnetic valve (selection means) 16 was provided for each flow path. The open / close state of each solenoid valve 16 is set for each section of the above-mentioned board section list, and the board material,
The board thickness and dimensional data are compared with the above-mentioned board classification list,
The open / closed state of each solenoid valve 16 according to the section to which it belongs is designated, and suction is performed with an appropriate suction force.

As described above, two or more flow paths 15 are provided between the vacuum pump 5 and the porous plate 7 and the solenoid valve 16 for selecting a flow path is provided as an adjusting means. Select the flow path to connect. At this time, the connection is switched to one or more of the plurality of flow paths 15 connected in parallel by the electromagnetic valve 16. Since the flow rate is proportional to the total cross-sectional area of the selected flow path, suction can be performed with an appropriate suction force by selecting an appropriate flow path according to the workpiece,
The dent of the workpiece can be prevented.

A sixth embodiment of the present invention will be described with reference to FIG. FIG. 4 is a conceptual diagram of a working table according to a sixth embodiment of the present invention. In the second embodiment, as shown in FIG.
This is an example in which two kinds of suction holes 19 and 20 of 1 mm and 1 mm are provided. The flow paths 21 and 22 from the two types of holes 19 and 20 to the vacuum pump 5 are independent, and electromagnetic valves (selection means) 23 and 24 are provided as adjustment means respectively.
The open / close state of each of the solenoid valves 23 and 24 is set for each section of the above-described board section list. When the thickness of the workpiece is thin and easy to bend, it is set so as to be sucked through the hole 20 having a diameter of 1 mm. ing. The board material, board thickness, and dimensional data in the processing data are collated with the board section list, and the open / close state of each of the solenoid valves 23 and 24 according to the section to which the board belongs is specified and suction is performed with an appropriate suction force.

As described above, a plurality of flow paths 21 and 22 having different areas of connection with the porous portion are provided from the vacuum pump 5, and the electromagnetic valves 22 and 23 for selecting the flow paths 21 and 22 as adjusting means. Is provided, an appropriate flow path is selected and connected from the plurality of flow paths 21 and 22 having different flow path cross-sectional areas. At this time, the suction force can be adjusted by switching and connecting a plurality of flow paths 21 and 22 having different flow path cross-sectional areas connected in parallel by the electromagnetic valves 22 and 23. Since the flow rate is proportional to the total cross-sectional area of the selected flow paths 21 and 22, by appropriate flow path selection according to the workpiece, suction can be performed with an appropriate suction force, and dent of the workpiece can be prevented.

A seventh embodiment of the present invention will be described with reference to FIG. FIG. 5 is a conceptual diagram of a working table according to a seventh embodiment of the present invention. In the first or second embodiment, as shown in FIG. 5, the porous portion 27 of the processing table 3 is divided into a plurality of sections (areas 1 to 5), and the vacuum pump 5 supplies an independent flow path to each section. 28 are provided, and an electromagnetic valve (selection means) 29 is provided for each. The plurality of flow paths 28 and the electromagnetic valve 29 constitute a suction unit. The open / close state of each solenoid valve 29 is set for each section of the above-described board section list, and only the solenoid valve 29 of the flow path corresponding to the minimum necessary section including the vertical and horizontal dimensions of the workpiece is set. Is opened, and the workpiece is adsorbed. The opening timing of the solenoid valve 29 at the start of suction is controlled by a delay circuit in a control circuit of the solenoid valve 29 (located in the automatic control device 6). After the solenoid valve 29 of the corresponding flow path 28 is opened, the solenoid valve 29 is sequentially opened toward the peripheral section. Therefore, the workpiece starts to be attracted from the central part, and the peripheral part is gradually attracted. The delay time can be set by a parameter. In addition, as a method of dividing the section, for example, an electromagnetic valve may be individually provided in a hole in a range of every 50 mm square, and the suction range may be finely controlled.

