CN103367172A - 接合线固定方法 - Google Patents
接合线固定方法 Download PDFInfo
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Abstract
本发明公开了一种固定接合线的方法,其步骤包含将一具有多个接合垫的芯片设在一具有多个接合指的载板上、将每一所述接合垫打线接合至一所述接合指,使得所形成的接合线呈平行排列、在每一所述接合垫上滴上流动性胶材,使得所述流动性胶材因毛细现象而沿着两邻近的接合线往其所接合的接合指方向扩散、以及,进行一烘烤工艺使得所述流动性胶材变为黏稠状态。
Description
技术领域
本发明涉及一种封装方法,特别是涉及一种固定封装结构中的接合线(bonding wire)的方法,使其可免除模流冲击影响。
背景技术
为了要在有限的面积中达到更高的存储容量,动态随机存取存储器(Dynamic Random Access Memory,DRAM)架构开始朝向立体的堆栈式封装技术(3D stacked package)发展,此封装技术的原理在于将多个互连的存取芯片(die)堆栈在一单一的封装载体上,如此将可在同样的面积范围内达到数倍的储存容量。
在封装结构中,芯片的输出入端(I/O)须与外部的封装体电性互连,其多是透过打线接合(wire bonding)方式将芯片上的接合垫(pad)与封装载板上的接合指(finger)电性连接。在打线接合后,封装结构中尚须进行一模封工艺以填入模封材料,使得内部的芯片与外部隔绝。
对于此等封装技术来说,随着现今DRAM结构的容量不断往上提升,其单位封装面积中所会布设的接合垫与接合指也会相对提升,进而造成连接其间的接合线数目的增加。此外,采用立体堆栈式封装技术的封装结构由于芯片呈堆叠之故,其接合垫与接合指之间的距离通常较大,也使得其间所连的接合线长度增加。上述接合线在密度与长度上的增加将会使接合线容易受到模封工艺的影响,特别是在填入模封材料的时候,若模封材料的模流路径与接合线走向不一致,则接合线会容易受到模流冲击而脱落或是彼此碰触,此冲线问题将造成线路的断路和短路失效。
对于上述冲线问题,业界一般利用计算机辅助设计(Computer AidedDesign,CAD)来进行模流分析,藉以优化流道及模套(mold chase)的设计,使模流对接合线的影响降到最低。也有部分作法是在进行打线接合之前先在芯片的适当位置处涂布紫外光固化胶(UV胶)并使之转态黏稠,之后进行打线工艺时所形成的接合线将为UV胶所固定,而不会受到模流的影响。
有别于上述的背景技术,本发明提供了一种新颖的接合线固定方法,其透过改变既有封装结构的设计以及对应的工序来达成接合线的固定效果。
发明内容
本发明的主要目的在提供一种新颖的接合线固定方法,其透过自然的毛细现象将流动性胶材均匀的分布在接合线周遭,使得接合线能被固化后的胶材所固定、支撑,进而避免后续工序中模流冲击所易造成的冲线问题。
根据本发明的优选实施例,本发明提供了一种固定接合线的方法,其步骤包含将一具有多个接合垫的芯片设在一具有多个接合指的载板上、将每一所述接合垫打线接合至一所述接合指,使得所形成的接合线呈平行排列、在每一所述接合垫上滴上流动性胶材,使得所述流动性胶材因毛细现象而沿着两邻近的接合线往其所接合的接合指方向扩散、以及,进行一烘烤工艺使得所述流动性胶材变为黏稠状态。
本发明透过载板的接合指设计,使得打线接合工艺所产生的接合线得以平行排列且具有较小的间距,进而形成毛细管路的环境。如此,再藉由使用流动性极佳的胶材,使胶材得以自然均匀地沿着接合线分布,而于模封工艺中达成固定接合线的效果。
附图说明
图1至图4为依据本发明优选实施例所绘示的接合线固定工序的顶视图。
图5为依据本发明另一优选实施例所绘示的接合线固定态样的顶视图。
图6为依据本发明优选实施例所绘示的经过接合线固定工序后的封装结构的横断面视图。
其中,附图标记说明如下:
100 封装载板 120 接合线
102 接合指 130 流动性胶材
110/110a/110b 芯片 140 模封材料
112 接合垫 150 焊锡凸块
具体实施方式
下文中将以图示来说明本发明的优选实施例,其中,图1至图4依序绘示出依据本发明优选实施例的接合线固定工序的顶视图。首先,请参照图1,提供一欲进行封装的芯片110。芯片110可为一单一芯片,或是由多个芯片层叠而成的立体堆叠式芯片组合,特别是小外形双列内存模组(Small Outline DualIn-line Memory Module,SO-DIMM)、低电流负荷双列内存模组(Load ReducedDual In-line Memory Module,LR-DIMM)等高速、高容量的内存模块所用的芯片。
