JP2008084858A - Processing method of exhaust hole of display panel - Google Patents
Processing method of exhaust hole of display panel Download PDFInfo
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- JP2008084858A JP2008084858A JP2007242452A JP2007242452A JP2008084858A JP 2008084858 A JP2008084858 A JP 2008084858A JP 2007242452 A JP2007242452 A JP 2007242452A JP 2007242452 A JP2007242452 A JP 2007242452A JP 2008084858 A JP2008084858 A JP 2008084858A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/38—Exhausting, degassing, filling, or cleaning vessels
- H01J9/385—Exhausting vessels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/46—Machines having sequentially arranged operating stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2217/00—Gas-filled discharge tubes
- H01J2217/38—Cold-cathode tubes
- H01J2217/49—Display panels, e.g. not making use of alternating current
- H01J2217/492—Details
- H01J2217/49264—Vessels
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Gas-Filled Discharge Tubes (AREA)
Abstract
Description
本発明はディスプレイパネルに排気ホールを加工する方法に係り、より詳しくはレーザーを利用する非接触式加工で排気ホールの効率的な加工を行って、基板の整列の際に、基板の摩擦を無くすようにしたディスプレイパネル用排気ホールの加工方法に関するものである。 The present invention relates to a method of processing an exhaust hole in a display panel. More specifically, the exhaust hole is efficiently processed by non-contact processing using a laser to eliminate the friction of the substrate when aligning the substrates. The present invention relates to a method of processing an exhaust hole for a display panel.
一般に、平板ディスプレイ素子であるPDP(Plasma Display Panel)はプラズマ表示装置の表示部分であるパネルであって、2枚の薄いガラス基板間の狭い隙間にネオンなどのガスが封入され、ガラス基板の内面に水平方向及び垂直方向に配列された透明電極を備える構成を有する。 Generally, a PDP (Plasma Display Panel) which is a flat display element is a panel which is a display part of a plasma display device, and a gas such as neon is sealed in a narrow gap between two thin glass substrates, and the inner surface of the glass substrate. Are provided with transparent electrodes arranged in a horizontal direction and a vertical direction.
前記PDPは、その製造工程において、2枚のガラス基板を接合するとき、内部に残留する空気を外部に排出させるために、ガラス基板のいずれか一方に排気ホールを予め加工する工程を含む。 In the manufacturing process of the PDP, when two glass substrates are joined, the PDP includes a step of processing an exhaust hole in one of the glass substrates in advance in order to discharge the air remaining inside.
このような排気ホールの加工においては、従来ダイヤモンドを利用する機械的ドリリングが実施されているが、これは、ガラス基板との直接的な接触方式のため、加工が精密でなく、しかも振動によってガラス基板の破損する問題点があり、排気ホールの加工部位にバリ(burr)が形成され、このようなバリの形成は、PDPの製造工程時に行われる熱処理の際に、クラック及び破損の要因として作用する問題点があった。 In the processing of such an exhaust hole, mechanical drilling using diamond has been carried out conventionally, but this is a direct contact method with a glass substrate, so the processing is not precise and the glass is vibrated by vibration. There is a problem that the substrate is damaged, and a burr is formed in the processing portion of the exhaust hole, and the formation of such a burr acts as a factor of cracks and damage during the heat treatment performed in the manufacturing process of the PDP. There was a problem to do.
また、排気ホール形成の際、機械的ドリリングを行うので、ガラスの粉塵が多く発生して作業環境に有害であるだけでなく、洗浄工程が必須に行われなければならない問題点があり、パネルの大型化及び多面取り工法の導入による対処が容易でない問題点があった。 In addition, since mechanical drilling is performed when the exhaust hole is formed, not only is glass dust generated and harmful to the work environment, there is a problem that the cleaning process must be performed. There was a problem that it was not easy to cope with the increase in size and the introduction of the multi-chamfer method.
本発明は前記のような問題点に鑑みてなされたもので、その目的は、レーザーを利用する非接触式加工により、排気ホールの加工における加工効率を向上させるようにし、基板の効率的な移送はもちろん、基板の摩擦を無くすようにし、パネルの大型化及び多面取り工法の導入による排気ホールの加工の容易な処理を可能にするディスプレイパネル用排気ホールの加工方法を提供することにある。 The present invention has been made in view of the above-mentioned problems, and its purpose is to improve the processing efficiency in exhaust hole processing by non-contact processing using a laser, and to efficiently transfer a substrate. Needless to say, the present invention is to provide a method for processing an exhaust hole for a display panel that eliminates the friction of the substrate and enables easy processing of the exhaust hole by increasing the size of the panel and introducing a multi-sided construction method.
また、本発明は、非接触式基板加工で基板の破損を防止し、精密加工を可能にし、排気ホールの加工部位でのバー(burr)の形成を防止して、後工程の熱処理の際にクラックが生じるか破損する従来の問題点を克服することに他の目的がある。 Further, the present invention prevents damage to the substrate by non-contact type substrate processing, enables precision processing, prevents the formation of a barr at the processing portion of the exhaust hole, and performs heat treatment in the subsequent process. There are other objectives to overcome the traditional problems of cracking or breaking.
前記のような目的を達成するための本発明は、基板の設定モデル別にレーザーユニットのマーキングヘッド座標を設定し、マーキングのための待機位置にレーザーユニットを移動させる過程と、前記基板を、ローディング部、上下に垂直移動する整列加工部及び排出部の3段階に分けられた移送コンベヤーにローディングし、前記整列加工部上に配置された加工ステージ上に進入したかを確認する過程と、前記加工ステージ上への基板の進入が確認されれば、前記移送コンベヤーの整列加工部を下降させて基板との接触を解除するとともに前記加工ステージの上側に空気を吹き出して基板を浮上させる過程と、前記基板の浮上状態で、基板のX軸及びY軸センタリングを調整して加工ステージの中央に整列させ、基板の中央整列が完了したかを確認する過程と、前記基板の中央整列が完了すれば、基板の浮上状態を解除し、真空吸着によって加工ステージに基板を固定させる過程と、前記待機位置に移動されたレーザーによって基板の加工位置にレーザーを走査して排気ホールを加工するとともに、加工時に発生する粉塵を除去するための吸い込みを行う過程と、前記基板の排気ホールの加工が完了すれば、基板の真空吸着を解除し、下降状態の整列加工部を上昇させて移送コンベヤーに基板を接触させる過程と、前記移送コンベヤーによって基板を排出させるとともに基板のエンドライン通過を確認する過程と、を含んでなることを特徴とする。 In order to achieve the above object, the present invention provides a process of setting marking head coordinates of a laser unit for each substrate setting model, moving the laser unit to a standby position for marking, and loading the substrate into a loading unit. Loading to a transfer conveyor divided into three stages of an alignment processing section that vertically moves up and down and a discharge section and confirming whether or not it has entered a processing stage disposed on the alignment processing section; and the processing stage If the entry of the substrate is confirmed, the process of lowering the alignment processing portion of the transfer conveyor to release the contact with the substrate and blowing the air above the processing stage to float the substrate, and the substrate In the floating state, adjust the X-axis and Y-axis centering of the substrate to align it with the center of the processing stage. After the confirmation process and the center alignment of the substrate are completed, the floating state of the substrate is released, the substrate is fixed to the processing stage by vacuum suction, and the processing position of the substrate is moved by the laser moved to the standby position. When the exhaust hole is processed by scanning the laser and the suction process for removing dust generated during processing is completed, and the exhaust hole processing of the substrate is completed, the vacuum suction of the substrate is released, and the lowered state And a step of bringing the substrate into contact with the transfer conveyor, and a step of discharging the substrate by the transfer conveyor and confirming the passage of the substrate through the end line.