As described above, the suction means has the plurality of channels 28 connected to each of the sections by dividing the porous portion 27 into a plurality of sections, and the solenoid valve 29 for selecting the channels 28. The flow path 28 can be switched by the electromagnetic valve 29 to be connected to each section. For this reason, by selecting an appropriate flow path 28 according to the workpiece from the flow paths 28 connected to the plurality of divided sections, the workpiece can be adsorbed in the minimum necessary number of sections. In addition, since a control unit for controlling the solenoid valve 29 is provided so as to expand the selection from a section corresponding to the central part of the workpiece placed on the porous part 27 to a section corresponding to the peripheral part, the work is divided into a plurality. In the flow path 28 connected to the divided section, first, the flow path 28 in the section corresponding to the center of the workpiece is selected to start suction, and then the flow path 28
By gradually expanding the selection range from the central portion to the peripheral portion, the workpiece is absorbed from the central portion to the outer peripheral portion, so that the workpiece does not sag and wrinkles are generated. Can be prevented.

An eighth embodiment of the present invention will be described. In this embodiment, in each of the above embodiments, after driving the suction unit with a suction force lower than the suction force corresponding to at least one of the type, shape, and size of the workpiece,
A control unit is provided for driving the suction means with a suction force corresponding to at least one of the type, shape, and size of the workpiece. In this case, the vacuum pump 5 uses an attached variable-speed type such as an inverter. The frequency and duration of the inverter at the rise from the start of the vacuum pump 5 to the steady rotation can be set by parameters. This parameter is set for each section in the above-described board section list. The data of the substrate material, the plate thickness, and the dimensions in the processing data are collated with the list, so that the workpiece can be suctioned without wrinkles. That is, first, the workpiece is absorbed by a force smaller than the suction force corresponding to the workpiece, thereby eliminating the bending of the workpiece. Next, the workpiece is attracted by a suction force corresponding to the workpiece so that wrinkles do not occur. Thereby, generation of wrinkles at the start of adsorption can be eliminated, and processing quality can be stabilized.

A ninth embodiment of the present invention will be described with reference to FIG. FIG. 6 is a conceptual diagram of a processing table according to the ninth embodiment of the present invention. In each of the above embodiments, as shown in FIG. 6, a plate thickness sensor 30 (measureable to a minimum of 1 μm unit) is attached to the Z axis above the processing table 3 (see FIG. 1), and the workpiece is sucked. After that,
The sensor 30 descends along with the Z-axis to slightly above. At the tip of the stylus of the sensor 30, an acrylic pad 30a with a slightly large area of about 50 mm in outer diameter is attached.
If the pad 30a even slightly contacts the workpiece, the lowering of the sensor 30 stops, and the Z coordinate at that time is fed back as a detected value of the thickness. Therefore, this pad 30a
If there is a bulge in the range, the thickness of the bulge is detected. After that, based on the dimension data of the workpiece in the processing data, the porous portion 31 of the processing table 3 reciprocates in the left-right (X) direction at an equal pitch (less than the diameter of the pad 30a) as shown in FIG. The movement is repeated in the Y) direction, and scanning is performed while measuring the thickness over the entire substrate 10 as the workpiece. Of course, the movement may be repeated in the left-right (X) direction while reciprocating in the front-back (Y) direction. When the displacement value changes by 100 μm or more set as the threshold value during the thickness scanning, the alarm lamp is turned on. An alarm buzzer may sound instead of the alarm lamp. When the surface of the workpiece is a conductive material such as a steel foil, the sensor may be a capacitance height sensor.

As described above, according to this embodiment, the sensor 30 for detecting the surface shape of the workpiece at the time of suction, and the absolute value of the value indicating the surface shape detected by the sensor 30 is smaller than the threshold value. Since there is provided a determination unit that generates a caution signal when the value is larger, the thickness of the workpiece is detected by the sensor 30, and the detected value is compared with the set threshold value. When the detected value exceeds the threshold value, a caution signal is issued and processing defects can be prevented beforehand.

