CN103210552B - 具有分子键合互连的连接器和同轴线缆 - Google Patents

具有分子键合互连的连接器和同轴线缆 Download PDF

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CN103210552B
CN103210552B CN201180054849.1A CN201180054849A CN103210552B CN 103210552 B CN103210552 B CN 103210552B CN 201180054849 A CN201180054849 A CN 201180054849A CN 103210552 B CN103210552 B CN 103210552B
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connector
outer conductor
connector body
inner wire
molecular linkage
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CN103210552A (zh
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K·范斯韦林根
J·弗雷明
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TE Connectivity Corp
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Tyco Electronics Corp
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Priority claimed from US12/951,558 external-priority patent/US8826525B2/en
Priority claimed from US12/962,943 external-priority patent/US8302296B2/en
Priority claimed from US12/974,765 external-priority patent/US8563861B2/en
Priority claimed from US12/980,013 external-priority patent/US8453320B2/en
Priority claimed from US13/070,934 external-priority patent/US9768574B2/en
Priority claimed from US13/161,326 external-priority patent/US8365404B2/en
Priority claimed from US13/170,958 external-priority patent/US9728926B2/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/52Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5205Sealing means between cable and housing, e.g. grommet
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/58Means for relieving strain on wire connection, e.g. cord grip, for avoiding loosening of connections between wires and terminals within a coupling device terminating a cable
    • H01R13/5845Means for relieving strain on wire connection, e.g. cord grip, for avoiding loosening of connections between wires and terminals within a coupling device terminating a cable the strain relief being achieved by molding parts around cable and connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02Soldered or welded connections
    • H01R4/029Welded connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207Ultrasonic-, H.F.-, cold- or impact welding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/03Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
