JP2010099708A - Method and apparatus for processing cut surface of cut material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for processing the cut surface of a glass sheet, which can reduce time required for processing the cut surface of the glass sheet without needing large additional equipment while retaining quality of the glass sheet such as safety and strength by effectively preventing the occurrence of cracking, chippage or the like. <P>SOLUTION: The invented apparatus for processing the cut surface of the glass sheet includes a laser beam source, a guiding means, an energy density adjusting means, and a heating means. The laser beam source oscillates a short pulsed laser beam to be radiated to the cut surface of the glass sheet. The guiding means guides the laser beam. The energy density adjusting means adjusts the energy density of the ultrashort pulsed laser beam so that the portion irradiated with the short pulsed laser beam evaporates instantaneously on the irradiated cut surface. The heating means heats the periphery of the cut portion of the glass sheet so that the peripheral area of the glass sheet is not damaged by the short pulse. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a processing method and a processing apparatus for processing a cut surface of a material to be cut such as a highly brittle non-metallic material by laser light irradiation.

  A highly brittle non-metallic material such as glass may require chamfering of a cut surface, particularly a corner, after cutting into a predetermined shape or size. Conventionally, a polishing tool has been used as the chamfering method, but a method using a laser beam instead of using the polishing tool has been proposed (for example, see Patent Documents 1 and 2).

  In the method shown in Patent Document 1, as shown in FIG. 7, the irradiation spot 22a of the laser beam 22 is changed to the corner portion 21a while the entire glass member 21 is held at a predetermined temperature higher than room temperature. By irradiating the glass member 21 so as to move over at least a part of the total length of the glass member 21, the irradiated part of the corner part 21 is heated to a higher temperature than the other part and softened to be chamfered.

In the method disclosed in Patent Document 2, the material is partially preheated, and the corners to be processed are irradiated with laser light to melt and soften the corners. This softening causes the corners to be rounded and chamfered.
Specifically, as shown in FIG. 8, an elliptical first laser spot LS <b> 1 whose one end is located at the edge portion 31 to be chamfered at the side edge of the glass substrate 30 is formed. The major axis of the first laser spot LS1 is inclined by an angle θ with respect to the edge portion, and the other end portion is located in the vicinity of the edge portion 31. The thermal energy intensity of the first laser spot LS1 is small at the end located in the vicinity of the edge portion 31, and is maximized at the end located on the edge portion 31 to be chamfered. When the glass substrate 30 is moved in the X direction, the vicinity of the edge portion 31 of the glass substrate 30 is preheated by the first laser spot LS1, and then the edge portion 31 is melted and chamfered. Further, after the edge portion 31 is melted and chamfered, the glass substrate 30 is annealed by heating with the second laser spot LS2, thereby relaxing the residual stress and preventing the occurrence of fine cracks. Thereby, it is supposed that the edge part 31 of a glass substrate can be chamfered reliably, without generating a crack.
JP-A-2-241684 Republished patent WO2003-15976

However, in the conventional chamfering method using a laser, the glass is melted and the cut surface is made into an R surface, so that there is a problem in that the shape accuracy is impaired due to the occurrence of defects or sagging in the shape at the melted portion. Furthermore, since the glass is partially heated, residual strain occurs, causing fine cracks, etc., so it is necessary to remove the residual strain, and for this purpose, means such as slow cooling over time is required. However, it takes a long time for slow cooling and the efficiency is low. Further, when the size of the glass is increased, there is a problem that the residual stress is integrated and the glass is broken without being able to withstand the residual stress.
For residual strain, as shown in Patent Document 1, it is possible to avoid the occurrence of residual strain by preheating the entire glass, but heating the entire glass takes time and productivity. There is a problem. In addition, as shown in Patent Document 2, annealing by irradiating a laser beam after the corner portion is also effective in alleviating the residual strain, but the effect is limited, and the size of the glass as described above. When becomes larger, it becomes difficult to sufficiently eliminate the influence of residual distortion.

  The present invention has been made to solve the above-described problems of the prior art, and by instantaneously evaporating a material to be cut such as glass, ceramic, or semiconductor material with a laser beam, It is an object of the present invention to provide a method and an apparatus capable of processing a cut surface without leaving a residual strain due to defects or thermal effects.

  That is, the first aspect of the method for treating a cut surface of a material to be cut according to the present invention is such that a short pulse laser beam is irradiated to the cut surface of the material to be cut to cause laser ablation at a corner of the cut surface. Then, the corners are chamfered.