Also, two or more of the nine embodiments may be combined and applied. Although the laser beam machine shown in this embodiment is an example of a laser drilling machine for printed circuit boards, it can be applied to other processes, for example, a laser cutting machine that requires high precision. Further, in any of the above-described embodiments, any processing laser such as a YAG laser or an excimer laser can be applied to the laser oscillator other than the carbon dioxide gas laser.

[0042]

According to the working table of the first aspect of the present invention, suction is performed through the porous portion disposed on the side on which the workpiece is placed and the respective holes of the porous portion. Since there is provided suction means for adsorbing the workpiece on the mounting surface of the porous portion, when the workpiece is placed and adsorbed on the mounting surface of the porous portion, the pores are infinitely wide and horizontal in the porous portion. Workpiece is adsorbed via the. Since the pore diameter of the porous portion is sufficiently smaller than the thickness of the workpiece, the suction force of one hole is sufficiently weak. Further, even if the suction force of one hole is weak, the number of holes is very large, so that the force for sucking the whole workpiece is sufficient. In this way, by increasing the number of suction holes by reducing the diameter, the suction pressure of the workpiece is made uniform, dents can be prevented even with a thin and soft material, and the processing quality can be stabilized. it can.

According to the working table of the second aspect of the present invention, the suction means for sucking the workpiece to the mounting surface of the porous portion by sucking through each hole of the porous portion, Since the control unit for controlling the suction force of the suction means in accordance with at least one of the type, shape, and size of the object is provided, in addition to the effect of claim 1, no dent is generated on the workpiece at the time of suction. Even if the suction force differs depending on the material, thickness, shape, and dimensions of the workpiece, if these are divided into several stages and the suction force is set in advance according to each division, the material and the material of the processed substrate The suction force of the suction means is controlled based on the data such as the thickness, so that appropriate suction is performed. Therefore, dents can be prevented even with a thin and soft material to be processed, and the processing quality can be stabilized.

According to the working table of the third aspect of the present invention, there is provided a suction means for sucking the workpiece to the mounting surface of the porous portion by sucking with the pump device through each hole of the porous portion. And the adjusting means for adjusting the suction force of the suction means, so that in addition to the function and effect of claim 1, a pump device is used as the suction means and provided between the pump device and the porous portion or provided in the pump device. The workpiece can be suctioned with an appropriate suction force by the means for adjusting the suction force. Therefore, dents can be prevented even with a thin and soft material to be processed, and the processing quality can be stabilized.

According to the working table of the fourth aspect of the present invention, the suction means for sucking the workpiece to the mounting surface of the porous portion by sucking the work with the pump device through each hole of the porous portion. And an adjusting means for adjusting the suction force of the suction means, and a control unit for controlling the adjusting means in accordance with at least one of the type, shape, and size of the workpiece. In addition, using a pump device as a suction means, between the pump device to the porous portion, or by controlling the suction force adjustment means provided in the pump device by the control unit, the material, thickness, shape, Suction can be performed with a suction force according to the size division. Therefore, dents can be prevented even with a thin and soft material to be processed, and the processing quality can be stabilized.

According to the fifth aspect, the adjusting means is a flow rate adjusting solenoid valve provided between the pump device and the porous portion.
By adjusting the flow rate by the flow rate adjusting solenoid valve, suction can be performed with an appropriate suction force, and dents in the workpiece can be prevented.

In the sixth aspect, the adjusting means is an air release adjusting valve provided between the pump device and the porous portion.
By adjusting the flow rate with the air release adjustment valve, suction can be performed with an appropriate suction force, and dents in the workpiece can be prevented.