芯片110表面具有多个接合垫112作为信号输出入端(I/O),其可于后续工序中进行打线接合工艺以将芯片内部的电路电性连接至外部的封装结构。在本实施例中,接合垫112在芯片110上排列成一直线,此种排列方式将有助于使后续所形成的接合线的呈规律排列。芯片110会以黏晶材料(如环氧树脂胶材)黏在一封装载板100预定的黏晶区域上,一般为中间区域。封装载板100可为树脂或陶瓷材质的载板,其表面涂布有阻焊层。封装载板100的黏晶区域四周设有多个接合指102自阻焊层中裸露出来。其中每一接合指102都会与芯片110上的一接合垫112对应。在本实施例中,芯片110上的接合垫112会与封装载板100上的接合指102对应设置,如接合垫112由上而下交替地对应到左右两侧的接合指102,使得接合指102能在封装载板100上均匀的分布,并使两者间所连接的各接合线能呈平行排列,见后续说明。
接着请参照图2,当芯片110经过黏晶步骤黏在封装载板100上的预定位置后,进行一打线接合工艺在每一接合垫112与对应的接合指102之间形成一接合线120,如金线。接合线120的两端会分别焊在对应的接合垫112与接合指102上,使两者达成电性连接。在本发明中,接合垫112与接合指102的布局会使得所形成的各接合线120呈平行排列,且相邻的接合线120之间的距离会小于一预定值。须注意,图2中所示的接合垫112与接合指102的布局仅为其中之一发明例示,在其它实施例中,接合垫112与接合指102可排列成其它态样,只要其间所形成的各接合线120能呈平行排列且间距小于一预定值。
接着请参照图3,完成打线接合步骤后,在各接合垫112部位上滴上流动性胶材130,特别是能转态固化的流动性胶材,如环氧树脂胶材。由于本实施例中芯片110上的接合垫112是排列成一直线,故可以操作一点胶机台从封装面最上方开始依序往下在接合垫112及其四周滴上足量的流动性胶材130。此点胶步骤的范围以不超过接合垫112四周为主,以避免过多的胶材造成污染或是影响到后续的模封工艺。
接着请参照图4,在滴上流动性胶材静置一段时间后,由于各接合线120之间呈平行排列且间隔很小,流动性胶材130会因为毛细现象而沿着所覆盖两邻近的接合线120处往其所接合对应的接合指102处行进扩散。此种胶材扩散方式的动力来自于平行、邻近的接合线120之间的毛细现象,故以此方式,胶材可以从接合垫112沿着接合线120均匀的往外分布,可控制布胶范围且不会过量溢胶。
在完成上述流动性胶材的分布后,整个封装结构包括芯片110与封装载板100会被送入一烤箱中进行烘烤工艺。此烘烤工艺会使得流动性胶材转变成B-stage的黏稠状态,使得流动性胶材130得以固定或支撑其所涵盖的接合线120。在进行上述烘烤工艺后,整个封装结构会被置入模套中进行模封工艺,此工序会在模套中灌入流动性的模封材料,如环氧树脂、有机硅、或聚氨脂等封胶,进而在模套中形成模流流经封装结构。对本发明而言,膜封期间由于接合线120已获得固化后的流动性胶材130的支撑,故就算接合线120受到模流的冲击后,特别是受到与接合线120延伸方向不同的模流冲击,也不会改变其初始位置而导致短路或断路等电路失效,达成固定接合线的效果。
须注意,本实施例中的接合垫是呈直线排列态样,在其它例子中,如图5所示,芯片110上的接合垫112也可能是沿着芯片的周围排列设置,其所对应位于封装载板100上的接合指也可对应此设置排列。对本发明而言,芯片上的接合垫与封装载板上的接合指的布局位置并无一定,只要能使所对应的两者间拉出的相邻接合线呈平行排列且间距小于一预定值,得以达成毛细作用的条件即可。
接着请参照图6,其绘示出根据本发明优选实施例完成接合线固定工序的封装结构的横断面视图。如图所示,堆栈式芯片110a与110b是层叠在封装载板100的黏晶区域上,其间通过一胶材,如环氧树脂材来黏合。芯片110a上的接合垫112会经由接合线电性连接至封装载板100上的接合指102,并再经由下方的焊锡凸块150电性连接至其它外部结构,如一电路板。接合垫112附近有经由点胶工艺往接合线方向扩散的流动性胶材130,其固化后可使得原本无机械支撑的接合线120获得支撑,故不会受到模封步骤中模流冲击的影响。模封材料140在灌入膜套后会固化成型,封住封装结构上裸露的构件,如接合线,如此即完成了整个模封工序。
以上所述仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (3)
1.一种固定接合线的方法,其特征在于,包含:
将一具有多个接合垫的芯片设在一具有多个接合指的载板上;
进行一打线接合工艺将每一所述接合垫经由接合线接至一所述接合指,且使得各所述接合线呈平行排列;
在每一所述接合垫上滴上流动性胶材,使得所述流动性胶材因毛细现象而沿着两邻近的所述接合线往其接合的所述接合指扩散;以及
进行一烘烤工艺使得所述流动性胶材变为黏稠状态。
2.如权利要求1所述的固定接合线的方法,其特征在于,另包含在所述烘烤工艺后进行一模封工艺。
3.如权利要求1所述的固定接合线的方法,其特征在于,其中所述流动性胶材为环氧树脂。
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