  According to a second aspect of the present invention, in the first aspect of the present invention, the material to be cut is a highly brittle non-metallic material.

  According to a third aspect of the present invention, there is provided a cut surface processing method for a material to be cut in the first aspect of the present invention, wherein the short pulse laser beam is scanned relative to the material to be cut along the longitudinal direction of the corner. Thus, the chamfering is performed along the longitudinal direction of the corner portion.

  According to a fourth aspect of the present invention, there is provided a cut surface treatment method for a material to be cut in the third aspect of the present invention, wherein heating is performed by a heating unit that partially preheats corners of the cut surface prior to the short pulse laser beam. Preheating is performed while scanning the portion, and irradiation is performed while scanning the short pulse laser light so as to overlap with a rear side region of the heating portion by the preheating means.

  According to a fifth aspect of the present invention, there is provided the cut surface treatment method for a material to be cut according to the fourth aspect of the present invention, wherein the heating means is provided with a preheating laser beam irradiation portion having a wavelength that is an absorption band wavelength of the material to be cut. The material to be cut is preliminarily partially heated.

  According to a sixth aspect of the present invention, there is provided a method for treating a cut surface of a material to be cut, in which the short pulse laser beam is emitted in a state in which the cut surfaces of two materials to be cut are adjacent to each other. By irradiating while scanning, two cut surfaces are processed simultaneously.

  According to a seventh aspect of the present invention, there is provided a cut surface processing apparatus for a material to be cut, which includes a light source that outputs laser light applied to the cut surface of the material to be cut, and means for guiding the laser light, The irradiation portion of the cut surface is irradiated with an energy density that instantaneously evaporates by irradiation of laser light.

  According to an eighth aspect of the present invention, in the seventh aspect of the present invention, the cut surface treatment apparatus for a cut material is configured such that the irradiated portion of the cut surface is instantaneously irradiated by irradiating the laser light output from the light source. A means for adjusting the energy density to evaporate is provided.

  According to a ninth aspect of the present invention, there is provided a cutting surface processing apparatus for a cutting material, according to the seventh aspect of the present invention, comprising a scanning unit that scans the laser light relative to the cutting material in the longitudinal direction of the cutting surface. It is characterized by that.

  According to a tenth aspect of the present invention, in the seventh aspect of the present invention, the cut surface treatment apparatus for cutting material is characterized in that the pulse width of the laser light is 100 picoseconds or less.

  According to an eleventh aspect of the present invention, there is provided a cutting surface processing apparatus for a material to be cut, which is the powder according to the seventh aspect of the present invention, wherein the laser beam is irradiated to the material to be cut and a part of the material to be evaporated evaporates. It is characterized by having a means for sucking.

  According to a twelfth aspect of the present invention, there is provided a cutting surface processing apparatus for a material to be cut, according to the seventh aspect of the present invention, comprising: heating means for preheating the material to be cut before the laser beam is irradiated onto the material to be cut. It is characterized by providing.

  According to a thirteenth aspect of the present invention, in the twelfth aspect of the present invention, there is provided the cut surface treatment apparatus according to the twelfth aspect of the present invention, wherein the heating means uses the preheating laser beam having a wavelength that is an absorption band wavelength of the material to be cut. It is characterized by preheating the material.

  According to a fourteenth aspect of the present invention, there is provided a cut surface processing apparatus for a material to be cut, in any one of the twelfth and thirteenth aspects of the present invention, the laser beam is applied to a portion of the cut surface that has reached a substantially maximum temperature by the preliminary heating. It is characterized by being irradiated and evaporated.

  According to a fifteenth aspect of the present invention, in the seventh aspect of the present invention, the cut surface treatment apparatus for a material to be cut can adjust the evaporation region of the material to be cut by repeatedly moving the laser beam in a direction intersecting the scanning direction. And a laser beam moving means.

  According to a sixteenth aspect of the present invention, in the seventh aspect of the present invention, the laser beam is irradiated perpendicularly to the surface of the material to be cut.

  According to a seventeenth aspect of the present invention, there is provided a cutting surface processing apparatus for a material to be cut, wherein, in the seventh aspect of the invention, prior to the scanning of the laser beam, the cutting position is moved together with the scanning of the laser beam. It is characterized by comprising a cutting means for cutting.

