CN103460361B - 在切割胶带上施加有底部填料膜的预切割的晶片 - Google Patents
在切割胶带上施加有底部填料膜的预切割的晶片 Download PDFInfo
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- CN103460361B CN103460361B CN201280007466.3A CN201280007466A CN103460361B CN 103460361 B CN103460361 B CN 103460361B CN 201280007466 A CN201280007466 A CN 201280007466A CN 103460361 B CN103460361 B CN 103460361B
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- bottom filling
- wafer
- semiconductor wafer
- cutting
- thinning
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Abstract
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Claims (2)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161438341P | 2011-02-01 | 2011-02-01 | |
US61/438,341 | 2011-02-01 | ||
PCT/US2012/023068 WO2012106223A2 (en) | 2011-02-01 | 2012-01-30 | Pre-cut wafer applied underfill film on dicing tape |
Publications (2)
Publication Number | Publication Date |
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CN103460361A CN103460361A (zh) | 2013-12-18 |
CN103460361B true CN103460361B (zh) | 2016-11-30 |
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1484290A (zh) * | 2002-07-12 | 2004-03-24 | 三星电子株式会社 | 切割带贴合单元和具有切割带贴合单元的序列式系统 |
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1484290A (zh) * | 2002-07-12 | 2004-03-24 | 三星电子株式会社 | 切割带贴合单元和具有切割带贴合单元的序列式系统 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20141119 Address after: Dusseldorf Applicant after: HENKEL IP & HOLDING GmbH Address before: American Connecticut Applicant before: Henkel American Intellectual Property LLC Effective date of registration: 20141119 Address after: American Connecticut Applicant after: Henkel American Intellectual Property LLC Address before: American Connecticut Applicant before: Henkel Corp. |
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GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220810 Address after: Dusseldorf Patentee after: HENKEL AG & Co.KGaA Address before: Dusseldorf Patentee before: HENKEL IP & HOLDING GmbH |