CN113611673B - 集成布线转接板的新型芯片封装结构 - Google Patents
集成布线转接板的新型芯片封装结构 Download PDFInfo
- Publication number
- CN113611673B CN113611673B CN202111179034.8A CN202111179034A CN113611673B CN 113611673 B CN113611673 B CN 113611673B CN 202111179034 A CN202111179034 A CN 202111179034A CN 113611673 B CN113611673 B CN 113611673B
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- chip
- air hole
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- integrated wiring
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 32
- 239000003292 glue Substances 0.000 claims abstract description 30
- 230000005611 electricity Effects 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 63
- 239000000565 sealant Substances 0.000 claims description 22
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000012945 sealing adhesive Substances 0.000 description 7
- 239000000428 dust Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000012858 packaging process Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111179034.8A CN113611673B (zh) | 2021-10-11 | 2021-10-11 | 集成布线转接板的新型芯片封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111179034.8A CN113611673B (zh) | 2021-10-11 | 2021-10-11 | 集成布线转接板的新型芯片封装结构 |
Publications (2)
Publication Number | Publication Date |
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CN113611673A CN113611673A (zh) | 2021-11-05 |
CN113611673B true CN113611673B (zh) | 2021-12-21 |
Family
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Family Applications (1)
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CN202111179034.8A Active CN113611673B (zh) | 2021-10-11 | 2021-10-11 | 集成布线转接板的新型芯片封装结构 |
Country Status (1)
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CN (1) | CN113611673B (zh) |
Citations (10)
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CN1942393A (zh) * | 2004-03-01 | 2007-04-04 | 德塞拉股份有限公司 | 组装的声波和电磁换能器芯片 |
CN101075624A (zh) * | 2006-05-18 | 2007-11-21 | 大瀚光电股份有限公司 | 覆晶式取像模块封装结构及其封装方法 |
TW200818027A (en) * | 2006-10-05 | 2008-04-16 | Chipmos Technologies Inc | Film type package for fingerprint sensor |
JP2011225828A (ja) * | 2010-03-30 | 2011-11-10 | Shin-Etsu Chemical Co Ltd | 樹脂組成物及び発光半導体素子用リフレクター、及び発光半導体装置 |
JP2013246112A (ja) * | 2012-05-29 | 2013-12-09 | Panasonic Corp | バイオセンサおよびバイオセンサ作製方法、ならびにバイオセンサを用いた診断装置システム |
JP2014203679A (ja) * | 2013-04-05 | 2014-10-27 | 日本電信電話株式会社 | 固体酸化物形燃料電池セパレータとその製造方法 |
JP2014237811A (ja) * | 2013-05-09 | 2014-12-18 | 住友ベークライト株式会社 | 接着フィルム、接着シート、ダイシングシート一体型接着フィルム、バックグラインドテープ一体型接着フィルム、ダイシングシート兼バックグラインドテープ一体型接着フィルム及び半導体装置 |
CN105374778A (zh) * | 2014-08-11 | 2016-03-02 | 精材科技股份有限公司 | 晶片封装体及其制造方法 |
CN108235562A (zh) * | 2016-12-22 | 2018-06-29 | 奥特斯奥地利科技与系统技术有限公司 | 用于将部件嵌入部件承载件中的透气性临时载带 |
CN109502537A (zh) * | 2017-09-15 | 2019-03-22 | 梅斯瑞士公司 | 传感器系统、传感器组件及使用焊接进行密封的组装方法 |
Family Cites Families (9)
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---|---|---|---|---|
TWI221324B (en) * | 2003-04-16 | 2004-09-21 | Hung-Ren Wang | Image sensor package and image pickup module using the image sensor |
TW200644261A (en) * | 2005-06-06 | 2006-12-16 | Megica Corp | Chip-package structure and manufacturing process thereof |
