CN103229289A - Substrate-processing device - Google Patents

Substrate-processing device Download PDF

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Publication number
CN103229289A
CN103229289A CN2012800038949A CN201280003894A CN103229289A CN 103229289 A CN103229289 A CN 103229289A CN 2012800038949 A CN2012800038949 A CN 2012800038949A CN 201280003894 A CN201280003894 A CN 201280003894A CN 103229289 A CN103229289 A CN 103229289A
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China
Prior art keywords
substrate
shuttle
conveying mechanism
conveying
individual
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CN2012800038949A
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Chinese (zh)
Inventor
古谷悟郎
寺田尚司
福田喜辉
和田宪雄
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/542—Dye sensitized solar cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

To perform a series of processes on substrates efficiently and with high throughput, regardless of whether said processes are single-wafer or batch processes, using a novel substrate-transfer system. In this substrate-processing device, a processing station (10) is arranged in the center of the system such that the long axis (x-axis) thereof is horizontal, and a loader (12) and unloader (14) are connected to the lengthwise ends thereof. Said processing station (10) has a transfer line (28) that runs straight along the long axis (x-axis) of the system from the loader (12) to the unloader (14). A large number and large number of types of processing units (44 to 54) are arranged on the left and right sides of said transfer line (28). On the transfer line (28), a plurality of single-wafer transfer mechanisms (30, 32, 34, and 36) and a plurality of shuttle transfer units (38, 40, and 42) are laid out in alternation in a single line.

Description

Substrate board treatment
Technical field
The present invention relates to the surface of substrate is implemented to be used for the substrate board treatment of the processing of retrofit, relate in particular to the substrate board treatment that the processing unit that substrate transferred to each operation in each treatment process carries out a series of processing.
Background technology
In the past, at semiconductor device, FPD(flat-panel monitor), in the production line of solar panel etc., mostly adopt following string row (inline) system mode: multiple processing unit centralized configuration that will be corresponding with series of processes transfers to each processing unit by the order of handling process with the substrate (semiconductor wafer, glass substrate etc.) of process object and carries out the series of processes processing.Especially all be under single sheet type that substrate is one by one the handled situation about handling in a series of processing, adopt such string heat-extraction system easily.That is, if the productive temp time of every substrate is T SAnd with each individual handles P mRequired time be made as T m, then as long as handle P this individual mIn make N iIndividual (wherein, N iBe natural number, and N i〉=T m/ T S) single sheet type processing unit PU mWith the productive temp time T SParallel running of time difference get final product.
But if kind, the quantity of the processing of string in arranging in a row are a lot, the task of then being responsible for the conveying mechanical arm that substrate passes between a plurality of processing unit increases and is unable to catch up with productive temp.Given this, adopted following mode: the heat-extraction system of will going here and there is divided into a plurality of zones, the substrate that in each zone a conveying mechanical arm is carried out between processing unit passes on, and carries out the exchange (for example with reference to patent documentation 1) of substrate at the regional chien shih both sides' of adjacency conveying mechanical arm via fixing substrate trunk desk.
Patent documentation 1: TOHKEMY 2001-319852 communique
A plurality of conveying mechanical arms are carried out in the string heat-extraction system of substrate exchange via fixing substrate trunk desk, become after the conveying mechanical arm of paying substrate one side is placed into the substrate trunk desk with substrate, the conveying mechanical arm of accepting substrate one side is taken the step of this substrate away from the substrate trunk desk.But, if from another viewpoint, then still be after the conveying mechanical arm of accepting substrate one side is taken substrate away from the substrate trunk desk, the conveying mechanical arm of paying substrate one side is placed into another substrate the step of substrate trunk desk.
In a word, importantly can't carry out conveying mechanical arm that the conveying mechanical arm of paying substrate one side is placed into the action of substrate trunk desk with substrate and accepts substrate one side is taken substrate away from the substrate trunk desk action here simultaneously.Two conveying mechanical arms carry out intrinsic separately conveying task independently, must confirm the idle condition of substrate trunk desk when carrying out the exchange of substrate between both sides, also need according to circumstances to carry out interruption controls.Thus, not only cause transfer efficiency to descend, also make the too fat to move and cost raising of control program (software) of conveying mechanical arm.
And, in the string heat-extraction system that the processing unit of a plurality of or other kinds is roughly arranged by the sequential lateral of handling process, each conveying mechanical arm not only makes its conveying arm lifting moving, rotation move, advance and retreat and move, and its manipulator main body is moved in the horizontal direction along being laid on intrasystem guide rail.Like this, owing to heavy conveying mechanical arm moves horizontally with multiaxis, thus cause the transporting velocity of substrate even the further reduction of transfer efficiency, and might produce particle or roll particle.
In other system mode, also can find problem as described above.For example, under the situation that the processing unit with the processing unit of single sheet type and batch processing formula mixes, owing to be difficult to coordinate productive temp separately,, be difficult to make up the string heat-extraction system so as described abovely make a plurality of conveying mechanical arms more remarkable via the shortcoming of substrate trunk desk cooperation way.
Summary of the invention
The present invention is used to solve prior art problems point as described above, and providing a kind of can irrespectively utilize the efficient and high production rate ground of novel substrate mode of movement to carry out the substrate board treatment of a series of processing that substrate is implemented with the kind of individual processing or batch processing.
Substrate board treatment in the 1st viewpoint of the present invention has: the 1st carries road and the 2nd to carry the road, and they are with the extension that is parallel to each other of length along continuous straight runs arbitrarily; The 1st shuttle, it has the objective table that loads a substrate, can be arranged at the above-mentioned the 1st carry the road an end the 1st shipping position be arranged at the above-mentioned the 1st and carry between the 1st unloading position of the other end on road and on above-mentioned the 1st conveying road, move back and forth; The 2nd shuttle, it has the objective table that loads a substrate, can be arranged at the above-mentioned the 2nd carry the road an end the 2nd shipping position be arranged at the above-mentioned the 2nd and carry between the 2nd unloading position of the other end on road and on above-mentioned the 2nd conveying road, move back and forth; The 1st conveying mechanism, it is set to visit above-mentioned the 1st shipping position and the 2nd shipping position, has the 1st conveying arm that one or more is used for conveying substrate in the 1st zone; The 2nd conveying mechanism, it is set to visit above-mentioned the 1st unloading position and the 2nd unloading position, has the 2nd conveying arm that one or more is used for conveying substrate in the 2nd zone; And handling part, for being implemented desirable individual processing or batch processing, substrate is disposed at least one zone in above-mentioned the 1st zone and the 2nd zone, above-mentioned the 1st conveying mechanism use above-mentioned the 1st conveying arm at above-mentioned the 1st shipping position and the 2nd shipping position to above-mentioned the 1st shuttle and the 2nd shuttle mounting substrate one by one, above-mentioned the 2nd conveying mechanism uses above-mentioned the 2nd conveying arm to unload infrabasal plate in above-mentioned the 1st unloading position and the 2nd unloading position one by one from above-mentioned the 1st shuttle and the 2nd shuttle, above-mentioned the 1st shuttle with substrate from of the conveying of above-mentioned the 1st shipping position to above-mentioned the 1st unloading position, with above-mentioned the 2nd shuttle substrate is independently carried out to the conveying of above-mentioned the 2nd unloading position from above-mentioned the 2nd shipping position.
In the substrate board treatment of above-mentioned the 1st viewpoint, as described above, the 1st shuttle independently carries out substrate substrate to the conveying of the 2nd unloading position from the 2nd shipping position from the conveying and the 2nd shuttle of the 1st shipping position to the 1st unloading position.
Here, the 1st conveying mechanism if in the 1st shuttle or the 2nd shuttle any one rest on the 1st shipping position or the 2nd shipping position during load a substrate.The 2nd conveying mechanism if any one of the 1st shuttle or the 2nd shuttle rest on the 1st unloading position or the 2nd unloading position during unload next substrate.Each conveying mechanism is as long as can be directly carry out the handing-over of substrate accordingly with the typing of the 1st shuttle and the 2nd shuttle and periodic reciprocating action or pass on, and need not to consider the mode or the situation of the conveying mechanism of subject side.
Substrate board treatment in the 2nd viewpoint of the present invention has: pipeline, and its upstream side from handling process is carried processed substrate towards the downstream along the direction of level; The 1st conveying mechanism, it is arranged on the above-mentioned pipeline, carries out the handing-over of substrate one by one with the 1st handling part that is disposed at around it; The 2nd conveying mechanism, it is arranged at above-mentioned the 1st conveying mechanism of ratio on the above-mentioned pipeline by the position, downstream, carries out the handing-over of substrate one by one with the 2nd handling part that is disposed at around it; And the 1st shuttle that can move back and forth and the 2nd shuttle, they constitute an interval of above-mentioned pipeline, respectively substrate are also carried out individual conveying from the 1st shipping position and the 2nd shipping position with above-mentioned the 1st conveying mechanism adjacency to the 1st unloading position and the 2nd unloading position loading with above-mentioned the 2nd conveying mechanism adjacency one by one individually.
In the substrate board treatment of the 2nd viewpoint of the present invention, can independently carry out the 1st shuttle with substrate from the 1st shipping position to individual of the 1st unloading position carry and the 2nd shuttle with substrate from individual conveying of the 2nd shipping position to above-mentioned the 2nd unloading position.Therefore, the 1st conveying mechanism if any one of the 1st shuttle or the 2nd shuttle rest on the 1st shipping position or the 2nd shipping position during load a substrate.The 2nd conveying mechanism if any one party of the 1st shuttle or the 2nd shuttle rest on the 1st unloading position or the 2nd unloading position during unload next substrate.Each conveying mechanism if can be directly with the typing of the 1st shuttle and the 2nd shuttle and periodically reciprocating action is corresponding carries out the handing-over of substrate or pass on, need not to consider the mode or the situation of the conveying mechanism of subject side.
Substrate board treatment in the 3rd viewpoint of the present invention has: pipeline, and its upstream side from handling process is carried processed substrate towards the downstream along the direction of level; The 1st conveying mechanism, it is set on the above-mentioned pipeline, carries out the handing-over of substrate one by one with the 1st handling part that is disposed at around it; The 2nd conveying mechanism, it is set at above-mentioned the 1st conveying mechanism of ratio on the above-mentioned pipeline by the position, downstream, carries out the handing-over of substrate one by one with the 2nd handling part that is disposed at around it; And the 1st shuttle that can move back and forth and the 2nd shuttle, they constitute an interval of above-mentioned pipeline, respectively with substrate one by one from the 1st shipping position of above-mentioned the 1st conveying mechanism adjacency and the 2nd shipping position to loading with the 1st unloading position of above-mentioned the 2nd conveying mechanism adjacency and the 2nd unloading position and carry out individual and carry, this substrate board treatment carries out above-mentioned the 1st shuttle to the conveying to substrate of the conveying of substrate and above-mentioned the 2nd shuttle so that certain productive temp is time-interleaved.
In the substrate board treatment of above-mentioned the 3rd viewpoint, as described above, with certain productive temp time-interleaved carry out that the 1st shuttle is carried individual of substrate and the 2nd shuttle to individual conveying of substrate.Here, the 1st conveying mechanism if the 1st shuttle and the 2nd shuttle alternately rest on cycle of productive temp time the 1st shipping position and the 2nd shipping position during load a substrate.The 2nd conveying mechanism if the 1st shuttle and the 2nd shuttle alternately rest on cycle of productive temp time the 1st unloading position and the 2nd unloading position during unload next substrate.Each conveying mechanism is as long as can be directly carry out the handing-over of substrate with the cycle of productive temp time accordingly with the typing of the 1st shuttle and the 2nd shuttle and periodic reciprocating action or pass on, and need not to consider the mode or the situation of the conveying mechanism of subject side.