以上説明したように、本発明によるディスプレイパネル用排気ホールの加工方法によれば、レーザーを利用する非接触式加工を行うので、排気ホールの加工による加工効率を大きく向上させることができ、基板の摩擦なしに容易に中央に整列させることができ、精密加工が可能であるだけでなく、パネルの大型化及び多面取り工法の導入による排気ホールの加工の容易な処理が可能であり、分子構造を破壊する加工であるので、既存の機械的接触式ドリリングに比べ、排気ホール加工部位のバー(burr)形成を防止することができ、後工程の熱処理の際にクラックが生じるか破損する問題点を事前に防止することができる有用性を提供する。 As described above, according to the method for processing an exhaust hole for a display panel according to the present invention, since non-contact processing using a laser is performed, the processing efficiency by processing the exhaust hole can be greatly improved, It can be easily aligned in the center without friction, and not only can precision processing be performed, but also allows easy processing of exhaust holes by increasing the size of the panel and introducing a multi-sided construction method. Since it is a destructive process, compared to existing mechanical contact drilling, it can prevent the formation of a bar (burr) in the exhaust hole machining site, and the problem of cracking or breakage during heat treatment in the subsequent process Provides usefulness that can be prevented in advance.
以下、本発明の好ましい実施例を添付図面に基づいて詳細に説明する。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
図1は本発明によるディスプレイパネル用排気ホールの加工方法を示すフローチャート、図2は本発明のディスプレイパネル用排気ホールの加工方法のための装置の概念図、図3は本発明において基板のレーザー加工の概念図、図4は本発明においてレーザー加工時のZ軸方向の調整を説明する図である。 FIG. 1 is a flowchart showing a method for processing an exhaust hole for a display panel according to the present invention, FIG. 2 is a conceptual diagram of an apparatus for the method for processing an exhaust hole for a display panel according to the present invention, and FIG. FIG. 4 is a diagram for explaining the adjustment in the Z-axis direction during laser processing in the present invention.
図1及び図2に示すように、本発明によるディスプレイパネル用排気ホールの加工方法は、レーザーユニット10において、フォーカシング(focusing)が調整可能なレーザーを基板Gの2次元平面に走査して排気ホールを非接触式で加工するためのもので、基板Gの設定モデル別にレーザーユニット10のマーキング(marking)ヘッド座標を設定し、マーキングのための待機位置にレーザーユニット10を移動させる過程(S1)と、前記基板Gをローディング部21、上下に垂直移動する整列加工部22及び排出部23の3段階に分けられた移送コンベヤー20にローディングし、前記整列加工部22上に配置された加工ステージ30上に進入することを確認する過程(S2)と、前記加工ステージ30上への基板Gの進入が確認されれば、移送コンベヤー20の整列加工部22を下降させて基板の移送を停止させるとともに、加工ステージ30の上側に空気を吹き出して基板Gを浮上させる過程(S3)と、前記基板Gの浮上状態で、基板のX軸とY軸のセンタリング(centering)を調整して加工ステージ30の中央に整列させ、基板Gの中央整列が完了したかを確認する過程(S4)と、前記基板Gの中央整列が完了すれば、基板の浮上状態を解除し、真空吸着によって加工ステージ30に基板を固定させる過程(S5)と、前記待機位置に移動されたレーザーユニット10によって基板の加工位置にレーザーを走査して排気ホールを加工するとともに、加工時に発生する粉塵の除去のための吸い込み(suction)を行う過程(S6)と、前記基板Gの排気ホールの加工が完了すれば、基板の真空吸着を解除し、下降状態の整列加工部22を上昇させて移送コンベヤー20に基板を接触させる過程(S7)と、前記移送コンベヤー20によって基板Gを排出させるとともに基板のエンドライン(end line)通過を確認する過程(S8)とを含んでなる。 As shown in FIGS. 1 and 2, according to the method of processing an exhaust hole for a display panel according to the present invention, the laser unit 10 scans a two-dimensional plane of the substrate G with a laser whose focus can be adjusted. A step of setting the marking head coordinates of the laser unit 10 for each set model of the substrate G, and moving the laser unit 10 to a standby position for marking (S1); The substrate G is loaded onto a transfer conveyor 20 divided into three stages, ie, a loading unit 21, an alignment processing unit 22 that vertically moves up and down, and a discharge unit 23, and is mounted on the processing stage 30 disposed on the alignment processing unit 22. (S2) for confirming that the substrate G has entered, and the substrate G on the processing stage 30 If the entry is confirmed, the alignment processing unit 22 of the transfer conveyor 20 is lowered to stop the transfer of the substrate, and the process of blowing the air above the processing stage 30 to float the substrate G (S3), and the substrate The step of adjusting the centering of the X axis and the Y axis of the substrate in the floating state of G to align it with the center of the processing stage 30 and confirming whether the center alignment of the substrate G is completed (S4), When the center alignment of the substrate G is completed, the floating state of the substrate is released, the process of fixing the substrate to the processing stage 30 by vacuum suction (S5), and the processing position of the substrate by the laser unit 10 moved to the standby position. Scanning the laser to process the exhaust hole, and performing a suction for removing dust generated during processing (S6); When the processing of the exhaust hole of the substrate G is completed, the process of releasing the vacuum suction of the substrate, raising the lowered alignment processing unit 22 to contact the substrate with the transfer conveyor 20 (S7), and the transfer conveyor 20 (S8) including the step of discharging the substrate G and confirming the passage of the substrate through the end line.