US20110031607A1 (en) * | 2009-08-06 | 2011-02-10 | Advanced Chip Engineering Technology Inc. | Conductor package structure and method of the same |
US8338208B2 (en) * | 2009-12-31 | 2012-12-25 | Texas Instruments Incorporated | Micro-electro-mechanical system having movable element integrated into leadframe-based package |
CN103400845B (zh) * | 2013-08-13 | 2016-08-10 | 南通大学 | 影像传感器封装方法 |
CN105428380B (zh) * | 2015-12-11 | 2019-03-26 | 江西芯创光电有限公司 | 一种传感器封装片的制作工艺 |
CN208714280U (zh) * | 2018-04-10 | 2019-04-09 | 苏州和合模塑科技有限公司 | 一种模具用导柱 |
CN209606998U (zh) * | 2019-03-21 | 2019-11-08 | 深圳市汇顶科技股份有限公司 | 指纹识别装置和电子设备 |
CN213181882U (zh) * | 2020-06-12 | 2021-05-11 | 无锡市新逵机械设备有限公司 | 一种半导体芯片的测试装置 |
-
2021
- 2021-10-11 CN CN202111179034.8A patent/CN113611673B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1942393A (zh) * | 2004-03-01 | 2007-04-04 | 德塞拉股份有限公司 | 组装的声波和电磁换能器芯片 |
CN101075624A (zh) * | 2006-05-18 | 2007-11-21 | 大瀚光电股份有限公司 | 覆晶式取像模块封装结构及其封装方法 |
TW200818027A (en) * | 2006-10-05 | 2008-04-16 | Chipmos Technologies Inc | Film type package for fingerprint sensor |
JP2011225828A (ja) * | 2010-03-30 | 2011-11-10 | Shin-Etsu Chemical Co Ltd | 樹脂組成物及び発光半導体素子用リフレクター、及び発光半導体装置 |
JP2013246112A (ja) * | 2012-05-29 | 2013-12-09 | Panasonic Corp | バイオセンサおよびバイオセンサ作製方法、ならびにバイオセンサを用いた診断装置システム |
JP2014203679A (ja) * | 2013-04-05 | 2014-10-27 | 日本電信電話株式会社 | 固体酸化物形燃料電池セパレータとその製造方法 |
JP2014237811A (ja) * | 2013-05-09 | 2014-12-18 | 住友ベークライト株式会社 | 接着フィルム、接着シート、ダイシングシート一体型接着フィルム、バックグラインドテープ一体型接着フィルム、ダイシングシート兼バックグラインドテープ一体型接着フィルム及び半導体装置 |
CN105374778A (zh) * | 2014-08-11 | 2016-03-02 | 精材科技股份有限公司 | 晶片封装体及其制造方法 |
CN108235562A (zh) * | 2016-12-22 | 2018-06-29 | 奥特斯奥地利科技与系统技术有限公司 | 用于将部件嵌入部件承载件中的透气性临时载带 |
CN109502537A (zh) * | 2017-09-15 | 2019-03-22 | 梅斯瑞士公司 | 传感器系统、传感器组件及使用焊接进行密封的组装方法 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: New chip packaging structure of integrated wiring adapter board Effective date of registration: 20220214 Granted publication date: 20211221 Pledgee: Zaozhuang rural commercial bank Limited by Share Ltd. Yicheng sub branch Pledgor: Shandong Hanxin Technology Co.,Ltd. Registration number: Y2022980001543 |
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Date of cancellation: 20230201 Granted publication date: 20211221 Pledgee: Zaozhuang rural commercial bank Limited by Share Ltd. Yicheng sub branch Pledgor: Shandong Hanxin Technology Co.,Ltd. Registration number: Y2022980001543 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A New Chip Packaging Structure of Integrated Wiring Adapter Board Effective date of registration: 20230213 Granted publication date: 20211221 Pledgee: Zaozhuang rural commercial bank Limited by Share Ltd. Yicheng sub branch Pledgor: Shandong Hanxin Technology Co.,Ltd. Registration number: Y2023980032481 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20211221 Pledgee: Zaozhuang rural commercial bank Limited by Share Ltd. Yicheng sub branch Pledgor: Shandong Hanxin Technology Co.,Ltd. Registration number: Y2023980032481 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |