KR20200029134A - Display glass deposition system - Google Patents

Abstract

A display substrate deposition system is disclosed. According to one embodiment of the present invention, the display substrate deposition system comprises: a working line where a deposition operation is performed on a substrate; and a chuck and substrate attaching unit which is disposed on one side of the working line, and attaches a front attaching chuck to be attached to the front of the substrate supplied to the working line and the substrate.

Description

Display substrate deposition system

The present invention relates to a substrate deposition system for a display, and more specifically, by applying a chuck that can be attached to the front surface of the substrate, so that the chuck and the front surface of the substrate are attached to each panel type, so that the quantity is applied. Not only can the number of problems be solved, but also the storage problem can be solved naturally, and the phenomenon of occurrence of mura on the panel can be prevented, and furthermore, the automatic cleaning function can be implemented. It relates to a substrate deposition system for a display that can elicit a labor cost reduction effect.

An OLED substrate, which is one of the flat panel display element substrates used for display, that is, an organic light emitting display (OLED), is an ultra-thin display device that implements a color image by self-emission of organic materials, and has a structure. It is attracting attention as a promising display device in that it is simple and has high light efficiency.

The organic light emitting display device (OLED) includes an anode and a cathode, and organic layers interposed between the anode and the cathode. Here, the organic films include a light emitting layer. Of course, the organic films may further include a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer in addition to the light emitting layer.

In order to realize full color, the light emitting layer must be patterned, and a deposition process is applied for this. In an evaporator that performs a deposition process for an OLED substrate (hereinafter referred to as a substrate), for example, in an OLED TV evaporator, an open metal mask is applied to perform a deposition process for a substrate.

In a large-sized evaporator for an OLED TV, glass is deposited while passing over a source while being sandwiched between a chuck and a mask.

At this time, the chuck plays a very important role in holding or handling the substrate. That is, the substrate that is attached to the chuck during substrate deposition or substrate flipping should not be arbitrarily separated, so a chuck that meets these functions must be selected.

The role of the chuck is most important for the implementation of the substrate deposition system. In general, the electrostatic chuck or the magnetic chuck is not only complicated in structure, but rather disadvantageous and large in attaching or detaching the substrate. The application of an ion chuck can be considered in that it is difficult to apply to vacuum equipment of a substrate. The ion chuck is made to attach to the substrate through an adhesive force (not an adhesive) based on van der Waals force.

On the other hand, when applying such an ion chuck to perform the attaching operation with the substrate, a method of attaching only to some points of the substrate rather than the front surface of the substrate may be considered.

However, in the case of a method of attaching only a partial local point of the substrate with the ion chuck, the following problems may occur.

First, in the case of producing a panel with a large substrate having a width / length of 2 m or more, there is a problem in that the number of ion chucks increases exponentially according to the type of the panel because the points attached to each panel may vary.

Second, as the number of ion chucks is increased, there is a problem in storage in which a wide storage place that needs to be stored for each type should be provided.

Third, in order to apply an ion chuck that attaches only to a part of the local point of the substrate, an attaching hole or attach attaching must be processed to the panel. There is a problem that can occur.

Fourth, periodic foreign matter management for the ion chuck is required, but there are many types of structures, which inevitably requires manual cleaning to be carried out, which makes the process inconvenient and increases labor costs.

As a result, when adopting a method of attaching the ion chuck and the substrate while attaching to only a portion of the substrate in applying the ion chuck, considering that the problems described above are very high, In order to solve these problems, it is necessary to develop technology to effectively attach a substrate.

Republic of Korea Patent Office Publication No. 10-2012-0077382

Therefore, the technical problem to be achieved by the present invention is to apply the chuck that can be attached (attach) to the front surface of the substrate so that the front surface of the chuck and the substrate is attached to each panel type to solve the problem that the quantity may increase. Of course, this can naturally solve storage problems, prevent the occurrence of mura on the panel, and furthermore, implement an automatic cleaning function, leading to a reduction in labor costs due to automation. It is to provide a substrate deposition system for a display.

According to an aspect of the present invention, a working line in which a deposition operation is performed on a substrate; And a front attaching chuck disposed on one side of the working line and capable of being attached to the front surface of the substrate to be supplied to the working line, and a chuck and substrate attaching unit to attach the substrate to each other. A substrate deposition system for a display characterized in that it can be provided.

The front attachment chuck may be an ion sheet front attachment chuck that enables front attachment with the substrate through the force of ions without additional power or adhesive.

The chuck and the substrate attaching unit include: a side pin for supporting a plurality of substrates on which side regions of the substrate are supported and moved up / down at corresponding positions; And a side rolling arm cooperating with the front attaching chuck and the side pin for supporting the substrate so that the substrate is attached to each other.

The side rolling arm, the unit base fixed to the mounting surface; A plurality of side arms spaced apart from each other and supporting the substrate while approaching or spaced apart from the substrate; An arm driving unit for driving the plurality of side arms; And an arm slider in which the plurality of side arms are integrally connected and driven together with the plurality of side arms.

