CN107855667A - For cutting the laser cutting device of FPC - Google Patents
For cutting the laser cutting device of FPC Download PDFInfo
- Publication number
- CN107855667A CN107855667A CN201711229361.3A CN201711229361A CN107855667A CN 107855667 A CN107855667 A CN 107855667A CN 201711229361 A CN201711229361 A CN 201711229361A CN 107855667 A CN107855667 A CN 107855667A
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- China
- Prior art keywords
- laser
- cutting
- travel mechanism
- cutting platform
- axis
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
A kind of laser cutting device for being used to cut FPC, it includes Cutting platform, laser module, mobile device and control unit.The Cutting platform is used for support flexible PCB to be cut, and the laser module is used to send laser and cuts flexible PCB.Cutting platform or laser module carry out position adjustment under mobile device drive, so as to utilize the shape for being cut by laser function by flexible PCB and cutting out setting under the control of the control unit.Present invention take advantage of that laser cutting possessed is quick, high-precision feature, to solve the problems, such as that the Operational preparation cycle is long in conventional flex circuits plate manufacturing process, cost is high.
Description
Technical field
The application is related to flexible PCB processing and manufacturing equipment, and in particular to a kind of laser for being used to cut FPC
Cutting equipment.
Background technology
Flexible printed circuit board FPC (Flexible Printed Circuit Board) is " the glamour female in circuit board
King ".Compared with traditional rigid printed board (PCB), FPC Distribution densities are high, in light weight, thickness of thin, can with free bend,
Winding, fold, any arrangement is required according to space layout, and arbitrarily moved and flexible in three dimensions, so as to reach component
Assemble the integration connected with wire.
Processing method traditional FPC, it is to use mold, is realized by the machining mode of mechanical stamping to FPC's
Cut out.This mode Operational preparation cycle is long, cost is high, but with the quick expansion of FPC applications, output value more and more higher,
Traditional processing method is caused to be not enough to support its cycle and required precision, it would therefore be highly desirable to provide a kind of new processing and manufacturing side
Formula substitutes traditional processing means.
The content of the invention
The application provides a kind of new laser cutting device for being used to cut FPC.
According to the one side of the application, a kind of laser cutting for being used to cut FPC is provided in a kind of embodiment and set
It is standby, including：
Frame, for playing a supportive role；
Cutting platform, the flexible PCB to be cut for support；
Laser module, for sending laser and cutting flexible PCB；
Mobile device, in the mobile device, the mobile device drives cutting for Cutting platform or the laser module installation
Platform or laser module movement, flexible PCB to be cut out to the shape of setting；
And control unit, for controlling the movement of mobile device and the operation of laser module.
As the further improvement of the laser cutting device, the mobile device includes X-axis travel mechanism, Y-axis moves
Orthogonal two in mechanism and Z axis travel mechanism, the X-axis travel mechanism and Y-axis moving mechanism difference output level direction
Motion on individual direction, the Z axis travel mechanism export the motion on vertical direction, and the Cutting platform or laser module are in X
Moved in the horizontal direction under axle travel mechanism and Y-axis moving mechanism driving；The Cutting platform or laser module are in Z axis moving machine
Move in vertical direction under structure driving, sent flexible PCB is adjusted into laser module on the focal plane of laser.
As the further improvement of the laser cutting device, the laser module fixed setting, the Cutting platform peace
Fill on the mobile device, and the Cutting platform is located at the lower section of the laser emitting mouth of laser module, the mobile device driving
Cutting platform realizes the movement in tri- directions of XYZ.
As the further improvement of the laser cutting device, the Z axis travel mechanism include electric rotating machine, screw mandrel, under
Voussoir, upper voussoir and the connecting plate for being connected with Cutting platform, the output shaft of the electric rotating machine are fixedly connected with screw mandrel, institute
State lower wedge block and form feed screw nut pair with screw mandrel, the lower wedge block has the first inclined-plane set along lower wedge block moving direction, institute
State voussoir have with the first inclined-plane coordinate the second inclined-plane, the upper voussoir be defined as can in the vertical direction motion,
The rectilinear movement for being converted into lower wedge block of the screw mandrel, and upper voussoir raising and lowering is driven by the first inclined-plane, it is described
The motion of upper voussoir drives connecting plate motion.