    • H01R9/05Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2103/00Two poles
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49123Co-axial cable
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49174Assembling terminal to elongated conductor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49174Assembling terminal to elongated conductor
    • Y10T29/49179Assembling terminal to elongated conductor by metal fusion bonding

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

一种与同轴线缆组合的同轴连接器,同轴线缆设有被同轴地支撑在外导体内的内导体以及包围外导体的聚合物护套。具有孔洞的单一连接器主体设有包围连接器主体的外径的包壳。外导体插入孔洞内。在外导体和连接器主体之间以及在护套和包壳之间形成分子键合。内导体端帽也可以被提供为通过分子键合联接到内导体的端部。

Description

具有分子键合互连的连接器和同轴线缆
技术领域
本发明涉及线缆连接器。更具体地,本发明涉及一种通过分子键合与同轴线缆互连的同轴连接器。
背景技术
同轴线缆连接器例如在要求高精度和高可靠性的通信系统中用于终止同轴线缆。
为了在同轴线缆和连接器之间创造牢固的机械互连和优化的电气互连,理想的是在同轴线缆外导体的前边缘和连接器主体之间具有基本均匀的圆周接触。可以通过联接主体将外导体的扩口端部夹持抵靠在连接器主体的环形楔面上。另外,常规的同轴连接器通常包括在外导体的外径和连接器主体之间和/或在连接器主体和同轴线缆的护套之间的一个或多个单独的环境密封件。这种技术的代表是2004年9月21日授予Buenz的共同拥有的美国专利No.6793529。
虽然这种连接器通常是可以拆卸/重复使用的,但是由于所需多个分开的内部元件、互连螺纹和相关环境密封件而使制造和安装复杂。
业内还已知有被配置为通过焊接和/或粘合互连与同轴线缆永久互连的连接器。这种技术的代表是1998年9月8日授予Bufanda等人的共同拥有的美国专利No.5802710。但是焊接和/或粘合互连难以赋予高水平的质量控制,从而导致互连可能不令人满意,例如当长期暴露在振动和/或腐蚀环境下时。
无源互调失真(passiveintermodulationdistortion)(也被称为PIM)是一种电干扰/信号传输劣化的形式,其发生在不对称互连的情况下和/或例如由于机械应力、振动、热循环、氧化形成和/或材料劣化导致长期的电-机互连移位或劣化。因为来自单个低质量互连的PIM可能使整个RF系统的电气性能劣化,所以PIM是很重要的互连质量特征。
同轴线缆可以设有被预附接的连接器。可以以定制长度或标准长度提供这种同轴线缆,以例如用于彼此非常靠近的设备之间的互连,其中短的线缆部分被称为跨接线。为了提供高质量的同轴线缆,线缆-连接器互连可能要求按照需要生产具有所需连接界面的特定长度的线缆,或者储存顾客可能需要的每种长度和界面的线缆/跨接线的库存。按需生产和/或维持预组装线缆长度的大量库存(每种长度的线缆具有多个可能的连接界面之一)可增加运输时间和/或制造/储存成本。
同轴线缆连接器市场上的竞争已经聚焦于提高线缆-连接器互连的电气性能、互连质量一致性和长期可靠性。另外,整体成本(包括材料、培训和安装成本)的减少也是非常重要的商业成功因素。
因此,本发明的目的是提供克服现有技术中的缺陷的一种同轴连接器和互联的方法。
附图说明
作为说明书组成部分并被纳入说明书的附图示出了本发明的实施例,图中相同的附图标记表示相同的特征或元素,并且不针对附图标记所出现的每一幅图做详细说明,这些附图以及前面所给出的本发明的一般性描述以及后面所给出的实施例的详细描述共同阐述了本发明的原理。
图1是与同轴连接器互连的同轴线缆的示范实施例的示意性倾斜等距视图。
图2是图1的示意性侧向剖视图,示出了通过激光焊接形成的外导体和连接器主体的分子键合。
图3是与同轴连接器互连的同轴线缆的另一种示范实施例的示意性倾斜等距视图。
图4是预备好的同轴线缆端部和内导体帽的示意性局部剖视图。
图5是图4的区域B的放大视图。
图6是与同轴连接器互连的同轴线缆的示意性侧向剖视图,示出了通过旋转焊接形成的外导体和连接器主体的分子键合。
图7是图6的区域A的放大图。
图8是与同轴连接器互连的同轴线缆的示意性侧向剖视图,示出了通过超声波焊接形成的外导体和连接器主体的分子键合。
图9是图8的区域C的放大图。
图10是与同轴线缆互连的连接器适配器的示范实施例的示意性等距视图。