The side rolling arm, coupled to the arm slider, may further include an arm support rail for supporting the side arm.

The side rolling arm may further include a resin-based ball transfer provided on the surface of the side arm contacting the substrate.

The substrate may be a film laminating substrate having a body in which a mask substitute film in which a deposition opening is formed is laminated in advance.

On the working line, the chuck and the substrate attaching unit may be disposed behind the process, and further include an organic film deposition unit for depositing an organic film on the film laminating substrate on which the front attaching chuck is attached.

It is disposed behind the process of the organic film deposition unit on the working line, and an edge region of the organic film deposited on the film laminating substrate through the deposition opening is etched with a laser to form an etching zone. A laser etching unit may be further included.

An initial process is formed on the working line, and the film laminating unit for laminating the mask substitute film on the substrate to produce the film laminating substrate integrated with the mask substitute film on the substrate in the air may be further included. have.

A load lock unit for forming an atmosphere in a vacuum state may be connected to the rear of the process of the film laminating unit on the working line.

An inorganic film deposition unit disposed on the working line after the process of the laser etching unit and covering the organic film already deposited on the film laminating substrate including the etching zone to deposit an inorganic film on the film laminating substrate. It may further include.

Disposed between the chuck and the substrate attaching unit and the organic film deposition unit on the working line, and flipping the front attaching chuck on which the film laminating substrate is attached, so that the film laminating substrate faces downward. A flip unit may be further included.

A process for forming opposite processes of the chuck and the substrate attaching unit on the working line, and may further include a chuck and a substrate attaching unit that detach the mutually attached chuck and the film laminating substrate.

An independent line is formed from the working line, but both ends are connected to the chuck and the substrate attaching unit and the chuck and the substrate attaching unit, and the chuck moves so that the chuck moves between the chuck and the substrate attaching unit and the chuck and the substrate attaching unit. It may further include a chuck return line forming a movement path of the chuck.

A second flip unit disposed on the working line in front of the process of the chuck and the substrate de-attach unit, flipping the front attaching chuck on which the film-laminating substrate is attached, so that the film-laminating substrate faces upward. It may further include.

A film de-laminating unit for forming a final process on the working line and delaminating the mask substitute film in the air from the film-laminating substrate may be further included.

An unload lock unit for forming a vacuum in an atmospheric state may be connected to the process line of the film de-laminating unit on the working line.

At least one buffer unit provided on the working line for smooth transportation of logistics; And it is provided on at least one side on the working line may further include at least one robot (robot) for the handling (handling) of the substrate.

According to the present invention, by applying a chuck that can be attached (attach) to the front surface of the substrate so that the front surface of the chuck and the substrate is attached, it can be applied to each panel type to solve the problem that the quantity may increase. Due to this, it is possible to solve the storage problem naturally, to prevent the occurrence of mura on the panel, and furthermore, to implement an automatic cleaning function, thereby reducing the labor cost due to automation.

1 is a schematic structural diagram of an organic light emitting display device (OLED) in which organic and inorganic films are alternately deposited in 10 layers.
2 is a layout of a substrate deposition system for a display according to an embodiment of the present invention.
3 is a view schematically showing a state in which the film laminating substrate is attached to the front attaching chuck.
4 is an exploded perspective view of the substrate and the mask substitute film.
FIG. 5 is a perspective view of a film-laminated substrate with a mask substitute film laminated on a substrate, and is a diagram showing a mask substitute film facing upward.
6 is a plan view of FIG. 5.
7 is a view showing a state in which the organic film is deposited in the state of FIG. 6.
8 is a view showing a state in which an etching zone is formed using a laser in the state of FIG. 7.
9 is a view showing an inorganic film deposited in the form of covering the organic film including the etching zone in the state of FIG. 8.
10 is a cross-sectional view taken along line AA in FIG. 9.
11 is a view illustrating a state in which the mask substitute film is removed in FIG. 10.
12 is a layout view of the side rolling arm of the chuck and the substrate attaching unit.
13 is a side view of the side rolling arm.
14 is an enlarged perspective view of a main portion of FIG. 13.
15A to 15I are diagrams showing steps of attaching the front attaching chuck and the film laminating substrate step by step.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the contents described in the accompanying drawings, which illustrate preferred embodiments of the present invention.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. The same reference numerals in each drawing denote the same members.

1 is a schematic structural diagram of an organic light emitting display (OLED) in which 10 layers of organic and inorganic layers are alternately deposited.

Referring to this drawing, the organic light emitting display devices 1 and OLED may include a substrate and an organic light emitting element 3 stacked on the substrate.

The substrate may be a substrate provided with glass. If the organic light emitting element 3 is briefly described without reference numerals, the organic light emitting element 3 has a stacked structure of an anode, three layers of organic films (hole transport layer, light emitting layer, electron transport layer), and a cathode. When an organic molecule receives energy (now, it is in an excited state), it tries to return to its original state (the ground state), which has the property of emitting the received energy as light.