As the further improvement of the laser cutting device, the Z axis travel mechanism also includes at least one cylinder, institute
The motion for stating voussoir drives cylinder moving, and the cylinder drives connecting plate motion.
As the further improvement of the laser cutting device, the X-axis travel mechanism includes the first linear electric machine, described
Y-axis moving mechanism is arranged in X-axis travel mechanism, and the movement in X-direction, institute are realized by first linear electric motor
Stating Y-axis moving mechanism includes the second linear electric machine, and the Z axis travel mechanism is arranged in Y-axis moving mechanism, and by described second
Linear electric motor realizes the movement in Y direction.
As the further improvement of the laser cutting device, the laser module includes laser, laser condensing lens, swashed
Light beam expanding lens, laser scanning galvanometer and laser telecentric scan lens, the laser that the laser is sent pass through Laser Focusing successively
It is irradiated to after mirror, laser beam expanding lens, laser scanning galvanometer and the effect of laser telecentric scan lens on flexible PCB to be cut.
As the further improvement of the laser cutting device, in addition to CCD positioning units, it is arranged on laser scanning and shaken
The side of mirror, for being positioned.
As the further improvement of the laser cutting device, the Cutting platform includes vacuum extractor and sucker, institute
Stating sucker includes sucker disk seat, cellular board and honeycomb panel seat, and the sucker disk seat has a cavity, the bottom wall of the cavity have fin and
Cavity is divided into different gas circuits by the air entry of insertion, the fin, and the cellular board seat tool has installation cavity, the installation cavity
Bottom has multiple blow vents, and the cellular board is arranged in installation cavity sealed aroundly, and the cellular board has multiple suckers
Mouthful, the sucker mouth is communicated with the blow vent of honeycomb panel seat, and the honeycomb panel seat is arranged in the cavity of sucker disk seat, and the honeybee
Nest panel seat bottom outer wall separates to form gap with the fin in cavity, and the air entry of the cavity connects with vacuum extractor.
As the further improvement of the laser cutting device, the fin is independently arranged and substantially across to be multiple
Projection.
According to the laser cutting device of above-described embodiment, it includes Cutting platform, laser module, mobile device and control
Unit.The Cutting platform is used for support flexible PCB to be cut, and the laser module is used to send laser and cuts flexible electrical
Road plate.Cutting platform or laser module carry out position adjustment under mobile device drive, so as to sharp under the control of the control unit
Flexible PCB is cut out to the shape of setting with laser cutting function.Present invention take advantage of that laser cutting possessed it is quick,
High-precision feature, to solve the problems, such as that the Operational preparation cycle is long in conventional flex circuits plate manufacturing process, cost is high.
Brief description of the drawings
Fig. 1 is the structural representation of laser cutting device in a kind of embodiment of the application；
Fig. 2 is the side view of embodiment illustrated in fig. 1；
Fig. 3 is a kind of structural representation of embodiment ZhongZZhou travel mechanisms of the application；
Fig. 4 is the structural representation of Cutting platform in a kind of embodiment of the application；
Fig. 5 is profile of the embodiment illustrated in fig. 4 along A-A cuttings；
Fig. 6 is the structural representation of cellular board in a kind of embodiment of the application；
Fig. 7 is the structural representation of honeycomb panel seat in a kind of embodiment of the application；
Fig. 8 is the structural representation of sucker disk seat in a kind of embodiment of the application；
Fig. 9 is the structural representation of connection ring in a kind of embodiment of the application.
Embodiment
The present invention is described in further detail below by embodiment combination accompanying drawing.Wherein different embodiments
Middle similar component employs associated similar element numbers.In the following embodiments, many detailed descriptions be in order to
The application is better understood.However, those skilled in the art can be without lifting an eyebrow recognize, which part feature
It is dispensed, or can be substituted by other elements, material, method in varied situations.In some cases, this Shen
Certain operations that please be related are not shown in the description or description, and this is the core in order to avoid the application by mistake
More descriptions are flooded, and to those skilled in the art, be described in detail these associative operations be not it is necessary, they
The general technology knowledge of description and this area in specification can completely understand associative operation.