图11是带有Type-N阳连接器界面的界面端部的示意性等距视图。
图12是带有Type-N阴连接器界面的界面端部的示意性等距视图。
图13是带有成角度7/16DIN-阳连接器界面的界面端部的示意性等距视图。
图14是图3的示意性等距局部剖视图。
具体实施方式
对于同轴线缆的导体来说已将铝作为铜的有成本效益的替代物。但是,铝表面一旦暴露在空气中就会很快地形成氧化铝表面覆层。这些氧化铝表面覆层可使常规的机械互连、焊接互连和/或导电粘合互连劣化。
发明人已经认识到,和常规的机械互连、焊接互连和/或导电粘合互连相比,分子键合型互连减少了氧化铝表面覆层的问题,PIM的产生以及改善了长期的互连可靠性。
本文中所用的“分子键合”被定义为如下互连:在所述互连中两个元件之间的结合界面利用了来自被结合在一起的两个元件中的每一个的材料的交换、混合、熔合等等。来自两个元件中的每一个的材料的交换、混合、熔合等等产生了一种界面层,在所述界面层中混合的材料组合成一种包括来自被结合在一起的两个元件中的每一个的材料的复合材料。
本领域技术人员将认识到,通过施加充分的热量使待被结合在一起的两个元件中的每一个的结合表面熔化,使得界面层熔化并且两个熔融表面相互交换材料,可以产生分子键合。然后这两个元件相对于彼此保持静止,直到熔化的界面层充分冷却以固化。
所得到的互连连续地横跨界面层,从而消除了互连质量和/或劣化问题,比如材料蠕变、氧化、电蚀、湿气渗透和/或互连表面移位。
可以通过对同轴线缆9的外导体8和同轴连接器2的连接器主体4之间所需要的互连表面施加热量(例如通过激光焊接或摩擦焊接)来产生外导体8和连接器主体4之间的分子键合。摩擦焊接例如可以被实施为旋转型焊接和/或超声型焊接。
即使外导体8被分子键合到连接器主体4上,可能还需要防止湿气等到达和/或汇聚在连接器主体4和同轴线缆9之间的外导体8的外径上。可以通过在同轴连接器2的聚合材料包壳30和同轴线缆9的护套28之间实施分子键合来永久密封线缆端部处的连接器主体4和同轴线缆9之间的进入路径。包壳30(如图1和2所示)可以作为一种聚合材料的包覆模制件被施加到连接器主体4。
根据所施加的连接界面31(在本文的几个示范实施例中被示出为一种标准7/16DIN阳界面),包壳30也可以提供连接界面结构,比如准直圆筒体38。包壳30的尺寸还可以被设计为在连接器端部18处具有外径圆筒支撑表面34,并且在线缆端部12处进一步加强支撑,从而减小连接器主体4的尺寸,由此可能减少整体材料成本。可以通过移除圆筒支撑表面34的表面部分,在圆筒支撑表面34上形成用于在与其他线缆和/或装置互连期间保持同轴连接器2的工具平坦部39。
本领域技术人员将明白,连接器端部18和线缆端部12在本文中分别作为同轴连接器2的端部以及同轴连接器2和设备的离散元件的端部的标识符,以根据它们沿着连接器端部18和线缆端部12之间的连接器的纵轴线的对准来识别相同及其各自的互连表面。
联接螺母36可以通过包壳凸缘32在连接器端部18处被保持在支撑表面34和/或支撑脊上。在线缆端部12处,可以通过在圆筒支撑表面34的线缆端部附近施加一个或多个保持凸起41而将联接螺母36保持在包壳30的支撑脊和/或圆筒支撑表面34上。保持凸起41可以成角度且从线缆端部12到连接器端部18增加直径,从而允许联接螺母36从线缆端部12经过保持凸起到达连接器端部18,且随后通过设置在保持凸起41的连接器端部18处的止挡表面被保持在圆筒支撑表面34上。
包壳凸缘32可以牢固地键合到连接器主体4的连接器主体凸缘40,因此通过一个或多个互锁孔眼42(比如设置在连接器主体凸缘40和/或连接器主体4的外径上的孔、纵向隆起、凹槽、切口等)与连接器主体4联接,如图1所示。因此,在包覆模制期间包壳30的聚合材料流入一个或多个互锁孔眼42时,在固化后包壳30将永久地联接到连接器主体4并与之旋转地互锁。
包壳30的线缆端部的尺寸可以设计成具有靠近同轴线缆护套28的摩擦表面的内径摩擦表面44,这产生相对于护套28的外径的过盈配合,从而通过连接器主体4相对于外导体8的摩擦旋转焊接形成包壳30和护套28之间的分子键合,由此在连接器/线缆互连的线缆端部12处不需要环境密封件。
包壳30可以为机械互连提供大的强度和保护特性。包壳30还可以具有在线缆端部附近的设置有多个应力消除控制孔眼46的延伸线缆部分,例如如图3所示。可以以一种大致椭圆形的构形形成应力消除控制孔眼46,其中应力消除控制孔眼46的主轴线布置为与同轴连接器2的纵轴线正交。应力消除控制孔眼46使包壳30的线缆端部具有一种朝着包壳30的线缆端部增加的柔性特质。因此,包壳30支撑同轴线缆9和同轴连接器2之间的互连,而无需引入刚性端部边缘(否则承受弯曲作用力的被连接同轴线缆2可能沿着所述刚性端部边缘弯曲),这可以增加互连的整体强度和柔性特质。
护套28和/或靠近摩擦区44的包壳30的内径可以被设置为具有轮廓图案(比如波状物或者阶梯表面)的多个间隔环形突起,从而提供增强的摩擦,为过量摩擦焊接材料流动提供了空间,和/或添加了用于额外强度的键锁定。在一种替换方案中,包壳30可以在与外导体8互连以后被包覆模制在连接器主体4上,如果注射成型的热量足以熔化至少护套28的外径表面的话,被注射的聚合材料的热量以分子键合的形式将包壳30与护套28结合和/或密封。在另一种替换方案中,可以通过对护套28和包壳线缆端部之间的边缘施加激光焊接将包壳分子键合到护套28。
