CN103339173B - 绝缘树脂材料的生产方法 - Google Patents

绝缘树脂材料的生产方法 Download PDF

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Publication number
CN103339173B
CN103339173B CN201280007000.3A CN201280007000A CN103339173B CN 103339173 B CN103339173 B CN 103339173B CN 201280007000 A CN201280007000 A CN 201280007000A CN 103339173 B CN103339173 B CN 103339173B
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CN
China
Prior art keywords
core
shell
resin material
insulating resin
particle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201280007000.3A
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English (en)
Chinese (zh)
Other versions
CN103339173A (zh
Inventor
柳本博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
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Toyota Motor Corp
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Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Publication of CN103339173A publication Critical patent/CN103339173A/zh
Application granted granted Critical
Publication of CN103339173B publication Critical patent/CN103339173B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C08J3/128—Polymer particles coated by inorganic and non-macromolecular organic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/442—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Insulating Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Paints Or Removers (AREA)
  • Inorganic Insulating Materials (AREA)
CN201280007000.3A 2011-02-01 2012-01-04 绝缘树脂材料的生产方法 Expired - Fee Related CN103339173B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP019970/2011 2011-02-01
JP2011019970A JP5353916B2 (ja) 2011-02-01 2011-02-01 絶縁樹脂材料の製造方法
PCT/IB2012/000010 WO2012104689A1 (en) 2011-02-01 2012-01-04 Method of fabricating insulating resin material

Publications (2)

Publication Number Publication Date
CN103339173A CN103339173A (zh) 2013-10-02
CN103339173B true CN103339173B (zh) 2014-11-12

Family

ID=45592755

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280007000.3A Expired - Fee Related CN103339173B (zh) 2011-02-01 2012-01-04 绝缘树脂材料的生产方法

Country Status (5)

Country Link
US (1) US8771566B2 (enExample)
EP (1) EP2670793B8 (enExample)
JP (1) JP5353916B2 (enExample)
CN (1) CN103339173B (enExample)
WO (1) WO2012104689A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6322016B2 (ja) * 2013-03-28 2018-05-09 積水化学工業株式会社 有機無機ハイブリッド粒子の製造方法、導電性粒子の製造方法、導電材料の製造方法及び接続構造体の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1413239A (zh) * 1999-12-23 2003-04-23 阿克佐诺贝尔股份有限公司 包含加聚物和聚氨酯的水性涂料组合物
CN101028970A (zh) * 2006-03-01 2007-09-05 罗姆两合公司 含有在建筑材料混合物中溶胀的微粒子的建筑材料混合物添加剂
CN101512387A (zh) * 2006-09-06 2009-08-19 帝斯曼知识产权资产管理有限公司 核壳纳米粒子
JP2010189600A (ja) * 2009-02-20 2010-09-02 Toyota Motor Corp 熱伝導性絶縁樹脂成形体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11233694A (ja) 1998-02-18 1999-08-27 Toshiba Chem Corp 高熱伝導樹脂封止型半導体装置
JP2009018215A (ja) * 2007-07-10 2009-01-29 Osaka Prefecture コア−シェル型高分子ゲル微粒子の固定化方法及び分離材
JP2010144153A (ja) 2008-12-22 2010-07-01 Nitto Denko Corp 有機−無機複合成形体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1413239A (zh) * 1999-12-23 2003-04-23 阿克佐诺贝尔股份有限公司 包含加聚物和聚氨酯的水性涂料组合物
CN101028970A (zh) * 2006-03-01 2007-09-05 罗姆两合公司 含有在建筑材料混合物中溶胀的微粒子的建筑材料混合物添加剂
CN101512387A (zh) * 2006-09-06 2009-08-19 帝斯曼知识产权资产管理有限公司 核壳纳米粒子
JP2010189600A (ja) * 2009-02-20 2010-09-02 Toyota Motor Corp 熱伝導性絶縁樹脂成形体

Also Published As

Publication number Publication date
JP5353916B2 (ja) 2013-11-27
CN103339173A (zh) 2013-10-02
EP2670793B8 (en) 2014-12-17
JP2012157828A (ja) 2012-08-23
US8771566B2 (en) 2014-07-08
US20130302515A1 (en) 2013-11-14
WO2012104689A1 (en) 2012-08-09
EP2670793B1 (en) 2014-10-15
EP2670793A1 (en) 2013-12-11

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