この際、前記基板Gの排気ホールの加工時に使用されるレーザーとしては紫外線レーザーを使用することが好ましい。これは、熱的損傷を引き起こさない材料を除去した高エネルギー光子と鋭利な焦点を可能にする短波長によって空間分解能を向上させる作用をし、特に非常に早い最大出力と高パルスエネルギーを有し、355nmで10Wに至るようにするQ−スイッチンググループの紫外線レーザーを使用することにより、排気ホール加工の効率を高めるとともに精密な加工をなすようにする。 At this time, it is preferable to use an ultraviolet laser as a laser used when processing the exhaust hole of the substrate G. It acts to improve spatial resolution by high energy photons with the removal of materials that do not cause thermal damage and short wavelengths that allow sharp focus, especially with very fast maximum power and high pulse energy, By using an ultraviolet laser of the Q-switching group that reaches 10 W at 355 nm, the exhaust hole processing efficiency is increased and precise processing is performed.
また、前記紫外線レーザーはレーザーソースの最適の実施例であって、これに特に限定されるものではなく、排気ホールの加工の容易性及び精密な加工をなし得るレーザーソースであればいずれも適用可能である。 The ultraviolet laser is an optimal example of a laser source, and is not particularly limited thereto. Any laser source can be used as long as it is easy to process exhaust holes and can perform precise processing. It is.
前記レーザーユニット10は、図3及び図4に示すように、レーザーソース11と光学系12との間に可変BET(Variable Beam Extender)13を配置して、レーザーのZ軸方向(上下)に対するフォーカシング(focusing)調整が早くなされるようにし、X軸ミラー14及びY軸ミラー15、X軸ガルバノメーター16及びY軸ガルバノメーター17、及びフォーカスレンズ18からなる光学系12によってレーザーの位置調整を行えるように構成される。 As shown in FIGS. 3 and 4, the laser unit 10 has a variable beam extender (BET) 13 disposed between a laser source 11 and an optical system 12 to focus on the Z-axis direction (up and down) of the laser. (Focusing) The adjustment is made early, and the laser position can be adjusted by the optical system 12 including the X-axis mirror 14 and the Y-axis mirror 15, the X-axis galvanometer 16, the Y-axis galvanometer 17, and the focus lens 18. Configured.
前記基板GのX軸及びY軸方向への整列は、加工ステージ30の前方、後方及び両側部に配置されるストッパー41、テンション構造を有するX軸整列器42、及びY軸整列器43によりなされる。 The alignment of the substrate G in the X-axis and Y-axis directions is performed by stoppers 41 arranged at the front, rear and both sides of the processing stage 30, an X-axis aligner 42 having a tension structure, and a Y-axis aligner 43. The
本発明に適用される基板Gはガラスが主材料となる。 The substrate G applied to the present invention is mainly made of glass.
このように構成された本発明によるディスプレイパネル用排気ホールの加工方法をより詳細に説明すれば次のようである。 The processing method of the display panel exhaust hole having the above-described configuration according to the present invention will be described in detail as follows.