In the present invention, two or more flow paths are provided between the pump device and the porous portion, and the selection means for selecting the flow path is provided as the adjusting means. Select At this time, the connection is switched to one or more of the plurality of flow paths connected in parallel by the selection means. Since the flow rate is proportional to the total cross-sectional area of the selected flow path, by selecting an appropriate flow path according to the workpiece,
Suction can be performed with an appropriate suction force, and dents in the workpiece can be prevented.

According to the eighth aspect, a plurality of flow paths having different areas of the connection portion with the porous portion are provided from the pump device, and the selection means for selecting the flow path is provided as the adjustment means. An appropriate flow path is selected from a plurality of different flow paths and connected. At this time, the suction force can be adjusted by switching and connecting a plurality of flow paths having different cross-sectional areas of the flow paths connected in parallel by the selection means. Since the flow rate is proportional to the total cross-sectional area of the selected flow path, by appropriate flow path selection according to the workpiece, suction can be performed with an appropriate suction force, and dent of the workpiece can be prevented.

According to the ninth aspect, the suction means has a plurality of flow paths connected to each of the divided sections by dividing the porous portion into a plurality of sections, and a selection means for selecting the flow path. , The flow path can be switched and connected to each section. Therefore, by selecting an appropriate flow path according to the workpiece from the flow paths connected to the plurality of divided sections, the workpiece can be adsorbed in the minimum necessary number of sections.
At the same time, the suction capacity of the suction means is kept to a minimum, and energy and running costs can be saved.

According to the tenth aspect, the control unit is provided for controlling the selection means so as to expand the selection from the section corresponding to the central portion of the workpiece placed on the porous portion to the section corresponding to the peripheral portion. In the flow paths connected to the plurality of divided sections, first, the flow path of the section corresponding to the center of the workpiece is selected and suction is started, and thereafter, the selection range of the flow path is changed from the central portion to the peripheral portion. By sequentially expanding the selection range to the sections, the workpiece is sucked from the center to the outer periphery. For this reason, it is possible to eliminate the occurrence of wrinkles at the start of adsorption, and to stabilize the processing quality.

In the eleventh aspect, the type, shape,
A control unit that drives the suction means with a suction force lower than the suction force corresponding to at least one of the dimensions, and then drives the suction means with a suction force corresponding to at least one of the type, shape, and size of the workpiece. Is provided, first, the workpiece is absorbed by a force smaller than the suction force corresponding to the workpiece, thereby eliminating the deflection of the workpiece. Next, the workpiece is attracted by a suction force corresponding to the workpiece so that wrinkles do not occur. For this reason, it is possible to eliminate the occurrence of wrinkles at the start of adsorption, and to stabilize the processing quality.

In the twelfth aspect, a sensor for detecting the surface shape of the workpiece at the time of suction, and a warning signal is generated when the absolute value of the value indicating the surface shape detected by the sensor is larger than a threshold value. Since the determination section is provided, the thickness of the workpiece is detected by the sensor, and the detected value is compared with the set threshold value. If the detected value exceeds the threshold, a warning signal is issued. For this reason, even if dents or bulges occur when the workpiece is adsorbed, a processing defect can be prevented beforehand by providing a function of detecting and notifying it before processing.

According to the laser processing machine of the present invention, a processing table as set forth in any one of claims 1 to 12, a laser oscillator for generating a laser, and a laser from the laser oscillator to a workpiece. Since an external optical system for guiding light is provided, the workpiece is attracted to the processing table with an appropriate force during laser processing, so that the focal position does not shift and the processing quality is improved.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram of a processing table and a laser processing machine according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing an example in which an electromagnetic needle valve is used for adjustment to release to the atmosphere in a fourth embodiment.

FIG. 3 is a conceptual diagram of a flow path used for a processing table according to a fifth embodiment of the present invention.

FIG. 4 is a conceptual diagram of a flow path used for a processing table according to a sixth embodiment of the present invention.

FIG. 5 is a conceptual diagram of a flow path used for a processing table according to a seventh embodiment of the present invention.