According to substrate board treatment of the present invention,, can utilize the efficient and high production rate ground of novel substrate mode of movement to carry out a series of processing that substrate is implemented and irrelevant with the kind of individual processing or batch processing by mechanism as described above and effect.
Description of drawings
Fig. 1 is the vertical view of the layout in the system of the substrate board treatment of expression in an embodiment of the invention.
Fig. 2 is the figure of movable range of the conveying arm of expression individual conveying mechanism of being assembled in the aforesaid substrate processing unit.
Fig. 3 is the stereogram of the structure of above-mentioned individual conveying mechanism of expression.
Fig. 4 is the stereogram of structure that expression is assembled in reciprocal (shuttle) delivery section of aforesaid substrate processing unit.
Fig. 5 A is the figure that schematically shows the 1st type of the single sheet type processing unit that is assembled in the aforesaid substrate processing unit.
Fig. 5 B is the figure that schematically shows the 2nd type of the single sheet type processing unit that is assembled in the aforesaid substrate processing unit.
Fig. 6 A be illustrated in the single sheet type processing unit of the 1st type put into, the figure of the situation of each one when taking out substrate.
Fig. 6 B be illustrated in the single sheet type processing unit of the 2nd type put into, the figure of the situation of each one when taking out substrate.
Fig. 7 is the figure that schematically shows the 3rd type of the single sheet type processing unit that is assembled in the aforesaid substrate processing unit.
Fig. 8 schematically shows the batch processing formula that is assembled in the aforesaid substrate processing unit to burn till the figure of the structure of unit.
Fig. 9 A is above-mentioned individual conveying mechanism of expression carries out the action of putting into, taking out of substrate to each processing unit the figure in each stage.
Fig. 9 B is above-mentioned individual conveying mechanism of expression carries out the action of putting into, taking out of substrate to each processing unit the figure in each stage.
Figure 10 A is the figure that above-mentioned individual conveying mechanism of expression carries out each stage when the top shuttle of upstream side takes off the action of substrate and substrate is loaded into the action of bottom shuttle in downstream simultaneously.
Figure 10 B is the figure that above-mentioned individual conveying mechanism of expression carries out each stage when the bottom shuttle of upstream side takes off the action of substrate and substrate is loaded into the action of top shuttle in downstream simultaneously.
Figure 11 A is the figure that above-mentioned individual conveying mechanism of expression carries out each stage when the bottom shuttle of upstream side takes off the action of substrate and substrate is loaded into the action of top shuttle in downstream successively.
Figure 11 B is the figure that above-mentioned individual conveying mechanism of expression carries out each stage when the bottom shuttle of upstream side takes off the action of substrate and substrate is loaded into the action of top shuttle in downstream successively.
Figure 12 is that expression the 1st is passed on above-mentioned individual conveying mechanism in the mode a series of and passed on the figure of action step.
Figure 13 is that expression the 2nd is passed on above-mentioned individual conveying mechanism in the mode a series of and passed on the figure of action step.
Figure 14 is that expression the 3rd is passed on above-mentioned individual conveying mechanism in the mode a series of and passed on the figure of action step.
Figure 15 is that the batch that a pair of above-mentioned batch processing formula of expression is burnt till in the unit burns till the figure in the cycle of processing and substrate exchange action.
Figure 16 is the vertical view of layout of treatment system of whole operations of expression manufacture process that concentrate to implement DSSC (Figure 17).
Figure 17 is the longitudinal section of the essential structure of expression DSSC.
Embodiment
Below, with reference to accompanying drawing preferred implementation of the present invention is described.
The system configuration of having represented the substrate board treatment in an embodiment of the invention among Fig. 1.For example in the manufacture process of as shown in Figure 17 DSSC, make with opposite electrode (anode) in the operation of tinkertoy module of the transparent substrate side before bonding and use this substrate board treatment with string row.
As the essential structure of this DSSC, between transparency electrode (negative electrode) 200 and opposite electrode (anode) 202, clip the semiconductor microactuator granulosa 204 and the dielectric substrate 206 of the porous matter that is used to carry sensitizing dyestuff.Here, semiconductor microactuator granulosa 204 is split into battery unit (cell) unit with transparency electrode 200, dielectric substrate 206 and opposite electrode 202, and is formed on the transparency carrier 208 via transparency electrode 200.Opposite electrode 202 is formed on the counter substrate 210 via basal electrode 205.The transparency electrode 200 of each battery unit is electrically connected with adjacent opposite electrode 202, and a plurality of battery units are electrically connected in series or in parallel the electrical connection in module whole.
In the DSSC of said structure, as if the backside illuminated visible light from transparency carrier 208, then the dyestuff that semiconductor microactuator granulosa 204 carried is excited and discharges electronics.The electronics that discharges is directed to transparency electrode 200 via semiconductor microactuator granulosa 204, and is sent to the outside.The electronics that is sent turns back to opposite electrode 202 via external circuit (not shown), is received by the dyestuff in the semiconductor microactuator granulosa 204 once more via the ion in the dielectric substrate 206.Like this, can with transform light energy be electric power and output immediately.
In the substrate board treatment of this execution mode, put into following transparency carrier 208 as untreated processed substrate G, above-mentioned transparency carrier 208 is formed with the transparency conducting layer that transparency electrode 200 is patterned cover layer (blanket) before.Then, string row ground to each substrate G carry out successively patterning, the semiconductor microactuator granulosa 204 of transparency electrode 200 film forming, burn till and dyestuff to these a series of main processing and these main incidental vice processings (clean, heat treatment etc.) of handling of absorption of porous matter semiconductor microactuator granulosa 204.As a result, make with opposite electrode (anode) 202 tinkertoy module (208/200/204) of transparency carrier 208 sides before bonding.And, the tinkertoy module of these transparency carrier 208 sides is offered other substrate board treatments of carrying out next process as the substrate G that disposes.Substrate G in this execution mode has the shape of square or rectangle.
［ structure that device is whole ］
In Fig. 1, the processing mounting table that this substrate board treatment will be grown crosswise (process stage) 10 is disposed at system centre portion, and linking at the both ends of its long side direction (directions X) has loading machine 12 and unloader 14.
Loading machine 12 is the ports that for example utilize waggon voluntarily that untreated substrate G is moved into box (cassette) unit, possess: box mounting table (cassette stage) 16, it arranges a plurality of box C of mounting in system-wide direction (Y direction), and above-mentioned box C takes in many (for example 25) untreatment base G so that flat-hand position is longitudinally stacked; With loading machine conveying mechanism 18, be that unit takes out substrate G with one its any box C on this mounting table 16, put into the substrate G that is taken out to handling mounting table 10.Loading machine conveying mechanism 18 has: the main body 18a that moves with Y, Z, three axles of θ and one can advance and retreat on this main body 18a or the conveying arm 18b of telescopic moving, and this loading machine conveying mechanism 18 can carry out the exchange of substrate G via the fixing substrate trunk desk 20 and processing mounting table 10 sides of adjacency.
Unloader 14 is the ports that for example utilize waggon voluntarily that the substrate G that disposes is taken out with box unit, possess: box mounting table 22, it arranges a plurality of box C of mounting in system-wide direction (Y direction), and above-mentioned box C receives the substrate G that many (25) dispose with the overlapping of flat-hand position longitudinal layer; With unloader conveying mechanism 24, it one by one is accommodated in any box C on this mounting table 22 with the substrate G that disposes.Unloader conveying mechanism 24 has: the main body 24a that moves with Y, Z, three axles of θ and one can advance and retreat on this main body 24a or the conveying arm 24b of telescopic moving, and this unloader conveying mechanism 24 can carry out the exchange of substrate G via the fixing substrate trunk desk 26 and processing mounting table 10 sides of adjacency.
Handle mounting table 10 and have from loading machine 12, dispose a plurality of and multiple processing unit 44～54 described later in its left and right sides across this pipeline 28 towards the pipeline 28 of unloader 14 along the straight extension of system's long side direction (directions X).
On pipeline 28, a plurality of (in the illustrated embodiment being four) individual conveying mechanism 30,32,34,36 replaces alignment arrangements with a plurality of (three) reciprocal transportation portion 38,40,42 and becomes row.
More specifically, the 1st individual conveying mechanism 30 is positioned at the upstream on the pipeline 28 in handling process, be clipped in and the substrate trunk desk 20 and the 1st reciprocal transportation portion 38 of loading machine 12 adjacency between.In the 1st zone of extending, dispose one or more single sheet type cleaning unit 44 of processed that is used for cleaning base plate G one by one and one or more respectively and be used for one by one the single sheet type patterning unit 46 that transparency conducting layer on substrate G processed is patterned as transparency electrode 200 to the left and right sides of the 1st individual conveying mechanism 30.Wherein, though be applicable to individual all processing units, when a plurality of identical single sheet type processing unit of centralized configuration in this substrate board treatment, can preferably adopt the vertical stacked structure in these a plurality of unit.
The 2nd individual conveying mechanism 32 is positioned at the downstream of the 1st individual conveying mechanism 30 on pipeline 28, by the 1st reciprocal transportation portion 38 and 40 clampings of the 2nd reciprocal transportation portion.In the 2nd zone of extending, dispose one or more respectively and be used for one by one the single sheet type effect utmost point at film forming on processed of substrate G (for example printing applies) semiconductor microactuator granulosa (the effect utmost point) 204 and become film unit 48 and one or more to be used for one by one the single sheet type thermal treatment unit 50 that the processed face to the substrate G after applying toasts to the left and right sides of the 2nd individual conveying mechanism 32.
The 3rd individual conveying mechanism 34 is positioned at the downstream of the 2nd individual conveying mechanism 32 on pipeline 28, by the 2nd reciprocal transportation portion 40 and 42 clampings of the 3rd reciprocal transportation portion.In the 3rd zone of extending, dispose and a pair ofly be used for that many (for example 100) are formed on the batch processing formula that the semiconductor microactuator granulosa (the effect utmost point) 204 on the substrate G burns till in the lump and burn till unit 52A, 52B to the left and right sides of the 3rd individual conveying mechanism 34.
The 4th individual conveying mechanism 36 is positioned at the downstream of the 3rd individual conveying mechanism 34 on pipeline 28, by the 3rd reciprocal transportation portion 42 and with substrate trunk desk 26 clampings of unloader 14 adjacency.In the 4th zone of extending, dispose the single sheet type dyestuff absorbing unit 54 of one or more semiconductor microactuator granulosa that is used to make the porous matter that is formed on the substrate G (the effect utmost point) 204 absorption sensitizing dyestufves to the left and right sides of the 4th individual conveying mechanism 36.
Structure and the conveying arm movable range of having represented the 2nd individual conveying mechanism 32 among Fig. 2 and Fig. 3.The 1st individual conveying mechanism the 30, the 3rd individual conveying mechanism 34 and the 4th individual conveying mechanism 36 also have structure and the function identical with the 2nd individual conveying mechanism 32.