In the organic light emitting device 3, when a voltage is applied, holes (+) injected from the anode and electrons (−) injected from the cathode recombine in the light emitting layer, where the organic molecules are excited to emit light. When the voltage is applied as described above, the organic light emitting display device 1 is used to display the organic light emitting property. R (Red), G (Green), B (Blue) according to the organic material on the organic light emitting element 3 Full color is implemented using the characteristic of emitting.

On the other hand, since the organic light emitting device 3 can be easily damaged by gas or moisture in the atmosphere, its lifespan problem can be raised, and to solve this, the organic film and the inorganic film are alternately stacked in multiple layers as shown in FIG. 1. The organic light emitting element 3 has been protected from the inflow of gas or moisture.

In FIG. 1, a total of 10 organic and inorganic layers are alternately stacked. That is, the first organic film, the first inorganic film, the second organic film, the second inorganic film ‥ the fifth organic film, the fifth inorganic film are sequentially and layer-by-layer deposited from the organic light emitting element 3.

Looking at this in detail, the first inorganic film is completely encapsulated in the first organic film, the second organic film is partially encapsulated in the first inorganic film, and the second inorganic film is completely enclosed in the second organic film. It can be seen that the following deposition system is required for such deposition.

FIG. 2 is a layout diagram of a substrate deposition system for a display according to an embodiment of the present invention, and FIG. 3 is a view schematically showing a state in which a film laminating substrate is attached to a front attachment chuck, FIG. 4 is an exploded perspective view of a substrate and a mask substitute film, FIG. 5 is a perspective view of a film laminating substrate with a mask substitute film laminated on the substrate, and a mask substitute film facing upward, and FIG. 6 is a plan view of FIG. 5 , FIG. 7 is a view of the state in which the organic film is deposited in the state of FIG. 6, FIG. 8 is a view of the state in which an etching zone is formed using a laser in the state of FIG. 7, and FIG. 9 is an etching zone in the state of FIG. 8 Is a diagram of a state in which the inorganic film is deposited in the form of covering the organic film, including, FIG. 10 is a cross-sectional view taken along line AA of FIG. 9, FIG. 11 is a view of removing the mask substitute film in FIG. 10, 12 is a layout view of the side rolling arm of the chuck and the substrate attachment unit, FIG. 13 is a side view of the side rolling arm, FIG. 14 is an enlarged perspective view of the main part of FIG. 13, and FIGS. 15A to 15I are front attaching chucks and film laminating These are diagrams showing the process of attaching the substrate step by step.

Referring to these drawings, but first referring to FIG. 2, the substrate deposition system for a display according to the present exemplary embodiment applies a front attachment chuck 40 that can be attached to the front surface of the film laminating substrate 30. By attaching the front surface of the front attaching chuck 40 and the film laminating substrate 30 to each panel type, it is possible to solve the problem that the quantity can be increased, as well as to solve the storage problem naturally. In addition, it is possible to prevent the phenomenon of occurrence of mura on the panel, and furthermore, to implement an automatic cleaning function, thereby leading to a reduction in labor costs due to automation.

In particular, the substrate deposition system for a display according to the present embodiment is to allow the deposition process for the substrate 10 for a display to be performed without application of a metal mask, which has been conventionally applied.

For reference, the substrate deposition system for a display according to the present embodiment may be a system for depositing a first organic film as a first layer and a first inorganic film as a second layer in the above-described picture of FIG. 1. Therefore, in order to alternately stack 10 layers of organic films and inorganic films as shown in FIG. 1, five systems such as FIG. 2 may be used continuously or the system of FIG. 2 may be repeatedly used.

Prior to the detailed description of the substrate deposition system for a display according to this embodiment, first, with reference to FIGS. 2 to 11, for a process of performing a deposition process for the substrate 10 for a display without applying a metal mask (metal mask) First, brief description.

In the case of this embodiment, instead of using a metal mask that has always been used in the previous deposition process, a method of performing a deposition process for the substrate 10 using the mask substitute film 20 is adopted.

The mask substitute film 20 is a film different from a conventional metal mask, although it serves as a conventional metal mask. That is, while the existing metal mask is moved through a separate device, attached to the substrate 10, separated again, and then returned (return), while the mask substitute film 20 applied to the present embodiment is thin As a film of the lamination (laminating) with the substrate 10 at all to form a body with the substrate 10.

Therefore, there is no need for a facility for moving the metal mask, a facility for attaching to the substrate 10, a facility for separating, a facility for returning, and the like. The mask substitute film 20 applied to this embodiment may be made of polyimide having excellent heat resistance.

As shown in FIG. 4, a deposition opening 21 is formed in the mask substitute film 20. Since two deposition openings 21 are shown in the drawing, the display finally manufactured on the original substrate may be two. However, the number of deposition openings 21 formed in the mask substitute film 20 may be one, or may be three or more. Therefore, the scope of the present invention is not limited by matters such as the number and shape of the deposition openings 21.

The mask substitute film 20 is a flexible sheet-like material and is previously laminated to the substrate 10 unlike a conventional metal mask. That is, through the film laminating unit 110 shown in FIG. 2, the mask substitute film 20 is laminated to the substrate 10 as shown in FIG. 4 to FIG. 5 to form a body. Hereinafter, for convenience of description, a state in which the mask substitute film 20 is laminated to the substrate 10 to form a body is referred to as a film laminating substrate 30.

Since the film laminating substrate 30 is attached to the front attaching chuck 40 as shown in FIG. 3, the deposition process is performed while moving the majority of the processes in FIG. 2, and thus the metal mask is moved as before. There is no need for a facility to attach to the substrate 10, a facility to separate, a facility to return, and the like.

The deposition process for the film laminating substrate 30 may be performed in the order of an organic film and an inorganic film. That is, the organic film 51 is deposited on the film laminating substrate 30 by the organic film deposition unit 150 in the initial state of FIG. 6. The organic film 5 is substantially deposited on the substrate 10 through the deposition opening 21 of the mask substitute film 20. Of course, the organic film 5 is also deposited on the mask substitute film 20, but the expression thereof is omitted for convenience. This is because the mask substitute film 20 is finally the object to be removed.

7, after the organic film 5 is deposited on the surface of the substrate 10 exposed by the deposition opening 21, the laser etching unit 160 lasers the edge region of the organic film 5 as shown in FIG. 8. Etch with (laser). Then, while the part deposited with the organic film 5 is removed, an etching zone 52 is formed. The etching zone 52 points to a region where the portion where the organic film 5 was removed, that is, the surface of the substrate 10.

After the etching zone 52 is formed through laser etching, the inorganic film 53 deposition process for the film laminating substrate 30 is performed through the inorganic film deposition unit 170 as shown in FIGS. 9 and 10.

At this time, the inorganic film 53 is deposited in a form that covers and covers the organic film 51 that is already deposited on the substrate 10 through the deposition opening 21 including the etching zone 52. The inorganic film 53 is also deposited on the mask substitute film 20, but the expression thereof is omitted for convenience.

After deposition of the inorganic film 53 is completed, when the mask substitute film 20 is peeled, that is, delaminating, as shown in FIG. 11, the organic film 51 is first deposited on the surface of the substrate 10, and the organic film ( In the form of covering 51), the inorganic film 53 is deposited. By repeating this method over and over again, the structure of FIG. 1 can be made.

In order to make a structure as shown in FIG. 11, in the present embodiment, a substrate deposition system for a display as shown in FIG. 2 is proposed.

The substrate deposition system for a display according to the present embodiment is to allow the deposition process for the display substrate 10 to be performed without the application of a metal mask, as described above, in particular to be attached to the front side of the film laminating substrate 30. By applying the front attachable chuck 40, the deposition process can be performed while the front attaching chuck 40 and the front surface of the film laminating substrate 30 are attached.

The substrate deposition system for a display according to the present embodiment capable of providing such an effect, as shown in FIG. 2, a predetermined working line (101, working line) in which a deposition process for the substrate 10 is performed, and It includes a separate chuck return line (103) different from the line 101.

The chuck return line 103 is a line where the front attach chuck 40 is returned, and most of the components are disposed on the work line 101. After the lamination of the mask substitute film 20 on the substrate 10, the working line 101 proceeds with deposition of the organic film 51, laser etching, and deposition of the inorganic film 53, followed by the mask substitute film 20. It forms a series of lines for de-laminating.

In this embodiment, since the working line 101 forms an inline, it is possible to elicit a smooth deposition process for the substrate 10. However, the work line 101 does not have to be inline.

Hereinafter, for convenience of description, configurations arranged in order on the working line 101 of the substrate deposition system for a display according to the present embodiment, that is, the film laminating unit 110, the chuck and the substrate attaching unit 120, First flip unit 141, organic film deposition unit 150, laser etching unit 160, inorganic film deposition unit 170, second flip unit 142, chuck and substrate detach unit 180, and film The delaminating unit 190 will be sequentially described. For reference, a plurality of buffer units are provided on the work line 101 for smooth transportation of the logistics. For the buffer unit, there is no reference sign in the drawing, and it is written directly on the drawing in English.

Looking at the configuration of the substrate deposition system for a display according to this embodiment, first, the film laminating unit 110 forms an initial process on the working line 101.

The film laminating unit 110 laminates the mask substitute film 20 separated from each other as shown in FIG. 4 onto the substrate 10 as shown in FIGS. 5 and 6, so that the mask substitute film 20 is integrated into the substrate 10. The laminated film laminating substrate 30 is produced.

The film laminating process may be applied in a roll-to-roll type, and when the film laminating process is applied in a roll-to-roll type, continuity of work becomes possible, thereby improving productivity.

The film laminating process by the film laminating unit 110 is performed in the air. In other words, it can be performed in a normal ATM chamber, not a vacuum chamber.

As described above, the film laminating process by the film laminating unit 110 is performed in the air, but since subsequent processes must be performed under vacuum, a load lock unit 112 is connected to the film laminating unit 110. . Of course, the film de-laminating process by the film de-laminating unit 190 formed at the distal end also proceeds in the air.

The load lock unit 112 is connected to the rear of the process of the film laminating unit 110 on the working line 101, and forms an atmosphere in a vacuum.

The first robot 114 (robot) is provided behind the process of the load lock unit 112. The first robot 114 handles the film laminating substrate 30 in which the mask substitute film 20 is integrated into the substrate 10 and then delivers it to a post-process, that is, the chuck and the substrate attaching unit 120. do.

Meanwhile, the chuck and the substrate attaching unit 120 may be attached to the front surface of the film laminating substrate 30 to be supplied to the working line 101 before depositing the organic film 51 to the film laminating substrate 30. The chuck chuck 40 and the film laminating substrate 30 serve to attach each other. In other words, the chuck and the substrate attaching unit 120 are responsible for attaching the front attaching chuck 40 to the film-laminating film-laminating substrate 30 as shown in FIG. 3.

In this embodiment, the front attaching chuck 40 applied to the chuck and the substrate attaching unit 120 enables attachment of the film laminating substrate 30 through the force of ions without additional power or adhesive. It is an ion sheet front attachment chuck 40.

For reference, the ion sheet front attach chuck 40 allows the film laminating substrate 30 to be attached through an adhesive force (not an adhesive) based on van der Waals force.

Here, the van der Waals force refers to a force acting between electrically neutral molecules that do not have side electrons. In particular, it refers to a manpower operating at a relatively long distance. The van der Waals force is a result of the dispersing force, and the forces acting between the rare gas atoms and the factors that form molecular crystals of hydrocarbons such as benzene can be explained by the van der Waals force. In addition, the van der Waals force refers to the essential force required to explain the phenomenon of physical adsorption, such as cohesion and adhesion of a liquid, as well as this embodiment.

In summary, the van der Waals force is a very weak electrostatic attraction acting only at very short distances between electrically neutral molecules and collectively refers to the electric forces acting between covalently binding molecules.

Particularly, physical adhesion is possible without separate power through the force of ions. Since the front attaching chuck 40 is manufactured based on the van der Waals force, the film laminating substrate on the front attaching chuck 40 30 can be attached without adhesive, and can be deattached again later.

The chuck and the substrate attaching unit 120 include a side pin 220 for supporting a plurality of substrates and a side rolling arm 230 for mutual attachment of the front attaching chuck 40 and the film laminating substrate 30. It includes.

The side pin 220 for supporting the substrate forms a place where the side region of the film laminating substrate 30 is supported, and is moved up / down at that position.

In other words, the side pin 220 for supporting the substrate is arranged to move up / down (up / down) around the front attaching chuck 40, and the front attaching chuck ( 40) It supports the side region of the film laminating substrate 30 which is input to the side.

On the other hand, when the side pins 220 for supporting the substrate are to be supported by the end region of the film laminating substrate 30, in the case of a small substrate, even if the side fins 220 for supporting the substrate support only the end regions of the small substrate The amount of deflection due to the self-weight of the substrate is small, so the process can be sufficiently performed without damaging the substrate.

However, when a large-sized substrate is applied as in this embodiment, deformation or damage may occur in the film-laminating substrate 30 due to sagging due to the self-loading of the film-laminating substrate 30. Accordingly, the side rolling arm 230 is applied to solve this problem.

The side rolling arm 230 is operated in cooperation with the side pin 220 for supporting the substrate so that the front attaching chuck 40 and the film laminating substrate 30 are attached to each other. The side rolling arms 230 may be arranged symmetrically one by one on both side regions of the front attaching chuck 40 as shown in FIG. 12.

The side rolling arm 230, as shown in detail in FIGS. 12 to 14, the unit base 240 fixed to the installation surface, and spaced apart from each other, the film laminating substrate while approaching or spaced apart from the film laminating substrate 30 It may include a plurality of side arms 250 for supporting the (30), and the arm driving unit 260 for driving the plurality of side arms 250.

The unit base 240 supports a plurality of side arms 250 and arm drivers 260 in a fixed position.

The plurality of side arms 250 are driven by the arm driving unit 260 while supporting the lower surface of the film laminating substrate 30, that is, the non-deposition surface of the substrate from the bottom. At this time, since the side arms 250 move between the side pins 220 for supporting the substrate in a state spaced apart from each other, they do not interfere with the side pins 220 for supporting the substrate. In addition, since the side arms 250 are driven only at a gap between the substrate input robot 200 and the substrate, the side arms 250 do not interfere with the substrate input robot 200.

On the surface of the side arms 250 in contact with the film laminating substrate 30, a resin-based ball transfer 251 is provided. The film laminating substrate 30 is not scratched because it is supported by a resin-based ball transfer 251.