  As described above, according to the cut surface processing method for a material to be cut according to the present invention, a short pulse laser beam is irradiated on the cut surface of the material to be cut to cause laser ablation at the corner of the cut surface. Since the corners are chamfered, there is no part of the material to be cut or sag due to melting, and the shape accuracy is maintained. Further, there is almost no thermal influence due to laser light irradiation, and chamfering can be performed without causing residual distortion in the material to be cut. Therefore, a process for heating the entire workpiece in advance is not necessary so that the remaining amount distortion does not occur, the process is simplified, and a large-scale peripheral facility for heating the entire workpiece is required. And not. Further, since slow cooling for a long time after chamfering is not required, the process is further simplified.

Furthermore, even if the size of the material to be cut increases, residual stress does not accumulate, and it becomes possible to process a material having a large size. Also, normally, there are horizontal cracks on the cut surface of the material to be cut such as glass, which cause the strength to decrease, but since the horizontal crack itself can be removed, the strength of the material to be cut such as glass is increased. be able to.
Furthermore, since it can process only on the surface of a to-be-cut material, even if there exists a material weak to a heat | fever around the cutting part of a to-be-cut material, it does not have influence. For example, there is an effect that glass as a material to be cut can be processed without causing thermal damage to liquid crystal, resin, or the like of the liquid crystal panel.
Furthermore, since it is dry chamfering, subsequent cleaning is not necessary, and since it is chamfered, there is an effect that scratches due to handling are hardly caused.

  In addition, the cut surface processing apparatus for a material to be cut of the present invention includes a light source that outputs a laser beam that irradiates the cut surface of the material to be cut, and a means for guiding the laser beam, the laser beam being the laser beam. Since the irradiated portion of the cut surface is output with an energy density that instantaneously evaporates due to light irradiation, a laser beam having an appropriate energy density is irradiated to the material to be cut, and the laser is irradiated at the irradiated portion of the material to be cut There is an effect that the cut surface can be processed without causing ablation and causing residual strain in the material to be cut.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.
As shown in FIG. 1, the cut surface processing apparatus includes a sample table 2 on which glass 1 as a material to be cut is placed, and a moving device 3 that linearly moves the sample table 2 in the horizontal direction. The moving device 3 corresponds to the scanning means of the present invention.

A guiding unit 5 having an optical system such as mirrors 5a and 5b is positioned above the sample stage 2, and an adjusting unit 6 for condensing the beam is positioned in the emission direction of the guiding unit 5, and the adjustment is performed. The cutting surface 1 </ b> A of the glass 1 placed on the sample stage 2 is positioned in front of the emission direction of the unit 6 (below the adjustment unit 6 in the figure). In addition, the guiding part 5 can include other appropriate optical system members such as a homogenizer and a cylindrical lens, and the configuration of the present invention is not limited to a specific one.
A laser beam 4 a output from the laser light source 4 is input to the incident side of the guide unit 5. In this embodiment, a laser beam having a wavelength in the ultraviolet region is preferably used as the laser beam 4a.

In addition, a guiding unit 11 having an optical system such as mirrors 11 a and 11 b is positioned above the guiding unit 5, and the cut surface 1 A of the glass 1 is positioned in the emission direction of the guiding unit 11. Yes. In addition, the guiding portion 11 can include other appropriate optical system members such as a homogenizer and a cylindrical lens, and the configuration of the present invention is not limited to a specific one.
In the cut surface 1A, the emission direction by the guiding portion 5 and the emission direction by the guiding portion 11 substantially overlap each other. A preheating laser beam 10 a output from the laser light source 10 using CO ₂ is input to the incident side of the guide unit 11. In this embodiment, the preheating laser beam 10a having a wavelength in the infrared region is preferably used.

  Further, a suction device 7 is provided in the vicinity of the position where the laser beam 4a and the preheating laser beam 10a are irradiated on the cut surface 1A, and dust around the suction device 7 can be sucked and removed. It is possible.

  In addition, in the said embodiment, although glass 1 is arrange | positioned horizontally and it has demonstrated as what has arrange | positioned the guidance parts 5 and 11 to the upper direction, as the present invention, the arrangement direction and arrangement positional relationship are especially limited. It is not a thing. For example, the glass may be installed vertically or obliquely, and the guiding part may be any one that is arranged so as to irradiate the cut surface of the installed glass with laser light.

Next, a processing method using the cut surface processing apparatus will be described.
The glass 1 is placed on the sample stage 2 so that the cut surface 1 </ b> A is positioned in the emission direction of the guiding part 5 and the guiding part 11.
In the laser light source 10, a preheating laser beam 10 a having a wavelength belonging to the absorption band wavelength of the glass 1 is output. The preheated laser beam 10a output from the laser light source 10 is incident on the guiding portion 11, and is emitted from the guiding portion 11 through appropriate beam shaping, deflection by the mirrors 11a and 11b, and the like on the cut surface 1A of the glass 1. Irradiate the surface. At that time, the beam shape when the preheating laser beam 10a is irradiated onto the glass 1 is shaped by the guiding portion 11 and is long in parallel with the moving direction of the glass 1 as shown in the irradiation portion 10b of FIG. The intensity distribution is such that only the chamfered portion of the cut surface 1A is effectively heated. The beam shape may be any width that can be preheated according to the size of the corner to be processed, and the length is effective for preheating prior to the irradiation of the laser beam 4a. It is sufficient if it is set so that it can be performed. For example, the ratio of width to length can be set from several times to several tens of times.

On the other hand, the laser light source 4 outputs laser light 4a having a wavelength in the ultraviolet region (wavelength 10 to 400 nm) with an appropriate output power. The pulse width of the laser beam 4a is set to a pico order, and is preferably a short pulse laser beam having a wavelength of 100 picoseconds or less.
The laser beam 4 a is incident on the guiding unit 5, is emitted from the guiding unit 5 through appropriate shaping and deflection by the mirrors 5 a and 5 b, and reaches the adjusting unit 6. The adjusting unit 6 condenses the laser light 4a and adjusts the focal position so that the surface of the cut surface 1A of the glass 1 is located. Thereby, the irradiation spot 4b by the laser beam 4a is obtained on the cut surface 1A. The diameter of the irradiation spot 4b can be made small corresponding to the size of the corner to be processed, and is made smaller than the width of the irradiation part 10b.

The irradiation spot 4b has an energy density at which the glass evaporates instantaneously, that is, laser ablation occurs. Laser ablation is a phenomenon in which a material is instantaneously released from the surface of a solid when energy exceeding a certain value is given to the irradiated portion, and evaporation occurs without melting the solid.
The irradiation spot 4b is condensed by the adjusting unit 6 and the energy density is adjusted. The adjusting unit 6 applies the laser beam to the irradiated portion of the cut surface by the laser beam irradiation. It has a role as a means for adjusting the energy density to evaporate instantaneously. In order to obtain the energy density, the power of the laser beam output from the laser light source needs to be set appropriately. In the case where a means for adjusting the power of the laser beam is provided, this is also included in the means for adjusting the energy density.

  The irradiation spot 4b is configured to partially overlap the irradiation unit 10b, and it is further desirable that the irradiation spot 4b is located at a position where the temperature of the glass surface reaches the maximum temperature due to heating of the irradiation unit 10b. The irradiation spot 4b and the irradiation unit 10b are moved relative to the glass 1 by moving the glass 1 by the moving device 3, and scanning of the laser light is performed. Preheating with the laser beam 10 is preceded by positioning the irradiation spot 4b in the scanning direction rear region of the irradiation unit 10b with respect to the scanning direction. In the irradiation unit 10b, the highest energy density is shown at the center in the scanning direction, but heat is accumulated on the glass surface by moving along the glass cut surface 1A. On the glass 1, from the center in the scanning direction of the irradiation unit 10b. However, the rear side is at the highest temperature.

  FIG. 3 is a diagram showing an example of the passage of time and the change in temperature of the cut surface (beam length Lmm, scanning speed (L × 11) mm / second) when the irradiation unit 10b moves on the cut surface. . After the beam center passes, the cut surface 1A reaches the maximum temperature after a while. That is, it is desirable to determine the positional relationship between the irradiation spot 4b and the irradiation unit 10b so that the irradiation spot 4b is always located at this position.

In this arrangement, the irradiation spot 4a, the irradiation part 10a, and the glass 1 are moved relative to each other so that the irradiation part 10b and the irradiation spot 4b move (scanned) along the corner 1B of the cut surface 1A. Chamfering is performed. That is, in the corner portion 1B partially preheated by the irradiation unit 10b, the irradiation spot 4b to be irradiated subsequently is irradiated with a short pulse and high energy density, so that the glass instantaneously evaporates at the spot. Ablation occurs and the corner 1B is chamfered. Examples of the scanning speed include a speed of several tens to several hundreds mm / second, but the present invention is not particularly limited to this. However, it is necessary to set the scanning speed so that at least the laser ablation occurs.
Note that the evaporated glass particles are forcibly sucked and removed by the suction device 7, so that reattachment to the glass 1 can be reliably prevented.

In the laser ablation, there is almost no thermal influence on the glass 1 by the irradiation spot 4b. A chamfer 1B ₀ is formed at the corner 1B through which the irradiation part 10b and the irradiation spot 4b have passed, and after the irradiation part 10b and the irradiation spot 4b have passed, the temperature gradually decreases during processing along the corner. Residual distortion hardly occurs. Further, slow cooling after the treatment is not required.

Figure 4 shows a corner portion 1B That chamfer 1B ₀ chamfer is performed, for example, the radius of curvature R can perform R chamfering of about 50 [mu] m. The radius of curvature differs depending on the diameter of the irradiation spot and the like, and the present invention can perform R chamfering with a wide range of curvature.

  That is, in the present invention, an ultrashort pulse laser beam that can evaporate on the glass is condensed into a small beam spot and irradiated onto the surface of the cut surface of the glass, thereby instantaneously irradiating a part of the glass. Can be evaporated. Since short pulses are used, there is no corner loss or sagging, and there is no thermal effect around the cut surface of the glass, so it is possible to chamfer without generating residual strain. it can.

  Moreover, the heat damage which generate | occur | produces when the glass particle which has evaporated and became high temperature adheres to a cut surface can be suppressed by making glass high beforehand by preheating. As the preheating, the laser beam is used in the above embodiment, but the present invention is not limited to this, and a burner or the like may be used as a heating source. However, if the preheating laser beam is used, the position of the highest temperature point becomes accurate, and preheating and chamfering can be performed more effectively.

  If the straightness of the cut surface deviates greatly from the diameter of the beam spot 4b of the short pulse laser, the above chamfering or goodness is not achieved. On the other hand, the rectilinearity is deviated by repeatedly moving the laser beam in a direction intersecting (or perpendicular to) the scanning direction by a galvanometer mirror or an AOM (acousto-optic element) corresponding to the laser beam moving means. Chamfering is possible even in the case where The galvanometer mirror and AOM (acousto-optic element) correspond to the laser beam moving means in the present invention. The amount of movement can be determined in consideration of the amount of laser beam deviation with respect to the scanning direction. In addition, the repetition period and the moving speed can be appropriately set in consideration of the scanning speed and the like.

Furthermore, in the present invention, since the chamfering can be performed by irradiating the beam perpendicular to the glass surface, as shown in FIG. 5, the cut surfaces 1A and 1A of the cut glass 1 and 1 are opposed to each other, In the same manner as described above, short-angle laser light is irradiated over the corners 1B and 1B from above to chamfer the corners 1B and 1B at a time to be chamfered portions 1B ₀ and 1B _0. Can do. At this time, it is desirable to preliminarily preheat the glasses 1 and 1 with a preheating laser or the like as in the above embodiment.

Moreover, in the said embodiment, although the glass which has already been cut was prepared and chamfered was demonstrated, in this invention, the said function is added to a glass scribing apparatus etc., and it chamfers simultaneously with the cleaving of glass. Can do.
This apparatus will be described with reference to FIG. In addition to the apparatus that irradiates the laser beams 4a and 10b, a mechanical wheel 15 is provided as a cutting means, and the mechanical wheel 15 is positioned in front of the laser beam 10b in the scanning direction.
In this apparatus, when the glass is moved in the same manner as in the above embodiment, a crack 1C is formed by a mechanical wheel 15 at a predetermined location. The laser beam 10a and the laser beam 4a are irradiated to the crack 1C as the irradiation portion 10b and the irradiation spot 4b at the opposite corners 1B and 1B in the crack 1C as in the above embodiment, and as in the above embodiment. The corner portions 1B and 1B are chamfered at the same time, and chamfered portions 1B ₀ and 1B ₀ are formed. In addition, the formation method of the crack 1C is not specifically limited as this invention, A various method is employable. In this embodiment, the cleaving and chamfering of the glass are performed at the same time, and the working efficiency is improved.

  In the above descriptions, the processing target is limited to glass. However, as the present invention, the object to be treated is not limited to glass, but can be applied to highly brittle non-metallic materials such as ceramics and semiconductors, and is not limited to this, as long as the above action is obtained. It is possible to apply to various materials.