In addition, feature described in this description, operation or feature can combine to form respectively in any suitable way
Kind embodiment.Meanwhile each step in method description or action can also can be aobvious and easy according to those skilled in the art institute
The mode carry out order exchange or adjustment seen.Therefore, the various orders in specification and drawings are intended merely to clearly describe a certain
Individual embodiment, necessary order is not meant to be, wherein some sequentially must comply with unless otherwise indicated.
It is herein part institute serialization number itself, such as " first ", " second " etc., is only used for distinguishing described object,
Without any order or art-recognized meanings.And " connection ", " connection " described in the application, unless otherwise instructed, include directly and
It is indirectly connected with (connection).
Embodiment one：
The present embodiment provides a kind of laser cutting device for being used to cut FPC, such as can be a kind of ultraviolet sharp
Light cutting equipment.
It refer to Fig. 1 and 2, in a kind of embodiment, the laser cutting device includes frame 100, and Cutting platform 200 is mobile
Device 300, laser module 400 and control unit (not shown in figure, but have no effect on the understanding of those skilled in the art).
The frame 100 is used to play a supportive role and must part for installing some.The Cutting platform 200 is used for support
Flexible PCB to be cut, so that laser module 400 can be cut to flexible PCB.The laser module 400 is used for
Send laser and cut flexible PCB.Cutting platform 200 or laser module 400 are arranged in mobile device 300, movement dress
Put 300 drive Cutting platforms 200 or laser module 400 moves, so as under the control of the control unit using being cut by laser function
Flexible PCB is cut out to the shape of setting.
Present invention take advantage of that laser cutting possessed is quick, high-precision feature, to solve traditional moulds punching press it
The problem of insufficient, realize convenient, high-precision processing.And the processing mode can adapt to multiple material processing, and add
Work process cleans, environmental protection, machined object neat in edge, impulse- free robustness, without following process.
The laser cutting device can be such that laser module 400 fixes based on the motion of Cutting platform 200, can also make to cut
Cut platform 200 fix and with laser module 400 motion based on.
Further, it refer to Fig. 1 and 2, in a kind of embodiment, the mobile device 300 includes Z axis travel mechanism 310, Y
Axle travel mechanism 320 and X-axis travel mechanism 330.
X-axis travel mechanism 330 and Y-axis moving mechanism 320 are distinguished in output level direction in orthogonal both direction
Motion, Z axis travel mechanism 310 export vertical direction on motion, that is, form a mobile device that can cover XYZ coordinate
300。
The Cutting platform 200 or laser module 400 are in the case where X-axis travel mechanism 330 and Y-axis moving mechanism 320 drive in water
Square to movement.The Cutting platform 200 or laser module 400 move in the case where Z axis travel mechanism 310 drives in vertical direction, use
Sent so that flexible PCB is adjusted into laser module 400 on the focal plane of laser, ensure the effect of laser cutting.
Certainly, in some other embodiment, mobile device 300 can according to the demand of motion, only export some or
Motion in both direction.
In cutting process, at least one moves in laser module 400 and Cutting platform 200.It refer to Fig. 1 and 2,
In a kind of embodiment, the laser module 400 is fixedly installed, and the Cutting platform 200 is arranged in mobile device 300, and is cut flat
Platform 200 is located at the lower section of the laser emitting mouth of laser module 400, and the mobile device 300 driving Cutting platform 200 realizes XYZ tri-
The movement in individual direction.
Using Cutting platform 200 motion by the way of structure it is more simple, without consider laser module 400 move when its cable
It is caused to follow problem, it can also avoid each part in laser module 400 that relative displacement occurs during exercise, influence to be cut by laser
Effect.
Fig. 3, a kind of embodiment are refer to, the Z axis travel mechanism 310 includes electric rotating machine 311, screw mandrel 312, lower wedge block
313rd, upper voussoir 314 and the connecting plate 315 for being connected with Cutting platform 200.
The output shaft of the electric rotating machine 311 is fixedly connected with screw mandrel 312, such as drives screw mandrel 312 to do by shaft coupling 318
Rotary motion.The lower wedge block 313 forms feed screw nut pair with screw mandrel 312, and the lower wedge block 313 has along the side of movement of lower wedge block 313
To the first inclined-plane of setting, voussoir 314 has the second inclined-plane coordinated with the first inclined-plane on this.Voussoir 314 is defined as on this
Can in the vertical direction motion, such as be defined by guide frame.The rotation of the screw mandrel 312 is converted into lower wedge block
313 rectilinear movement, it can coordinate the motion of lower wedge block 313 that guide rail 317 is set.Lower wedge block 313 drives upper wedge by the first inclined-plane
The raising and lowering of block 314, motion drive connecting plate 315 of voussoir 314 moves on this.
It is mentioned here to refer to that the first inclined-plane is back and forth transported along lower wedge block 313 along the moving direction of lower wedge block 313 shown in Fig. 3
Dynamic direction tilts, so as to using the principle of motion on a slope, ensure that the first inclined-plane can be oblique by second when being moved along a straight line to side
Face or even whole upper voussoir 314 jack up, and the first inclined-plane can put down the second inclined-plane when being moved along a straight line to opposite side.
Further, in a kind of embodiment, the Z axis travel mechanism 310 also includes at least one cylinder 316, voussoir on this
314 motion drives cylinder 316 to move, and the cylinder 316 drives connecting plate 315 to move.
This structure design compared to traditional Z axis structure (such as Z axis is independently hung on crossbeam), space availability ratio is higher,
Cost is lower, more simple and convenient, functionally can more accurately control the intensity of variation of Z axis focal length.
Further, refer to Fig. 1, in a kind of embodiment, the X-axis travel mechanism 330 includes the first linear electric machine 321,
The Y-axis moving mechanism 320 is arranged in X-axis travel mechanism 330, and is realized by the driving of the first linear electric machine 321 in X-direction
It is mobile.Y-axis moving mechanism 320 includes the second linear electric machine 331, and Z axis travel mechanism 310 is arranged in Y-axis moving mechanism 320,
And the movement in Y direction is realized by the driving of the second linear electric machine 331, so as to realize the movement in tri- directions of XYZ.
On the other hand, please continue to refer to Fig. 1 and 2, in a kind of embodiment, the laser module 400 includes laser 410, swashed
Light focus lamp 420, laser beam expanding lens 430, laser scanning galvanometer 440 and laser telecentric scan lens 450, the laser 410 are sent out
The laser gone out passes through laser condensing lens 420, laser beam expanding lens 430, laser scanning galvanometer 440 and laser telecentric scan lens successively
It is irradiated to after 450 effects on flexible PCB to be cut.
In actual processing production, control unit sends to laser 410 and instructed, and sends laser beam, is gathered by laser
Burnt mirror 420, after focusing, focus on light beam is formed, then pass through laser beam expanding lens 430, the diameter and reduction laser beam of expanded beam
The angle of divergence after, then by laser scanning galvanometer 440 processing after, after laser telecentric scan lens 450, focus on sheet material
On.
Laser 410 can be all solid state laser, minimum spot size 20um, optical maser wavelength 355nm, and laser is defeated
More than 10W will be reached by going out power, the laser that laser 410 is sent will by laser beam expanding lens 430, laser scanning galvanometer 440, swash
Light telecentric scan lens 450 can be just acted on processing sheet material.Scanning galvanometer is used to control laser enterprising on sheet fabrication surface
The track scanning of row cutting pattern.
On the other hand, it refer to Fig. 1 and 2, in a kind of embodiment, the laser cutting device also includes CCD positioning units
500, it is arranged on the side of laser scanning galvanometer 440, for being positioned.CCD positioning units 500 can gather the height of processed goods
Clear image is transferred directly to control unit, to improve locating effect, and then ensures the precision of laser cutting.
It refer to Figure 4 and 5, in a kind of embodiment, the Cutting platform 200 is fixed to be cut soft by the way of vacuum suction
Property circuit board.
The Cutting platform 200 includes vacuum extractor and (such as vavuum pump, not shown in figure, but has no effect on this area skill
The understanding of art personnel) and sucker.The vacuum extractor is used to provide negative pressure source.The sucker is used to adsorb flexible circuit to be cut
Plate.