Individual conveying mechanism 32 has can be along azimuth direction (θ direction) rotation and can be in vertical (Z direction) lifting, and can carry out the advance and retreat of level or two sections conveying arm MU, the ML of telescopic moving respectively independently.More specifically, as shown in Figure 3, individual conveying mechanism 32 for example constitutes carries main body 60U, 60L to be overlapped into two sections and be installed on the lift drive shaft 58 of the fixed lifting drive division 56 with linear motor or ball screw framework in mode that can lifting top and bottom, and make and respectively carry main body 60U, 60L can distinguish independently to move to orientation arbitrarily, and constitute and to make two conveying arm MU, ML carry advance and retreat or telescopic moving on main body 60U, the 60L independently respectively in lift drive shaft 58 upper edge azimuth directions (θ direction) rotation.Each conveying arm MU, ML constitute the substrate G with the mode mounting that can load and unload one by one, carrying or maintenance rectangle.
As shown in Figure 2, any processing unit A(single sheet type effect utmost point that individual conveying mechanism 32 of this structure can be visited configuration in the 2nd zone becomes film unit 48) and B(single sheet type thermal treatment unit 50) and shuttle KSU/ bottom, the top shuttle KSL of shuttle JSU/ bottom, the top shuttle JSL of upstream side (the 1st reciprocal transportation portion 38) and downstream (the 2nd reciprocal transportation portion 40) in any one, can visit the exchange that the destination is carried out substrate G one by one at each.
Wherein, for the 1st individual conveying mechanism 30 of the upstream that is positioned at pipeline 28, fixing substrate trunk desk 20 is replaced into upstream side shuttle JSU/JSL.This substrate trunk desk 20 disposes a pair of mounting table 20U, 20L in overlapping two sections mode up and down, and above-mentioned a pair of mounting table can be come this substrate of horizontal supporting in a plurality of fulcrum posts or lifter pin with a substrate G mounting.From the 1st individual conveying mechanism 30, top mounting table 20U is equivalent at the top of the static upstream side of unloading position shuttle JSU, and bottom mounting table 20L is equivalent at the bottom of the static upstream side of unloading position shuttle JSL.
In addition, for the 4th individual conveying mechanism 36 in the downstream that is positioned at pipeline 28, fixing substrate trunk desk 26 is replaced into downstream shuttle KSU/KSL.This substrate trunk desk 26 is identical with substrate trunk desk 20, also is to dispose a pair of mounting table 26U, 26L in overlapping two sections mode up and down, and above-mentioned a pair of mounting table can be come this substrate of horizontal supporting in a plurality of fulcrum posts or lifter pin with a substrate G mounting.From the 4th individual conveying mechanism 36, top mounting table 26U is with corresponding at the top in the static downstream of shipping position shuttle KSU, and bottom mounting table 26L is with corresponding at the bottom in the static downstream of shipping position shuttle KSL.
［ structure of reciprocal transportation portion ］
Structure and the shuttle movable range of having represented the 1st reciprocal transportation portion 38 among Fig. 4.The 2nd reciprocal transportation portion 40 and the 3rd reciprocal transportation portion 42 also have structure and the function identical with the 1st reciprocal transportation portion 38.
As shown in the figure, reciprocal transportation portion 38 has: conveying road, top 62 and conveying road, bottom 64, and they separate certain interval or space in vertical, and extend in parallel with length arbitrarily along system's long side direction (directions X); With top shuttle SU and bottom shuttle SL, they on above-mentioned conveying road 62,64 independently straight line move.Each shuttle SU, SL have the objective table 66 that a substrate G level is loaded.This objective table 66 is provided with four jiaos maintaining part 68 keeping substrate G and a plurality of substrate G that makes with the lifter pin 70 of flat-hand position lifting etc. when loading and unloading (load/unload) substrate G.With motor or cylinder etc. is drive source, and the straight line that uses straight-moving mechanisms such as LM guide rail, ball-screw or conveyer belt to carry out each shuttle SU, SL moves.
Be respectively arranged with for mounting substrate G in the end of the upstream side (left side of figure) of carrying road 62,64 and two shuttle SU, SL stopped and temporary transient top shipping position FU and the bottom shipping position FL that stops.On the other hand, be respectively arranged with in order to unload carried base board G in the end in the downstream (right side of figure) of carrying road 62,64 and two shuttle SU, SL stopped and temporary transient top unloading position WU and the bottom unloading position WL that stops.
Top shuttle SU is stopping certain time interval T for mounting substrate G at top shipping position FU FUAfter, move to outlet direction (directions X) straight line on conveying road, top 62 with certain speed or certain traveling time, behind the top unloading position WU that reaches home, stop at this position, stop certain time interval T in order to unload carried base board G WUAnd, at process this time of staying T WUAfter, move to loop direction (directions X) straight line on conveying road, top 62 with certain speed or certain traveling time from top unloading position WU with the dummy status that does not have substrate, behind the top shipping position FU that reaches home, stop at this position, stop certain time interval T in order to load new substrate G FUTop shuttle SU with certain cycle, be 2T SCarry out repeatedly by loading as described above, a series of actions of going, unloading, reversing and constitute.Here, T SIt is the productive temp time of the entire system in this substrate board treatment.
Equally, shuttle SL in bottom is stopping certain time interval T for mounting substrate G at bottom shipping position FL FLAfter, move to outlet direction (directions X) straight line on conveying road, bottom 64 with certain speed, behind the bottom unloading position WL that reaches home, stop at this position, stop certain time interval T in order to unload this substrate G WLAnd, at process this time of staying T WLAfter, move to loop direction (directions X) straight line on conveying road, bottom 64 with certain speed or certain traveling time from bottom unloading position WL with the dummy status that does not have substrate, behind the bottom shipping position FL that reaches home, stop at this position, stop certain time interval T in order to load new substrate G FLBottom shuttle SL also with certain cycle, be 2T SCarry out repeatedly by loading as described above, a series of actions of going, unloading, reversing and constitute.
And the reciprocating action of the reciprocating action of top shuttle SU and bottom shuttle SL is the relation of mutual conversion period or phase reversal.That is, when top shuttle SU rested on top shipping position FU for mounting substrate G, bottom shuttle SL stopped the identical time in order to unload carried base board G at bottom unloading position WL.That is T, FU=T WLAnd, as top shuttle SU mounting substrate G and from top shipping position FU towards top unloading position WU with certain speed or certain traveling time on conveying road, top 62 towards outlet direction (directions X) when straight line moves, bottom shuttle SL moves at conveying road, bottom loop, 64 upper edge direction (directions X) straight line with identical speed or identical traveling time towards bottom shipping position FL from bottom unloading position WL with the dummy status of mounting substrate not simultaneously.
When top shuttle SU rested on top unloading position WU in order to unload carried base board G, bottom shuttle SL stopped the identical time for mounting substrate G at bottom shipping position FL.That is T, FL=T WUAnd, as bottom shuttle SL mounting substrate G and from bottom shipping position FL towards bottom unloading position WL with certain speed or certain traveling time on conveying road, bottom 64 towards outlet direction (directions X) when straight line moves, top shuttle SU moves at conveying road, top loop, 62 upper edge direction (directions X) straight line with identical speed or identical traveling time towards top shipping position FU from top unloading position WU with the dummy status of mounting substrate not simultaneously.In a word, existence concerns T FU=T WL=T FL=T WU
Like this, in the substrate board treatment of this execution mode, by each productive temp time T SHocket utilize top shuttle SU with substrate G from top shipping position FU to individual conveying of top unloading position WU and utilize bottom shuttle SL with substrate G from bottom shipping position FL individual conveying to bottom unloading position WL.And, between the 38, the 2nd reciprocal transportation portion 40 of the 1st reciprocal transportation portion and the 3rd reciprocal transportation portion 42, simultaneously, promptly carry out individual conveying that replaces of carrying out by top shuttle SU as described above and bottom shuttle SL synchronously.
［ structure of processing unit ］
Represented to be assembled in the type of single sheet type processing unit of the substrate board treatment of this execution mode among Fig. 5 A and Fig. 5 B.
In the 1st type shown in Fig. 5 A, with substrate G horizontal positioned on the mounting table 74 that is provided with at the central part of process chamber or chamber 72, use can be above mounting table 74 surface (processed face) of 76 couples of substrate G of moving of along continuous straight runs and vertical implement individual required processing.For example, use the single sheet type effect utmost point of the single sheet type cleaning type unit 44 of brush scrubber or ultraviolet cleaning device, the single sheet type patterning unit 46 that uses the laser-induced thermal etching device and use screen process press to become film unit 48, use the single sheet type dyestuff absorbing unit 54 of nozzle-type dyestuff adsorbent equipment to be the 1st type.Under this situation, brush scrubber 76 on be equipped with rotating brush, the ultraviolet ray cleaning device 76 on be equipped with ultra-violet lamp, the laser-induced thermal etching device 76 on be equipped with the laser injection unit, screen process press 76 on be equipped with scraper plate etc., nozzle-type dyestuff adsorbent equipment 76 on be equipped with gap nozzle outlet length and substrate G about equally nozzle or have the nozzle of the corresponding outlets such as tubular, slit-shaped or circle of a plurality of and each semiconductive particles layer.
In the 2nd type shown in Fig. 5 B, with substrate G horizontal positioned to rotating suction disc 82 that the rotary driving part 80 that is provided with at the central part of process chamber or chamber 78 combines on, and it is remained and can rotate, use can be above rotating suction disc 82 surface (processed face) of 84 couples of substrate G of moving of along continuous straight runs and vertical implement needed individual processing.For example, using the single sheet type dyestuff absorbing unit 54 of nozzle-type dyestuff adsorbent equipment is the 2nd type.In addition, use under the situation of cleaning systems at single sheet type cleaning unit 44, single sheet type patterning unit 46 uses under the situation of Wet-type etching devices, also is the 2nd type.Under this situation, be equipped with the nozzle of ejection dye solution, be equipped with the nozzle of jet cleaning liquid, be equipped with the nozzle of ejection etching solution at 84 of Wet-type etching device at 84 of cleaning system at 84 of nozzle-type dyestuff adsorbent equipment.
The loading of the substrate in the single sheet type processing unit of the above-mentioned the 1st and the 2nd type, the action of unloading have been represented among Fig. 6 A and Fig. 6 B.
In the 1st type (Fig. 6 A), the substrate G that finishes when hand-off process on mounting table 74 iWith the substrate G that next accepts to handle jThe time, at first many lifter pins 86 rise (giving prominence to) from mounting table 74 and lift the substrate G that disposes iAt this, the conveying arm of dummy status (for example top conveying arm MU) enters into process chamber 72 from the substrate gateway 75 of the sidewall of process chamber 72, accepts the substrate G that disposes from lifter pin 86 i, with the substrate G that receives iBe taken out to outside the process chamber 72.Lifter pin 86 temporarily descends.Afterwards, in this single sheet type processing unit, maintain the substrate G that next should accept individual processing jBottom conveying arm ML enter into process chamber 72, lifter pin 86 rises once more and accepts this substrate G afterwards jAnd after the bottom conveying arm ML that becomes dummy status reached outside the process chamber 72, lifter pin 86 dropped in the mounting table 74, made substrate G jBy mounting on mounting table 74.
In the 2nd type (Fig. 6 B), near the lifter pin 88 that also makes in rotary driving part 80 or be provided with it carries out lifting action with above-mentioned lifter pin 86 similarly collaborative conveying arm MU, ML, can similarly exchange the substrate G that disposes on rotating suction disc 82 with above-mentioned situation thus iWith the substrate G that next accepts to handle j
The 3rd type of having represented the single sheet type processing unit that this substrate board treatment comprised among Fig. 7.The 3rd type is used to single sheet type thermal treatment unit 50, can and carry the plate 90 of a substrate G to put into, take out with respect to main body thermal chamber 92 as pulling out with slidingtype with mounting.During heat-treating, plate 90 standby outside main body thermal chamber 92 (c).And after heat treatment finished, plate 90 entered into main body thermal chamber 92 and accepts substrate G, the substrate G that receives is got the outside and expose certain hour under atmosphere and cool off (b).Then, lifter pin 94 and the collaborative lifting action that carries out of conveying arm MU, ML that plate 90 is possessed are thus with the above-mentioned substrate G that similarly exchange disposes on plate 90 iWith next substrate G j(a).
