CN103451689B - 铜系材料的制造方法及由该方法制造的铜系材料 - Google Patents
铜系材料的制造方法及由该方法制造的铜系材料 Download PDFInfo
- Publication number
- CN103451689B CN103451689B CN201310193506.4A CN201310193506A CN103451689B CN 103451689 B CN103451689 B CN 103451689B CN 201310193506 A CN201310193506 A CN 201310193506A CN 103451689 B CN103451689 B CN 103451689B
- Authority
- CN
- China
- Prior art keywords
- copper
- oxygen
- system material
- layer
- copper system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/005—Jewels; Clockworks; Coins
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12785—Group IIB metal-base component
- Y10T428/12792—Zn-base component
- Y10T428/12799—Next to Fe-base component [e.g., galvanized]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
Abstract
Description
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012125861A JP5776630B2 (ja) | 2012-06-01 | 2012-06-01 | 銅系材料及びその製造方法 |
JP2012-125861 | 2012-06-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103451689A CN103451689A (zh) | 2013-12-18 |
CN103451689B true CN103451689B (zh) | 2017-08-11 |
Family
ID=49670609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310193506.4A Active CN103451689B (zh) | 2012-06-01 | 2013-05-23 | 铜系材料的制造方法及由该方法制造的铜系材料 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9884467B2 (zh) |
JP (1) | JP5776630B2 (zh) |
CN (1) | CN103451689B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5742859B2 (ja) * | 2013-01-30 | 2015-07-01 | 日立金属株式会社 | 高速伝送ケーブル用導体、及びその製造方法、並びに高速伝送ケーブル |
JP6127941B2 (ja) * | 2013-11-29 | 2017-05-17 | 日立金属株式会社 | はんだ接合材料及びその製造方法 |
JP6123655B2 (ja) * | 2013-11-29 | 2017-05-10 | 日立金属株式会社 | 銅箔及びその製造方法 |
JP6287126B2 (ja) * | 2013-11-29 | 2018-03-07 | 日立金属株式会社 | プリント配線板及びその製造方法 |
JP6172573B2 (ja) * | 2013-11-29 | 2017-08-02 | 日立金属株式会社 | はんだ接合材料とその製造方法、及びはんだ接合用部材、並びに太陽電池モジュール |
JP6020972B2 (ja) * | 2015-06-11 | 2016-11-02 | 日立金属株式会社 | 銅ボンディングワイヤ |
JP6493047B2 (ja) * | 2015-07-13 | 2019-04-03 | 日立金属株式会社 | 銅合金材およびその製造方法 |
CN108884334A (zh) | 2015-10-29 | 2018-11-23 | 电力研究所有限公司 | 用于在金属部件中产生耐腐蚀锌-金属氧化物层的方法 |
CN110234782B (zh) * | 2017-01-31 | 2021-12-17 | Ykk株式会社 | 具有金属表面的物体、其色调处理方法和气相氧化装置 |
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CN1322857A (zh) * | 2001-04-26 | 2001-11-21 | 上海交通大学 | 耐腐蚀耐磨梯度膜 |
CN100365737C (zh) * | 2002-05-17 | 2008-01-30 | 出光兴产株式会社 | 布线材料和使用该材料的布线板 |
CN100518446C (zh) * | 2006-02-01 | 2009-07-22 | 三星电机株式会社 | 用于制造具有嵌入其中的薄膜电容器的印刷电路板的方法 |
CN101864530A (zh) * | 2009-04-17 | 2010-10-20 | 日立电线株式会社 | 低铜合金材料及其制造方法 |
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US3729294A (en) * | 1968-04-10 | 1973-04-24 | Gen Electric | Zinc diffused copper |
JPS55145396A (en) * | 1979-04-27 | 1980-11-12 | Furukawa Circuit Foil | Copper foil for printed circuit and method of fabricating same |
JPS6052539A (ja) * | 1983-08-31 | 1985-03-25 | Kanai Hiroyuki | 複合アモルファス合金およびその製造方法 |
JPS6148572A (ja) * | 1984-08-11 | 1986-03-10 | Nippon Denso Co Ltd | 化成皮膜を有する銅系金属部材 |
JPS6126783A (ja) * | 1984-07-14 | 1986-02-06 | Nippon Denso Co Ltd | 銅系材料表面への化成皮膜形成方法 |
JPS61287932A (ja) * | 1985-06-14 | 1986-12-18 | Bridgestone Corp | ゴム用補強材 |
JPS6240361A (ja) * | 1985-08-13 | 1987-02-21 | Furukawa Electric Co Ltd:The | 耐食性銅系部材の製造法 |
JPS63140435A (ja) * | 1986-12-01 | 1988-06-13 | Victor Co Of Japan Ltd | 情報記録媒体 |
JPS63312996A (ja) * | 1987-06-15 | 1988-12-21 | Seiko Instr & Electronics Ltd | アモルファス合金の電着方法 |
JPH01205065A (ja) * | 1988-02-09 | 1989-08-17 | Furukawa Electric Co Ltd:The | 表面にZnの拡散層を有する銅又は銅合金条の製造法 |
US5709958A (en) | 1992-08-27 | 1998-01-20 | Kabushiki Kaisha Toshiba | Electronic parts |