Fig. 4-8 are refer to, the sucker includes sucker disk seat 210, honeycomb panel seat 220 and cellular board 230, and the sucker disk seat 210 has
There is cavity 211, the bottom wall of the cavity 211 has the air entry 212 of insertion, and the honeycomb panel seat 220 has installation cavity 221, the peace
Behave affectedly 221 bottom has multiple blow vents 222.The cellular board 230 is arranged in installation cavity 221 sealed aroundly, the honeycomb
Plate 230 has multiple sucker mouths 232, and the sucker mouth 232 communicates with the blow vent 222 of honeycomb panel seat 220, the honeycomb panel seat 220
In the cavity 211 of sucker disk seat 210, the air entry 212 of the cavity 211 connects with vacuum extractor.
When vacuum extractor works, suction cup interior can produce suction, make the FPC being placed on cellular board 230
(FPC plates) can be adsorbed completely, enable its finished surface smooth, and laser is consistent to the heating degree on its surface, makes processing
Effect is more perfect.
The sucker disk seat 210 plays a part of forming a connecting link in total device, is connected to honeycomb panel seat 220 and takes out true
Empty device, when vacuum extractor works, absorption affinity is produced, the inside of sucker disk seat 210 can form one air-flow, act on cellular board
On seat 220, so as to reach adsorption effect.
Honeycomb panel seat 220 can be made of aluminum alloy materials, and close aperture can ensure the permeability of absorption, middle peace
221 are behave affectedly for ensureing that what cellular board 230 can be smooth, firm is placed on honeycomb panel seat 220.Honeycomb panel seat 220 and sucker
It can be fixed between seat 210 by screw.
Cellular board 230 can be made of makrolon material, abbreviation PC cellular boards.PC cellular boards physical and mechanical properties is good,
Especially excellent impact resistance, stretching, bending, compressive strength are high.
The setting of blow vent 222 on honeycomb panel seat 220, it can make it that suction force is not when vacuum extractor vacuumizes
The part of cellular board 230 can be confined to, but cellular board 230 is distributed to everywhere by blow vent 222, ensures cellular board 230
The suction of each sucker mouth 232 can be more uniformly distributed.
Further, in certain embodiments, blow vent 222 and the stagger setting of sucker mouth 232 can also be made, make a ventilation
Mouth 222 can communicate with more than two sucker mouths 232, make the suction force on sucker mouth 232 more uniform.
Fig. 6 is refer to, the cellular board 230 has a plate body 232, and the sucker mouth 232 is substantially in regular hexagon, and the sucker mouth
232 are arranged on plate body 232 in arrays., can be smooth, firm after the structure of the honeycombed make it that FPC is put up
It is adsorbed, have the function that fixed.
It refer to Fig. 7, in a kind of embodiment, the blow vent 222 can also be arranged in the bottom wall of installation cavity 221 in arrays
On.
On the other hand, Fig. 5 and 8 are refer to, the bottom wall of the cavity 211 of sucker disk seat 210 has fin 213, and the fin 213 will be recessed
Chamber 211 is divided into different gas circuits, so that the bottom outer wall of honeycomb panel seat 220 is separated with the fin 213 in cavity 211 between being formed
Gap.These gas circuits can cause the suction force of vacuum extractor to be distributed to cavity 211 everywhere, so as to the shape on cellular board 230
Into the absorption affinity being more uniformly distributed.
It refer to Fig. 8, in a kind of embodiment, the fin 213 is independently arranged and the substantially projection of across to be multiple.Should
Projection can also be arranged on the bottom wall of cavity 211 in arrays.
Further, it refer to Fig. 8 and 9, in a kind of embodiment, in addition to the connection ring 240 into flange shape, the connection
Ring 240 is fixed in the cavity 211 of sucker disk seat 210, and its narrower one end 241 is stretched out from air entry 212, the vacuum extractor
The part that air entry 212 is stretched out with connection ring 240 connects.
The connection ring 240 can be made of the little higher aluminum alloy materials of hardness level.Connection ring 240 is from sucker disk seat
210 above toward trapping, and is pinned with screw from two hole positions of its ring flange side 242 toward sucker disk seat 210, below a section connection
Pvc pipe, pvc pipe is set preferably to be linked together with sucker disk seat 210.Pvc pipe is used to connect vacuum extractor.
Fig. 1 is refer to, motion control card, driver, cooling-water machine and circuit control unit can be housed below the frame 100
Point；Frame 100 has marble platform 110 and raised support arm 120, and laser 410, laser is placed above in support arm 120
Focus lamp 420, laser beam expanding lens 430, galvanometer and CCD fixed plates, laser scanning galvanometer 440 and laser telecentric scan lens 450
Sequentially connect, telecentric scan lens are connected in below laser scanning galvanometer 440.CCD locating modules are fixed on the left of galvanometer.Frame
Marble platform 110 on 100 is connected with X/Y axis linear motors 321,331, Z axis travel mechanism 310 and Cutting platform from bottom to top
200。
The process of equipment shown in the present embodiment is summarized as follows：
FPC to be processed is kept flat on Cutting platform, and determines that its position and control are adjusted by control unit
The height of whole Cutting platform so that laser focal reaches the height that can swash sheet material, then the characteristic according to FPC, graphics processing
And cutting mode realizes cutting processing by control unit.Z axis travel mechanism can cut according to parameter set in advance
The constantly height of the Cutting platform of adjust automatically FPC plates in process, to cause the incised layer of FPC plates to be located at Jiao of laser
In plane, so with the progress of cutting, the focal plane of laser can little by little from the lower surface of FPC plates be moved to upper surface until
Monoblock FPC plates are all cut.
The present apparatus can solve the deficiency of traditional moulds punching press, realize convenient, high-precision processing, additionally it is possible to which raising is set
Standby automaticity, operating cost is reduced, improves operating efficiency, while can adapt to multiple material processing, and it is processed
Cheng Qingjie, environmental protection, machined object neat in edge, impulse- free robustness, without following process.
Use above specific case is illustrated to the present invention, is only intended to help and is understood the present invention, not limiting
The system present invention.For those skilled in the art, according to the thought of the present invention, can also make some simple
Deduce, deform or replace.
Claims (10)
- A kind of 1. laser cutting device for being used to cut FPC, it is characterised in that including：Frame, for playing a supportive role；Cutting platform, the flexible PCB to be cut for support；Laser module, for sending laser and cutting flexible PCB；Mobile device, in the mobile device, the mobile device drives Cutting platform for Cutting platform or the laser module installation Or laser module movement, flexible PCB to be cut out to the shape of setting；And control unit, for controlling the movement of mobile device and the operation of laser module.
- 2. laser cutting device as claimed in claim 1, it is characterised in that the mobile device includes X-axis travel mechanism, Y Mutually hung down in axle travel mechanism and Z axis travel mechanism, the X-axis travel mechanism and Y-axis moving mechanism difference output level direction Motion in straight both direction, the Z axis travel mechanism export the motion on vertical direction, the Cutting platform or laser group Part moves in the horizontal direction under X-axis travel mechanism and Y-axis moving mechanism driving；The Cutting platform or laser module are in Z axis Moved under travel mechanism's driving in vertical direction, flexible PCB is adjusted into the focal plane that laser module sends laser On.
- 3. laser cutting device as claimed in claim 2, it is characterised in that the laser module fixed setting, the cutting On the mobile device, and the Cutting platform is located at the lower section of the laser emitting mouth of laser module to stage+module, the mobile dress Put the movement that driving Cutting platform realizes tri- directions of XYZ.
- 4. laser cutting device as claimed in claim 2, it is characterised in that the Z axis travel mechanism includes electric rotating machine, silk Bar, lower wedge block, upper voussoir and the connecting plate for being connected with Cutting platform, the output shaft of the electric rotating machine is fixed with screw mandrel to be connected Connect, the lower wedge block forms feed screw nut pair with screw mandrel, and the lower wedge block has first set along lower wedge block moving direction oblique Face, the upper voussoir have the second inclined-plane coordinated with the first inclined-plane, and the upper voussoir is defined as being capable of in the vertical direction Motion, the rectilinear movement for being converted into lower wedge block of the screw mandrel, and upper voussoir raising and lowering is driven by the first inclined-plane, The motion of the upper voussoir drives connecting plate motion.
- 5. laser cutting device as claimed in claim 4, it is characterised in that the Z axis travel mechanism also includes at least one Cylinder, the motion of the upper voussoir drive cylinder moving, and the cylinder drives connecting plate motion.
- 6. laser cutting device as claimed in claim 4, it is characterised in that the X-axis travel mechanism includes the first linear electricity Machine, the Y-axis moving mechanism is arranged in X-axis travel mechanism, and is realized by first linear electric motor in X-direction Mobile, the Y-axis moving mechanism includes the second linear electric machine, and the Z axis travel mechanism is arranged in Y-axis moving mechanism, and by Second linear electric motor realizes the movement in Y direction.
- 7. laser cutting device as claimed in claim 3, it is characterised in that the laser module includes laser, laser gathers Jiao Jing, laser beam expanding lens, laser scanning galvanometer and laser telecentric scan lens, the laser that the laser is sent is successively through too drastic Flexible circuit to be cut is irradiated to after light focus lamp, laser beam expanding lens, laser scanning galvanometer and the effect of laser telecentric scan lens On plate.
- 8. laser cutting device as claimed in claim 7, it is characterised in that also including CCD positioning units, it is arranged on laser The side of scanning galvanometer, for being positioned.
- 9. the laser cutting device as described in claim any one of 1-8, it is characterised in that the Cutting platform includes vacuumizing Device and sucker, the sucker include sucker disk seat, cellular board and honeycomb panel seat, and the sucker disk seat has cavity, the cavity Bottom wall has fin and the air entry of insertion, and cavity is divided into different gas circuits by the fin, and the cellular board seat tool has installation Chamber, the bottom of the installation cavity have multiple blow vents, and the cellular board is arranged in installation cavity sealed aroundly, the honeycomb Plate has multiple sucker mouths, and the sucker mouth communicates with the blow vent of honeycomb panel seat, and the honeycomb panel seat is arranged on sucker disk seat In cavity, and the honeycomb panel seat bottom outer wall separates to form gap with the fin in cavity, and the air entry of the cavity is with taking out Vacuum plant connects.
- 10. laser cutting device as claimed in claim 9, it is characterised in that the fin is independently arranged and substantially to be multiple The projection of across.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711229361.3A CN107855667A (en) | 2017-11-29 | 2017-11-29 | For cutting the laser cutting device of FPC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711229361.3A CN107855667A (en) | 2017-11-29 | 2017-11-29 | For cutting the laser cutting device of FPC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107855667A true CN107855667A (en) | 2018-03-30 |
Family
ID=61704608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711229361.3A Pending CN107855667A (en) | 2017-11-29 | 2017-11-29 | For cutting the laser cutting device of FPC |
Country Status (1)
| Country | Link |
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| CN (1) | CN107855667A (en) |
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| CN109926736A (en) * | 2019-04-10 | 2019-06-25 | 英诺激光科技股份有限公司 | A kind of device and method using high frequency nanosecond optical-fiber laser cutting battery pole piece |
| CN110270766A (en) * | 2019-07-04 | 2019-09-24 | 大族激光科技产业集团股份有限公司 | Laser cutting device |
| CN112388151A (en) * | 2019-08-16 | 2021-02-23 | 阳程科技股份有限公司 | Method for pre-separating flexible display and additional circuit board |
| CN113815025A (en) * | 2020-06-18 | 2021-12-21 | 国奥激光智能设备(深圳)有限公司 | Coil stock cutting device and laser cutting system |
| CN113894434A (en) * | 2020-06-18 | 2022-01-07 | 国奥激光智能设备(深圳)有限公司 | Laser cutting system |
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| CN109926736A (en) * | 2019-04-10 | 2019-06-25 | 英诺激光科技股份有限公司 | A kind of device and method using high frequency nanosecond optical-fiber laser cutting battery pole piece |
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| CN112388151A (en) * | 2019-08-16 | 2021-02-23 | 阳程科技股份有限公司 | Method for pre-separating flexible display and additional circuit board |
| CN112388151B (en) * | 2019-08-16 | 2022-08-02 | 阳程科技股份有限公司 | Method for pre-separating flexible display and additional circuit board |
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| CN113894434B (en) * | 2020-06-18 | 2024-06-21 | 国奥显示与半导体技术(深圳)有限公司 | Laser cutting system |
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