CN103426883B - 一种可调节电势分布的半导体装置及其制备方法 - Google Patents
一种可调节电势分布的半导体装置及其制备方法 Download PDFInfo
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- CN103426883B CN103426883B CN201210174782.1A CN201210174782A CN103426883B CN 103426883 B CN103426883 B CN 103426883B CN 201210174782 A CN201210174782 A CN 201210174782A CN 103426883 B CN103426883 B CN 103426883B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 102
- 238000002360 preparation method Methods 0.000 title claims description 7
- 239000000463 material Substances 0.000 claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 11
- 238000002161 passivation Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 230000003628 erosive effect Effects 0.000 claims description 6
- 239000012535 impurity Substances 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 230000000903 blocking effect Effects 0.000 abstract description 2
- 238000009826 distribution Methods 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 29
- 239000000377 silicon dioxide Substances 0.000 description 14
- 239000002210 silicon-based material Substances 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 7
- 238000001459 lithography Methods 0.000 description 7
- 239000004411 aluminium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 241000790917 Dioxys <bee> Species 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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Abstract
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CN201210174782.1A CN103426883B (zh) | 2012-05-20 | 2012-05-20 | 一种可调节电势分布的半导体装置及其制备方法 |
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CN201210174782.1A CN103426883B (zh) | 2012-05-20 | 2012-05-20 | 一种可调节电势分布的半导体装置及其制备方法 |
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CN103426883A CN103426883A (zh) | 2013-12-04 |
CN103426883B true CN103426883B (zh) | 2016-08-24 |
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CN201210174782.1A Active CN103426883B (zh) | 2012-05-20 | 2012-05-20 | 一种可调节电势分布的半导体装置及其制备方法 |
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Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103515387B (zh) * | 2012-06-30 | 2017-05-17 | 盛况 | 一种具有可调节电势分布的半导体装置及其制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08172188A (ja) * | 1994-12-19 | 1996-07-02 | Kawasaki Steel Corp | 半導体装置 |
CN1503365A (zh) * | 2002-11-27 | 2004-06-09 | 旺宏电子股份有限公司 | 含有二极管的掩模式只读存储器及其制造方法 |
CN1589087A (zh) * | 2004-07-02 | 2005-03-02 | 北京工业大学 | 用于发光管的抗静电保护电路 |
CN101916768A (zh) * | 2010-05-19 | 2010-12-15 | 武汉华灿光电有限公司 | 高效抗静电氮化镓基发光器件及其制作方法 |
CN102034819A (zh) * | 2009-10-02 | 2011-04-27 | 三洋电机株式会社 | 半导体器件 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011003693A (ja) * | 2009-06-18 | 2011-01-06 | Renesas Electronics Corp | 半導体集積回路装置 |
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2012
- 2012-05-20 CN CN201210174782.1A patent/CN103426883B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08172188A (ja) * | 1994-12-19 | 1996-07-02 | Kawasaki Steel Corp | 半導体装置 |
CN1503365A (zh) * | 2002-11-27 | 2004-06-09 | 旺宏电子股份有限公司 | 含有二极管的掩模式只读存储器及其制造方法 |
CN1589087A (zh) * | 2004-07-02 | 2005-03-02 | 北京工业大学 | 用于发光管的抗静电保护电路 |
CN102034819A (zh) * | 2009-10-02 | 2011-04-27 | 三洋电机株式会社 | 半导体器件 |
CN101916768A (zh) * | 2010-05-19 | 2010-12-15 | 武汉华灿光电有限公司 | 高效抗静电氮化镓基发光器件及其制作方法 |
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