まず、レーザーソース、光学系及び可変BETからなるレーザーユニット10を、加工しようとする基板Gの設定モデルに合わせて、マーキングのためのヘッド座標を設定し、マーキングのための待機位置にレーザーヘッドを移動させる(S1)。 First, the laser unit 10 comprising a laser source, an optical system, and a variable BET is set in accordance with the setting model of the substrate G to be processed, the head coordinates for marking are set, and the laser head is placed at the standby position for marking. Move (S1).
排気ホールの加工用基板Gを移送コンベヤー20のローディング部21でローディングして移送処理するとともに、整列加工部22上に配置された加工ステージ30上に進入したかを確認する(S2)。 The processing substrate G in the exhaust hole is loaded and transferred by the loading unit 21 of the transfer conveyor 20, and it is confirmed whether the processing substrate 30 has entered the processing stage 30 arranged on the alignment processing unit 22 (S2).
この際、基板Gの進入確認は、ストッパー41に近くにすぐ後ろに設置されたフォトセンサー(図示せず)の感知で信号処理され、これと同時に、移送コンベヤー20の動作が停止し、慣性によって移送される基板は加工ステージ30の前方にUP状態で位置するストッパー41によって規制されて停止される。 At this time, the entry confirmation of the substrate G is signal-processed by the detection of a photo sensor (not shown) installed immediately behind the stopper 41, and at the same time, the operation of the transfer conveyor 20 is stopped, and due to inertia The transferred substrate is regulated and stopped by a stopper 41 positioned in the UP state in front of the processing stage 30.
加工ステージ30上に基板Gの進入が確認されれば、移送コンベヤー20の整列加工部22をさせて、基板との接触を解除させるとともに、加工ステージ30の下から上側に空気を吹き出して基板Gを浮上させる(S3)。 If the entrance of the substrate G is confirmed on the processing stage 30, the alignment processing unit 22 of the transfer conveyor 20 is made to release the contact with the substrate, and air is blown upward from below the processing stage 30 to eject the substrate G. (S3).
基板Gを浮上させた状態で、X軸整列器42とY軸整列器43を位置調整して、加工ステージ30の中央に基板を整列し、基板Gの中央整列が完了したかを確認する(S4)。 With the substrate G floating, the X-axis aligner 42 and the Y-axis aligner 43 are adjusted in position to align the substrate with the center of the processing stage 30 and confirm whether the center alignment of the substrate G is completed ( S4).
この際、基板Gの適用モデルによって、メーンコントロール部(図示せず)に既に設定された値だけサーボモーター(図示せず)を制御して、X軸整列器42及びY軸整列器43を位置移動させて基板の中央整列を試みることになり、サーボモーターの位置移動完了が基板Gの中央整列の完了を知らせる信号になる。 At this time, the servo motor (not shown) is controlled by a value already set in the main control unit (not shown) according to the application model of the substrate G, and the X-axis aligner 42 and the Y-axis aligner 43 are positioned. The substrate is moved to attempt center alignment of the substrate, and the completion of the position movement of the servo motor becomes a signal notifying completion of center alignment of the substrate G.
ここで、基板Gの浮上を利用することにより、空中に浮かんだ状態の基板を接触状態で位置調整するので、基板の位置調整が容易になり、基板の整列の際、基板Gと加工ステージ30間の摩擦を除去することによって、スクラッチを防止することができるとともに基板の摩擦を無くす利点を提供する。 Here, by using the floating of the substrate G, the position of the substrate floating in the air is adjusted in a contact state, so that the position adjustment of the substrate is facilitated, and the substrate G and the processing stage 30 are aligned when the substrates are aligned. By removing the friction between them, scratching can be prevented and the advantage of eliminating the friction of the substrate is provided.
基板の中央整列が完了すれば、空気供給を遮断して基板の浮上を解除し、真空吸着によって加工ステージ30に基板を密着固定させる(S5)。 When the center alignment of the substrates is completed, the air supply is shut off to release the floating of the substrate, and the substrate is tightly fixed to the processing stage 30 by vacuum suction (S5).
その後、待機位置に移動されたレーザーユニット10からレーザーを発生させ、可変BETによるZ軸フォーカシングを調整すると同時に、X及びYガルバノメーターによるX軸ミラー及びY軸ミラーの位置を調整しながら、基板の加工位置にレーザーの焦点を合わせて排気ホールを加工処理する(S6)。 Thereafter, a laser is generated from the laser unit 10 moved to the standby position, and the Z-axis focusing by the variable BET is adjusted, and at the same time, the positions of the X-axis mirror and the Y-axis mirror by the X and Y galvanometers are adjusted. The exhaust hole is processed with the laser focused on the processing position (S6).
この際、吸い込み(suction)を行うことで、排気ホールの加工時に基板で発生する粉塵を除去するようにする。 At this time, suction is performed to remove dust generated on the substrate during processing of the exhaust hole.
基板Gの排気ホールの加工が完了すれば、基板の真空吸着を遮断して密着固定状態を解除し、下降状態の整列加工部22を再度上昇させて、移送コンベヤー20に基板Gを接触させる(S7)。 When processing of the exhaust hole of the substrate G is completed, the vacuum suction of the substrate is cut off to release the tightly fixed state, the lowered alignment processing portion 22 is raised again, and the substrate G is brought into contact with the transfer conveyor 20 ( S7).
この際、移送コンベヤーの上昇動作により、基板は移送コンベヤー20と接触するとともに加工ステージ30からは分離され、基板Gの排出のために、上昇状態のストッパー41が下降し、X軸整列器42及びY軸整列器43が初期位置に復帰する。 At this time, the substrate is brought into contact with the transfer conveyor 20 and separated from the processing stage 30 by the raising operation of the transfer conveyor, and the stopper 41 in the raised state is lowered to discharge the substrate G, and the X-axis aligner 42 and The Y-axis aligner 43 returns to the initial position.
移送コンベヤー20を作動させることで基板Gを排出部に移送させて排出処理するとともに、基板のエンドライン(end line)通過を確認する(S8)。 By operating the transfer conveyor 20, the substrate G is transferred to the discharge unit and discharged, and the passage of the substrate through the end line is confirmed (S 8).
この際、基板Gの通過は、ストッパー41に近くにすぐ前に設置されたフォトセンサー(図示せず)の感知によって信号処理され、下降したストッパー41を再度上昇させる。 At this time, the passage of the substrate G is signal-processed by sensing of a photosensor (not shown) installed immediately in front of the stopper 41, and the lowered stopper 41 is raised again.
以上、本発明によるディスプレイパネル用排気ホールの加工方法は前述したような具体的な実施例及び添付図面に基づいて説明したが、これに特に限定されるものではなく、本発明の特許請求範囲の技術的思想の範疇内でなされる当該技術分野の多様な変形及び修正は本発明に属するものであるといえる。 The processing method of the display panel exhaust hole according to the present invention has been described based on the above-described specific embodiments and the accompanying drawings. However, the present invention is not particularly limited thereto. Various changes and modifications in the technical field made within the scope of the technical idea can be said to belong to the present invention.
本発明は、レーザーを利用する非接触式加工で排気ホールの効率的な加工を行って、基板の整列の際に、基板の摩擦を無くすようにしたディスプレイパネル用排気ホールの加工方法に適用可能である。 INDUSTRIAL APPLICABILITY The present invention can be applied to a processing method of an exhaust hole for a display panel in which exhaust holes are efficiently processed by non-contact processing using a laser so that friction of the substrate is eliminated when the substrates are aligned. It is.
