CN103215592B - 蚀刻膏、蚀刻膏的应用以及利用蚀刻膏蚀刻纳米银导电材料的方法 - Google Patents
蚀刻膏、蚀刻膏的应用以及利用蚀刻膏蚀刻纳米银导电材料的方法 Download PDFInfo
- Publication number
- CN103215592B CN103215592B CN201310152180.0A CN201310152180A CN103215592B CN 103215592 B CN103215592 B CN 103215592B CN 201310152180 A CN201310152180 A CN 201310152180A CN 103215592 B CN103215592 B CN 103215592B
- Authority
- CN
- China
- Prior art keywords
- etching
- silver conductive
- conductive material
- nano
- etching paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005530 etching Methods 0.000 title claims abstract description 88
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 66
- 239000004020 conductor Substances 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000006071 cream Substances 0.000 title abstract 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000011521 glass Substances 0.000 claims abstract description 16
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 21
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 17
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 10
- -1 Polyoxyethylene Polymers 0.000 claims description 8
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 7
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 5
- 239000006229 carbon black Substances 0.000 claims description 5
- 239000013530 defoamer Substances 0.000 claims description 5
- 235000011187 glycerol Nutrition 0.000 claims description 5
- MVFCKEFYUDZOCX-UHFFFAOYSA-N iron(2+);dinitrate Chemical compound [Fe+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MVFCKEFYUDZOCX-UHFFFAOYSA-N 0.000 claims description 5
- 239000008399 tap water Substances 0.000 claims description 5
- 235000020679 tap water Nutrition 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 4
- 230000002378 acidificating effect Effects 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000007639 printing Methods 0.000 abstract description 5
- 239000000945 filler Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 150000003839 salts Chemical class 0.000 abstract description 4
- 229920003169 water-soluble polymer Polymers 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000003085 diluting agent Substances 0.000 abstract 1
- 239000007800 oxidant agent Substances 0.000 abstract 1
- 230000001590 oxidative effect Effects 0.000 abstract 1
- 239000003755 preservative agent Substances 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003020 moisturizing effect Effects 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 229960001866 silicon dioxide Drugs 0.000 description 3
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000001768 carboxy methyl cellulose Substances 0.000 description 2
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 2
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 235000006491 Acacia senegal Nutrition 0.000 description 1
- 239000004160 Ammonium persulphate Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 241000978776 Senegalia senegal Species 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- DPDMMXDBJGCCQC-UHFFFAOYSA-N [Na].[Cl] Chemical compound [Na].[Cl] DPDMMXDBJGCCQC-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 1
- 235000019395 ammonium persulphate Nutrition 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004323 potassium nitrate Substances 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- 229940001516 sodium nitrate Drugs 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/81—Electrodes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Electric Cables (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
Claims (4)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310152180.0A CN103215592B (zh) | 2013-04-27 | 2013-04-27 | 蚀刻膏、蚀刻膏的应用以及利用蚀刻膏蚀刻纳米银导电材料的方法 |
CN201510219866.6A CN104805441B (zh) | 2013-04-27 | 2013-04-27 | 蚀刻膏、蚀刻膏的应用以及利用蚀刻膏蚀刻纳米银导电材料的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310152180.0A CN103215592B (zh) | 2013-04-27 | 2013-04-27 | 蚀刻膏、蚀刻膏的应用以及利用蚀刻膏蚀刻纳米银导电材料的方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510219866.6A Division CN104805441B (zh) | 2013-04-27 | 2013-04-27 | 蚀刻膏、蚀刻膏的应用以及利用蚀刻膏蚀刻纳米银导电材料的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103215592A CN103215592A (zh) | 2013-07-24 |
CN103215592B true CN103215592B (zh) | 2015-07-08 |
Family
ID=48813726
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310152180.0A Active CN103215592B (zh) | 2013-04-27 | 2013-04-27 | 蚀刻膏、蚀刻膏的应用以及利用蚀刻膏蚀刻纳米银导电材料的方法 |
CN201510219866.6A Active CN104805441B (zh) | 2013-04-27 | 2013-04-27 | 蚀刻膏、蚀刻膏的应用以及利用蚀刻膏蚀刻纳米银导电材料的方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510219866.6A Active CN104805441B (zh) | 2013-04-27 | 2013-04-27 | 蚀刻膏、蚀刻膏的应用以及利用蚀刻膏蚀刻纳米银导电材料的方法 |
Country Status (1)
Country | Link |
---|---|
CN (2) | CN103215592B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103508677A (zh) * | 2013-09-24 | 2014-01-15 | 苏州诺维克光伏新材料有限公司 | 一种膏体材料及其应用 |
US20160293289A1 (en) * | 2013-11-08 | 2016-10-06 | Merck Patent Gmbh | Method for structuring a transparent conductive matrix comprising nano materials |
GB2539508A (en) * | 2015-06-19 | 2016-12-21 | Dst Innovations Ltd | A method for making patterned conductive textiles |
CN105441949A (zh) * | 2016-01-26 | 2016-03-30 | 苏州诺菲纳米科技有限公司 | 纳米银蚀刻液、制备图案化的纳米银导电膜的方法及触控传感器 |
CN106433647B (zh) * | 2016-09-19 | 2019-02-15 | 苏州诺菲纳米科技有限公司 | 基于纳米银导电膜的蚀刻膏及其制备方法 |
CN108624106B (zh) * | 2017-03-16 | 2020-07-21 | 苏州诺菲纳米科技有限公司 | 具有蚀刻功能的可剥胶及蚀刻方法 |
CN107385444A (zh) * | 2017-06-21 | 2017-11-24 | 天津宝兴威科技股份有限公司 | 一种纳米银导电膜的蚀刻膏配方 |
CN108048842A (zh) * | 2017-12-13 | 2018-05-18 | 天津宝兴威科技股份有限公司 | 一种银纳米线导电膜的刻蚀液及其使用方法 |
CN109722248A (zh) * | 2018-01-03 | 2019-05-07 | 厦门蓝科电子科技有限公司 | 一种蚀刻膏及其制备方法 |
WO2020171051A1 (ja) * | 2019-02-19 | 2020-08-27 | Dic株式会社 | 銀用エッチング液、及びそれを用いたプリント配線板の製造方法 |
CN111979546A (zh) * | 2020-08-19 | 2020-11-24 | 江苏科林泰电子有限公司 | 一种有效的金属镁、银的剥离清洗剂 |
CN113969173B (zh) * | 2021-09-23 | 2022-05-13 | 易安爱富(武汉)科技有限公司 | 一种ITO/Ag/ITO复合金属层薄膜的蚀刻液 |
CN114136956B (zh) * | 2021-11-16 | 2023-12-12 | 中国中医科学院中药研究所 | 一种基于可视化传感器通道的石斛产地溯源方法 |
CN114540818B (zh) * | 2022-02-15 | 2023-11-10 | 江西省科学院应用物理研究所 | 一种铜镁硅合金金相腐蚀剂及其金相组织显示方法 |
DE102022207926A1 (de) * | 2022-08-01 | 2024-02-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Paste zur Überprüfung der Korrosionsbeständigkeit von Werkstoffen, Verfahren zu ihrer Herstellung sowie Verfahren zur korrosiven Schädigung eines korrodierbaren Bauteils |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6277799B1 (en) * | 1999-06-25 | 2001-08-21 | International Business Machines Corporation | Aqueous cleaning of paste residue |
CN1311056C (zh) * | 2002-06-25 | 2007-04-18 | 三星电子株式会社 | 用于布线的蚀刻剂、利用该蚀刻剂制造布线的方法、包含该布线的薄膜晶体管阵列面板及其制造方法 |
CN101717645A (zh) * | 2009-11-17 | 2010-06-02 | 张�林 | 用于金属及金属氧化物透明导电层的蚀刻膏及蚀刻工艺 |
CN101508860B (zh) * | 2009-03-06 | 2011-08-17 | 华南农业大学 | 铜材线路板蚀刻油墨及其制备方法与应用 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6630433B2 (en) * | 1999-07-19 | 2003-10-07 | Honeywell International Inc. | Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride |
JP5443863B2 (ja) * | 2009-07-09 | 2014-03-19 | 株式会社Adeka | 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法 |
-
2013
- 2013-04-27 CN CN201310152180.0A patent/CN103215592B/zh active Active
- 2013-04-27 CN CN201510219866.6A patent/CN104805441B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6277799B1 (en) * | 1999-06-25 | 2001-08-21 | International Business Machines Corporation | Aqueous cleaning of paste residue |
CN1311056C (zh) * | 2002-06-25 | 2007-04-18 | 三星电子株式会社 | 用于布线的蚀刻剂、利用该蚀刻剂制造布线的方法、包含该布线的薄膜晶体管阵列面板及其制造方法 |
CN101508860B (zh) * | 2009-03-06 | 2011-08-17 | 华南农业大学 | 铜材线路板蚀刻油墨及其制备方法与应用 |
CN101717645A (zh) * | 2009-11-17 | 2010-06-02 | 张�林 | 用于金属及金属氧化物透明导电层的蚀刻膏及蚀刻工艺 |
Also Published As
Publication number | Publication date |
---|---|
CN104805441B (zh) | 2017-11-24 |
CN104805441A (zh) | 2015-07-29 |
CN103215592A (zh) | 2013-07-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103215592B (zh) | 蚀刻膏、蚀刻膏的应用以及利用蚀刻膏蚀刻纳米银导电材料的方法 | |
CN101717645A (zh) | 用于金属及金属氧化物透明导电层的蚀刻膏及蚀刻工艺 | |
TWI470813B (zh) | 薄層太陽能模組利用蝕刻之邊緣剔除方法 | |
CN105002564A (zh) | 一种环保型蓝宝石膜层退镀液及其使用方法 | |
CN110783025B (zh) | 一种抗氧化的导电铜纳米线膜及其制备方法和应用 | |
CN104036876A (zh) | 一种高温铜电子浆料的制备方法 | |
CN103700784A (zh) | 一种图形化电极的制备方法 | |
CN107731434A (zh) | 一种热敏电阻铜电极多功能防护膜层及其制备方法 | |
CN105555052A (zh) | 一种印制电路板化学腐蚀工艺 | |
CN113948368A (zh) | 一种返工片的清洗方法 | |
CN109698040A (zh) | 一种水基电子浆料及其制备方法 | |
CN108060024A (zh) | 玻璃基板水基清洗液及使用该清洗液清洗玻璃基板的方法 | |
CN104498882A (zh) | 在已印制油墨玻璃上镀制消影层及ito层的工艺方法 | |
CN106245048A (zh) | 黄铜管芯酸洗方法 | |
CN105449036A (zh) | 一种用于丝网印刷不良片的返工处理方法 | |
CN102432901A (zh) | 一种用萘钠液对聚四氟乙烯制品表面处理的方法 | |
CN109462946B (zh) | 一种pcb阻焊返洗方法 | |
CN108364711A (zh) | 一种丝网印刷银纳米线透明导电薄膜的后处理方法 | |
CN103745764B (zh) | 一种与硅太阳能电池背场铝浆附着良好的背面银浆及其制备方法 | |
CN105278718B (zh) | 一种采用可剥离蚀刻油墨的蚀刻工艺 | |
CN103811894B (zh) | 消除电火花的接插电极及化学处理生产工艺 | |
CN108203819A (zh) | 一种玻璃纤维镀银教学试验方法 | |
CN102306628B (zh) | 用铝箔做焊料制造平板二极管或晶闸管管芯的方法 | |
CN106283055A (zh) | 一种印刷板的蚀刻方法 | |
CN105274544B (zh) | 一种快速处理轧制态钼制品表面氧化层的方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP02 | Change in the address of a patent holder |
Address after: Unit B 1 building in Suzhou City, Jiangsu province 215300 industrial parks Xinglin Street No. 78 emerging industrial square No. 5 factory Patentee after: Suzhou Nuovo Film Inc. Address before: Xinghu Street Industrial Park of Suzhou city in Jiangsu province 215300 No. 218 BioBAY A4-308 Patentee before: Suzhou Nuovo Film Inc. |
|
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20130724 Assignee: Caim Holdings Limited Assignor: Suzhou Nuovo Film Inc. Contract record no.: 2018990000274 Denomination of invention: Etching cream, applications of etching cream, and method for etching nano silver conductive material by utilizing etching cream Granted publication date: 20150708 License type: Exclusive License Record date: 20181018 |
|
EE01 | Entry into force of recordation of patent licensing contract |