JP3911643B2 (ja) * | 1995-07-05 | 2007-05-09 | 富士通株式会社 | 埋め込み導電層の形成方法 |
JP3465427B2 (ja) * | 1995-07-28 | 2003-11-10 | ソニー株式会社 | 圧電アクチュエーター及びその製造方法 |
JP2001059198A (ja) | 1999-08-23 | 2001-03-06 | Kobe Steel Ltd | 耐食性に優れたZn−Coめっき金属板とその製造方法 |
US6541137B1 (en) * | 2000-07-31 | 2003-04-01 | Motorola, Inc. | Multi-layer conductor-dielectric oxide structure |
JP2004176082A (ja) | 2002-11-25 | 2004-06-24 | Osaka Gas Co Ltd | 高耐食性部材及びその製造方法 |
KR101016158B1 (ko) * | 2005-01-05 | 2011-02-17 | 신닛테츠 마테리알즈 가부시키가이샤 | 반도체 장치용 본딩 와이어 |
WO2006103966A1 (ja) * | 2005-03-25 | 2006-10-05 | Bridgestone Corporation | In-Ga-Zn-O膜の成膜方法及び太陽電池 |
JP2007047317A (ja) * | 2005-08-08 | 2007-02-22 | Idemitsu Kosan Co Ltd | 薄膜半導体装置及びそれを用いた液晶表示装置 |
AU2007228054B2 (en) | 2006-03-20 | 2011-03-10 | Nippon Steel Corporation | Highly corrosion-resistant hot dip galvanized steel stock |
JP5119465B2 (ja) | 2006-07-19 | 2013-01-16 | 新日鐵住金株式会社 | アモルファス形成能が高い合金及びこれを用いた合金めっき金属材 |
JP2008258555A (ja) * | 2007-03-14 | 2008-10-23 | Hitachi Chem Co Ltd | 薄膜複合材料、薄膜複合材料の製造法及びこの薄膜複合材料を用いた電子部品用材料、電子部品用材料の製造法、電子部品、電子部品の製造法 |
JP2009231309A (ja) * | 2008-03-19 | 2009-10-08 | Hitachi Cable Ltd | プリント配線板用銅箔 |
US8974959B2 (en) * | 2008-07-16 | 2015-03-10 | Uchicago Argonne, Llc | Multi-component intermetallic electrodes for lithium batteries |
JP2010159515A (ja) * | 2009-01-08 | 2010-07-22 | Bridgestone Corp | ゴム物品補強用ブラスめっき鋼線及びゴム物品補強用スチールコード |
JP5671210B2 (ja) | 2009-01-13 | 2015-02-18 | 日本パーカライジング株式会社 | 金属表面処理方法 |
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JP5742859B2 (ja) * | 2013-01-30 | 2015-07-01 | 日立金属株式会社 | 高速伝送ケーブル用導体、及びその製造方法、並びに高速伝送ケーブル |
-
2012
- 2012-06-01 JP JP2012125861A patent/JP5776630B2/ja active Active
-
2013
- 2013-05-23 CN CN201310193506.4A patent/CN103451689B/zh active Active
- 2013-05-29 US US13/904,950 patent/US9884467B2/en active Active
Patent Citations (4)
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CN1322857A (zh) * | 2001-04-26 | 2001-11-21 | 上海交通大学 | 耐腐蚀耐磨梯度膜 |
CN100365737C (zh) * | 2002-05-17 | 2008-01-30 | 出光兴产株式会社 | 布线材料和使用该材料的布线板 |
CN100518446C (zh) * | 2006-02-01 | 2009-07-22 | 三星电机株式会社 | 用于制造具有嵌入其中的薄膜电容器的印刷电路板的方法 |
CN101864530A (zh) * | 2009-04-17 | 2010-10-20 | 日立电线株式会社 | 低铜合金材料及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US9884467B2 (en) | 2018-02-06 |
JP2013249522A (ja) | 2013-12-12 |
CN103451689A (zh) | 2013-12-18 |
JP5776630B2 (ja) | 2015-09-09 |
US20130323532A1 (en) | 2013-12-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: HITACHI METALS, LTD. Free format text: FORMER OWNER: HITACHI CABLE CO., LTD. Effective date: 20140214 |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20140214 Address after: Tokyo, Japan, Japan Applicant after: Hitachi Metals Co., Ltd. Address before: Tokyo, Japan, Japan Applicant before: Hitachi Cable Co., Ltd. |
|
C53 | Correction of patent of invention or patent application | ||
CB03 | Change of inventor or designer information |
Inventor after: Seigi Aoyama Inventor after: Hideyuki Sagawa Inventor after: Jiu Jianheng Inventor after: Keisuke Fujiie Inventor after: Hiromitsu Kuroda Inventor before: Hideyuki Sagawa Inventor before: Seigi Aoyama Inventor before: Jiu Jianheng Inventor before: Keisuke Fujiie Inventor before: Hiromitsu Kuroda |
|
COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: SAGAWA HIDEYUKI AOYAMA SEIGI SUMI TORU FUJITO KEISUKE KURODA HIROMITSU TO: AOYAMA SEIGI SAGAWA HIDEYUKI SUMI TORU FUJITO KEISUKE KURODA HIROMITSU |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |