CN103367206B - 用于等离子体均匀性调谐的多射频阻抗控制 - Google Patents

用于等离子体均匀性调谐的多射频阻抗控制 Download PDF

Info

Publication number
CN103367206B
CN103367206B CN201310105829.3A CN201310105829A CN103367206B CN 103367206 B CN103367206 B CN 103367206B CN 201310105829 A CN201310105829 A CN 201310105829A CN 103367206 B CN103367206 B CN 103367206B
Authority
CN
China
Prior art keywords
frequency
radio
frequency power
top electrode
coupled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310105829.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN103367206A (zh
Inventor
阿列克谢·马拉什塔内夫
拉金德尔·丁德萨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN103367206A publication Critical patent/CN103367206A/zh
Application granted granted Critical
Publication of CN103367206B publication Critical patent/CN103367206B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/20Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32091Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32137Radio frequency generated discharge controlling of the discharge by modulation of energy
    • H01J37/32155Frequency modulation
    • H01J37/32165Plural frequencies
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/38Impedance-matching networks
    • H03H7/40Automatic matching of load impedance to source impedance
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/46Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Filters And Equalizers (AREA)
CN201310105829.3A 2012-03-28 2013-03-28 用于等离子体均匀性调谐的多射频阻抗控制 Active CN103367206B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/433,004 US9881772B2 (en) 2012-03-28 2012-03-28 Multi-radiofrequency impedance control for plasma uniformity tuning
US13/433,004 2012-03-28

Publications (2)

Publication Number Publication Date
CN103367206A CN103367206A (zh) 2013-10-23
CN103367206B true CN103367206B (zh) 2017-07-18

Family

ID=49235589

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310105829.3A Active CN103367206B (zh) 2012-03-28 2013-03-28 用于等离子体均匀性调谐的多射频阻抗控制

Country Status (6)