Represented among Fig. 8 that the batch processing formula that substrate board treatment comprised of this execution mode burns till unit 52A(52B) structure example.This batch processing formula is burnt till unit 52A(52B) constitute vertical thermal processing apparatus, have: the longitudinal type heating furnace 96 of tubular, can be accommodated in the longitudinal type substrate boat (boat) 98 of this heating furnace 96, from the below via the boat supporting arm 102 of these substrate boats 98 of heat-preservation cylinder 100 supporting and the elevating mechanism 104 that makes boat supporting arm 102 lifting moving for substrate boat 98 is put into, taken out with respect to heating furnace 96.On the many substrate supporting rods 106 that extend in parallel of substrate boat 98, separate certain intervals and be formed with a plurality of being used for the substrate G of batch processing number (for example 100) is remained the maintenance groove (slot) that can load and unload.
Burn till unit 52A(52B in this batch processing formula) in, if burning till processing, a batch processing formula finishes, then like that substrate boat 98 is moved to heating furnace 96 outsides (below) as shown in the figure.Here, conveying arm MU, the ML of the 3rd individual conveying mechanism 34 visit each slot of substrate boat 98 successively, exchange the substrate G that disposes one by one iWith the substrate G before the processing j
［ elemental motion of individual conveying mechanism ］
With reference to Fig. 9 A and Fig. 9 B each individual each each single sheet type processing unit or each batch processing formula processing unit of being responsible in the zone of conveying mechanism 30,32,34,36 visits is exchanged the substrate G that disposes iWith the substrate G before the processing jAction describe.
At first, shown in Fig. 9 A (a), this individual conveying mechanism two conveying arm MU, ML are withdrawn into original position or the state of the position of reversing under, separately conveying main body 60U, 60L lifting moving and rotation are moved, with two conveying arm MU, ML place as access object processing unit (not shown) nearby.At this moment, the substrate G before among two conveying arm MU, the ML, for example bottom conveying arm ML are keeping handling in the processing unit of this access object jAnother arm, be that top conveying arm MU is the dummy status that does not have substrate G.The top conveying arm MU of this dummy status and height and position that substrate delivery/reception is used are coincide.
Next, shown in Fig. 9 A (b), this individual conveying mechanism advances the top conveying arm MU of dummy status or extends and moves to moving position, utilizes top conveying arm MU to accept the substrate G that disposes from the processing unit of this access object iNext, shown in Fig. 9 A (c), make top conveying arm MU retreat or shorten and move to original position, take out of the substrate G that disposes from this processing unit i
Taking out of the substrate G that disposes like this iAfterwards, shown in Fig. 9 B (d), this individual conveying mechanism carries out lifting moving (illustrated situation moves for rising) immediately, makes the substrate G that maintains before handling jBottom conveying arm ML and the height and position used of substrate delivery/reception coincide.Next, shown in Fig. 9 B (e), bottom conveying arm ML is advanced or extends to move to moving position, with the substrate G before handling jMove into and be sent in this processing unit.And shown in Fig. 9 B (f), making becomes the bottom of dummy status conveying arm ML and retreats or shorten and move to original position.
Each individual conveying mechanism 30,32,34,36 in this execution mode can be simultaneously or is parallelly carried out following action: uses two conveying arm MU, ML shuttle JSU/JSL or the substrate trunk desk 20(20U/20L from the upstream side that is adjacent) take off the action of a substrate G and to the shuttle KSU/KSL or the substrate trunk desk 26(26U/26L in the downstream that is adjacent) action of a substrate G of loading.
Represented among Figure 10 A that the top shuttle JSU from upstream side unloads next substrate G in each individual conveying mechanism 30,32,34,36 j, meanwhile the bottom shuttle KSL to the downstream loads a substrate G iAction.Under this situation, shown in Figure 10 A (a), this individual conveying mechanism two conveying arm MU, ML are returned to original position or the state of the position of reversing under, separately conveying main body 60U, 60L lifting moving and rotation are moved, thereby top conveying arm MU is placed the top shuttle JSU of upstream side, bottom conveying arm ML is placed the bottom shuttle KSL in downstream.At this moment, top conveying arm MU is a dummy status, and bottom conveying arm ML is keeping substrate G iIn addition, the top shuttle JSU of upstream side is mounted with substrate G j, the bottom shuttle KSL in downstream is a dummy status.
Next, shown in Figure 10 A (b), this individual conveying mechanism advances top conveying arm MU or extends and moves and unload (acceptance) substrate G from the top shuttle JSU of upstream side j, bottom conveying arm ML is advanced or extend and move, load (handing-over) substrate G at the bottom in downstream shuttle KSL iAfter this, shown in Figure 10 A (c), top conveying arm MU and bottom conveying arm ML are returned to original position.
Represented among Figure 10 B that the bottom shuttle JSL from upstream side unloads next substrate G in each individual conveying mechanism 30,32,34,36 j, meanwhile load a substrate G at the top in downstream shuttle KSU iAction.Under this situation, shown in Figure 10 B (a), this individual conveying mechanism two conveying arm MU, ML are returned to original position or the state of the position of reversing under, separately conveying main body 60U, 60L lifting moving and rotation are moved, thereby bottom conveying arm ML is placed the bottom shuttle JSL of upstream side, top conveying arm MU is placed the top shuttle KSU in downstream.At this moment, bottom conveying arm ML is a dummy status, and top conveying arm MU is keeping substrate G iIn addition, the bottom shuttle JSL of upstream side is mounted with substrate G j, the top shuttle KSU in downstream is empty.
Next, shown in Figure 10 B (b), this individual conveying mechanism advances bottom conveying arm ML or extends and moves and unload (acceptance) substrate G from the bottom shuttle JSL of upstream side j, top conveying arm MU is advanced or extends and move and load (handing-over) substrate G at the top in downstream shuttle KSU iAfter this, shown in Figure 10 B (c), top conveying arm MU and bottom conveying arm ML are returned to original position.
In addition, as other mode of movement, each individual conveying mechanism 30,32,34,36 in this execution mode can walk abreast or carry out following action successively: use among two conveying arm MU, the ML one, for example top conveying arm MU from the shuttle JSU/JSL or the substrate of upstream side platform 20(20U/20L to be set specially) take off the action of a substrate G and use another arm specially, be that shuttle KSU/KSL or the substrate of bottom conveying arm ML in the downstream is provided with platform 26(26U/26L) action of loading a substrate G.
For example, portion's conveying arm MU unloads next substrate G from the top shuttle JSU of upstream side in the use jAnd use bottom conveying arm ML to load a substrate G at the bottom in downstream shuttle KSL iThe time, can carry out the action parallel or while same with Figure 10 A.But portion's conveying arm MU unloads next substrate G from the bottom shuttle JSL of upstream side in the use jAnd use bottom conveying arm ML to load a substrate G at the top in downstream shuttle KSU iThe time, become the action of shown in Figure 11 A and Figure 11 B, carrying out successively like that.
At first, shown in Figure 11 A (a), this individual conveying mechanism makes carries main body 60U, 60L lifting moving and rotation to move, and will keep substrate G iBottom conveying arm ML place the top shuttle KSU in downstream.Next, shown in Figure 11 A (b), bottom conveying arm ML is advanced or extend and move, load (handing-over) substrate G at the top in downstream shuttle KSU iAfter this, shown in Figure 11 A (c), the bottom conveying arm ML of sky is returned to original position.
Next, shown in Figure 11 B (d), this individual conveying mechanism makes carries main body 60U, 60L lifting moving and rotation to move, and the top conveying arm MU of dummy status is placed the bottom shuttle JSL of upstream side.Next, shown in Figure 11 B (e), top conveying arm MU is advanced or extend and move, unload (acceptance) substrate G from the bottom shuttle JSL of upstream side jAfter this, shown in Figure 11 B (f), will keep substrate G jTop conveying arm MU be returned to original position.
［ treatment step of whole operation ］
Here, during this substrate board treatment is handled at a substrate G nThe treatment step of whole operation describe.
At first, in loading machine 12, extract a substrate G loading machine conveying mechanism 18 any one box C on mounting table 16 out n, with the substrate G of this extraction nMounting in substrate trunk desk 20, be top mounting table 20U or bottom mounting table 20L.
After this, with this substrate G nMounting is under the situation of top mounting table 20U, and the 1st individual conveying mechanism 30 utilizes top conveying arm MU to take off this substrate G n, with this substrate G nMounting is under the situation of bottom mounting table 20L, and the 1st individual conveying mechanism 30 utilizes bottom conveying arm ML to take off this substrate G n, and with this substrate G nMove into single sheet type cleaning unit 44.At this moment, with substrate G nMove into before this single sheet type cleaning unit 44, take out of other substrates of just having finished clean by this unit 44.
In this single sheet type cleaning unit 44, utilize cleaning head 76(84) to mounting or remain on mounting table 74 or rotating suction disc 82 on substrate G nProcessed (tectal transparency conducting layer) implement the clean of individual mode.By this clean, from substrate G nProcessed face remove foreign matter, dirt.
If the clean of individual mode as described above finishes, then the 1st individual conveying mechanism 30 is with substrate G nTake out of from this single sheet type cleaning unit 44, and move into the single sheet type patterning unit 46 of the opposite side that in the 1st zone, is disposed at pipeline 28.At this moment, also with substrate G nMove into before this single sheet type patterning unit 46, other substrates of just having finished patterned process by this unit 46 are taken out of.
In this single sheet type patterning unit 46,, utilize 76 pairs of laser injection heads to be positioned in substrate G on the mounting table 74 by for example laser-induced thermal etching method nProcessed (tectal transparency conducting layer) implement the patterned process of individual mode.By this patterned process, at substrate G nProcessed transparency electrode 200 that forms behind the patterning.
Wherein, transparency conducting layer and transparency electrode 200 are for example by fluorine doping SnO 2(FTO) or indium tin oxide (ITO) form.In addition, as substrate G nThe transparency carrier 208 of mother metal for example form by transparent plastic materials such as transparent inorganic materials such as quartz, glass or polyester fiber, acrylic resin, polyimides.
If the patterned process of individual mode as described above finishes, then the 1st individual conveying mechanism 30 is with this substrate G nTake out of from this single sheet type patterning unit 46, be loaded into the top shuttle SU or the bottom shuttle SL of the 1st reciprocal transportation portion 38.Loaded substrate G nThe top shuttle SU or the bottom shuttle SL of the 1st reciprocal transportation portion 38 move to unloading position (WU or WL) from its shipping position (FU or FL).
If this substrate G nArrived the unloading position (WU or WL) of the 1st reciprocal transportation portion 38, then the 2nd individual conveying mechanism 32 unloads this substrate G n, and with its move into the 2nd the zone in single sheet type effect utmost point become film unit 48.Under this situation, also with substrate G nMove into this single sheet type effect utmost point and become before the film unit 48, will be have just finished other substrates that the film forming of the effect utmost point (semiconductor microactuator granulosa) 204 handles and taken out of by this unit 48.
Become in the film unit 48 at the single sheet type effect utmost point, for example, utilize the substrate G on 76 pairs of mounting tables 74 of print head by silk screen print method nProcessed (transparency electrode 200 of patterning) film forming of implementing individual mode handle.Handle by this film forming, at substrate G nProcessed semiconductor microactuator granulosa 204 that forms behind the patterning.Wherein, semiconductor microactuator granulosa 204 is for example by T iO 2, ZnO, SnO 2Form Deng metal oxide.
If the effect utmost point film forming processing of individual mode as described above finishes, then the 2nd individual conveying mechanism 32 is with this substrate G nBecome film unit 48 to take out of from this single sheet type effect utmost point, move into the single sheet type thermal treatment unit 50 of the opposite side that in the 2nd zone, is disposed at pipeline 28.At this moment, also with substrate G nMove into before this single sheet type thermal treatment unit 50, will just finish heat treated other substrates and take out of by this unit 50.
In single sheet type thermal treatment unit 50, utilize main body thermal chamber 92 with substrate G nWith set point of temperature heating certain hour, the semiconductor microactuator granulosa 204 that the baking substrate is processed.And, after baking finishes, utilize plate 90 with substrate G nFrom main body thermal chamber 92 move to the outside, on plate 90 with substrate G nBe cooled to normal temperature.Improve the connecting airtight property of semiconductor microactuator granulosa 204 by this heat treatment.
If the heat treatment of individual mode as described above finishes, then the 2nd individual conveying mechanism 32 is with this substrate G nTake out of from this single sheet type thermal treatment unit 50, be loaded into the top shuttle SU or the bottom shuttle SL of the 2nd reciprocal transportation portion 40.Loaded substrate G nThe top shuttle SU or the bottom shuttle SL of the 2nd reciprocal transportation portion 40 be delivered to unloading position (WU or WL) from its shipping position (FU or FL).
The 3rd individual delivery section 34 will arrive the substrate G of the unloading position (WU or WL) of the 2nd reciprocal transportation portion 40 nUnload, move into any one party that the batch processing formula in the 3rd zone is burnt till unit 52A or 52B.At this moment, with substrate G nBe encased in this batch processing formula and burn till unit 52A(or 52B) corresponding slot before, will be from this slot by this unit 52A(or 52B) finished other substrates that burn till processing and taken out, and move to outside the unit.
Burn till unit 52A(52B in the batch processing formula) in, as the substrate G before substrate boat 98 is with batch processing number (100 s') processing 1～G 100(comprising substrate G n) all get all the ready after, utilize elevating mechanism 104 that boat supporting arm 102 is risen, substrate boat 98 is inserted or is loaded in the heating furnace 96.Then, in heating furnace 96 with the substrate G on the substrate boat 98 1～G 100With the temperature heating stipulated time of regulation, the result is at each substrate G 1～G 100Processed on obtain the sintered body of semiconductor microactuator granulosa 204.
If the processing of burning till of batch mode as described above finishes, then elevating mechanism 104 descends boat supporting arm 102, and substrate boat 98 is fetched into outside the heating furnace 96, exposes certain hour and cools off at airspace.The 3rd individual conveying mechanism 34 is with the productive temp time T SCycle access this batch processing formula that batch processing formula burns till processing (burning till+cool off) that is through with burn till unit 52A(52B), the substrate G that disposes of exchange one by one in each slot on substrate boat 98 1～G 100With the substrate G before the heat treated processing of the batch processing formula next time of accepting 101～G 200
Like this, utilize the 3rd individual conveying mechanism 34 will finish the substrate G that burns till processing nBurn till unit 52A(52B from the batch processing formula) take out of, and be loaded into the top shuttle SU or the bottom shuttle SL of the 4th reciprocal transportation portion 42.Loaded substrate G nThe top shuttle SU or the bottom shuttle SL of the 4th reciprocal transportation portion 42 be delivered to unloading position (WU or WL) from its shipping position (FU or FL).
The 4th individual delivery section 36 will arrive the substrate G of the unloading position (WU or WL) of the 3rd reciprocal transportation portion 42 nUnload, and the dyestuff of the single sheet type arbitrarily absorbing unit 54 in the 4th zone is moved into this substrate G nAt this moment, with substrate G nMove into before this single sheet type dyestuff absorbing unit 54, other substrates that will just finish dye adsorbing process from this unit 54 take out, and move to outside the unit 54.
Moving into substrate G nSingle sheet type dyestuff absorbing unit 54 in, the substrate G that utilizes 84 pairs of nozzle heads on rotating suction disc 82, to rotatablely move nProcessed (the semiconductor microactuator granulosa 204 of porous matter) jet-dye solution implement the dye adsorbing process of individual mode.By this dye adsorbing process, make sensitizing dyestuff be adsorbed in substrate G nProcessed on porous matter semiconductor microactuator granulosa 204.Wherein, the dye solution that uses in this dyestuff absorbing unit 54 is that sensitizing dyestuff is dissolved in the solution that forms in the solvent with the concentration of stipulating.As sensitizing dyestuff, for example section uses organic dyestuff such as metal complex such as metal phthalocyanine or flower cyanines based dye, basic-dyeable fibre.For solvent, for example can use alcohols, ethers, amide-type, hydrocarbon etc.
If the dye adsorbing process of individual mode as described above finishes, then the 4th individual conveying mechanism 36 is with this substrate G nTake out of from this single sheet type dyestuff absorbing unit 54, mounting in substrate trunk desk 26, be top mounting table 26U or bottom mounting table 26L.Afterwards, unloader conveying mechanism 24 from substrate trunk desk 26 with substrate G nTake off, take in the substrate G that disposes among any one the box C on mounting table 22 n
［ mode of passing on 1 of individual conveying mechanism ］
With reference to Figure 12, utilize the 1st mode of passing on that substrate G is described from a series of actions that the shuttle JSU/JSL of upstream side transfers to the shuttle KSU/KSL in downstream to the 2nd individual conveying mechanism 32.
When two kinds of processing units, be the single sheet type effect utmost point when becoming film unit 48 and single sheet type thermal treatment unit 50 in the 2nd zone, to be respectively arranged with, use the 1st and pass on mode.Under this situation, a single sheet type effect utmost point becomes film unit 48 and a single sheet type thermal treatment unit 50 all with the productive temp time T SCycle to each substrate G nImplement individual film forming processing and individual heat treatment respectively.In Figure 12, become film unit 48 to abbreviate individual processing unit A as the single sheet type effect utmost point for convenience of explanation, abbreviate single sheet type thermal treatment unit 50 as individual processing unit B.Among the figure, t constantly for example 0～t 4During and t constantly 4～t 8During be equivalent to the productive temp time T S
Among Figure 12, at moment t 0, the 1st substrate G of all individual processing that in this zone, are through with 1On the conveying arm ML of the bottom of individual conveying mechanism 32, wait for the loading of the bottom shuttle KSL of side downstream.The 2nd substrate G 2Stay in individual processing unit B that in this zone, is responsible for subsequent handling.The 3rd substrate G 3Stay in individual processing unit A of continuous (before) operation before in this zone, being responsible for.At this moment, the top shuttle JSU of upstream side (the 1st reciprocal transportation portion 38) loads the 4th substrate G 4And arrival top unloading position WU.
Afterwards, individual conveying mechanism 32 is immediately by the action shown in Figure 10 A, use top conveying arm MU from the top shuttle JSU of upstream side with the 4th substrate G 4Unload, use bottom conveying arm ML to load the 1st substrate G simultaneously at the bottom in downstream shuttle KSL 1(t=t 1～t 2).
Next, individual conveying mechanism 32 individual processing unit of visit A are with firm the 4th the substrate G that unloads from the top shuttle JSU of upstream side 4With the 3rd the substrate G that has finished preceding operation (film forming processing) at this constantly 3Exchange (t=t 2～t 3).Under this situation, the 3rd the substrate G that the bottom conveying arm ML that use is available will dispose 3A takes out of from individual processing unit, and uses the 4th substrate G before top conveying arm MU will handle 4Move into individual processing unit A and exchange above-mentioned the 3rd substrate G 3
Next, individual conveying mechanism 32 individual processing unit of visit B are with the 3rd the substrate G that has just taken out of from individual processing unit A 3With the 2nd the substrate G that has finished back operation (heat treatment) at this constantly 2Exchange (t=t 3～t 4).Under this situation, the 2nd the substrate G that the top conveying arm MU that use earlier is available will dispose 2B takes out of from individual processing unit, re-uses bottom conveying arm ML and will handle the 3rd preceding substrate G 3Move into individual processing unit B and exchange above-mentioned the 2nd substrate G 2On the other hand, the bottom shuttle JSL of upstream side (the 1st reciprocal transportation portion 38) loads the 5th substrate G 5And arrival bottom unloading position WL(t=t 4).
Afterwards, individual conveying mechanism 32 unloads the 5th substrate G immediately by the action shown in Figure 10 B at the bottom shuttle JSL that uses bottom conveying arm ML from upstream side 5The time, use top conveying arm MU to load the 2nd substrate G at the top in downstream shuttle KSU 2(t=t 5～t 6).
Next, individual conveying mechanism 32 individual processing unit of visit A are with firm the 5th the substrate G that unloads from the bottom shuttle JSL of upstream side 5With the 4th the substrate G that has finished preceding operation (film forming processing) at this constantly 4Exchange (t=t 6～t 7).Under this situation, the 4th the substrate G that the top conveying arm MU that use is available will dispose 4A takes out of from individual processing unit, and uses the 5th substrate G before bottom conveying arm ML will handle 5Move into individual processing unit A and exchange above-mentioned the 4th substrate G 4
Next, individual conveying mechanism 32 individual processing unit of visit B are with the 4th the substrate G that has just taken out of from individual processing unit A 4With the 3rd the substrate G that has finished back operation (heat treatment) at this constantly 3Exchange (t=t 7～t 8).Under this situation, the 3rd the substrate G that the bottom conveying arm ML that use earlier is available will dispose 3B takes out of from individual processing unit, uses top conveying arm MU will handle the 4th preceding substrate G then 4Move into individual processing unit B and exchange above-mentioned the 3rd substrate G 3The 3rd the substrate G that is taken out of 3On the conveying arm ML of bottom, wait for the loading of the bottom shuttle KSL of side downstream.On the other hand, the top shuttle JSU of upstream side (the 1st reciprocal transportation portion 38) loads the 6th substrate G 6And arrival top unloading position WU(t=t 8).Later on also with the productive temp time T SCarry out a series of substrate as described above repeatedly for reference period and pass on action.
［ mode of passing on 2 of individual conveying mechanism ］
A plurality of, two (A have for example been represented in the 2nd zone that the 2nd individual conveying mechanism 32 is responsible for, to be respectively arranged with among Figure 13 1, A 2) and three (B 1, B 2, B 3) the 2nd substrate used under the situation of single sheet type processing unit A, B passes on mode.Here, single sheet type processing unit A 1, A 2Respectively with the productive temp time T STime difference need 2T repeatedly SIndividual of preceding operation of the substrate time of staying (comprising the processing time of reality) handle A(single sheet type effect utmost point film forming and handle).On the other hand, single sheet type processing unit B 1, B 2, B 3Respectively with the productive temp time T STime difference need 3T repeatedly SIndividual treatments B (single sheet type heat treatment) of back operation of the substrate time of staying.
Under this situation, at moment t 0, the 1st substrate G of all individual processing that in this zone, are through with 1Be maintained at the bottom conveying arm ML of individual conveying mechanism 32, wait for the loading of the bottom shuttle KSL of side downstream.The 2nd substrate G 2, the 3rd substrate G 3And the 4th substrate G 4Stay in individual processing unit B that in this zone, is responsible for the back operation respectively 1, B 2, B 3In.The 5th substrate G 5And the 6th substrate G 6Stay in individual processing unit A of operation before being responsible in this zone 1, A 2In.At this moment, the top shuttle JSU of upstream side (the 1st reciprocal transportation portion 38) loads the 7th substrate G 7And arrival top unloading position WU.
