CN103489989B - 直插式led灯珠封装工艺的固晶工序 - Google Patents
直插式led灯珠封装工艺的固晶工序 Download PDFInfo
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- CN103489989B CN103489989B CN201310331161.4A CN201310331161A CN103489989B CN 103489989 B CN103489989 B CN 103489989B CN 201310331161 A CN201310331161 A CN 201310331161A CN 103489989 B CN103489989 B CN 103489989B
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- 239000011324 bead Substances 0.000 title claims abstract description 12
- 238000003780 insertion Methods 0.000 title claims abstract description 9
- 230000037431 insertion Effects 0.000 title claims abstract description 9
- 238000012536 packaging technology Methods 0.000 title claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 61
- 238000007599 discharging Methods 0.000 claims abstract description 40
- 238000003754 machining Methods 0.000 claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims abstract description 11
- 239000004568 cement Substances 0.000 claims abstract description 5
- 230000033001 locomotion Effects 0.000 claims description 8
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- 230000005540 biological transmission Effects 0.000 description 9
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- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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Application Number | Priority Date | Filing Date | Title |
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CN201310331161.4A CN103489989B (zh) | 2013-07-31 | 2013-07-31 | 直插式led灯珠封装工艺的固晶工序 |
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CN201310331161.4A CN103489989B (zh) | 2013-07-31 | 2013-07-31 | 直插式led灯珠封装工艺的固晶工序 |
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CN103489989A CN103489989A (zh) | 2014-01-01 |
CN103489989B true CN103489989B (zh) | 2016-01-20 |
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CN201310331161.4A Expired - Fee Related CN103489989B (zh) | 2013-07-31 | 2013-07-31 | 直插式led灯珠封装工艺的固晶工序 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104185133B (zh) * | 2014-08-09 | 2017-09-22 | 歌尔股份有限公司 | 弹片组装装置 |
CN104319335B (zh) * | 2014-10-22 | 2017-01-11 | 苏州大学 | 一种全自动二极管封装机构及其使用方法 |
CN104780715A (zh) * | 2015-04-17 | 2015-07-15 | 深圳市炫硕光电科技有限公司 | Led灯珠供料装置 |
CN106626114B (zh) * | 2016-12-29 | 2018-08-31 | 济南兰洁生物技术有限公司 | 一种棒料连续推送机构 |
CN107785294B (zh) * | 2017-10-11 | 2020-02-14 | 厦门市迅光电子有限公司 | 全自动固晶机 |
CN111319349B (zh) * | 2020-04-13 | 2024-05-07 | 东江精创注塑(惠州)有限公司 | 产品印刷组装一体机及印刷组装方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101673795A (zh) * | 2009-07-20 | 2010-03-17 | 英展有限公司 | 双排轨道送料式供垂直led引线框架特定送料系统 |
CN101976714A (zh) * | 2010-09-13 | 2011-02-16 | 深圳市因沃客科技有限公司 | 一种led焊线机的上下料装置 |
CN202292243U (zh) * | 2011-07-18 | 2012-07-04 | 广州市精伦机电设备有限公司 | 一种led焊线机或固晶机的上下料装置 |
CN202423244U (zh) * | 2012-01-10 | 2012-09-05 | 先进光电器材(深圳)有限公司 | 送料机构 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101673795A (zh) * | 2009-07-20 | 2010-03-17 | 英展有限公司 | 双排轨道送料式供垂直led引线框架特定送料系统 |
CN101976714A (zh) * | 2010-09-13 | 2011-02-16 | 深圳市因沃客科技有限公司 | 一种led焊线机的上下料装置 |
CN202292243U (zh) * | 2011-07-18 | 2012-07-04 | 广州市精伦机电设备有限公司 | 一种led焊线机或固晶机的上下料装置 |
CN202423244U (zh) * | 2012-01-10 | 2012-09-05 | 先进光电器材(深圳)有限公司 | 送料机构 |
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Effective date of registration: 20151210 Address after: 325204 Ruian City, Zhejiang Province, Times Square, A building, room, room 2905 Applicant after: Wan Linhua Address before: 325200 Zhejiang city of Wenzhou province Ruian City Cao Village Song ao Village Applicant before: Rui'an City Mingguang City lighting Co. Ltd. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
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CB03 | Change of inventor or designer information |
Inventor after: Ma Huabo Inventor before: Lin Guoshi |
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TR01 | Transfer of patent right |
Effective date of registration: 20170302 Address after: 528478 Changan Road, Guangdong city of Zhongshan province Henglan Town No. 107 two floor first card Patentee after: Zhongshan Yu Ming Photoelectric Technology Co., Ltd. Address before: 325204 Ruian City, Zhejiang Province, Times Square, A building, room, room 2905 Patentee before: Wan Linhua |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160120 Termination date: 20190731 |
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CF01 | Termination of patent right due to non-payment of annual fee |