  The present invention has been described based on the above-described embodiments. However, the present invention is not limited to the contents of the above-described embodiments, and can be appropriately changed without departing from the present invention. .

It is the schematic which shows the cut surface processing apparatus in one Embodiment of this invention. Similarly, it is a figure which shows the cut surface processing process by this apparatus. Similarly, it is a graph which shows the temperature change by the preheating laser beam on the glass surface. Similarly, it is an enlarged view which shows the corner | angular part of the glass by which the surface treatment was made. It is a figure which shows the process in other embodiment in the cutting processing method of this invention. It is a figure which shows the cut surface processing process by the cut surface processing apparatus of other embodiment of this invention. It is a figure which shows an example of the conventional chamfering method. It is a figure which shows the other example of the conventional chamfering method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Glass 1A Cutting surface 1B Corner | angular part 1B ₀ Chamfering part 1C Crack 3 Moving apparatus 4 Laser light source 4a Laser light 4b Irradiation spot 6 Adjustment part 7 Suction apparatus 10 Laser light source 10a Preheating laser beam 10b Irradiation part

Claims (17)

  A method for treating a cut surface of a material to be cut, wherein the cut surface of the material to be cut is irradiated with a short pulse laser beam to cause laser ablation at the corner of the cut surface to chamfer the corner.   The cut surface treatment method for a material to be cut according to claim 1, wherein the material to be cut is a highly brittle non-metallic material.   The chamfering is performed along the longitudinal direction of the corner by scanning the short pulse laser light relative to the material to be cut along the longitudinal direction of the corner. The cut surface treatment method of a material to be cut according to 1.   Prior to the short pulse laser beam, preheating is performed while scanning the heating portion by a heating means that partially preheats the corners of the cut surface, and is superimposed on the rear side area of the heating portion by the preheating means. 4. The method for treating a cut surface of a material to be cut according to claim 3, wherein the irradiation is performed while scanning with a short pulse laser beam.   The said heating means partially preheats the said to-be-cut material by the irradiation part of the preheating laser beam which has a wavelength used as the absorption band wavelength of the said to-be-cut material, The Claim 4 characterized by the above-mentioned. A method for treating a cut surface of a material to be cut.   The two cut surfaces are simultaneously processed by irradiating the short pulse laser beam while scanning with the cut surfaces of the two materials to be cut next to each other. A method for treating a cut surface of a material to be cut according to claim 1.   A light source for outputting a laser beam to be irradiated onto the cut surface of the material to be cut; and means for guiding the laser beam. The laser beam is instantly evaporated by irradiation of the laser beam. A cut surface treatment apparatus for a material to be cut, which is irradiated with an energy density.   8. The material to be cut according to claim 7, further comprising means for adjusting the laser light output from the light source to the energy density at which the irradiated portion of the cut surface instantaneously evaporates by irradiation of the laser light. Cutting surface processing equipment.   The cutting surface processing apparatus for a material to be cut according to claim 7, further comprising a scanning unit that scans the laser light relative to the material to be cut in the longitudinal direction of the cutting surface.   The cut surface treatment apparatus for a material to be cut according to claim 7, wherein a pulse width of the laser beam is 100 picoseconds or less.   8. A cutting surface processing apparatus for a cutting material according to claim 7, further comprising means for sucking powder generated by irradiating the cutting material with the laser beam and partially evaporating the cutting material. .   The cut surface treatment apparatus for a cut material according to claim 7, further comprising a heating unit that preheats the cut material before the laser beam is irradiated onto the cut material.   13. The cut surface of the material to be cut according to claim 12, wherein the heating means preheats the material to be cut with a preheating laser beam having a wavelength that is an absorption band wavelength of the material to be cut. Processing equipment.   The cut surface treatment apparatus for a material to be cut according to claim 12 or 13, wherein the portion of the cut surface that has reached a substantially maximum temperature by the preliminary heating is irradiated with the laser beam to evaporate.   8. The cut surface processing of a workpiece according to claim 7, further comprising laser beam moving means capable of adjusting the evaporation region of the workpiece by repeatedly moving the laser beam in a direction intersecting the scanning direction. apparatus.   The cut surface treatment apparatus for a cut material according to claim 7, wherein the laser beam is irradiated perpendicularly to a surface of the cut material.   The cutting surface processing of the cut material according to claim 7, further comprising a cutting means for cutting the cut material by moving a cutting position together with the scan of the laser light prior to the scan of the laser light. apparatus.

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