FIG. 6 is a conceptual diagram of a flow path used for a processing table according to a ninth embodiment of the present invention.

FIG. 7 is a conceptual diagram of a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Laser oscillator 2 External optical system 3 Processing table 4 Z-axis 5 Vacuum pump 6 Automatic control device 7 Porous plate 15,21,22,28 Flow path 16,23,24,29 Solenoid valve 27,31 Porous part 30 Plate Thickness sensor

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Kimi Katade 1006 Kazuma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. F term (reference) 4E068 AF00 CA17 CA18 CC00 CC06 CE09 CH08 DA11 DA14

Claims (13)

[Claims] 1. A processing table on which a plate-shaped or sheet-shaped workpiece can be placed, a porous portion disposed on a side on which the workpiece is placed, and each hole of the porous portion. And a suction means for sucking the workpiece on the mounting surface of the porous portion by suctioning through the work table. 2. A processing table on which a plate-like or sheet-like workpiece can be placed, a porous portion disposed on a side on which the workpiece is placed, and each hole of the porous portion. Suction means for sucking the workpiece to the mounting surface of the porous portion by suctioning through the suction port; and a suction force of the suction means according to at least one of the type, shape, and size of the workpiece. And a control unit for controlling the processing table. 3. A processing table on which a plate-shaped or sheet-shaped workpiece can be placed, a porous portion disposed on a side on which the workpiece is placed, and each hole of the porous portion. A processing table, comprising: suction means for sucking the workpiece on the mounting surface of the porous portion by suctioning the workpiece with a pump device through the device; and adjusting means for adjusting the suction force of the suction means. 4. A processing table on which a plate-shaped or sheet-shaped workpiece can be placed, a porous portion disposed on a side on which the workpiece is placed, and each hole of the porous portion. Suction means for suctioning the workpiece to the mounting surface of the porous portion by suctioning the workpiece with a pump device, adjusting means for adjusting the suction force of the suction means, and the type of the workpiece, shape,
And a control unit for controlling the adjusting means according to at least one of the dimensions. 5. The processing table according to claim 3, wherein the adjusting means is a flow rate adjusting solenoid valve provided between the pump device and the porous portion. 6. The processing table according to claim 3, wherein the adjusting means is an air release adjusting valve provided between the pump device and the porous portion. 7. The processing table according to claim 3, wherein two or more flow paths are provided between the pump device and the porous portion, and selection means for selecting the flow path is provided as adjustment means. . 8. The pump device according to claim 3, wherein a plurality of flow paths having different areas of the connection portion with the porous portion are provided, and a selection means for selecting the flow path is provided as an adjustment means. 6. The processing table according to 6. 9. The suction means has a plurality of flow paths connected to each of the plurality of sections by dividing the porous portion into a plurality of sections, and a selection means for selecting the flow paths. 3,
The processing table described in 4, 5, 6, 7 or 8. 10. A control unit for controlling said selection means so as to expand selection from a section corresponding to a central portion of a workpiece placed on a porous portion to a section corresponding to a peripheral portion. The processing table described. 11. After the suction means is driven with a suction force lower than a suction force corresponding to at least one of the type, shape, and size of the workpiece, the suction means is changed to at least one of the type, shape, and size of the workpiece. 11. The processing table according to claim 1, further comprising a control unit for driving said suction means with a corresponding suction force. 12. A sensor for detecting a surface shape of a workpiece at the time of suction, and a determination unit for generating a caution signal when an absolute value of a value indicating the surface shape detected by the sensor is larger than a threshold value. Claims 1, 2, 3, 4, 5, 6,
The processing table according to 7, 8, 9, 10, or 11. 13. The method of claim 1, 2, 3, 4, 5, 6, 7,
A processing table described in 8, 9, 10, 11 or 12,
A laser processing machine comprising: a laser oscillator that generates a laser; and an external optical system that guides a laser beam from the laser oscillator to a workpiece.