Afterwards, by the action shown in Figure 10 A, portion's conveying arm MU unloads the 7th substrate G from the top shuttle JSU of upstream side to individual conveying mechanism 32 in the use immediately 7The time, use bottom conveying arm ML to load the 1st substrate G at the bottom in downstream shuttle KSL 1(t=t 1～t 2).
Next, individual conveying mechanism 32 individual processing unit of visit A 1, with firm the 7th the substrate G that unloads from the top shuttle JSU of upstream side 7With this moment near finishing the 5th substrate G of preceding operation (film forming processing) 5Exchange (t=t 2～t 3).
Next, individual conveying mechanism 32 individual processing unit of visit B 1, will be just from individual processing unit A 1The 5th the substrate G that takes out of 5With the 2nd substrate G near operation (heat treatment) after finishing in this moment 2Exchange (t=t 3～t 4).On the other hand, the bottom shuttle JSL of upstream side (the 1st reciprocal transportation portion 38) loads the 8th substrate G 8And arrival bottom unloading position WL(t=t 4).
Afterwards, individual conveying mechanism 32 unloads the 8th substrate G immediately by the action shown in Figure 10 B at the bottom shuttle JSL that uses bottom conveying arm ML from upstream side 8The time, use top conveying arm MU to load the 2nd substrate G at the top in downstream shuttle KSU 2(t=t 5～t 6).
Next, individual conveying mechanism 32 individual processing unit of visit A 2, with firm the 8th the substrate G that unloads from the bottom shuttle JSL of upstream side 8With this moment near finishing the 6th substrate G of preceding operation (film forming processing) 6Exchange (t=t 6～t 7).
Next, individual conveying mechanism 32 individual processing unit of visit B 2, will be just from individual processing unit A 2The 6th the substrate G that takes out of 6With the 3rd substrate G near operation (heat treatment) after finishing in this moment 3Exchange (t=t 7～t 8).The 3rd the substrate G that is taken out of 3On the conveying arm ML of bottom, wait for the loading of the bottom shuttle KSL of side downstream.On the other hand, the top shuttle JSU of upstream side (the 1st reciprocal transportation portion 38) loads the 9th substrate G 9And arrival top unloading position WU(t=t 8).After, also with the productive temp time T SCarry out a series of substrate as described above repeatedly for reference period and pass on action.
In addition, in the 1st individual conveying mechanism 30, except the upstream side at pipeline 28 does not dispose reciprocal transportation portion and placement substrate trunk desk 20(20U/20L) this point difference, with above-mentioned the 2nd individual conveying mechanism 32 similarly also with the productive temp time T SCarrying out the above-mentioned the 1st repeatedly for reference period passes on a series of substrates that mode or above-mentioned the 2nd mode of passing on relate to and passes on action.
［ mode of passing on 3 of individual conveying mechanism ］
In Figure 14, pass on mode as the 3rd, the 3rd individual conveying mechanism 34 is burnt till a series of substrates that carry out in the 3rd zone of unit 52A, 52B and passes on action and be illustrated disposing a pair of batch processing formula.
As shown in figure 15, above-mentioned two batch processing formulas are burnt till unit 52A, 52B alternately needs T repeatedly NThe batch processing time or the substrate time of staying (actual firing time T a+ cooling time T b) same batch processing formula burn till processing.Here, if being made as N, the batch processing number opens (for example 100), then productive temp time T SWith the batch processing time T NBetween exist and to concern T R=N*T S
Wherein, in Figure 14, with understanding a batch processing formula is burnt till unit 52A for convenience of explanation and abbreviate batch processing unit C as, another batch processing formula is burnt till unit 52B abbreviate the batch processing cells D as.Among the figure, t constantly for example 0～t 4During and t constantly 4～t 8During be equivalent to the productive temp time T S
In Figure 14, moment t 0Be that a batch processing unit C has just finished batch processing (the batch processing formula the is burnt till processing) moment afterwards.At this moment, the 1st substrate G 1By 1st slot of the lower arm ML of individual conveying mechanism 34 from unit C(substrate boat 98) take out of, wait for the loading of the bottom shuttle KSL of side (the 3rd reciprocal transportation portion 42) downstream.Wherein, the 201st substrate G 201Moved into the 1st slot of unit C(substrate boat 98) exchange the 1st substrate G 1The 2nd substrate G 2～the 100 substrate G 100Still rest on the 2nd slot～the 100th slot of batch processing unit C(substrate boat 98) in.On the other hand, the 101st substrate G 101～the 200 substrate G 200Rest in another batch processing cells D (the 1st slot of substrate boat 98～the 100th slot), be under batch processing (the batch processing formula is burnt till processing) the beginning situation soon.At this moment, the top shuttle JSU of upstream side (the 2nd reciprocal transportation portion 40) loads the 202nd substrate G 202And arrival top unloading position WU.
Afterwards, individual conveying mechanism 34 uses bottom conveying arm ML to load the 1st substrate G at the bottom in downstream shuttle KSL immediately by the action identical with Figure 10 A 1, meanwhile, use top conveying arm MU to unload the 202nd substrate G from the top shuttle JSU of upstream side 202(t=t 1～t 2).
Next, the 2nd slot of individual conveying mechanism 34 visit batch processing unit C(substrate boats 98), with firm the 202nd the substrate G that unloads from the top shuttle JSU of upstream side 202The 2nd substrate G of batch processing finished in exchange 2(t=t 2～t 3).
Afterwards, the bottom shuttle JSL of upstream side loads the 203rd substrate G immediately 203And arrival bottom unloading position WU(t=t 4).
Afterwards, individual conveying mechanism 32 uses bottom conveying arm ML to load the 2nd substrate G at the top in downstream shuttle KSU earlier immediately by the action shown in Figure 11 A and Figure 11 B 2, next use top conveying arm MU to unload the 203rd substrate G from the bottom shuttle JSL of upstream side 203(t=t 5～t 6).
Next, the 3rd slot of individual conveying mechanism 34 visit batch processing unit C(substrate boats 98), with firm the 203rd the substrate G that unloads from the bottom shuttle JSL of upstream side 203The 3rd substrate G of batch processing finished in exchange 3(t=t 6～t 7).
Afterwards, the top shuttle JSU of upstream side loads the 204th substrate G immediately 204And arrival bottom unloading position WU(t=t 8).After, also with the productive temp time T SCycle carry out repeatedly and above-mentioned same action.
Though the omission diagram, the 100th slots of individual conveying mechanism 34 final visit batch processing unit C(substrate boats 98), with firm the 300th the substrate G that unloads from the top shuttle JSU of upstream side 300The 100th substrate G of batch processing finished in exchange 100As shown in figure 15, another batch processing cells D just in time finishes a batch processing at this moment.
After, as shown in figure 15, individual conveying mechanism 34 by step same as described above with the productive temp time T SCycle move into successively with the productive temp time T to processing unit D SThe 301st the follow-up substrate G that unload successively from the shuttle JSU/JSL of upstream side of cycle 301～the 400 substrate G 400, exchange the 101st the substrate G that batch processing finishes one by one 101～the 200 substrate G 200And, the 101st the substrate G that takes out of successively from the batch processing cells D 101～the 200 substrate G 200With the productive temp time T SCycle stacked gradually in the shuttle KSU/KSL in downstream and be delivered to the downstream of pipeline 28.
In this embodiment, can burn till unit 52A, 52B in a pair of batch processing unit C, D(batch processing formula) between intert that the ground alternate repetition carries out batch processing (burning till processings) and substrate exchange is moved.And, in the substrate exchange action, with the productive temp time T SFor reference period to substrate one by one (slot one by one) carry out repeatedly in the substrate reception portion (slot on the substrate boat 98) the substrate that disposes with handle before the exchange of substrate.
［ mode of passing on 4 of individual conveying mechanism ］
A series of substrates that the 4th individual conveying mechanism 36 carries out in the 4th zone that disposes one or more single sheet type dyestuff absorbing unit 54 pass on action basically to above-mentioned the 3rd zone in a series of substrates of the 3rd individual conveying mechanism 34 to pass on action (the 3rd pass on mode) similar.
That is,, the top shuttle JSU of upstream side (the 3rd reciprocal transportation portion 42) opens substrate G if loading n nAnd arrive top unloading position WU, then after the 4th individual conveying mechanism 36 immediately by the action identical with Figure 10 A carry out simultaneously with remain in a conveying arm for example other substrates that dispose of bottom conveying arm ML be positioned over the downstream substrate trunk desk 26 bottom mounting table 26L action and use another top conveying arm MU with substrate G nThe action of unloading from top shuttle JSU.
Next, individual conveying mechanism 36 visits are at the single sheet type dyestuff absorbing unit 54 of this constantly the most approaching end dyestuff absorption, with the firm substrate G that unloads from the top shuttle JSU of upstream side nWith the substrate G that disposes pExchange.At this moment, use the bottom conveying arm ML be available with the substrate G that disposes pTake out of from this single sheet type dyestuff absorbing unit 54, and use top conveying arm MU will handle preceding substrate G nMove into this single sheet type dyestuff absorbing unit 54 and exchange aforesaid substrate G p
Then, the bottom shuttle JSL of upstream side loads n+1 immediately and opens substrate G N+1And arrival bottom unloading position WL.Afterwards, the 4th individual conveying mechanism 36 will remain in the substrate G that disposes of bottom conveying arm ML earlier immediately by the action shown in Figure 11 A and Figure 11 B pBe positioned over the top mounting table 26U of substrate trunk desk 26, next use top conveying arm MU substrate G N+1Shuttle JSL unloads from the bottom.And visit is at the single sheet type dyestuff absorbing unit 54 of this constantly the most approaching end dyestuff absorption, with the firm substrate G that unloads from the bottom shuttle JSL of upstream side N+1Other substrates G that exchange disposes qUnder this situation, use the bottom conveying arm ML that is available with the substrate G that disposes qTake out of from this single sheet type dyestuff absorbing unit 54, and use top conveying arm MU will handle preceding substrate G N+1Move into this single sheet type dyestuff absorbing unit 54 and exchange aforesaid substrate G qLater on also with the productive temp time T SFor the basic cycle carries out a series of substrate as described above repeatedly and passes on action.
［ the main action effect in the execution mode ］
As mentioned above, in the substrate board treatment of this execution mode, a plurality of (1～the 4th) individual conveying mechanism 30,32,34,36 and a plurality of (the 1st～the 3rd) reciprocal transportation portion 38,40,42 according to the order of handling process on pipeline 28 alternately alignment arrangements become row.
Here, the 1st individual conveying mechanism 30 is with the productive temp time T SCycle visit one or more single sheet type cleaning unit 44 and one or more single sheet type patterning unit 46 that is disposed at (the 1st zone) around it, each unit is carried out putting into, taking out of substrate G one by one.The 2nd individual conveying mechanism 32 is with the productive temp time T SCycle visit and be disposed at that one or more single sheet type effect utmost point in (the 2nd zone) becomes film unit 48 and one or more thermal treatment unit 50 around it, each unit is carried out putting into, taking out of substrate G one by one.The 3rd individual conveying mechanism 34 is with the productive temp time T SCycle visit and be disposed at around it a pair of (two) batch processing formula in (the 3rd zone) and burn till unit 52A, 52B, each unit is carried out putting into, taking out of substrate G one by one.The 4th individual conveying mechanism 36 is with the productive temp time T SCycle visit one or more dyestuff absorbing unit 54 that is disposed at (the 4th zone) around it, each unit is carried out putting into, taking out of substrate G one by one.