Country Link
US (2) US9881772B2 (enExample)
JP (2) JP2013225672A (enExample)
KR (1) KR102153141B1 (enExample)
CN (1) CN103367206B (enExample)
SG (2) SG10201507984VA (enExample)
TW (2) TWI589192B (enExample)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130059448A1 (en) * 2011-09-07 2013-03-07 Lam Research Corporation Pulsed Plasma Chamber in Dual Chamber Configuration
US9083182B2 (en) 2011-11-21 2015-07-14 Lam Research Corporation Bypass capacitors for high voltage bias power in the mid frequency RF range
US10586686B2 (en) 2011-11-22 2020-03-10 Law Research Corporation Peripheral RF feed and symmetric RF return for symmetric RF delivery
US9396908B2 (en) 2011-11-22 2016-07-19 Lam Research Corporation Systems and methods for controlling a plasma edge region
US9263240B2 (en) 2011-11-22 2016-02-16 Lam Research Corporation Dual zone temperature control of upper electrodes
CN104024477B (zh) * 2011-11-23 2016-05-18 朗姆研究公司 多区域气体注入上电极系统
WO2013078434A1 (en) 2011-11-24 2013-05-30 Lam Research Corporation Plasma processing chamber with flexible symmetric rf return strap
JP2017504955A (ja) * 2013-11-06 2017-02-09 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Dcバイアス変調による、粒子発生抑制装置
US10892140B2 (en) 2018-07-27 2021-01-12 Eagle Harbor Technologies, Inc. Nanosecond pulser bias compensation
JP6574547B2 (ja) 2013-12-12 2019-09-11 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP2015162266A (ja) * 2014-02-26 2015-09-07 株式会社日立ハイテクノロジーズ プラズマ処理装置
US10047438B2 (en) * 2014-06-10 2018-08-14 Lam Research Corporation Defect control and stability of DC bias in RF plasma-based substrate processing systems using molecular reactive purge gas
US10410889B2 (en) 2014-07-25 2019-09-10 Applied Materials, Inc. Systems and methods for electrical and magnetic uniformity and skew tuning in plasma processing reactors
US9595424B2 (en) * 2015-03-02 2017-03-14 Lam Research Corporation Impedance matching circuit for operation with a kilohertz RF generator and a megahertz RF generator to control plasma processes
US9761414B2 (en) * 2015-10-08 2017-09-12 Lam Research Corporation Uniformity control circuit for use within an impedance matching circuit
WO2017161641A1 (zh) 2016-03-23 2017-09-28 北京北方微电子基地设备工艺研究中心有限责任公司 阻抗匹配系统、阻抗匹配方法及半导体加工设备
KR102793197B1 (ko) * 2016-04-13 2025-04-07 램 리써치 코포레이션 Rf 생성기의 복수의 상태들 동안 단계적 방식으로 임피던스 매칭 네트워크를 튜닝하기 위한 시스템들 및 방법들
US10229816B2 (en) * 2016-05-24 2019-03-12 Mks Instruments, Inc. Solid-state impedance matching systems including a hybrid tuning network with a switchable coarse tuning network and a varactor fine tuning network
US11430635B2 (en) 2018-07-27 2022-08-30 Eagle Harbor Technologies, Inc. Precise plasma control system
US11004660B2 (en) * 2018-11-30 2021-05-11 Eagle Harbor Technologies, Inc. Variable output impedance RF generator
US9852889B1 (en) 2016-06-22 2017-12-26 Lam Research Corporation Systems and methods for controlling directionality of ions in an edge region by using an electrode within a coupling ring
US10424467B2 (en) * 2017-03-13 2019-09-24 Applied Materials, Inc. Smart RF pulsing tuning using variable frequency generators
US10546724B2 (en) * 2017-05-10 2020-01-28 Mks Instruments, Inc. Pulsed, bidirectional radio frequency source/load
KR102475069B1 (ko) * 2017-06-30 2022-12-06 삼성전자주식회사 반도체 제조 장치, 이의 동작 방법
KR102217139B1 (ko) 2017-08-14 2021-02-18 가부시키가이샤 코쿠사이 엘렉트릭 플라스마 생성 장치, 기판 처리 장치 및 반도체 장치의 제조 방법
US10002746B1 (en) * 2017-09-13 2018-06-19 Lam Research Corporation Multi regime plasma wafer processing to increase directionality of ions
US10342114B2 (en) * 2017-09-15 2019-07-02 Axcelis Technologies, Inc. RF resonator for ion beam acceleration
US11551909B2 (en) 2017-10-02 2023-01-10 Tokyo Electron Limited Ultra-localized and plasma uniformity control in a plasma processing system
US20190108976A1 (en) * 2017-10-11 2019-04-11 Advanced Energy Industries, Inc. Matched source impedance driving system and method of operating the same
US10264663B1 (en) * 2017-10-18 2019-04-16 Lam Research Corporation Matchless plasma source for semiconductor wafer fabrication
CN120497150A (zh) 2018-02-23 2025-08-15 朗姆研究公司 不断开高功率电路的电容测量
CN110323117B (zh) * 2018-03-28 2024-06-21 三星电子株式会社 等离子体处理设备
EP3806586B1 (en) * 2018-05-30 2022-07-13 Toshiba Mitsubishi-Electric Industrial Systems Corporation Active gas generation device
KR102487930B1 (ko) 2018-07-23 2023-01-12 삼성전자주식회사 기판 지지 장치 및 이를 포함하는 플라즈마 처리 장치
US11810761B2 (en) 2018-07-27 2023-11-07 Eagle Harbor Technologies, Inc. Nanosecond pulser ADC system
US11532457B2 (en) 2018-07-27 2022-12-20 Eagle Harbor Technologies, Inc. Precise plasma control system
US11222767B2 (en) 2018-07-27 2022-01-11 Eagle Harbor Technologies, Inc. Nanosecond pulser bias compensation
WO2020033931A1 (en) 2018-08-10 2020-02-13 Eagle Harbor Technologies, Inc. Plasma sheath control for rf plasma reactors
US12456604B2 (en) 2019-12-24 2025-10-28 Eagle Harbor Technologies, Inc. Nanosecond pulser RF isolation for plasma systems
US11282679B2 (en) * 2019-05-22 2022-03-22 Samsung Electronics Co., Ltd. Plasma control apparatus and plasma processing system including the same
US11158488B2 (en) * 2019-06-26 2021-10-26 Mks Instruments, Inc. High speed synchronization of plasma source/bias power delivery
TWI887254B (zh) * 2019-07-17 2025-06-21 美商得昇科技股份有限公司 利用可調式電漿電位的可變模式電漿室
US11043362B2 (en) * 2019-09-17 2021-06-22 Tokyo Electron Limited Plasma processing apparatuses including multiple electron sources
JP6873588B1 (ja) 2019-11-12 2021-05-19 東芝三菱電機産業システム株式会社 活性ガス生成装置
TWI778449B (zh) 2019-11-15 2022-09-21 美商鷹港科技股份有限公司 高電壓脈衝電路
KR102524433B1 (ko) 2019-11-27 2023-04-24 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 활성 가스 생성 장치
EP4486072A3 (en) 2019-12-24 2025-04-09 Eagle Harbor Technologies, Inc. Nanosecond pulser rf isolation for plasma systems
JP7736446B2 (ja) 2020-05-07 2025-09-09 エーエスエム・アイピー・ホールディング・ベー・フェー 同調回路を備える反応器システム
US11967484B2 (en) 2020-07-09 2024-04-23 Eagle Harbor Technologies, Inc. Ion current droop compensation
US11749505B2 (en) 2021-02-23 2023-09-05 Applied Materials, Inc. Methods and apparatus for processing a substrate
US11538663B2 (en) 2021-02-23 2022-12-27 Applied Materials, Inc. Methods and apparatus for processing a substrate
JP7560214B2 (ja) * 2021-03-11 2024-10-02 東京エレクトロン株式会社 着火方法及びプラズマ処理装置
EP4105963A1 (en) * 2021-06-17 2022-12-21 Impedans Ltd A controller for a matching unit of a plasma processing system
KR102929923B1 (ko) 2021-09-23 2026-02-24 삼성전자주식회사 플라즈마 제어 장치 및 플라즈마 처리 시스템
CN114792619B (zh) * 2022-05-07 2026-03-20 北京北方华创微电子装备有限公司 半导体工艺腔室
US11824542B1 (en) 2022-06-29 2023-11-21 Eagle Harbor Technologies, Inc. Bipolar high voltage pulser
KR20250084155A (ko) 2022-09-29 2025-06-10 이글 하버 테크놀로지스, 인코포레이티드 고전압 플라즈마 제어
KR102854932B1 (ko) 2023-07-03 2025-09-05 코스맥스 주식회사 비피도박테리움 애니멀리스 서브스페시스 락티스 균주 및 그의 모발 또는 두피 상태 개선 용도
JP7695977B2 (ja) 2023-08-23 2025-06-19 株式会社アルバック プラズマ処理装置およびその制御方法
US20250210304A1 (en) * 2023-12-20 2025-06-26 Applied Materials, Inc. Electrode and Coil Configurations For Processing Chambers and Related Chamber Kits, Apparatus, and Methods For Semiconductor Manufacturing
WO2026015311A1 (en) * 2024-07-09 2026-01-15 Lam Research Corporation Systems and methods for providing an hf rf signal to an upper electrode extension
WO2026043814A1 (en) * 2024-08-22 2026-02-26 Lam Research Corporation Systems and methods for splitting top mhz power

