KR102190638B1 - Display glass deposition system - Google Patents

Abstract

A substrate deposition system for a display is disclosed. A substrate deposition system for a display according to an embodiment of the present invention includes a working line on which a deposition operation is performed on a substrate; And an organic film deposition unit disposed on one side of the work line and for depositing an organic film on a substrate, wherein the organic film deposition unit includes: a chamber in which a deposition process is performed on the substrate; A source disposed on one side of the deposition chamber and injecting a deposition material toward the substrate; And a deposition preventing masking frame coupled to one side of the chamber and preventing deposition of a deposition material from a source from being deposited on the substrate when the deposition process proceeds to form a non-deposition section on the substrate.

Description

Display substrate deposition system {Display glass deposition system}

The present invention relates to a substrate deposition system for a display, and more particularly, a deposition process for a display substrate can be performed without using a mask, and accordingly, a mask return line and a mask return line that had to be applied to the previous system The present invention relates to a substrate deposition system for a display capable of reducing investment costs since it is not necessary to build facilities such as a mask cleaning line.

One of the flat panel display device substrates used for displays, the OLED substrate, that is, the Organic Light Emitting Display (OLED), is an ultra-thin display device that emits color images by self-emission of organic materials. It is attracting attention as a promising display device in that it is simple and has high light efficiency.

The organic light emitting display device (OLED) includes an anode and a cathode, and organic layers interposed between the anode and the cathode. Here, the organic layers include an emission layer. Of course, the organic layers may further include a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer in addition to the emission layer.

On the other hand, in order to realize full color, the light emitting layer must be patterned, and for this, a deposition process is applied. In a vapor deposition machine that performs a deposition process on an OLED substrate (hereinafter referred to as a substrate), for example, in an OLED TV deposition machine, it is common to perform a deposition process on the substrate by applying an open mask. When the substrate is large, a large mask suitable for its size is applied.

However, when the deposition process is carried out by applying a mask as before, especially when the deposition process is carried out by applying a large-sized mask, the size is too large, so there is a problem of handling of the mask, and the substrate and the substrate are chucking. ), the problem of attaching to the chuck, the problem of building a mask return line that causes the mask to return from the system, and the problem of building a mask cleaning line to clean the mask. Can be.

In fact, many of these problems are becoming a big issue when investing in a customer's evaporation system. Even if the investment is in progress, the construction of the mask return line and mask cleaning line requires a lot of cost and space, so the system supplier Considering that it is inevitable for us to be practical from the standpoint, it is necessary to develop a technology for a new concept substrate deposition system for display that is completely different from the existing system.

Korean Intellectual Property Office Publication No. 10-2012-0077382

Therefore, the technical problem to be achieved by the present invention is that it is possible to perform a deposition process on a display substrate without using a mask, and accordingly, the construction of facilities such as a mask return line and a mask cleaning line, which were inevitable in previous systems, is It is not necessary to provide a substrate deposition system for displays that can reduce investment costs.

According to an aspect of the present invention, there is provided a working line in which a deposition operation is performed on a substrate; And an organic film deposition unit disposed on one side of the work line to deposit an organic film on the substrate, wherein the organic film deposition unit includes: a chamber in which a deposition process for the substrate is performed; A source disposed on one side of the deposition chamber and injecting a deposition material toward the substrate; And a deposition preventing masking frame coupled to one side of the chamber and preventing deposition of a deposition material from the source from being deposited on the substrate when the deposition process proceeds to form a non-deposition section on the substrate. A substrate deposition system for a display may be provided.

The organic film deposition unit may further include a gap adjustment unit that is positionally adjustable to one side of the deposition preventing masking frame and adjusting a gap between the substrate and the deposition preventing masking frame.

The organic layer deposition unit may further include a frame tension holding unit disposed in a central region of the deposition preventing masking frame and maintaining a tension with respect to the deposition preventing masking frame.

The organic film deposition unit may further include a chuck moving part provided on one side of the masking frame for preventing deposition and moving a chuck that is moved together with the substrate in a state attached to the substrate. .

The chuck moving part may include a driving roller in contact with the chuck to move the chuck; A driving unit generating power for rotation of the driving roller; And a motion transmission unit connected to the driving unit and the driving roller and transmitting a driving force of the driving unit to the rotational motion of the driving roller.

The chuck moving part may further include a guide roller that is rotatably disposed in a side region of the chuck and guides the movement of the chuck.

The non-deposition section may be formed symmetrically in a straight line in both side regions of the substrate.

It is disposed behind the process of the organic film deposition unit on the work line, and an etching zone is formed by etching the edge region of the organic film with a laser in a direction crossing the non-deposition section formed on the substrate. It may further include a laser etching unit to form.

It may further include an inorganic film deposition unit for depositing an inorganic film on the substrate in a form that is disposed behind the process of the laser etching unit on the work line and covers the organic film already deposited on the substrate including the etching zone. have.

It is disposed in front of the process of the organic film deposition unit on the working line, the chuck, and may further include a chuck and a substrate attach unit for attaching the substrate.

The chuck may be an ion sheet chuck capable of attaching to the substrate through the force of ions without additional power or an adhesive.

The ion sheet chuck may be attached only to some points of the substrate.

The ion sheet chuck may be attached to the entire surface of the substrate.

A first flip unit disposed between the chuck and the substrate attaching unit and the organic film deposition unit on the work line, and flipping the ion sheet chuck to which the substrate is attached to face the substrate downward. Can include.

A chuck and a substrate detachment unit may be further included to form a process opposite to the chuck and the substrate attaching unit on the work line, and detach the chuck and the substrate that are mutually attached.

A line independent from the work line is formed, but both ends thereof are connected to the chuck and the substrate attach unit, and the chuck and the substrate detachment unit, and the chuck moves between the chuck and the substrate attach unit and the chuck and the substrate detachment unit. It may further include a chuck return line (chuck return line) forming a movement path of the chuck.

A second flip unit disposed on the work line in front of the process of the chuck and the substrate detaching unit, and flipping the ion sheet chuck to which the substrate is attached to the substrate so as to face the substrate may be further included. .

According to the present invention, it is possible to perform a deposition process on a display substrate without using a mask, thereby reducing the investment cost since it is not necessary to construct facilities such as mask return lines and mask cleaning lines that were inevitably applied to the previous system. I can make it.

1 is a schematic structural diagram of an organic light emitting display device (OLED) in which 10 layers of organic and inorganic layers are alternately deposited.
2 is a layout of a substrate deposition system for a display according to an embodiment of the present invention.
3 is a diagram schematically showing a state in which a substrate is attached to an ion sheet chuck.
4 is a diagram illustrating a state in which an organic film is deposited on a substrate.
5 is a diagram illustrating a state in which an etching zone is formed using a laser in the state of FIG. 4.
6 is a plan view of FIG. 5.
7 is a diagram illustrating a state in which an inorganic layer is deposited to cover an organic layer in the state of FIG. 5.
8 is a plan layout view of a masking frame for preventing deposition for explaining the operation of the frame tension holding unit.
9 is a schematic side structural diagram of an organic film deposition unit.
FIG. 10 is a front structural view of FIG. 9 and is a diagram illustrating a state in which a substrate is disposed.
11 is an enlarged view of a main part of FIG. 10.
12A to 12I are diagrams illustrating a step-by-step process of attaching the ion sheet chuck and the substrate.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the implementation of the present invention, reference should be made to the accompanying drawings illustrating preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by describing a preferred embodiment of the present invention with reference to the accompanying drawings. The same reference numerals in each drawing indicate the same member.

1 is a schematic structural diagram of an organic light emitting display (OLED) in which 10 layers of organic and inorganic layers are alternately deposited.

Referring to this drawing, the organic light emitting display device 1 (OLED) may include a substrate and an organic light emitting device 3 stacked on the substrate.

The substrate may be a substrate made of glass. Briefly describing the organic light-emitting device 3 without reference numerals, the organic light-emitting device 3 has a stacked structure of an anode, a three-layer organic film (hole transport layer, light emitting layer, electron transport layer), and a cathode. When an organic molecule receives energy (now, it is in an excited state), it tries to return to its original state (ground state), and has the property of emitting the received energy as light.

In the organic light-emitting device 3, when a voltage is applied, holes (+) injected from the anode and electrons (-) injected from the cathode recombine in the emission layer, and at this time, the organic molecules are excited to emit light. When a voltage is applied in this way, the organic light emitting display device 1 displays using the characteristic that the organic material emits light, and R(Red), G(Green), B(Blue) depending on the organic material on the organic light emitting device 3 It implements full color by using the characteristic that emits a color.

On the other hand, since the organic light emitting device 3 can be easily damaged by gas or moisture in the atmosphere, the problem of lifespan can be raised, and to solve this problem, by alternately stacking multiple layers of organic and inorganic films as shown in FIG. It has come to protect the organic light-emitting device 3 from the inflow of gas or moisture.

In FIG. 1, a total of 10 layers of organic and inorganic layers are alternately stacked. That is, from the organic light-emitting device 3, a first organic film, a first inorganic film, a second organic film, a second inorganic film… a fifth organic film, and a fifth inorganic film are sequentially and layer-by-layer deposited.

Looking at this in detail, a film is deposited in a form in which the first inorganic film completely encloses the first organic film, followed by a form in which the second organic film partially encloses the first inorganic film, and then the second inorganic film completely encloses the second organic film. It can be seen that, for such a deposition, the following deposition system is required.

2 is a layout of a substrate deposition system for a display according to an embodiment of the present invention, FIG. 3 is a schematic view showing a state in which a substrate is attached to an ion sheet chuck, and FIG. 4 is a substrate 5 is a view of a state in which an etching zone is formed using a laser in the state of FIG. 4, FIG. 6 is a plan view of FIG. 5, and FIG. 7 is It is a diagram of a state in which an inorganic film is deposited in a form covering the film, FIG. 8 is a plan layout view of a masking frame for preventing deposition for explaining the action of the frame tension holding unit, and FIG. 9 is a schematic side structure diagram of an organic film deposition unit, 9 is a front structural view of FIG. 9 and a diagram in which a substrate is disposed, FIG. 11 is an enlarged view of a main part of FIG. 10, and FIGS. 12A to 12I are diagrams showing step by step a process of attaching the ion sheet chuck and the substrate. .

Referring to these drawings, the substrate deposition system for a display according to the present exemplary embodiment enables a deposition process for a display substrate 10 (hereinafter referred to as a substrate) to be performed without using a mask.

For reference, the substrate deposition system for a display according to the present embodiment may be a system for depositing a first organic layer, which is a first layer, and a first inorganic layer, which is a second layer in the drawing of FIG. 1. Therefore, in order to alternately stack a total of 10 layers of organic and inorganic films as shown in FIG. 1, five systems as shown in FIG. 2 may be used in succession or the system of FIG.

Prior to the detailed description of the substrate deposition system for a display according to the present embodiment, first, a brief description of the process of performing the deposition process on the substrate 10 without using a mask with reference to FIGS. 4 to 11 Explain.

As will be described repeatedly, in the case of this embodiment, the mask that has always been used in the previous deposition process is not used.

Instead, a deposition process for the substrate 10 is performed by applying the masking frame 153 for preventing deposition to the organic layer deposition unit 150. While the existing mask is moved to the chamber 151 of the organic film deposition unit 150 in a state attached to the substrate 10, the masking frame 153 for preventing deposition is a fixed structure disposed on one side of the chamber 151 In that it has a different structure from the existing mask.

As described above, since no mask is used in the system of the present embodiment, a facility for moving a mask, a facility for attaching a mask to the substrate 10, and a facility for separating the mask as before are not required. In particular, there is a very advantageous advantage in reducing initial investment cost because it is not necessary to construct facilities such as a mask return line and a mask cleaning line.

After the substrate 30 is attached to the ion sheet chuck 40 as shown in FIG. 3, a deposition process is performed while moving most of the processes of FIG. 2. The deposition process for the substrate 30 may be performed in the order of an organic layer and an inorganic layer.

First, as shown in FIG. 4, an organic film 51 is deposited on the substrate 30 by the organic film deposition unit 150. At this time, since the vapor deposition prevention masking frame 153 is installed in the chamber 151 of the organic layer deposition unit 150, the organic layer is formed on the substrate 30 except for a region where the deposition prevention masking frame 153 is disposed. 51) is deposited.

As the masking frame 153 is disposed, a section in which the organic film 51 is not deposited on the substrate 30, that is, a region corresponding to the masking frame 153 is a non-deposition section 31. In FIG. 4, the non-deposition section 31 is where the masking frame 153 is disposed. As will be described later, since the masking frame 153 is provided in a straight bar type, the non-deposition section 31 is also formed in a straight line. For reference, the organic film 51 is also deposited on the masking frame 153 for preventing deposition, but its expression is omitted for convenience.

After the organic film 51 is deposited on the surface of the substrate 30 except for the masking frame 153 for preventing deposition as shown in FIG. 4, the laser etching unit 160 is used as a ratio of the organic film 51 as shown in FIGS. 5 and 6. The edge region of the organic film 51 is etched with a laser in a direction crossing the deposition section 31. Then, the portion deposited as the organic layer 51 is removed to form an etching zone 52. The etching zone 52 indicates a region from which the portion of the organic film 51 has been removed. Since the non-deposition section 31 is provided in a linear shape, the etching zone 52 may also be formed in a linear shape to cross the non-deposition section 31.

After the etching zone 52 is formed through laser etching, the inorganic film 53 deposition process is performed on the substrate 30 through the inorganic film deposition unit 170 as shown in FIG. 7. In this case, the inorganic film 53 is deposited in a form that covers and covers the organic film 51 already deposited on the substrate 10. Accordingly, the organic film 51 is first deposited on the surface of the substrate 10, and the inorganic film 53 is deposited to cover the organic film 51. By continuing to repeat this method, the structure of FIG. 1 can be made.

In this embodiment, a substrate deposition system for a display as shown in FIG. 2 is proposed so that the inorganic layer 53 can be deposited on the substrate 10 in a form covering the organic layer 51 as shown in FIG. 7.

As described above, the substrate deposition system for a display according to the present embodiment can perform a deposition process on the substrate 10 without using a mask, and thus, mask return lines and mask cleaning lines, which were inevitably applied to the previous system, can be used. It does not require facility construction, so it can reduce investment costs.

As shown in FIG. 2, the substrate deposition system for a display according to the present embodiment capable of providing such an effect includes a predetermined working line 101 in which a deposition process for the substrate 10 is performed, It includes a separate chuck return line 103 (chuck return line) different from the work line 101.

The chuck return line 103 is a line to which the ion sheet chuck 40 is returned, and most of the components are disposed on the work line 101. The working line 101 forms a series of lines for depositing an organic film 51, laser etching, and depositing an inorganic film 53 on the substrate 10.

In the case of this embodiment, since the working line 101 is inline, a smooth deposition process for the substrate 10 can be induced. However, the work line 101 does not necessarily have to be inline.

Hereinafter, for convenience of description, components arranged in order on the work line 101 of the substrate deposition system for a display according to the present embodiment, that is, the chuck and the substrate attach unit 120 and the first flip unit 141 , The organic film deposition unit 150, the laser etching unit 160, the inorganic film deposition unit 170, the second flip unit 142, and the chuck and substrate detachment unit 180 will be sequentially described. For reference, on the work line 101, a plurality of buffer units are provided in several places for smooth transfer of logistics. The buffer unit is directly indicated in the drawings in English letters (buffer) without reference numerals.

Looking at the configuration of the substrate deposition system for a display according to the present embodiment, first, the chuck and the substrate attach unit 120 move the substrate 30 by chucking the substrate 30 before depositing the organic film 51 on the substrate 30. It serves to attach the chuck 40 and the substrate 30. In other words, as shown in FIG. 3, the chuck and the substrate attach unit 120 are in charge of the process of attaching the chuck 40 to the substrate 30.

In the present embodiment, the chuck 40 applied to the chuck and the substrate attaching unit 120 is an ion sheet chuck 40 that enables attachment to the substrate 30 through the force of ions without additional power or adhesive. , ion sheet chuck).

For reference, the ion sheet chuck 40 causes the substrate 30 to be attached through an adhesive force (not an adhesive) based on van der Waals force.

Here, the van der Waals force refers to the force acting between electrically neutral molecules that do not have negative electrons. In particular, it refers to the attractive force acting at a relatively long distance. The van der Waals force is a result of the dispersing force, and the forces acting between rare gas atoms and the factors that form molecular crystals of hydrocarbons such as benzene can be explained by the van der Waals force. In addition, the van der Waals force refers to an intrinsic force required to explain the phenomena such as agglomeration and adhesion of liquids and physical adsorption as in this embodiment.

In summary, Van der Waals force is an extremely weak electrostatic attraction that acts only at very close distances between electrically neutral molecules, and collectively refers to the electrical forces acting between covalently bonded molecules.

In particular, physical adhesion is possible without additional power through the force of ions. Since the ion sheet chuck 40 is manufactured based on the Van der Waals force, the substrate 30 is attached to the ion sheet chuck 40. It can be attached without an adhesive and can be attached again later.

When the ion sheet chuck 40 and the substrate 30 are attached, the ion sheet chuck 40 may be attached only to some points of the substrate 30, or may be attached to the front surface of the substrate 30. It may be possible, but it should be said that whatever method is applied, all belong to the scope of the present invention.

Meanwhile, the actual operation of the chuck and the substrate attaching unit 120, that is, a process in which the ion sheet chuck 40 and the substrate 30 are attached, will be briefly described with reference to FIGS. 12A to 12I.

Of course, FIGS. 12A to 12I are only one method example, and the scope of the present invention is not limited to this structure and operation. For reference, (a) and (b) of FIGS. 12D to 12F are views respectively showing a corresponding figure in a plan view and a side view.

First, in the standby state as shown in FIG. 12A, the substrate 30 is put into the unit body 121 by the hand 123 of the robot, as shown in FIG. 12B.

The unit body 121 is provided with side pins 122 for supporting a substrate on which the substrate 30 is supported. The side pins 122 for supporting the substrate are provided in a pin type spaced apart from each other. Therefore, when the hand 123 of the robot or the side rolling arm 124 enters and exits the unit body 121, interference does not occur.

Subsequently, as shown in FIG. 12C, the hand 123 of the robot is down and the substrate 30 is supported on the side pin 122 for supporting the substrate.

Then, as shown in Fig. 12D, the side rolling arms 124 are inserted from both sides. As described above, since the side pins 122 for supporting the substrate are provided in a pin type that is spaced apart from each other, interference does not occur even when the side rolling arms 124 are inserted from both sides.

Next, as shown in FIG. 12E, the hand 123 of the robot is taken out from the unit body 121 in a state in which the input side rolling arms 124 support both sides of the substrate 30.

Next, as shown in FIG. 12F, the substrate 30 and the ion sheet chuck 40 to be attached are moved and introduced into the lower portion of the substrate 30, and thereafter, an alignment process is performed.

Then, after the side rolling arm 124 is taken out as shown in FIG. 12G, the side pin 122 for supporting the substrate is down as shown in FIG. 12H. Then, the substrate 30 is attached to the ion sheet chuck 40. Thereafter, as shown in FIG. 12I, the ion sheet chuck 40 to which the substrate 30 is attached is taken out.

A first robot 114 is provided in front of the chuck and substrate attach unit 120. The first robot 114 handles the substrate 30 and transfers it to the post process, that is, the chuck and the substrate attach unit 120. The first robot 114 transfers the substrate 30, and the ion sheet chuck 40 is returned through the chuck return line 103, so that the ion sheet chuck 40 and the substrate ( 30) can be attached.

The first flip unit 141 is disposed between the chuck and the substrate attach unit 120 and the organic film deposition unit 150 on the work line 101, and includes the ion sheet chuck 40 to which the substrate 30 is attached. It serves to flip the substrate 30 toward the bottom.

In other words, as described with reference to FIGS. 12A to 12I, immediately after the ion sheet chuck 40 and the substrate 30 are attached by the chuck and the substrate attach unit 120, the substrate 30 is It becomes a shape that faces. To reverse this, the first flip unit 141 is applied. This is because the organic layer 51 is deposited by an upward deposition method. If the organic layer 51 is deposited by a downward deposition method, the first flip unit 141 may not be applied.

Meanwhile, the organic film deposition unit 150 serves to deposit the organic film 51 on the substrate 30 as described in FIG. 4. The organic film deposition unit 150 may include a chamber 151, a source 152, and a masking frame 153 for preventing deposition.

The chamber 151 forms a place where a deposition process for the substrate 30, in particular, an organic film deposition process is performed. The chamber 151 performs an organic film deposition process on the substrate 30 in a vacuum state.

The source 152 is disposed on one side of the chamber 151 and sprays a deposition material toward the substrate 30. The deposition material at this time is an organic material, and when deposition is completed, an organic layer 51 may be deposited on the substrate 30 as shown in FIG. 4. In this embodiment, the source 152 is provided in a fixed manner on one side of the chamber 151. Since the source 152 is a fixed type, the substrate 30 is attached to the ion sheet chuck 40 and then enters and exits the chamber 151 together with the ion sheet chuck 40.

The masking frame 153 for preventing deposition is coupled to one side of the chamber 151, and when the deposition process proceeds, the deposition material from the source 152 is prevented from being deposited on the substrate 30, thereby preventing the deposition on the substrate 30. It serves to form the deposition section 31.

In this embodiment, the masking frame 153 for preventing deposition may have a shape as shown in FIG. 8. Accordingly, the non-deposition section 31 may be formed symmetrically in a straight line in both side regions of the substrate 30 covered by the masking frame 153.

The evaporation prevention masking frame 153 will be described in more detail. As described above with reference to FIG. 4, since the deposition preventing masking frame 153 is installed in the chamber 151 of the organic film deposition unit 150, when the deposition material is sprayed from the source 152, the deposition preventing masking frame 153 The organic layer 51 may be deposited on the substrate 30 except for the area where) is disposed. As the masking frame 153 is disposed, a section in which the organic film 51 is not deposited on the substrate 30, that is, a region corresponding to the masking frame 153 is a non-deposition section 31.

The organic film deposition unit 150 may further include a gap adjusting unit 154 and a frame tension holding unit 155.

The gap adjustment unit 154 is coupled to one side of the deposition preventing masking frame 153 so as to be adjustable in position, and serves to adjust a gap between the substrate 30 and the deposition preventing masking frame 153. If the gap is unnecessarily wide, the deposition material may penetrate through the gap, and if there is no gap, it is difficult to move. Therefore, it is necessary to adjust the gap manually through the gap adjustment unit 154. You can set it.

The frame tension holding unit 155 is disposed on both sides of the central area of the masking frame 153 for preventing deposition, as shown in FIG. 8, and serves to maintain tension with respect to the masking frame 153 for preventing deposition. . Considering that the masking frame 153 for preventing deposition is also a large area like the substrate 30 and is an empty structure, its central area may sag due to its own weight or deformation. To prevent this, the frame tension holding unit 155 ) Is applied, and the frame tension holding unit 155 serves to maintain the masking frame 153 for preventing deposition in an initial setting state.

A chuck moving part 156 is provided on one side of the deposition preventing masking frame 153. The chuck moving part 156 serves to move the ion sheet chuck 40 that is moved together with the substrate 30 while being attached to the substrate 30.

In this embodiment, the chuck moving part 156 is applied in a roller manner. That is, the chuck moving unit 156 includes a driving roller 156a for moving the ion sheet chuck 40 in contact with the ion sheet chuck 40, a driving unit 156b for generating power for rotation of the driving roller 156a, , It is connected to the driving unit 156b and the driving roller 156a, and may include a motion transmission unit 156c that transmits the driving force of the driving unit 156b to the rotational motion of the driving roller 156a. A guide roller 156d is further applied to the chuck moving part 156. The guide roller 156d is rotatably disposed in a side region of the ion sheet chuck 40 and serves to guide the movement of the ion sheet chuck 40. Due to the action of the driving roller 156a and the guide roller 156d, the ion sheet chuck 40 attached to the substrate 30 may be stably moved.

The laser etching unit 160 is disposed behind the process of the organic film deposition unit 150 on the work line 101, and the organic film 51 is formed in a direction crossing the non-deposition section 31 of the organic film 51. It serves to form the etching zone 52 by etching the edge region with a laser.

After the organic layer 51 is deposited, the laser etching unit 160 is positioned in a direction crossing the edge region of the organic layer 51, that is, the non-deposition section 31 as shown in FIGS. 5 and 6. The edge area of is etched with a laser. Then, the portion deposited as the organic layer 51 is removed, and the etching zone 52 is formed. As described above, the etching zone 52 indicates a region from which the portion of the organic film 51 was removed, that is, the surface of the substrate 10.

At this time, the laser etching unit 160 only needs to be etched by irradiating a laser in a direction crossing the length direction of the masking frame 153 for preventing deposition. Therefore, there is no need to apply several expensive laser etching units 160, and there is an advantage in that the etching process can be shortened.

The inorganic film deposition unit 170 is disposed behind the process of the laser etching unit 160 on the work line 101, and is already deposited on the substrate 30 including the etching zone 52 and the non-deposition section 31. It serves to deposit the inorganic layer 53 on the substrate 30 in a form that covers the existing organic layer 51.

After the etching zone 52 is formed through laser etching by the laser etching unit 160, the inorganic film 53 deposition process on the substrate 30 proceeds through the inorganic film deposition unit 170 as shown in FIG. 7. In this case, the inorganic film 53 may be deposited in a form that covers and covers the organic film 51 already deposited on the substrate 10 including the etching zone 52 and the non-deposition section 31.

The second flip unit 142 is disposed behind the process of the inorganic film deposition unit 170, and flips the ion sheet chuck 40 with respect to the substrate 30 on which the organic film 51 has been deposited. ) Faces the top. In other words, the second flip unit 142 serves to reverse the ion sheet chuck 40 so that it becomes the original state as shown in FIG. 3.

The chuck and substrate detachment unit 180 forms a process opposite to the chuck and the substrate attach unit 120 on the work line 101, but detaches the ion sheet chuck 40 and the substrate 30 that are mutually attached. It plays a role to let.

The ion sheet chuck 40 detached and detached from the substrate 30 is transferred to the chuck and the substrate attach unit 120 again through a chuck return line 103.

As previously described, the chuck return line 103 forms an independent line from the work line 101, but both ends are connected to the chuck and the substrate attach unit 120 and the chuck and the substrate detach unit 180, and the chuck and the substrate attach. A moving path of the ion sheet chuck 40 is formed so that the ion sheet chuck 40 moves between the unit 120 and the chuck and the substrate detachment unit 180.

A second robot 194 is provided behind the chuck and substrate detaching unit 180. The second robot 194 handles the substrate 30 on which the ion sheet chuck 40 is attached, and transfers it to a post process.

Hereinafter, the process of depositing the organic layer 51 and the inorganic layer 53 on the substrate 10 will be briefly described.

First, the ion sheet chuck 40 and the substrate 30 are attached through the chuck and substrate attach unit 120. Then, the ion sheet chuck 40 is turned over using the first flip unit 141 so that the substrate 30 faces downward.

Next, the organic film 51 is deposited on the substrate 30 through the organic film deposition unit 150. Since the deposition preventing masking frame 153 is installed in the chamber 151 of the organic film deposition unit 150, the organic film 51 on the substrate 30 except for the area where the deposition preventing masking frame 153 is disposed. Is deposited.

When the deposition of the organic layer 51 is completed, the etching zone 52 is formed by laser etching the edge region of the organic layer 51 in a direction crossing the non-deposition section 31 through the laser etching unit 160.

Next, the inorganic film 53 is deposited on the substrate 30 by covering the organic film 51 already deposited on the substrate 30 through the inorganic film deposition unit 170. Then, the ion sheet chuck 40 is turned over using the second flip unit 142 so that the substrate 30 faces upward.

Then, the ion sheet chuck 40 and the substrate 30, which are mutually attached through the chuck and the substrate detaching unit 180, are detached. Then, the organic layer 51 is first deposited on the surface, and the substrate 10 in which the inorganic layer 53 is deposited in a form covering the organic layer 51 may be obtained.

According to the present embodiment having the structure and function as described above, the deposition process for the display substrate 30 can be performed without using a mask, and accordingly, a mask return line and a mask return line that had to be applied to the previous system It is possible to reduce the investment cost since it is not necessary to build facilities such as a mask cleaning line.

As described above, the present invention is not limited to the described embodiments, and it is obvious to those of ordinary skill in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention. Therefore, it should be said that such modifications or variations belong to the claims of the present invention.

30: substrate 31: non-deposition section
40: ion sheet chuck 51: organic film
52: etching zone 53: inorganic film
101: working line 103: chuck return line
120: chuck and substrate attach unit 121: unit body
122: side pin for supporting the substrate 123: hand
124: side rolling arm 141: first flip unit
142: second flip unit 150: organic film deposition unit
151: chamber 152: source
153: masking frame for preventing deposition 154: gap adjustment unit
155: frame tension holding unit 156: chuck moving unit
156a: drive roller 156b: drive unit
156c: motion transmission unit 156d: guide roller
160: laser etching unit 170: inorganic film deposition unit
180: chuck and substrate detach unit

Claims (17)

A working line in which a deposition operation is performed on the substrate;
An organic film deposition unit disposed on one side of the work line and for depositing an organic film on the substrate;
It is disposed behind the process of the organic film deposition unit on the work line, and an etching zone is formed by etching the edge region of the organic film with a laser in a direction crossing the non-deposition section formed on the substrate. A laser etching unit to form;
A chuck disposed in front of the process of the organic film deposition unit on the work line and moved together with the substrate in a state attached to the substrate, and a chuck and a substrate for attaching the substrate Attach unit; And
A first flip unit disposed between the chuck and the substrate attaching unit and the organic film deposition unit on the working line, and flipping the chuck to which the substrate is attached to face the substrate downward,
The organic film deposition unit,
A chamber in which a deposition process is performed on the substrate;
A source disposed on one side of the deposition chamber and injecting a deposition material toward the substrate; And
It is coupled to one side of the chamber, characterized in that it comprises a masking frame for preventing deposition to form a non-deposition section on the substrate by preventing the deposition material from the source from being deposited on the substrate when the deposition process is in progress. Display substrate deposition system. The method of claim 1,
The organic film deposition unit,
A substrate deposition system for a display, further comprising a gap adjusting unit coupled to one side of the deposition preventing masking frame so as to be position adjustable, and adjusting a gap between the substrate and the deposition preventing masking frame. The method of claim 1,
The organic film deposition unit,
And a frame tension holding unit disposed in a central region of the deposition preventing masking frame and maintaining a tension with respect to the deposition preventing masking frame. The method of claim 3,
The organic film deposition unit,
A substrate deposition system for a display, further comprising a chuck moving part provided on one side of the deposition preventing masking frame and moving the chuck. The method of claim 4,
The chuck moving part,
A driving roller in contact with the chuck to move the chuck;
A driving unit generating power for rotation of the driving roller; And
And a motion transmission unit connected to the driving unit and the driving roller and transmitting a driving force of the driving unit to a rotational motion of the driving roller. The method of claim 5,
The chuck moving part,
And a guide roller that is rotatably disposed in a side region of the chuck and guides the movement of the chuck. The method of claim 1,
The substrate deposition system for a display, wherein the non-deposition section is symmetrically formed in a straight line in both side areas of the substrate. delete The method of claim 1,
It is disposed behind the process of the laser etching unit on the work line, further comprising an inorganic film deposition unit for depositing an inorganic film on the substrate in a form that covers the organic film already deposited on the substrate including the etching zone A substrate deposition system for a display, characterized in that. delete The method of claim 1,
The chuck is an ion sheet chuck capable of attaching to the substrate through the force of ions without additional power or an adhesive. The method of claim 11,
The ion sheet chuck is a substrate deposition system for a display, characterized in that attached (attach) only at some points of the substrate. The method of claim 11,
The ion sheet chuck is attached to the entire surface of the substrate. delete The method of claim 1,
A substrate deposition system for a display, further comprising a chuck and a substrate detach unit to form a process opposite to the chuck and the substrate attach unit on the work line, and to detach the chuck and the substrate attached to each other. . The method of claim 15,
A line independent from the work line is formed, but both ends thereof are connected to the chuck and the substrate attach unit, and the chuck and the substrate detachment unit, and the chuck moves between the chuck and the substrate attach unit and the chuck and the substrate detachment unit. A substrate deposition system for a display, further comprising a chuck return line for forming a movement path of the chuck. The method of claim 15,
And a second flip unit disposed on the work line in front of the process of the chuck and the substrate detaching unit, and flipping the chuck to which the substrate is attached to face the substrate. For substrate deposition system.

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