Between the 1st individual conveying mechanism 30 and the 2nd individual conveying mechanism 32, shuttle SU/ bottom, the top shuttle SL that is used alternatingly the 1st reciprocal transportation portion 38 with substrate G with the productive temp time T SCycle be delivered to downstream (32) from upstream side (30) one by one.Under this situation, the 1st individual conveying mechanism 30 if any one party of shuttle SU/ bottom, top shuttle SL rest on shipping position FU/FL during mounting substrate G, can not consider the mode of the 2nd individual conveying mechanism 32.On the other hand, the 2nd individual conveying mechanism 32 if any one party of shuttle SU/ bottom, top shuttle SL rest on unloading position WU/WL during unload infrabasal plate G, can not consider the situation of the 1st individual conveying mechanism 30 sides.
Same pass ties up to the 2nd reciprocal transportation portion 40 that clips and exchanges between the 2nd individual conveying mechanism 32 of substrate G and the 3rd individual conveying mechanism 34 and the 3rd reciprocal transportation portion 42 that clips exchanges between the 3rd individual conveying mechanism 34 of substrate G and the 4th individual conveying mechanism 36 and also sets up.Individual conveying mechanism of upstream side if any one party of shuttle SU/ bottom, top shuttle SL rest on shipping position FU/FL during mounting substrate G, individual conveying mechanism in downstream need only shuttle SU/ bottom, top shuttle SL rest on unloading position WU/WL during unload infrabasal plate G.Therefore, individual conveying mechanism mounting substrate G of upstream side jOpportunity and individual conveying mechanism in downstream shed substrate G iOpportunity can be consistent, also can stagger a little.
In addition, each individual conveying mechanism 30,32,34,36 is in order to carry out passing on of substrate G in responsible zone separately, as long as carry the lifting moving of main body 60U, 60L, the advance and retreat or the telescopic moving of rotating mobile and conveying arm MU, ML, need not to carry moving horizontally of main body 60U, 60L.Therefore, each individual conveying mechanism 30,32,34,36 can be fast and is carried out substrate efficiently and pass on, and can reduce the generation of particle or roll.
On the other hand, because shuttle SU/ bottom, the top shuttle SL that reciprocal transportation portion 38,40,42 just utilizes the conveying mechanism of single shaft to make has the legerity type objective table 66 that only loads a substrate G moves horizontally, so structure and action are simple, also seldom produce particle.
And, as long as, realize cost degradation so can simplify conveying program (software) significantly because each reciprocal transportation portion 38,40,42 can have the typing action (loading stop → outlet is moved → unloaded stop → loop and moves) of the top shuttle SU and the bottom shuttle SL of same configuration and identical function repeatedly with conversion period or phase reversal.Especially in this embodiment, owing to make the action of the 1st～the 3rd reciprocal transportation portion 38,40,42 all synchronous, thus can realize further simplification, the cost degradation of conveying program (software) in whole system, and can realize high production rate.
In addition, in this substrate board treatment, single sheet type processing unit 44,46,48,50,54 and batch processing formula processing unit 52A, 52B are along pipeline 28 mixed configuration.The processing unit that no matter is arranged in each zone of being responsible for is single sheet type or batch processing formula, and each individual conveying mechanism 30,32,34,36 is all without exception with the productive temp time T SCycle substrate G is put into one by one, takes out or exchanges.Thus, individual of the substrate in each one on the pipeline 28 carried all with the productive temp time T SFor reference period repeats.Thus, can easily make up the string rowization of the system that the processing unit of the processing unit of single sheet type and batch processing formula mixes.
Wherein, in this substrate board treatment, the 1st individual conveying mechanism 30 that is positioned at the upstream of pipeline 28 exchanges substrate G one by one via fixing substrate trunk desk 20 and loading machine conveying mechanism 18.Under this situation, because the conveying productive temp of loading machine conveying mechanism 18 always is less than the conveying productive temp of individual conveying mechanism 30, so can easily avoid the loading and unloading competition of between substrate G.In addition, even when loading machine conveying mechanism 18 produces particle or rolls particle along system-wide direction (Y direction) in loading machine 12 when moving horizontally, owing to be to handle mounting table 10 zone in addition, even suppose in untreated substrate G attaching particles, also can utilize the single sheet type cleaning unit 44 of the 1st operation to remove degranulation, so not influence.Distolateral fixing substrate trunk desk 26 and the unloader conveying mechanism 18 in downstream that is arranged at pipeline 28 is suitable for too.
［ other execution modes or variation ］
In the substrate board treatment of above-mentioned execution mode, can be with substrate trunk desk 20(20U, the 20L of loading machine 12 sides) and/or substrate trunk desk 26(26U, the 26L of unloader 14 sides) replace with the reciprocal transportation portion same with above-mentioned reciprocal transportation portion 38,40,42.
As the improvement shape of the substrate board treatment in the above-mentioned execution mode, also can be for example shown in Figure 16, all processing units that structure will use in the manufacture process of DSSC (Figure 17) are concentrated the treatment system that forms.
In this treatment system, as above-mentioned execution mode, utilize the 1st processing mounting table 10 to make the 1st tinkertoy module (208/200/204) of transparency carriers 208 sides, and utilize the 2nd processing mounting table 110 to make the 2nd tinkertoy module (210/205/202) of counter substrate 210 sides, in adhesive unit 112 that the 1st tinkertoy module (208/200/204) and the 2nd tinkertoy module (210/205/202) is bonding.
Here, utilize loading machine 12 with the productive temp time T SCycle handle mounting table 10 to the 1st and put into above-mentioned execution mode and similarly be formed with transparency carrier 208 with the tectal transparency conducting layer before transparency electrode 202 patternings as untreated substrate G.On the other hand, utilize loading machine 114 with the productive temp time T SCycle handle mounting table 110 to the 2nd and put into the counter substrate 210 that is formed with the tectal conductive layer (for example FTO) before basal electrode 205 patternings as untreated substrate H.Loading machine 114 has structure and the function identical with loading machine 12, and possesses loading machine conveying mechanism 116.
The 2nd handles mounting table 110 has from loading machine 114 towards the pipeline 118 of adhesive unit 112 along the straight extension of system's long side direction (directions X), disposes a plurality of and multiple processing unit 134～142B described later in its left and right sides across this pipeline 118.
On pipeline 118, a plurality of (in the illustrated embodiment being three) individual conveying mechanism 120,122,124 replaces alignment arrangements with a plurality of (three) reciprocal transportation portion 126,128,130 and becomes row.
More specifically, the 5th individual conveying mechanism 120 is positioned at the upstream on the pipeline 118 in handling process, by with the substrate trunk desk 132 and 126 clampings of the 5th reciprocal transportation portion of loading machine 114 adjacency.In the 1st zone of to about the 5th individual conveying mechanism 120, extending, dispose one or more single sheet type cleaning unit 134 of processed that is used for cleaning base plate G one by one and one or more respectively and be used for one by one the single sheet type patterning unit 136 that tectal conductive layer pattern on substrate H processed turns to basal electrode 205.
The 6th individual conveying mechanism 122 is positioned on pipeline 118 than the 5th individual conveying mechanism 120 by the downstream, by the 5th reciprocal transportation portion 126 and 128 clampings of the 6th reciprocal transportation portion.In the 6th zone of extending, dispose one or more single sheet type that is used for one by one the opposite electrode 202 that for example forms in film forming on processed of substrate H (for example printing applies) respectively and the utmost point is become film unit 138 and one or more are used for one by one the single sheet type thermal treatment unit 140 that processed (opposite electrode 202) to the substrate H after applying toasts by carbon to the left and right sides of the 6th individual conveying mechanism 122.
The 7th individual conveying mechanism 124 is positioned on pipeline 118 than the 6th individual conveying mechanism 122 by the downstream, by the 6th reciprocal transportation portion 128 and 130 clampings of the 7th reciprocal transportation portion.In the 7th zone of extending, dispose and a pair ofly be used for that many (for example 100) are formed at the batch processing formula that processed opposite electrode 202 on the substrate H burns till in the lump and burn till unit 142A, 142B to the left and right sides of the 7th individual conveying mechanism 124.
The the 5th～the 7th individual conveying mechanism 120,122,124 has with the above-mentioned the 1st handles the identical structure of individual conveying mechanism of the 1st～the 3rd in the mounting table 10 30,32,34, serves the same role.The the 5th～the 7th reciprocal transportation portion 126,128,130 has and the above-mentioned the 1st identical structure of handling in the mounting table 10 of the 1st～the 3rd reciprocal transportation portion 38,40,42, serves the same role.
Handle in the mounting table 110 the 2nd, substrate H is descending and accept a series of individual processing or batch processing successively by the predetermined process unit in the 5th～the 7th zone in pipeline 118.And the substrate H that disposes that becomes the 2nd tinkertoy module (210/205/202) is by with the productive temp time T SThe cycle conveying mechanism 144 that is fetched into adhesive unit 112 from the top unloading position and the bottom unloading position (WU/WL) of the 7th reciprocal transportation portion 130.
On the other hand, handle in the mounting table 10 the 1st, as above-mentioned execution mode, substrate G is descending and accept a series of individual processing or batch processing successively by the predetermined processing unit in the 1st～the 4th zone in pipeline 28.And the substrate G that disposes that becomes the 1st tinkertoy module (208/200/204) is by with the productive temp time T SCycle from the top unloading position of the 4th reciprocal transportation portion 43 that is connected with the 4th individual conveying mechanism 36 and the conveying mechanism 144 that bottom unloading position (WU/WL) is fetched into adhesive unit 112.
Adhesive unit 112 for example uses adhesive to handle the 1st tinkertoy module (208/200/204) that mounting table 10 obtains and to handle the 2nd tinkertoy module (210/205/202) that mounting table 110 obtains from the 2nd bonding from the 1st, forms the tinkertoy module (208/200/204/202/205/210) of one.
The electrolyte that tinkertoy module after this is integrated (208/200/204/202/205/210) is fed to next stage injects unit 146, in this unit 146, in integrated tinkertoy module, more specifically between porous matter semiconductor microactuator granulosa 204 and opposite electrode 202, inject electrolyte.
At last, in the sealing unit 148 of next stage, integrated tinkertoy module is implemented sealing (Seal) so that electrolyte does not leak, thereby obtain dye sensitization solar cell module G/H as Figure 17 of final finished.This dye sensitization solar cell module G/H is with box C SFor unit is exported from unloader 14.
Wherein, inject between unit 146 and the sealing unit 148 at adhesive unit 112, electrolyte, do not use individual conveying mechanism and reciprocal transportation portion among the present invention, and utilize existing known or well-known conveying mechanism (not shown) conveying substrate or tinkertoy module and integrated tinkertoy module substrate G/H one by one.
As other variation, can be independent or non-synchronously carry out the reciprocating action (load, go, unload, reverse) of top shuttle and the reciprocating action (load, go, unload, reverse) of bottom shuttle in reciprocal transportation portion arbitrarily according to the specification of system.
As mentioned above, in the present invention, even if around each individual conveying mechanism the processing unit of (be responsible for zone) configuration single sheet type or batch processing formula, individual conveying of also can be on pipeline finalizing the design with the cycle of carrying productive temp without exception or pass on.Therefore, the present invention is not limited to the system that the such single sheet type processing unit of above-mentioned execution mode and batch processing formula processing unit mix, and can also be applied to intrasystem all processing units is that the such string heat-extraction system of single sheet type processing unit or intrasystem all processing units are the such string heat-extraction system of batch processing formula processing unit.And the present invention is not limited to go here and there heat-extraction system, also can be applied to a part or the integral body of a plurality of processing units by any system of the substantial transverse alignment arrangements of order of handling process.
Therefore, the present invention is not limited to the substrate board treatment that the manufacture process of the such DSSC of above-mentioned execution mode is used, and also can be applied to for example to make the substrate board treatment that semiconductor device, FPD are used.
Description of reference numerals: 10 ... handle mounting table; 12 ... loading machine; 14 ... unloader; 18 ... the loading machine conveying mechanism; 24 ... the unloader conveying mechanism; 28 ... pipeline; 30,32,34,36 ... individual conveying mechanism; 38,40,42 ... reciprocal transportation portion; 44 ... the single sheet type cleaning unit; 46 ... single sheet type patterning unit; 48 ... the single sheet type effect utmost point becomes film unit; 50 ... thermal treatment unit; 52A, 52B ... the batch processing formula is burnt till the unit; 54 ... single sheet type dyestuff absorbing unit; 60U, 60L ... carry main body; MU ... the top conveying arm; ML ... the bottom conveying arm; SU ... the top shuttle; SL ... the bottom shuttle; 62 ... conveying road, top; 64 ... conveying road, bottom; FU ... the top shipping position; FL ... the bottom shipping position; WU ... the top unloading position; WL ... the bottom unloading position.

Claims (20)

1. substrate board treatment is characterized in that having:
The 1st carries road and the 2nd to carry the road, and they are with the extension that is parallel to each other of length along continuous straight runs arbitrarily;
The 1st shuttle, it has the objective table that loads a substrate, can be arranged at the described the 1st carry the road an end the 1st shipping position be arranged at the described the 1st and carry between the 1st unloading position of the other end on road and on described the 1st conveying road, move back and forth;
The 2nd shuttle, it has the objective table that loads a substrate, can be arranged at the described the 2nd carry the road an end the 2nd shipping position be arranged at the described the 2nd and carry between the 2nd unloading position of the other end on road and on described the 2nd conveying road, move back and forth;
The 1st conveying mechanism, it is set to visit described the 1st shipping position and the 2nd shipping position, has the 1st conveying arm that one or more is used for conveying substrate in the 1st zone;
The 2nd conveying mechanism, it is set to visit described the 1st unloading position and the 2nd unloading position, has the 2nd conveying arm that one or more is used for conveying substrate in the 2nd zone; And
Handling part is configured at least one zone in described the 1st zone and the 2nd zone for substrate is implemented desirable individual processing or batch processing,
Described the 1st conveying mechanism use described the 1st conveying arm at described the 1st shipping position and the 2nd shipping position to described the 1st shuttle and the 2nd shuttle mounting substrate one by one,
Described the 2nd conveying mechanism uses described the 2nd conveying arm to unload infrabasal plate in described the 1st unloading position and the 2nd unloading position one by one from described the 1st shuttle and the 2nd shuttle,
Utilize described the 1st shuttle with substrate from described the 1st shipping position to the conveying of described the 1st unloading position, with utilize described the 2nd shuttle that substrate is independently carried out to the conveying of described the 2nd unloading position from described the 2nd shipping position.
2. substrate board treatment according to claim 1 is characterized in that,
Be provided with loading part in described the 1st zone, this loading part is taken in the putting into of box of untreated substrate,
Described the 1st conveying mechanism uses described the 1st conveying arm will be used for taking out from described box to the substrate of described the 1st shuttle or the 2nd shuttle loading.
3. substrate board treatment according to claim 1 is characterized in that,
It is overlapping up and down that described the 1st conveying road and the 2nd carries the road to draw back certain interval.
4. substrate board treatment is characterized in that having:
Pipeline, its from the upstream side of handling process towards downstream side carry processed substrate along the direction of level;
The 1st conveying mechanism, it is set on the described pipeline, carries out the handing-over of substrate one by one with the 1st handling part that is disposed at around it;
The 2nd conveying mechanism, it is set at described the 1st conveying mechanism of ratio on the described pipeline by the position in downstream, carries out the handing-over of substrate one by one with the 2nd handling part that is disposed at around it; And
The 1st shuttle that can move back and forth and the 2nd shuttle, they constitute an interval of described pipeline, respectively substrate are also carried out individual conveying from the 1st shipping position and the 2nd shipping position with described the 1st conveying mechanism adjacency to the 1st unloading position and the 2nd unloading position loading with described the 2nd conveying mechanism adjacency one by one individually.
5. substrate board treatment is characterized in that having:
Pipeline, its from the upstream side of handling process towards downstream side carry processed substrate along the direction of level;
The 1st conveying mechanism, it is set on the described pipeline, carries out the handing-over of substrate one by one with the 1st handling part that is disposed at around it;
The 2nd conveying mechanism, it is set at described the 1st conveying mechanism of ratio on the described pipeline by the position in downstream, carries out the handing-over of substrate one by one with the 2nd handling part that is disposed at around it; And
The 1st shuttle that can move back and forth and the 2nd shuttle, they constitute an interval of described pipeline, respectively with substrate one by one from the 1st shipping position of described the 1st conveying mechanism adjacency and the 2nd shipping position to loading with the 1st unloading position of described the 2nd conveying mechanism adjacency and the 2nd unloading position and carrying out individual conveying
Described substrate board treatment utilizes described the 1st shuttle to the conveying of substrate with utilize the conveying of described the 2nd shuttle to substrate so that certain productive temp is time-interleaved.
6. substrate board treatment according to claim 5 is characterized in that,
The not mounting substrate ground action of moving to described the 2nd shipping position of action of carrying out described the 1st shuttle mounting substrate simultaneously and moving to described the 1st unloading position from described the 1st shipping position and described the 2nd shuttle from described the 2nd unloading position
The not mounting substrate ground action of moving to described the 1st shipping position of action of carrying out described the 2nd shuttle mounting substrate simultaneously and moving to described the 2nd unloading position from described the 2nd shipping position and described the 1st shuttle from described the 1st unloading position.
7. substrate board treatment according to claim 5 is characterized in that,
Described the 1st conveying mechanism unloads infrabasal plate to the action and described the 2nd conveying mechanism of described the 1st shuttle mounting substrate from described the 2nd shuttle action to be independently regularly carrying out,
Described the 1st conveying mechanism unloads infrabasal plate to the action and described the 2nd conveying mechanism of described the 2nd shuttle mounting substrate from described the 1st shuttle action is independently regularly to carry out.
8. substrate board treatment according to claim 4 is characterized in that,
Described the 1st shuttle and the 2nd shuttle the 1st carry road and the 2nd to carry independent moving on the road what extend in parallel with length arbitrarily respectively.
9. substrate board treatment according to claim 8 is characterized in that,
It is overlapping up and down that described the 1st conveying road and the 2nd carries the road to draw back certain interval.
10. substrate board treatment according to claim 5 is characterized in that,
Described the 1st handling part has a plurality of the 1st single sheet type processing units that carry out the 1st individual processing repeatedly with the regular hour difference respectively.
11. substrate board treatment according to claim 10 is characterized in that,
Described the 1st conveying mechanism is in described productive temp in the time, receive a substrate of not accepting described the 1st individual processing as yet from the upstream side of described pipeline, this substrate that receives is moved into described the 1st single sheet type processing unit of described the 1st individual processing of the most approaching end, and the substrate of taking out of described the 1st individual processing that is through with in return, this substrate of taking out of is loaded into any one of described the 1st shuttle or the 2nd shuttle.
12. substrate board treatment according to claim 5 is characterized in that,
Described the 1st handling part has: a plurality of the 1st single sheet type processing units, and they carry out the 1st individual processing repeatedly with the regular hour difference respectively; With a plurality of the 2nd single sheet type processing units, they carry out the 2nd individual processing of the subsequent processing of described the 1st individual processing repeatedly with the regular hour difference respectively.
13. substrate board treatment according to claim 12 is characterized in that,
Described the 1st conveying mechanism is in described productive temp in the time, receive a substrate of not accepting any processing the described the 1st individual processing and the 2nd individual processing as yet from the upstream side of described pipeline, this substrate that receives is moved into described the 1st single sheet type processing unit of described the 1st individual processing of the most approaching end, and the substrate of taking out of described the 1st individual processing that is through with in return, this substrate of taking out of is moved into described the 2nd single sheet type processing unit of described the 2nd individual processing of the most approaching end, and the substrate of taking out of described the 2nd individual processing that is through with in return, this substrate of taking out of is loaded into any one of described the 1st shuttle or the 2nd shuttle.
14. substrate board treatment according to claim 5 is characterized in that,
Described the 1st handling part has a plurality of the 1st batch processing formula processing units that carry out the 1st batch processing repeatedly with the regular hour difference respectively.
15. substrate board treatment according to claim 14 is characterized in that,
Described the 1st conveying mechanism is in described productive temp in the time, receive a substrate of not accepting described the 1st batch processing as yet from the upstream side of described pipeline, this substrate that receives is moved into described the 1st batch processing formula processing unit of described the 1st batch processing of the most approaching end, and the substrate of taking out of described the 1st batch processing that is through with in return, this substrate of taking out of is loaded into any one of described the 1st shuttle or the 2nd shuttle.
16. substrate board treatment according to claim 5 is characterized in that,
Described the 2nd handling part has a plurality of the 3rd single sheet type processing units that carry out the 3rd individual processing repeatedly with the regular hour difference respectively.
17. substrate board treatment according to claim 16 is characterized in that,
Described the 2nd conveying mechanism is in described productive temp in the time, unload the substrate that next Zhang Shangwei accepts described the 3rd individual processing from described the 1st shuttle or the 2nd shuttle, this substrate that unloads is moved into described the 3rd single sheet type processing unit of described the 3rd individual processing of the most approaching end, and the substrate of taking out of described the 3rd individual processing that is through with in return, and this substrate of taking out of is transmitted to the downstream of described pipeline.
18. substrate board treatment according to claim 5 is characterized in that,
Described the 2nd handling part has: a plurality of the 3rd single sheet type processing units, and they carry out the 3rd individual processing repeatedly with the regular hour difference respectively; With a plurality of the 4th single sheet type processing units, they carry out the 4th individual processing of the subsequent processing of described the 3rd individual processing repeatedly with the regular hour difference respectively.
19. substrate board treatment according to claim 18 is characterized in that,
Described the 2nd conveying mechanism is in described productive temp in the time, unload the substrate that next Zhang Shangwei accepts any processing the described the 3rd individual processing and the 4th individual processing from described the 1st shuttle or the 2nd shuttle, this substrate that unloads is moved into described the 3rd single sheet type processing unit of described the 3rd individual processing of the most approaching end, and the substrate of taking out of described the 3rd individual processing that is through with in return, this substrate of taking out of is moved into described the 4th single sheet type processing unit of described the 4th individual processing of the most approaching end, and the substrate of taking out of described the 4th individual processing that is through with in return, and this substrate of taking out of is transmitted to the downstream of described pipeline.
20. substrate board treatment according to claim 5 is characterized in that,
Described the 2nd handling part has a plurality of the 2nd batch processing formula processing units that all carry out the 2nd batch processing repeatedly with the regular hour difference.
CN2012800038949A 2011-01-13 2012-01-05 Substrate-processing device Pending CN103229289A (en)

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