10 レーザーユニット
11 レーザーソース
12 光学系
13 可変BET
14、15 ミラー
16、17 ガルバノメーター
18 フォーカスレンズ
20 移送コンベヤー
30 加工ステージ
41 ストッパー
42 X軸整列器
43 Y軸整列器
10 Laser unit 11 Laser source 12 Optical system 13 Variable BET
14, 15 Mirror 16, 17 Galvanometer 18 Focus lens 20 Transfer conveyor 30 Processing stage 41 Stopper 42 X-axis aligner 43 Y-axis aligner
Claims (4)
前記基板を、ローディング部、上下に垂直移動する整列加工部及び排出部の3段階に分けられた移送コンベヤーにローディングし、前記整列加工部上に配置された加工ステージ上に進入したかを確認する過程と、
前記加工ステージ上への基板の進入が確認されれば、前記移送コンベヤーの整列加工部を下降させて基板との接触を解除するとともに前記加工ステージの上側に空気を吹き出して基板を浮上させる過程と、
前記基板の浮上状態で、基板のX軸及びY軸センタリングを調整して加工ステージの中央に整列させ、基板の中央整列が完了したかを確認する過程と、
前記基板の中央整列が完了すれば、基板の浮上状態を解除し、真空吸着によって加工ステージに基板を固定させる過程と、
前記待機位置に移動されたレーザーによって基板の加工位置にレーザーを走査して排気ホールを加工するとともに、加工時に発生する粉塵を除去するための吸い込みを行う過程と、
前記基板の排気ホールの加工が完了すれば、基板の真空吸着を解除し、下降状態の整列加工部を上昇させて移送コンベヤーに基板を接触させる過程と、
前記移送コンベヤーによって基板を排出させるとともに基板のエンドライン通過を確認する過程と、を含んでなることを特徴とする、ディスプレイパネル用排気ホールの加工方法。 The process of setting the marking head coordinates of the laser unit for each setting model of the substrate and moving the laser unit to the standby position for marking,
The substrate is loaded onto a transfer conveyor divided into three stages of a loading unit, an alignment processing unit that vertically moves vertically, and a discharge unit, and it is confirmed whether or not the substrate has entered a processing stage disposed on the alignment processing unit. Process,
If the entry of the substrate onto the processing stage is confirmed, the process of lowering the alignment processing portion of the transfer conveyor to release the contact with the substrate and blowing the air above the processing stage to float the substrate; ,
Adjusting the X-axis and Y-axis centering of the substrate to be aligned with the center of the processing stage in the floating state of the substrate, and checking whether the center alignment of the substrate is completed;
When the center alignment of the substrate is completed, the process of releasing the floating state of the substrate and fixing the substrate to the processing stage by vacuum suction;
A process of scanning the laser to the processing position of the substrate by the laser moved to the standby position to process the exhaust hole, and performing suction for removing dust generated during processing,
When the processing of the exhaust hole of the substrate is completed, the process of releasing the vacuum suction of the substrate, raising the lowered alignment processing portion and bringing the substrate into contact with the transfer conveyor,
A method of processing an exhaust hole for a display panel, comprising: discharging the substrate by the transfer conveyor and confirming the passage of the substrate through the end line.
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CN103180255A (en) * | 2010-10-20 | 2013-06-26 | 旭硝子株式会社 | Method for drilling mother glass substrate, and mother glass substrate |
CN106517749B (en) * | 2016-11-08 | 2018-11-20 | 重庆兴宝兴玻璃制品有限公司 | Utilize the device of high-temperature fusion principle processing glass |
CN107721142A (en) * | 2017-11-25 | 2018-02-23 | 滕州市耀海玻雕有限公司 | A kind of hot drilling technology of blow-molded glass product |
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JP2000193604A (en) * | 1998-12-25 | 2000-07-14 | Takano Co Ltd | Automatic inspection device for substrate |
JP2001138095A (en) * | 1999-11-09 | 2001-05-22 | Matsushita Electric Ind Co Ltd | Machining table and laser beam machine |
JP2002134927A (en) * | 2000-10-23 | 2002-05-10 | Hamamatsu Photonics Kk | Via hole forming equipment of multilayer printed board |
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WO2021202911A1 (en) * | 2020-04-03 | 2021-10-07 | Applied Materials, Inc. | Method of forming holes from both sides of substrate |
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KR100811115B1 (en) | 2008-03-06 |
CN101154542B (en) | 2010-06-16 |
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