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5460684A (en) * 1992-12-04 1995-10-24 Tokyo Electron Limited Stage having electrostatic chuck and plasma processing apparatus using same
US6379576B2 (en) * 1997-11-17 2002-04-30 Mattson Technology, Inc. Systems and methods for variable mode plasma enhanced processing of semiconductor wafers
JP4456694B2 (ja) * 1999-06-22 2010-04-28 東京エレクトロン株式会社 プラズマ処理装置
JP2001144077A (ja) 1999-11-15 2001-05-25 Applied Materials Inc プラズマ処理装置及び方法
US6770166B1 (en) * 2001-06-29 2004-08-03 Lam Research Corp. Apparatus and method for radio frequency de-coupling and bias voltage control in a plasma reactor
US6706138B2 (en) * 2001-08-16 2004-03-16 Applied Materials Inc. Adjustable dual frequency voltage dividing plasma reactor
US6920729B2 (en) * 2002-07-03 2005-07-26 Peter J. Konopka Composite wall tie
CN101160014B (zh) * 2002-07-12 2011-12-28 东京毅力科创株式会社 等离子体处理装置和可变阻抗装置的校正方法
JP4370789B2 (ja) 2002-07-12 2009-11-25 東京エレクトロン株式会社 プラズマ処理装置及び可変インピーダンス手段の校正方法
US7144521B2 (en) 2003-08-22 2006-12-05 Lam Research Corporation High aspect ratio etch using modulation of RF powers of various frequencies
US7405521B2 (en) 2003-08-22 2008-07-29 Lam Research Corporation Multiple frequency plasma processor method and apparatus
US7169256B2 (en) 2004-05-28 2007-01-30 Lam Research Corporation Plasma processor with electrode responsive to multiple RF frequencies
US7611603B2 (en) 2006-03-31 2009-11-03 Tokyo Electron Limited Plasma processing apparatus having impedance varying electrodes
JP5254533B2 (ja) 2006-03-31 2013-08-07 東京エレクトロン株式会社 プラズマ処理装置と方法
US7264688B1 (en) * 2006-04-24 2007-09-04 Applied Materials, Inc. Plasma reactor apparatus with independent capacitive and toroidal plasma sources
US7837826B2 (en) 2006-07-18 2010-11-23 Lam Research Corporation Hybrid RF capacitively and inductively coupled plasma source using multifrequency RF powers and methods of use thereof
JP5199595B2 (ja) * 2007-03-27 2013-05-15 東京エレクトロン株式会社 プラズマ処理装置及びそのクリーニング方法
US20170213734A9 (en) * 2007-03-30 2017-07-27 Alexei Marakhtanov Multifrequency capacitively coupled plasma etch chamber
CN101478857A (zh) * 2008-01-04 2009-07-08 北京北方微电子基地设备工艺研究中心有限责任公司 等离子体处理装置
US20090230089A1 (en) * 2008-03-13 2009-09-17 Kallol Bera Electrical control of plasma uniformity using external circuit
JP2010238730A (ja) 2009-03-30 2010-10-21 Tokyo Electron Ltd プラズマ処理装置
US8652298B2 (en) * 2011-11-21 2014-02-18 Lam Research Corporation Triode reactor design with multiple radiofrequency powers