The plurality of side arms 250 are integrally connected as one body by the arm slider 270. That is, the arm slider 270 is integrally connected to the plurality of side arms 250, and is driven together with the plurality of side arms 250. The arm slider 270 is provided with an arm support rail 255 that supports the side arm 250. The exposure length of the side arm 250 may be set in advance through the arm support rail 255.

The arm driving unit 260 serves to drive the side arm 250 in the direction of the arrow in FIG. 13. The arm driving unit 260 may be implemented by a combination of a servo motor and a ball screw.

Hereinafter, a process in which the front attaching chuck 40 and the film laminating substrate 30 are attached will be described with reference to FIGS. 15A to 15I.

First, the film laminating substrate 30 is input to the upper portion of the front attaching chuck 40 by the robot 200 for inputting the substrate in the standby state as shown in FIG. 15A. In this case, the film laminating substrate 30 is not in contact with the side pin 220 for supporting the substrate.

Next, as shown in FIG. 15C, as the side pin 220 for supporting a substrate is operated up, the film laminating substrate 30 is supported in contact with the upper ends of the side pins 220 for supporting multiple substrates.

In this case, since the side fins 220 for supporting the substrate support only the side end region of the film laminating substrate 30, sagging of the film laminating substrate 30 may occur.

Therefore, after the film laminating substrate 30 is contacted and supported by the side pin 220 for supporting the substrate, the side arms 250 of the side rolling arm 230 are introduced into the central region of the film laminating substrate 30 as shown in FIG. 15D. The non-deposition surface of the film laminating substrate 30 is supported from the bottom. At this time, since the side arms 250 are driven only at a gap between the robot 200 for inputting the substrate and the film laminating substrate 30, even if the side arms 250 are injected into the central region of the film laminating substrate 30, the side The arms 250 do not interfere with the substrate input robot 200. Therefore, even a large substrate is prevented from sagging.

Then, as shown in FIG. 15E, the robot 200 for inputting a substrate is down. Then, as shown in FIG. 15F, the robot 200 for loading the substrate is escaped.

Next, as shown in Figure 15g, the side arm 250 of the side rolling arm 230 starts to escape to the original position. As the side arm 250 of the side rolling arm 230 is evacuated to the original position, when the central region of the film laminating substrate 30 sags and first contacts the front attaching chuck 40, the side rolling arm 230 as shown in FIG. 15H Side arm 250 is completely evacuated to its original position.

Subsequently, as the side pin 220 for supporting the substrate is gradually down, the film laminating substrate 30 may be attached while being in full contact with the front attaching chuck 40 as shown in FIG. 15I. At this time, the front side of the film laminating substrate 30 is attached to the front attaching chuck 40, and the film laminating substrate 30 takes a state facing upward.

The first flip unit 141 is disposed between the chuck and the substrate attaching unit 120 and the organic film deposition unit 150 on the work line 101, and the front attaching chuck on which the film laminating substrate 30 is attached ( 40) flip (flip) serves to make the film laminating substrate 30 face downward.

In other words, as described with reference to FIGS. 15A to 15I, immediately after the front attaching chuck 40 and the film laminating substrate 30 are attached by the chuck and the substrate attaching unit 120, the film laminating substrate as shown in FIG. 15I ( 30) is in the form facing upward. To flip this, the first flip unit 141 is applied. This is because the deposition of the organic film 51 is an upward vapor deposition type. If the deposition is a downward vapor deposition type, the first flip unit 141 may not be applied.

The organic film deposition unit 150 serves to deposit the organic film 51 on the film laminating substrate 30 of one body by laminating a mask substitute film 20 in which a deposition opening 21 is formed in advance. do.

As described above, the organic film 51 may be deposited on the film laminating substrate 30 by the organic film deposition unit 150 as shown in FIGS. 6 to 7. Substantially, the organic layer 5 may be deposited on the substrate 10 through the deposition opening 21 of the mask substitute film 20.

Meanwhile, the laser etching unit 160 is disposed behind the process of the organic film deposition unit 150 on the work line 101, and the organic film 51 deposited on the film laminating substrate 30 through the deposition opening 21. Etching the edge region of the laser (laser) serves to form the etching zone 52.

That is, after the organic film 5 is deposited on the surface of the substrate 10 exposed by the deposition opening 21 as shown in FIG. 7, the laser etching unit 160 displays the edge region of the organic film 5 as shown in FIG. 8. Etching with a laser. Then, the portion deposited with the organic film 5 is removed, and the etching zone 52 is formed. The etching zone 52 refers to a region where the portion where the organic film 5 was removed, that is, the surface of the substrate 10, as described above.

2, unlike the organic film deposition unit 150 or the inorganic film deposition unit 170, a plurality of laser etching units 160 are applied. This is to reduce the overall tact time (tact time) because the etching process takes a lot of time. Therefore, one laser etching unit 160 may be applied, and it should be said that such matters also fall within the scope of the present invention.

The inorganic film deposition unit 170 is disposed behind the process of the laser etching unit 160 on the work line 101, and the organic film 51 already deposited on the film laminating substrate 30 including the etching zone 52 ) In the form of covering the film to serve to deposit the inorganic film 53 on the film laminating substrate 30.

After the etching zone 52 is formed through laser etching by the laser etching unit 160, the inorganic film 53 is deposited on the film laminating substrate 30 as shown in FIGS. 9 and 10 through the inorganic film deposition unit 170. The process proceeds, and at this time, the inorganic film 53 may be deposited in a form of covering the organic film 51 already deposited on the substrate 10 through the deposition opening 21 including the etching zone 52. You can.

The second flip unit 142 is disposed behind the process of the inorganic film deposition unit 170, and flips the front attaching chuck 40 with respect to the film laminating substrate 30 on which the organic film 51 is deposited. The film laminating substrate 30 is facing upward. In other words, the second flip unit 142 serves to flip the front attaching chuck 40 so as to be in the original state as shown in FIG. 3.

The chuck and substrate de-attach unit 180 form opposite processes of the chuck and substrate attach unit 120 on the work line 101, but de-attach the front attaching chuck 40 and the film laminating substrate 30 attached to each other. It serves to (detach).

The front attaching chuck 40 detached by being detached from the film laminating substrate 30 is transferred back to the chuck and the substrate attaching unit 120 through the chuck return line 103.

The chuck return line 103 forms a line independent from the working line 101 as described above, but both ends are connected to the chuck and the substrate attaching unit 120 and the chuck and the substrate detaching unit 180, and the chuck and the substrate attaching A movement path of the front attaching chuck 40 is formed such that the front attaching chuck 40 moves between the unit 120 and the chuck and the substrate de-attaching unit 180.

The second robot 194 (robot) is provided behind the chuck and the substrate de-attach unit 180. The second robot 194 handles the film laminating substrate 30 on which the front attaching chuck 40 is de-attached, and transmits it to a post-process, ie, an unload lock unit 192. .

The unloading lock unit 192 is disposed between the second robot 194 and the film de-laminating unit 190 and forms a vacuum laminating state to the atmosphere so far, so that the film-laminating substrate 30 is a film de-laminating unit 190. To pass.

The film de-laminating unit 190 forms a final process on the work line 101, and serves to delaminating the mask substitute film 20 in the atmosphere from the film-laminating substrate 30. That is, when peeling, or delaminating, the mask substitute film 20 as shown in FIGS. 10 to 11, the organic film 51 is first deposited on the surface, and the inorganic film 53 is formed to cover the organic film 51. The substrate 10 in this deposited state can be obtained.

Hereinafter, a process of depositing the organic layer 51 and the inorganic layer 53 on the display substrate 10 will be briefly described.

First, by laminating (laminating) the mask substitute film 20 to the substrate 10 through the film laminating unit 110, the film laminating substrate 30 in which the mask substitute film 20 is integrated into the substrate 10 in the air To produce.

Next, the front attaching chuck 40 and the film laminating substrate 30 are attached through the chuck and the substrate attaching unit 120. At this time, as described above, the front attaching chuck 40 is attached to the front side of the film laminating substrate 30. Then, by using the first flip unit 141, the front attaching chuck 40 is turned over so that the film laminating substrate 30 faces downward.

Next, the organic film 51 is deposited on the film laminating substrate 30 through the organic film deposition unit 150.

When deposition of the organic film 51 is completed, the edge region of the organic film 51 is etched with a laser through the laser etching unit 160 to form an etching zone 52.

Next, the inorganic film 53 on the film laminating substrate 30 in the form of covering the organic film 51 already deposited on the film laminating substrate 30 including the etching zone 52 through the inorganic film deposition unit 170 ) Is deposited. Then, the front attaching chuck 40 is turned over using the second flip unit 142 so that the film laminating substrate 30 faces upward.

Next, the front attaching chuck 40 and the film laminating substrate 30 attached to each other through the chuck and the substrate de-attaching unit 180 are detached.

Then, by using the film de-laminating unit 190 to delaminate (delaminating) the mask substitute film 20 in the air from the film-laminating substrate 30, the organic film 51 is first deposited on the surface as shown in FIG. In the form of covering the organic film 51, the substrate 10 in which the inorganic film 53 is deposited can be obtained.

According to this embodiment having the structure and action as described above, the front attaching chuck 40 and the film laminating substrate by applying the front attaching chuck 40 that can be attached to the front side of the film laminating substrate 30 By attaching the front surface of (30), it can be applied to each panel type to solve the problem that the quantity can increase, and of course, it can solve the storage problem naturally. The phenomenon can be prevented, and furthermore, an automatic cleaning function can be implemented, so that it is possible to elicit a labor cost reduction effect due to automation.

As described above, the present invention is not limited to the described embodiments, and it is obvious to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention. Therefore, such modifications or variations will have to belong to the claims of the present invention.

10: substrate 20: mask substitute film
21: vapor deposition opening 30: film laminating substrate
40: front attachment chuck 51: organic film
52: etching zone 53: inorganic film
101: working line 103: chuck return line
110: film laminating unit 112: load lock unit
114: first robot 120: chuck and board attach unit
141: first flip unit 142: second flip unit
150: organic film deposition unit 160: laser etching unit
170: inorganic film deposition unit 180: chuck and substrate detach unit
190: film de-laminating unit 192: unload lock unit
194: second robot 200: substrate input robot
220: side pin for substrate support 230: side rolling arm
240: unit base 250: side arm
251: Ball transfer 255: Arm support rail
260: arm drive 270: arm slider

Claims (19)

A working line in which a deposition operation on a substrate is performed; And
It is disposed on one side of the working line, and includes a front attaching chuck that can be attached to the front of the substrate to be supplied to the working line, a chuck for attaching the substrates to each other, and a substrate attaching unit. Display substrate deposition system characterized in that the. According to claim 1,
The front attachment chuck is an ion sheet front attachment chuck that enables front attachment with the substrate through the power of ions without additional power or adhesive. . According to claim 1,
The chuck and the substrate attachment unit,
A side pin for supporting a plurality of substrates on which side regions of the substrate are supported and moved up / down at corresponding positions; And
And a front rolling chuck and a side rolling arm cooperating with a side pin for supporting the substrate so that the substrate is attached to each other. According to claim 3,
The side rolling arm,
A unit base fixed to the mounting surface;
A plurality of side arms spaced apart from each other and supporting the substrate while approaching or spaced apart from the substrate;
An arm driving unit for driving the plurality of side arms; And
The plurality of side arms are integrally connected, a substrate deposition system for a display, characterized in that it comprises an arm slider that is driven together with the plurality of side arms. According to claim 4,
The side rolling arm,
A substrate deposition system for a display, further comprising an arm support rail coupled to the arm slider and supporting the side arm. According to claim 4,
The side rolling arm,
And a resin-based ball transfer provided on a surface of the side arm in contact with the substrate. According to claim 1,
The substrate is a substrate deposition system for a display, characterized in that the film-laminated substrate in one body by laminating (laminating) in advance the mask substitute film in which the deposition opening is formed. The method of claim 7,
Deposition of a substrate for a display, which is disposed on the working line after the process of the chuck and the substrate attaching unit, and further comprises an organic film deposition unit for depositing an organic film on the film laminating substrate on which the front attaching chuck is attached. system. The method of claim 8,
It is disposed behind the process of the organic film deposition unit on the working line, and an edge region of the organic film deposited on the film laminating substrate through the deposition opening is etched with a laser to form an etching zone. A substrate deposition system for a display, further comprising a laser etching unit. The method of claim 7,
Forming an initial process on the working line, and further comprising a film laminating unit for laminating the mask substitute film on the substrate to fabricate the film laminating substrate in which the mask substitute film is integrated into the substrate in the air Characterized in that the substrate deposition system for a display. The method of claim 10,
A substrate deposition system for a display, characterized in that a load lock unit for forming an atmosphere in a vacuum state is connected to the rear of the process of the film laminating unit on the working line. The method of claim 9,
An inorganic film deposition unit disposed on the working line after the process of the laser etching unit and covering the organic film already deposited on the film laminating substrate including the etching zone to deposit an inorganic film on the film laminating substrate. A substrate deposition system for a display, further comprising. The method of claim 8,
Disposed between the chuck and the substrate attaching unit and the organic film deposition unit on the working line, and flipping the front attaching chuck on which the film laminating substrate is attached so that the film laminating substrate faces downward A substrate deposition system for a display, further comprising a flip unit. According to claim 1,
And forming a process opposite to the chuck and the substrate attaching unit on the working line, and further comprising a chuck and a substrate attaching unit that detach the mutually attached chuck and the film laminating substrate. Deposition system. The method of claim 14,
An independent line is formed from the working line, but both ends are connected to the chuck and the substrate attaching unit and the chuck and the substrate attaching unit, and the chuck moves so that the chuck moves between the chuck and the substrate attaching unit and the chuck and the substrate attaching unit. And a chuck return line forming a movement path of the chuck. The method of claim 14,
A second flip unit disposed on the working line in front of the process of the chuck and the substrate de-attaching unit, flipping the front attaching chuck on which the film-laminating substrate is attached, so that the film-laminating substrate faces upward. A substrate deposition system for a display, further comprising. The method of claim 7,
And forming a final process on the working line, and further comprising a film de-laminating unit for delaminating the mask substitute film in the air from the film-laminating substrate. The method of claim 17,
A substrate deposition system for a display, characterized in that an unload lock unit for forming a vacuum in an atmospheric state is connected to a process front side of the film de-laminating unit on the working line. According to claim 1,
At least one buffer unit provided on the working line for smooth transportation of logistics; And
A substrate deposition system for a display, which is provided on at least one side of the working line, and further comprises at least one robot for handling the substrate.

Images