CN103400845B - 影像传感器封装方法 - Google Patents
影像传感器封装方法 Download PDFInfo
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CN103400845B true CN103400845B (zh) | 2016-08-10 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2017036344A1 (zh) * | 2015-08-28 | 2017-03-09 | 苏州晶方半导体科技股份有限公司 | 影像传感器封装结构及其封装方法 |
CN105244360B (zh) * | 2015-10-29 | 2019-02-26 | 苏州晶方半导体科技股份有限公司 | 感光芯片封装结构及其封装方法 |
CN111866323A (zh) | 2019-04-30 | 2020-10-30 | 宁波舜宇光电信息有限公司 | 摄像模组及其感光组件、电子设备和制备方法 |
CN110660893B (zh) * | 2019-09-06 | 2021-08-17 | 深圳市银宝山新科技股份有限公司 | 发光元件封装结构及其制作方法、制作设备 |
CN113611673B (zh) * | 2021-10-11 | 2021-12-21 | 山东汉芯科技有限公司 | 集成布线转接板的新型芯片封装结构 |
CN116884985B (zh) * | 2023-09-08 | 2024-05-28 | 无锡鉴微华芯科技有限公司 | 一种像素探测器的读出像素芯片 |
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CN1971924A (zh) * | 2005-11-24 | 2007-05-30 | 矽格股份有限公司 | 光传感器封装结构 |
CN101075624A (zh) * | 2006-05-18 | 2007-11-21 | 大瀚光电股份有限公司 | 覆晶式取像模块封装结构及其封装方法 |
CN103137635A (zh) * | 2011-11-23 | 2013-06-05 | 同欣电子工业股份有限公司 | 一种影像感测模块封装结构及制造方法 |
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SG152086A1 (en) * | 2007-10-23 | 2009-05-29 | Micron Technology Inc | Packaged semiconductor assemblies and associated systems and methods |
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CN1971924A (zh) * | 2005-11-24 | 2007-05-30 | 矽格股份有限公司 | 光传感器封装结构 |
CN101075624A (zh) * | 2006-05-18 | 2007-11-21 | 大瀚光电股份有限公司 | 覆晶式取像模块封装结构及其封装方法 |
CN103137635A (zh) * | 2011-11-23 | 2013-06-05 | 同欣电子工业股份有限公司 | 一种影像感测模块封装结构及制造方法 |
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Effective date of registration: 20190929 Address after: 226019 Jiangsu city of Nantong province sik Road No. 9 Co-patentee after: Center for technology transfer, Nantong University Patentee after: Nantong University Address before: 226019 Jiangsu Province, Nantong City Chongchuan District sik Road No. 9 Patentee before: Nantong University |
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Effective date of registration: 20201104 Address after: 2 / F, building 11, 988 Zhongchun Road, Minhang District, Shanghai, 201109 Patentee after: Shanghai Aijin Intelligent Technology Co., Ltd Address before: 226019 Jiangsu city of Nantong province sik Road No. 9 Patentee before: NANTONG University Patentee before: Center for technology transfer, Nantong University |