Also Published As

Publication number Publication date
SG10201507984VA (en) 2015-10-29
TW201349946A (zh) 2013-12-01
KR102153141B1 (ko) 2020-09-07
TWI538571B (zh) 2016-06-11
CN103367206A (zh) 2013-10-23
JP2013225672A (ja) 2013-10-31
JP2018164093A (ja) 2018-10-18
US20130260567A1 (en) 2013-10-03
US9881772B2 (en) 2018-01-30
US10593516B2 (en) 2020-03-17
JP6623256B2 (ja) 2019-12-18
SG193760A1 (en) 2013-10-30
US20180166256A1 (en) 2018-06-14
TW201622492A (zh) 2016-06-16
KR20130110104A (ko) 2013-10-08
TWI589192B (zh) 2017-06-21

Similar Documents

Publication Publication Date Title
CN103367206B (zh) 用于等离子体均匀性调谐的多射频阻抗控制
KR102031388B1 (ko) 다수의 무선 주파수 전력들을 갖는 쓰라이오드 반응기 설계
CN107068529B (zh) 用于控制等离子体边缘区域的系统和方法
US9385021B2 (en) Electronic knob for tuning radial etch non-uniformity at VHF frequencies
CN103890916B (zh) 双室结构的脉冲等离子体室
KR100926380B1 (ko) 플라즈마 처리 장치 및 플라즈마 처리 방법
JP6120527B2 (ja) プラズマ処理方法
JP6715129B2 (ja) プラズマ処理装置
CN111937114B (zh) 用于在加工等离子体时控制离子能量分布的装置和方法
US20190318913A1 (en) Apparatus and Method for Controlling Ion Energy Distribution in Process Plasmas
US10998170B2 (en) Method for ion mass separation and ion energy control in process plasmas
CN104025279B (zh) 一种用于等离子体处理的卡盘组件和用于给静电卡盘组件供电的方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant