KR102171684B1 - Display glass deposition system - Google Patents

Abstract

A substrate deposition system for a display is disclosed. A substrate deposition system for a display according to an embodiment of the present invention includes a working line on which a deposition operation is performed on a substrate; And a front attach chuck disposed on one side of the work line and attachable to a front surface of the substrate to be supplied to the work line, a chuck for attaching the substrate to each other, and a substrate attach unit.

Description

Display substrate deposition system {Display glass deposition system}

The present invention relates to a substrate deposition system for a display, and more particularly, by applying a chuck that can be attached to the front surface of the substrate so that the chuck and the front surface of the substrate are attached, the quantity is applied for each panel model. In addition to solving problems that may increase, storage problems can be naturally solved, and mura can be prevented on the panel, and furthermore, automatic cleaning function can be implemented. It relates to a substrate deposition system for a display that can lead to a labor cost reduction effect.

One of the flat panel display device substrates used for displays, the OLED substrate, that is, the Organic Light Emitting Display (OLED), is an ultra-thin display device that emits color images by self-emission of organic materials. It is attracting attention as a promising display device in that it is simple and has high light efficiency.

The organic light emitting display device (OLED) includes an anode and a cathode, and organic layers interposed between the anode and the cathode. Here, the organic layers include an emission layer. Of course, the organic layers may further include a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer in addition to the emission layer.

In order to realize full color, the light emitting layer must be patterned, and for this, a deposition process is applied. In a vapor deposition machine that performs a deposition process on an OLED substrate (hereinafter referred to as a substrate), for example, in an OLED TV deposition machine, it is common to perform a deposition process on the substrate by applying an open metal mask.

In a large-sized evaporator for OLED TV, a glass is deposited while passing over a source while being sandwiched between a chuck and a mask.

At this time, the chuck plays a very important role in holding or handling the substrate. In other words, a chuck that meets this function must be selected because the substrate attached to the chuck must not be arbitrarily separated during deposition of the substrate or when the substrate is flipped.

As such, the role of the chuck is of paramount importance for the implementation of the substrate deposition system. Conventional electrostatic chuck or magnetic chuck has a complex structure, and is somewhat disadvantageous in attaching or detaching the substrate and is large. The application of an ion chuck can be considered in that it is difficult to apply it to the vacuum equipment of the substrate. The ion chuck allows it to be attached to the substrate through adhesion (not adhesive) based on van der Waals force.

On the other hand, when attaching to a substrate by applying such an ion chuck, a method of attaching only to some points of the substrate, not the front surface of the substrate, may be considered.

However, in the case of attaching only a partial point of the substrate with the ion chuck as described above, the following problems may occur.

First, in the case of producing a panel with a large substrate with a width of 2m or more, there is a problem that the number of ion chucks is inevitably increased exponentially depending on the type of panel because the points to be attached to each panel may vary.

Second, as the number of ion chucks increases, there is a problem in storage that a wide storage space that must be stored for each model must be provided.

Third, in order to apply the ion chuck that attaches only to some local points on the substrate, it is necessary to process an attach hole or a detach attach hole on the panel. The processing of these holes causes mura on the panel. There is a problem that can occur.

Fourth, periodic foreign matter management for the ion chuck is required, but there are problems in that the process is inconvenient and labor costs are increased in that there are many types and thus the manual cleaning operation is inevitable.

As a result, when the ion chuck is applied to only some points of the substrate while the ion chuck and the substrate are attached to each other, when the ion chuck is applied, it is highly likely that various problems as described above may occur. While solving these problems, it is necessary to develop a technology for effectively attaching a substrate.

Korean Intellectual Property Office Publication No. 10-2012-0077382

Therefore, the technical problem to be achieved by the present invention is to solve the problem that the quantity may increase due to each panel type by applying a chuck that can be attached to the front surface of the substrate so that the chuck and the front surface of the substrate are attached. Of course, this can naturally solve storage problems, prevent mura from occurring on the panel, and even implement an automatic cleaning function, leading to a reduction in labor costs due to automation. It is to provide a substrate deposition system for a display.

According to an aspect of the present invention, there is provided a working line in which a deposition operation is performed on a substrate; And a front attach chuck disposed on one side of the work line and attachable to the front surface of the substrate to be supplied to the work line, and a chuck and a substrate attach unit for mutually attaching the substrate. A substrate deposition system for a display characterized in that it includes may be provided.

The front attach chuck may be an ion sheet front attach chuck that enables front attachment to the substrate through the force of ions without separate power or an adhesive.

The chuck and the substrate attach unit may include a plurality of side pins for supporting a substrate to which a side region of the substrate is supported and which are moved up/down at a corresponding position; And a side rolling arm cooperatively operated with the front attach chuck and the side pin for supporting the substrate so that the substrate is attached to each other.

The side rolling arm may include a unit base fixed to an installation surface; A plurality of side arms disposed to be spaced apart from each other and supporting the substrate while approaching or spaced apart from the substrate; An arm driving unit driving the plurality of side arms; And an arm slider in which the plurality of side arms are integrally connected and driven together with the plurality of side arms.

The side rolling arm may further include an arm support rail coupled to the arm slider and supporting the side arm.

The side rolling arm may further include a resin-based ball transfer provided on a surface of the side arm in contact with the substrate.

The substrate may be a film-laminating substrate formed by laminating a mask substitute film in which a deposition opening is formed in advance.

An organic film deposition unit may further include an organic film deposition unit disposed behind the process of the chuck and the substrate attach unit on the work line, and depositing an organic film on the film laminating substrate to which the front attach chuck is attached.

It is disposed behind the process of the organic film deposition unit on the work line, and forms an etching zone by etching an edge region of the organic film deposited on the film laminating substrate through the deposition opening with a laser. It may further include a laser etching unit.

It may further include a film laminating unit for forming an initial process on the work line and for manufacturing the film-laminating substrate in which the mask substitute film is integrated with the substrate by laminating the mask substitute film to the substrate. have.

A load lock unit for forming the atmosphere into a vacuum state may be connected to the rear of the process of the film laminating unit on the work line.

An inorganic film deposition unit that is disposed on the work line behind the process of the laser etching unit and covers the organic film already deposited on the film laminating substrate, including the etching zone, to deposit an inorganic film on the film laminating substrate. It may contain more.

It is disposed between the chuck and the substrate attach unit and the organic film deposition unit on the work line, and flips the front attach chuck to which the film laminating substrate is attached, so that the film laminating substrate faces downward. It may further include 1 flip unit.

It may further include a chuck and a substrate detachment unit forming a process opposite to the chuck and the substrate attaching unit on the work line, and detaching the chuck and the film-laminating substrate attached to each other.

A line independent from the work line is formed, but both ends thereof are connected to the chuck and the substrate attach unit, and the chuck and the substrate detachment unit, and the chuck moves between the chuck and the substrate attach unit and the chuck and the substrate detachment unit. It may further include a chuck return line (chuck return line) forming a movement path of the chuck.

A second flip unit disposed on the work line in front of the process of the chuck and the substrate detaching unit, flipping the front attach chuck to which the film-laminating substrate is attached, so that the film-laminating substrate faces upward. It may contain more.

It may further include a film de-laminating unit forming a final process on the work line and delaminating the mask substitute film from the film laminating substrate in the atmosphere.

An unload lock unit for forming a vacuum in an atmospheric state may be connected in front of the process of the film delaminating unit on the work line.

At least one buffer unit provided on the work line for smooth transfer of logistics; And at least one robot provided on at least one side of the work line and for handling the substrate.

According to the present invention, by applying a chuck that can be attached to the front surface of the substrate so that the chuck and the front surface of the substrate are attached, it is possible to solve the problem that may be applied by panel model and increase the quantity. As a result, storage problems can be naturally resolved, mura can be prevented from occurring on the panel, and an automatic cleaning function can be implemented, leading to a reduction in labor costs due to automation.

1 is a schematic structural diagram of an organic light emitting display device (OLED) in which 10 layers of organic and inorganic layers are alternately deposited.
2 is a layout of a substrate deposition system for a display according to an embodiment of the present invention.
3 is a diagram schematically showing a state in which a film laminating substrate is attached to the front attach chuck.
4 is an exploded perspective view of a substrate and a mask substitute film.
5 is a perspective view of a film laminating substrate in which a mask substitute film is laminated on a substrate, and is a view showing the mask substitute film facing upward.
6 is a plan view of FIG. 5.
7 is a diagram illustrating a state in which an organic layer is deposited in the state of FIG. 6.
FIG. 8 is a diagram illustrating a state in which an etching zone is formed using a laser in the state of FIG. 7.
9 is a diagram illustrating a state in which an inorganic layer is deposited to cover an organic layer including an etching zone in the state of FIG. 8.
10 is a cross-sectional view taken along line AA of FIG. 9.
11 is a diagram illustrating a state in which the mask substitute film is removed from FIG. 10.
12 is a layout view of a side rolling arm of a chuck and a substrate attach unit.
13 is a side view of a side rolling arm.
14 is an enlarged perspective view of a main part of FIG. 13.
15A to 15I are diagrams illustrating a step-by-step process in which the front attachment chuck and the film laminating substrate are attached.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the implementation of the present invention, reference should be made to the accompanying drawings illustrating preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by describing a preferred embodiment of the present invention with reference to the accompanying drawings. The same reference numerals in each drawing indicate the same member.

1 is a schematic structural diagram of an organic light emitting display (OLED) in which 10 layers of organic and inorganic layers are alternately deposited.

Referring to this drawing, the organic light emitting display device 1 (OLED) may include a substrate and an organic light emitting device 3 stacked on the substrate.

The substrate may be a substrate made of glass. Briefly describing the organic light-emitting device 3 without reference numerals, the organic light-emitting device 3 has a stacked structure of an anode, a three-layer organic film (hole transport layer, light emitting layer, electron transport layer), and a cathode. When an organic molecule receives energy (now, it is in an excited state), it tries to return to its original state (ground state), and has the property of emitting the received energy as light.

In the organic light-emitting device 3, when a voltage is applied, holes (+) injected from the anode and electrons (-) injected from the cathode recombine in the emission layer, and at this time, the organic molecules are excited to emit light. When a voltage is applied in this way, the organic light emitting display device 1 displays using the characteristic that the organic material emits light, and R(Red), G(Green), B(Blue) depending on the organic material on the organic light emitting device 3 It implements full color by using the characteristic that emits a color.

On the other hand, since the organic light emitting device 3 can be easily damaged by gas or moisture in the atmosphere, the problem of lifespan can be raised, and to solve this problem, by alternately stacking multiple layers of organic and inorganic films as shown in FIG. It has come to protect the organic light-emitting device 3 from the inflow of gas or moisture.

In FIG. 1, a total of 10 layers of organic and inorganic layers are alternately stacked. That is, from the organic light-emitting device 3, a first organic film, a first inorganic film, a second organic film, a second inorganic film… a fifth organic film, and a fifth inorganic film are sequentially and layer-by-layer deposited.

Looking at this in detail, a film is deposited in a form in which the first inorganic film completely encloses the first organic film, followed by a form in which the second organic film partially encloses the first inorganic film, and then the second inorganic film completely encloses the second organic film. It can be seen that, for such a deposition, the following deposition system is required.

FIG. 2 is a layout of a substrate deposition system for a display according to an embodiment of the present invention, and FIG. 3 is a schematic view showing a state in which a film laminating substrate is attached to a front attach chuck. 4 is an exploded perspective view of a substrate and a mask substitute film, FIG. 5 is a perspective view of a film-laminating substrate in which a mask substitute film is laminated on a substrate, showing the mask substitute film facing upward, and FIG. 6 is a plan view of FIG. , FIG. 7 is a diagram illustrating a state in which an organic film is deposited in the state of FIG. 6, FIG. 8 is a diagram illustrating a state in which an etching zone is formed using a laser in the state of FIG. 7, and FIG. 9 is an etching zone in the state of FIG. Including an organic film is a view of a state in which the inorganic film is deposited in a form covering the organic film, Figure 10 is a cross-sectional view taken along line AA of Figure 9, Figure 11 is a view in a state in which the mask substitute film is removed from Figure 10, Figure 12 is a chuck and a substrate It is a layout view of the side rolling arm of the attach unit, Fig. 13 is a side view of the side rolling arm, Fig. 14 is an enlarged perspective view of the main part of Fig. 13, and Figs. 15A to 15I are the front attach chuck and the film laminating substrate are attached. These are drawings showing the process step by step.

Referring to these drawings, but first referring to FIG. 2, the substrate deposition system for a display according to the present embodiment applies a front attach chuck 40 that can be attached to the front surface of the film laminating substrate 30. By allowing the front attaching chuck 40 and the front of the film laminating substrate 30 to be attached, it is possible to solve the problem that may increase the quantity applied to each panel type, as well as to naturally solve the storage problem. In addition, it is possible to prevent the occurrence of mura on the panel, and furthermore, it is possible to implement an automatic cleaning function, thus leading to an effect of reducing labor costs due to automation.

In particular, the display substrate deposition system according to the present exemplary embodiment allows a deposition process on the display substrate 10 to be performed without applying a metal mask, which has been conventionally applied.

For reference, the substrate deposition system for a display according to the present embodiment may be a system for depositing a first organic layer, which is a first layer, and a first inorganic layer, which is a second layer in the drawing of FIG. 1. Therefore, in order to alternately stack a total of 10 layers of organic and inorganic layers as shown in FIG. 1, five systems as shown in FIG. 2 may be used in succession or the system of FIG. 2 may be repeatedly used.

Prior to the detailed description of the display substrate deposition system according to the present embodiment, first, referring to FIGS. 2 to 11, a process of performing a deposition process on the display substrate 10 without applying a metal mask will be described. First, a brief description.

In the case of the present embodiment, instead of using a metal mask that has always been used in the previous deposition process, a method of performing a deposition process on the substrate 10 using the mask substitute film 20 is adopted.

The mask substitute film 20 is a film that is completely different from the existing metal mask, although it serves as a conventional metal mask. That is, the conventional metal mask is moved through a separate device, attached to the substrate 10, separated again, and then returned, whereas the mask substitute film 20 applied in this embodiment is thin. As a film of, it is laminated with the substrate 10 to form one body with the substrate 10.

Therefore, equipment for moving the metal mask, equipment for attaching to the substrate 10, equipment for separating, equipment for returning, and the like are not required at all. The mask substitute film 20 applied to this embodiment may be made of polyimide having excellent heat resistance.

As shown in FIG. 4, a deposition opening 21 is formed in the mask substitute film 20. Since it is shown that the two deposition openings 21 are formed in the drawing, the number of displays finally manufactured on the original substrate may be two. However, the number of deposition openings 21 formed in the mask substitute film 20 may be one, or may be three or more. Therefore, the scope of the present invention is not limited by matters such as the number and shape of the deposition openings 21.

The mask substitute film 20 is a flexible sheet-like material and is previously laminated to the substrate 10 unlike a conventional metal mask. That is, through the film laminating unit 110 shown in FIG. 2, the mask substitute film 20 is laminated to the substrate 10 as shown in FIG. 4 to form one body. Hereinafter, for convenience of explanation, a state in which the mask substitute film 20 is laminated to the substrate 10 to form one body is referred to as a film laminating substrate 30.

After the film laminating substrate 30 is attached to the front attach chuck 40 as shown in FIG. 3, the deposition process is performed while moving most of the processes in FIG. 2, so that the metal mask is moved as before, Equipment to attach to the substrate 10, equipment to separate, equipment to return, and the like are not required at all.

The deposition process for the film laminating substrate 30 may be performed in the order of an organic layer and an inorganic layer. That is, in the initial state of FIG. 6, the organic layer 51 is deposited on the film laminating substrate 30 by the organic layer deposition unit 150 as shown in FIG. 7. Substantially, the organic film 5 is deposited on the substrate 10 through the deposition opening 21 of the mask substitute film 20. Of course, the organic film 5 is also deposited on the mask substitute film 20, but its expression is omitted for convenience. This is because the mask substitute film 20 is finally a target to be removed.

After the organic film 5 is deposited on the surface of the substrate 10 exposed by the deposition opening 21 as shown in FIG. 7, the laser etching unit 160 lasers the edge region of the organic film 5 as shown in FIG. Etch with (laser). Then, the portion deposited as the organic layer 5 is removed, and an etching zone 52 is formed. The etching zone 52 indicates a region from which the portion of the organic film 5 was removed, that is, the surface of the substrate 10.

After the etching zone 52 is formed through laser etching, as shown in FIGS. 9 and 10, a deposition process of the inorganic film 53 on the film laminating substrate 30 is performed through the inorganic film deposition unit 170.

In this case, the inorganic film 53 is deposited to cover and cover the organic film 51 already deposited on the substrate 10 through the deposition opening 21 including the etching zone 52. The inorganic film 53 is also deposited on the mask substitute film 20, but its expression is omitted for convenience.

After the deposition of the inorganic film 53 is completed, as shown in FIG. 11, when the mask substitute film 20 is peeled, that is, delaminating, the organic film 51 is first deposited on the surface of the substrate 10, and the organic film ( In the form of covering 51), the inorganic film 53 is deposited. By continuing to repeat this method, the structure of FIG. 1 can be made.

In order to make the structure shown in FIG. 11, in the case of this embodiment, a substrate deposition system for a display as shown in FIG. 2 is proposed.

The substrate deposition system for a display according to this embodiment allows the deposition process to be performed on the display substrate 10 without the application of a metal mask, as described above. In particular, it is attached to the front surface of the film laminating substrate 30. A possible front attach chuck 40 is applied so that the front attach chuck 40 and the entire surface of the film laminating substrate 30 are attached to each other so that the deposition process can be performed.

As shown in FIG. 2, the substrate deposition system for a display according to the present embodiment capable of providing such an effect includes a predetermined working line 101 in which a deposition process for the substrate 10 is performed, and It includes a separate chuck return line 103 different from the line 101.

The chuck return line 103 is a line from which the front attach chuck 40 is returned, and most of the components are disposed on the work line 101. The work line 101 laminates the mask substitute film 20 on the substrate 10, and then proceeds to deposit the organic film 51, laser etching, and deposit the inorganic film 53, and then deposit the mask substitute film 20. It forms a series of lines for delaminating.

In the case of this embodiment, since the working line 101 is inline, a smooth deposition process for the substrate 10 can be induced. However, the work line 101 does not necessarily have to be inline.

Hereinafter, for convenience of description, components arranged in order on the work line 101 of the substrate deposition system for a display according to the present embodiment, that is, the film laminating unit 110, the chuck and the substrate attaching unit 120, The first flip unit 141, the organic film deposition unit 150, the laser etching unit 160, the inorganic film deposition unit 170, the second flip unit 142, the chuck and substrate detachment unit 180, and a film The delaminating unit 190 will be described sequentially. For reference, on the work line 101, a plurality of buffer units are provided in several places for smooth transfer of logistics. The buffer unit is directly indicated in the drawings in English letters (buffer) without reference numerals.

Looking at the configuration of the substrate deposition system for a display according to the present embodiment, first, the film laminating unit 110 forms an initial process on the work line 101.

The film laminating unit 110 laminates the mask substitute film 20 separated from each other as shown in FIG. 4 to the substrate 10 as shown in FIGS. 5 and 6 so that the mask substitute film 20 is integrated with the substrate 10 The resulting film laminating substrate 30 is manufactured.

The film laminating process may be applied in a roll-to-roll type, and when the film laminating process is applied in a roll-to-roll type, continuity of work becomes possible and productivity may be improved.

The film laminating process by the film laminating unit 110 is performed in the atmosphere. In other words, it can be performed in a general ATM chamber other than a vacuum chamber.

In this way, the film laminating process by the film laminating unit 110 is performed in the atmosphere, but since the subsequent processes must be performed under vacuum, the load lock unit 112 is connected to the film laminating unit 110. . Of course, the film delaminating process by the film delaminating unit 190 formed at the most distal end is also performed in the atmosphere.

The load lock unit 112 is connected to the rear of the film laminating unit 110 on the work line 101 and forms the atmosphere in a vacuum state.

A first robot 114 is provided behind the process of the load lock unit 112. The first robot 114 handles the film-laminating substrate 30 in which the mask substitute film 20 is integrated with the substrate 10 and transfers it to a post process, that is, the chuck and the substrate attach unit 120 do.

On the other hand, the chuck and the substrate attaching unit 120 is a front surface that can be attached to the front surface of the film laminating substrate 30 to be supplied to the work line 101 prior to the deposition of the organic film 51 on the film laminating substrate 30. It serves to attach the attaching chuck 40 and the film laminating substrate 30 to each other. In other words, as shown in FIG. 3, the chuck and the substrate attach unit 120 are in charge of a process of attaching the front attach chuck 40 to the film laminating film laminating substrate 30.

In this embodiment, the front attach chuck 40 applied to the chuck and the substrate attach unit 120 enables attachment to the film laminating substrate 30 through the force of ions without separate power or adhesive. It is an ion sheet front attach chuck 40.

For reference, the ion sheet front attach chuck 40 allows the film laminating substrate 30 to be attached through an adhesive force (not an adhesive) based on van der Waals force.

Here, the van der Waals force refers to the force acting between electrically neutral molecules that do not have negative electrons. In particular, it refers to the attractive force acting at a relatively long distance. The van der Waals force is a result of the dispersing force, and the forces acting between rare gas atoms and the factors that form molecular crystals of hydrocarbons such as benzene can be explained by the van der Waals force. In addition, the van der Waals force refers to an intrinsic force required to explain the phenomena such as agglomeration and adhesion of liquids and physical adsorption as in this embodiment.

In summary, Van der Waals force is an extremely weak electrostatic attraction that acts only at very close distances between electrically neutral molecules, and collectively refers to the electrical forces acting between covalently bonded molecules.

In particular, physical adhesion is possible without additional power through the force of ions. Since the front attach chuck 40 is manufactured based on such Van der Waals force, the film laminating substrate on the front attach chuck 40 (30) This can be attached without the adhesive, and can be detached again later.

The chuck and substrate attach unit 120 includes a plurality of side pins 220 for supporting substrates and a side rolling arm 230 for mutual attachment of the front attach chuck 40 and the film laminating substrate 30. Includes.

The side pin 220 for supporting the substrate forms a place where the side region of the film laminating substrate 30 is supported, and is moved up/down at the corresponding position.

In other words, the side pin 220 for supporting the substrate is disposed to be movable up/down around the front attach chuck 40, and the front attach chuck ( Supports the side area of the film laminating substrate 30 that is introduced to the 40) side.

On the other hand, when the substrate supporting side pins 220 support the end regions of the film laminating substrate 30, in the case of a small substrate, even if the substrate supporting side pins 220 support only the end regions of the small substrate. The amount of sag due to the weight of the substrate is small, so that the process can be sufficiently carried out without damage to the substrate.

However, when a large-sized substrate is applied as in the present embodiment, the film laminating substrate 30 may be deformed or damaged due to sagging due to the self-load of the film laminating substrate 30. Thus, the side rolling arm 230 is applied to solve this problem.

The side rolling arm 230 is operated cooperatively with the side pin 220 for supporting the substrate so that the front attach chuck 40 and the film laminating substrate 30 are attached to each other. As shown in FIG. 12, the side rolling arms 230 may be symmetrically disposed one by one on both side areas of the front attach chuck 40.

As shown in detail in FIGS. 12 to 14, the side rolling arm 230 is a unit base 240 fixed to the installation surface, and is disposed spaced apart from each other, and is approached or spaced apart from the film laminating substrate 30 while the film laminating substrate It may include a plurality of side arms 250 for supporting 30 and an arm driving unit 260 for driving the plurality of side arms 250.

The unit base 240 supports a plurality of side arms 250 and arm driving units 260 in a fixed position.

The plurality of side arms 250 support the lower surface of the film-laminated substrate 30, that is, the non-deposited surface of the substrate, while being driven by the arm driving unit 260. In this case, since the side arms 250 are moved between the side pins 220 for supporting the substrate in a state that they are spaced apart from each other, they do not interfere with the side pins 220 for supporting the substrate. In addition, since the side arms 250 are driven only at a gap between the substrate loading robot 200 and the substrate, the side arms 250 do not interfere with the substrate loading robot 200.

A resin-based ball transfer 251 is provided on the surfaces of the side arms 250 in contact with the film laminating substrate 30. Since the film laminating substrate 30 is supported by the resin-based ball transfer 251, there is no scratch.

The plurality of side arms 250 are integrally connected to one body by an arm slider 270. That is, the arm slider 270 is integrally connected with the plurality of side arms 250 and is driven together with the plurality of side arms 250. The arm slider 270 is provided with an arm support rail 255 supporting the side arm 250. The exposure length of the side arm 250 may be set in advance through the arm support rail 255.

The arm driving unit 260 serves to drive the side arm 250 in the direction of an arrow in FIG. 13. The arm driving unit 260 may be implemented by a combination of a servo motor and a ball screw.

Hereinafter, a process in which the front attach chuck 40 and the film laminating substrate 30 are attached will be described with reference to FIGS. 15A to 15I.

First, in the standby state as shown in FIG. 15A, the film-laminating substrate 30 is put into the upper portion of the front attach chuck 40 by the substrate input robot 200 as shown in FIG. 15B. In this case, the film laminating substrate 30 is not in contact with the side pins 220 for supporting the substrate.

Next, as the side pins 220 for supporting the substrate are operated up as shown in FIG. 15C, the film-laminating substrate 30 is supported in contact with the upper ends of the side pins 220 for supporting the plurality of substrates.

At this time, since the side pins 220 for supporting the substrate support only the side end regions of the film laminating substrate 30, sagging of the film laminating substrate 30 may occur.

Therefore, after the film laminating substrate 30 is contacted and supported by the side pins 220 for supporting the substrate, the side arms 250 of the side rolling arm 230 are introduced into the central region of the film laminating substrate 30 as shown in FIG. 15D. The non-deposited surface of the film laminating substrate 30 is supported from the bottom. At this time, since the side arms 250 are driven only at a gap between the substrate input robot 200 and the film laminating substrate 30, even if the side arms 250 are inserted into the central region of the film laminating substrate 30, the side The arms 250 do not interfere with the substrate loading robot 200. Therefore, even a large substrate is prevented from sagging.

Then, as shown in FIG. 15E, the robot 200 for inputting the substrate is down. Then, as shown in FIG. 15F, the robot 200 for inputting the substrate escapes.

Next, as shown in FIG. 15G, the side arm 250 of the side rolling arm 230 starts to escape to its original position. As the side arm 250 of the side rolling arm 230 is evacuated to its original position, the central region of the film-laminating substrate 30 sags and first contacts the front attaching chuck 40, as shown in FIG. 15H, the side rolling arm 230 The side arm 250 of the is completely evacuated to its original position.

Subsequently, the side pin 220 for supporting the substrate is gradually down, so that the film laminating substrate 30 may be attached while completely in contact with the front attach chuck 40 as shown in FIG. In this case, the front surface of the film laminating substrate 30 is attached to the front attach chuck 40, and the film laminating substrate 30 is taken to face upward.

The first flip unit 141 is disposed between the chuck and the substrate attach unit 120 and the organic film deposition unit 150 on the work line 101, and the front attach chuck to which the film laminating substrate 30 is attached ( 40) serves to flip the film laminating substrate 30 toward the bottom.

In other words, immediately after the front attach chuck 40 and the film laminating substrate 30 are attached by the chuck and the substrate attach unit 120 as described with reference to FIGS. 15A to 15I, the film laminating substrate ( 30) becomes a shape facing the top. To reverse this, the first flip unit 141 is applied. This is because the organic layer 51 is deposited by an upward deposition method. If the organic layer 51 is deposited by a downward deposition method, the first flip unit 141 may not be applied.

The organic film deposition unit 150 serves to deposit the organic film 51 on the film laminating substrate 30 of one body by pre-laminating the mask substitute film 20 in which the deposition opening 21 is formed. do.

As described above, the organic layer 51 may be deposited on the film laminating substrate 30 by the organic layer deposition unit 150 as shown in FIGS. 6 to 7. Substantially, the organic layer 5 may be deposited on the substrate 10 through the deposition opening 21 of the mask substitute film 20.

Meanwhile, the laser etching unit 160 is disposed behind the process of the organic film deposition unit 150 on the work line 101, and the organic film 51 deposited on the film laminating substrate 30 through the deposition opening 21 It serves to form the etching zone 52 by etching the edge region of the laser (laser).

That is, after the organic film 5 is deposited on the surface of the substrate 10 exposed by the deposition opening 21 as shown in FIG. 7, the laser etching unit 160 covers the edge area of the organic film 5 as shown in FIG. Etch with a laser. Then, the portion deposited as the organic layer 5 is removed to form the etching zone 52. As described above, the etching zone 52 refers to a region from which the portion of the organic film 5 was removed, that is, the surface of the substrate 10.

In FIG. 2, unlike the organic film deposition unit 150 and the inorganic film deposition unit 170, a plurality of laser etching units 160 are applied. This is because the etching process takes a lot of time, so the overall tact time is reduced. Therefore, one laser etching unit 160 may be applied, and these matters should also be included within the scope of the present invention.

The inorganic film deposition unit 170 is disposed behind the process of the laser etching unit 160 on the work line 101, and includes the etching zone 52 and the organic film 51 already deposited on the film laminating substrate 30. ) Serves to deposit the inorganic film 53 on the film laminating substrate 30 in a form covering the ).

After the etching zone 52 is formed through laser etching by the laser etching unit 160, the inorganic film 53 is deposited on the film laminating substrate 30 through the inorganic film deposition unit 170 as shown in FIGS. 9 and 10 The process proceeds. At this time, the inorganic film 53 will be deposited in a form covering and covering the organic film 51 already deposited on the substrate 10 through the deposition opening 21 including the etching zone 52. I can.

The second flip unit 142 is disposed behind the process of the inorganic film deposition unit 170 and flips the front attach chuck 40 with respect to the film laminating substrate 30 on which the organic film 51 has been deposited. The film laminating substrate 30 faces upward. In other words, the second flip unit 142 serves to reverse the front attachment chuck 40 so as to be in an original state as shown in FIG. 3.

The chuck and substrate detachment unit 180 forms a process opposite to the chuck and the substrate attach unit 120 on the work line 101, but attaches the front attach chuck 40 and the film laminating substrate 30 that are mutually attached. It serves to (detach).

The front attach chuck 40 detached and detached from the film laminating substrate 30 is transferred to the chuck and the substrate attach unit 120 again through a chuck return line 103.

As previously described, the chuck return line 103 forms an independent line from the work line 101, but both ends are connected to the chuck and the substrate attach unit 120 and the chuck and the substrate detach unit 180, and the chuck and the substrate attach. A moving path of the front attach chuck 40 is formed so that the front attach chuck 40 moves between the unit 120 and the chuck and the substrate detachment unit 180.

A second robot 194 is provided behind the chuck and substrate detaching unit 180. The second robot 194 handles the film laminating substrate 30 on which the front attach chuck 40 is attached, and transfers it to a post process, that is, an unload lock unit 192. .

The unload lock unit 192 is disposed between the second robot 194 and the film de-laminating unit 190, and forms a vacuum state into the atmosphere so that the film laminating substrate 30 is transferred to the film de-laminating unit 190. To deliver.

The film delaminating unit 190 forms the last process on the work line 101, and serves to delaminate the mask substitute film 20 from the film laminating substrate 30 in the atmosphere. That is, when the mask substitute film 20 is peeled off, that is, delaminated, as shown in FIG. 10 to 11, the organic film 51 is first deposited on the surface, and the inorganic film 53 is formed to cover the organic film 51. The substrate 10 in this deposited state can be obtained.

Hereinafter, the process of depositing the organic film 51 and the inorganic film 53 on the display substrate 10 will be briefly described.

First, by laminating the mask substitute film 20 on the substrate 10 through the film laminating unit 110, the film laminating substrate 30 in which the mask substitute film 20 is integrated with the substrate 10 is placed in the atmosphere. Make it.

Next, the front attach chuck 40 and the film laminating substrate 30 are attached through the chuck and substrate attach unit 120. In this case, as described above, the front attach chuck 40 is attached to the front surface of the film laminating substrate 30. Then, the front attach chuck 40 is turned over using the first flip unit 141 so that the film laminating substrate 30 faces downward.

Next, the organic layer 51 is deposited on the film laminating substrate 30 through the organic layer deposition unit 150.

When the deposition of the organic film 51 is completed, the edge region of the organic film 51 is etched with a laser through the laser etching unit 160 to form the etching zone 52.

Next, the inorganic film 53 on the film laminating substrate 30 in a form covering the organic film 51 already deposited on the film laminating substrate 30 including the etching zone 52 through the inorganic film deposition unit 170. ) Is deposited. Then, the front attach chuck 40 is turned over using the second flip unit 142 so that the film laminating substrate 30 faces upward.

Next, the front attach chuck 40 and the film laminating substrate 30 that are mutually attached through the chuck and the substrate detaching unit 180 are detached.

Then, the organic film 51 is first deposited on the surface as shown in FIG. 11 by delaminating the mask-substitute film 20 from the air from the film laminating substrate 30 using the film de-laminating unit 190. The substrate 10 in which the inorganic film 53 is deposited in a form covering the organic film 51 may be obtained.

According to the present embodiment having the structure and function as described above, the front attach chuck 40 and the film laminating substrate are applied by applying the front attach chuck 40 that can be attached to the front of the film laminating substrate 30. By allowing the front of (30) to be attached, it is possible to solve the problem that may increase the quantity applied to each panel model, and this can naturally solve the storage problem, and mura is generated on the panel. The phenomenon can be prevented and, furthermore, an automatic cleaning function can be implemented, leading to the effect of reducing labor costs due to automation.

As described above, the present invention is not limited to the described embodiments, and it is obvious to those of ordinary skill in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention. Therefore, it should be said that such modifications or variations belong to the claims of the present invention.

10: substrate 20: mask substitute film
21: vapor deposition opening 30: film laminating substrate
40: front attach chuck 51: organic film
52: etching zone 53: inorganic film
101: working line 103: chuck return line
110: film laminating unit 112: load lock unit
114: first robot 120: chuck and substrate attach unit
141: first flip unit 142: second flip unit
150: organic film deposition unit 160: laser etching unit
170: inorganic film deposition unit 180: chuck and substrate detachment unit
190: film delaminating unit 192: unload lock unit
194: second robot 200: substrate input robot
220: side pin for supporting the substrate 230: side rolling arm
240: unit base 250: side arm
251: ball transfer 255: arm support rail
260: arm driving unit 270: arm slider

Claims (19)

A working line in which a deposition operation is performed on the substrate; And
A front attach chuck disposed on one side of the work line and attachable to a front surface of a substrate to be supplied to the work line, and a chuck and a substrate attach unit to mutually attach the substrate And
The chuck and the substrate attach unit,
A plurality of side pins for supporting a substrate to support a side region of the substrate and to be moved up/down at a corresponding position; And
The front attach chuck and a side rolling arm cooperatively operated with the side pin for supporting the substrate so that the substrate is attached to each other,
The front attach chuck is an ion sheet front attach chuck that enables front attachment to the substrate through the force of ions without separate power or adhesive,
The substrate is a substrate deposition system for a display, characterized in that a film-laminating substrate formed by laminating a film for a mask in which a deposition opening is formed in advance. delete delete The method of claim 1,
The side rolling arm,
A unit base fixed to the installation surface;
A plurality of side arms disposed to be spaced apart from each other, and supporting the substrate while approaching or spaced apart from the substrate;
An arm driving unit driving the plurality of side arms; And
And an arm slider in which the plurality of side arms are integrally connected and driven together with the plurality of side arms. The method of claim 4,
The side rolling arm,
And an arm support rail coupled to the arm slider and supporting the side arm. The method of claim 4,
The side rolling arm,
A substrate deposition system for a display, further comprising a resin-based ball transfer provided on a surface of the side arm in contact with the substrate. delete The method of claim 1,
The substrate deposition for a display, further comprising an organic film deposition unit disposed behind the process of the chuck and the substrate attach unit on the work line and depositing an organic film on the film laminating substrate to which the front attach chuck is attached. system. The method of claim 8,
It is disposed behind the process of the organic film deposition unit on the work line, and forms an etching zone by etching an edge region of the organic film deposited on the film laminating substrate through the deposition opening with a laser. A substrate deposition system for a display, further comprising a laser etching unit. The method of claim 1,
It further comprises a film laminating unit for forming an initial process on the work line, and laminating the mask substitute film to the substrate to produce the film laminating substrate in which the mask substitute film is integrated with the substrate in the atmosphere. A substrate deposition system for a display, characterized in that. The method of claim 10,
A substrate deposition system for a display, characterized in that a load lock unit for forming an atmosphere in a vacuum state is connected to the rear of the process of the film laminating unit on the work line. The method of claim 9,
An inorganic film deposition unit that is disposed on the work line behind the process of the laser etching unit and covers the organic film already deposited on the film laminating substrate, including the etching zone, to deposit an inorganic film on the film laminating substrate. A substrate deposition system for a display, characterized in that it further comprises. The method of claim 8,
It is disposed between the chuck and the substrate attach unit and the organic film deposition unit on the work line, and flips the front attach chuck to which the film laminating substrate is attached, so that the film laminating substrate faces downward. 1 A substrate deposition system for a display, further comprising a flip unit. The method of claim 1,
A display substrate comprising a chuck and a substrate detach unit for forming a process opposite to the chuck and the substrate attaching unit on the work line, and detaching the chuck and the film laminating substrate attached to each other. Evaporation system. The method of claim 14,
A line independent from the work line is formed, but both ends thereof are connected to the chuck and the substrate attach unit, and the chuck and the substrate detachment unit, and the chuck moves between the chuck and the substrate attach unit and the chuck and the substrate detachment unit. A substrate deposition system for a display, further comprising a chuck return line for forming a movement path of the chuck. The method of claim 14,
A second flip unit disposed on the work line in front of the process of the chuck and the substrate detaching unit, flipping the front attach chuck to which the film-laminating substrate is attached, so that the film-laminating substrate faces upward. A substrate deposition system for a display, characterized in that it further comprises. The method of claim 1,
And a film delaminating unit forming a final process on the work line and delaminating the mask substitute film from the film laminating substrate in the atmosphere. The method of claim 17,
A substrate deposition system for a display, characterized in that an unload lock unit for forming a vacuum in an atmospheric state is connected in front of the process of the film delaminating unit on the work line. The method of claim 1,
At least one buffer unit provided on the work line for smooth transfer of logistics; And
The substrate deposition system for a display, further comprising at least one robot provided on at least one side of the work line and for handling the substrate.

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