在该区域的分子键合不有效的情况下,包壳30可以通过过盈配合和/或应用粘结剂/密封剂与外护套28密封。
在互连之前,可以通过切割该同轴线缆9来预备同轴线缆9的前端,使得内导体24从外导体8延伸,例如如图4和5所示。还有,可以剥离内导体24和外导体8之间的介电材料26,并且移除一定长度的外护套28来暴露每种所需的长度。内导体24的尺寸被设计为延伸穿过所附接的同轴连接器2,用于与作为连接界面31一部分的另一个同轴连接器2直接互连。或者,例如在所选连接界面31要求与所选同轴线缆9的内导体24不兼容的内导体外形的情况下,和/或在内导体24的材料是一种不理想的内导体连接器界面材料(比如铝)的情况下,可以通过应用内导体帽20来终止内导体24。
内导体帽20(例如由一种金属形成,比如黄铜、青铜或其他所需的金属)可以也是通过摩擦焊接(比如旋转焊接或超声焊接)用分子键合被施加到内导体24的端部。内导体帽20可以设有在线缆端部12处的内导体槽21,以及在连接器端部18处的所需的内导体界面22。内导体槽21的尺寸被设计为与同轴线缆9的内导体24的预备端部23匹配。为了施加内导体帽20,内导体24的端部可以被预备为提供一种与所选择的内导体帽20的槽外形相对应的销轮廓。为了允许在焊接期间材料互相流动,当内导体帽20被放置在内导体24的预备端部23上时,内导体帽20的槽轮廓和/或内导体24的端部可以形成为提供材料间隙25。
旋转键27可以被设置在内导体帽20上,旋转键27的尺寸被设计为与旋转焊接工具或用于旋转和/或扭转地往复驱动内导体帽20的超声波发生器匹配,以用于通过旋转焊接或超声摩擦焊接形成分子键合互连。
替代地,可以通过对内导体24的外径和内导体帽20的线缆端部12的外径之间的接缝实施激光焊接来施加内导体帽20。
在图1和2中示出被配置为通过激光焊接在外导体8和连接器主体4之间形成分子键合的连接器主体4。连接器主体4在同轴线缆9的预备端部上滑动,使得外导体8与连接器主体孔洞6的连接器端部18齐平,从而能对在连接器端部18处的外导体8外径和连接器主体孔洞6内径之间的圆周连结部施加激光。
在对外导体8和连接器主体4的连结部施加激光以前,可以通过相对于同轴线缆9旋转连接器主体4以及由此被施加在连接器主体4外径上的聚合物包壳30来实施包壳30和护套28之间的分子键合。当包壳30相对于护套28旋转时,摩擦表面44被充分加热到产生熔化界面层,在旋转停止和熔化界面层被允许冷却时,所述熔化界面层使包壳30和护套28以圆周分子键合的形式彼此熔合。
在包壳30和护套28被分子键合在一起的情况下,可以随后施加激光(或者是连续激光焊接,或者是多次重叠的点焊)到外导体8和连接器主体4的连结部的圆周,直到在连接器主体4和外导体8之间获得圆周分子键合位置。或者,连接器主体孔洞6可以设有靠近连接器主体孔洞6的连接器端部18的向内突出的肩部,外导体8被插入连接器主体孔洞6中以抵靠所述肩部,并且从连接器端部18以一个角度施加激光到外导体端部的内径和向内突出的肩部之间的接缝。
在图6和7中示出通过旋转式摩擦焊接在外导体和连接器主体之间形成的分子键合。连接器主体的孔洞设有向内突出的肩部11,肩部11朝着连接器主体4的线缆端部12成角度,这形成对着线缆端部12敞开的环形摩擦沟槽15。如图7最佳所示,摩擦沟槽15的尺寸被设计为在其中接收外导体8的前边缘,外导体8的厚度防止外导体8一开始就到达摩擦沟槽15的底部,从而当外导体8一开始放入摩擦沟槽15内时,形成在外导体8的前边缘和摩擦沟槽15的底部之间的环形材料腔16。另外,孔洞侧壁17的径向尺寸可以被设计为产生靠近摩擦沟槽15的摩擦部分22。摩擦部分22产生在孔洞侧壁20和外导体8外径之间的额外干涉,以在摩擦焊接期间增加摩擦。
为了启动摩擦焊接,在纵向压力下将外导体8的前边缘放入摩擦部分22内并进入摩擦沟槽15期间,相对于外导体8旋转连接器主体4。在例如以250-500转每分钟的速度旋转期间,外导体8的前边缘和/或外径与孔洞6的摩擦部分22和/或摩擦沟槽15之间的摩擦产生足够的热量,以使外导体8的前边缘和/或外导体8以及连接器主体4的局部相邻部分软化,从而当外导体8的牺牲部分形成流入材料腔16的塑料焊珠时,外导体8和连接器主体4锻造在一起,从而通过分子键合将外导体8和连接器主体4熔合在一起。
如上所示,包壳30的尺寸可以被类似地设计为具有相对于护套28的摩擦表面44,从而当实施旋转来执行旋转焊接以实现外导体8和连接器主体4之间的分子键合时,允许旋转焊接同时在护套28和包壳30之间也形成分子键合。
在实施旋转焊接以同时形成聚合物包壳30和护套28之间以及金属外导体8和连接器主体4之间的分子键合时,可应用连接器外圆周包封和/或径向向内压缩旋转焊接设备,使得在金属部分到达需要的焊接温度之前,聚合物部分不被加热到如下温度水平:在所述温度水平中聚合物部分软化/熔化到被旋转所产生的离心力径向向外分开的点。
替代地,可以在压力下在两个需要被焊接在一起的部件之间的结合区域内通过应用超声振动经超声焊接形成分子键合,从而导致局部的热量足以使相邻的表面塑化,然后这些表面保持彼此接触直到这些交流表面被冷却,从而完成分子键合。可以通过超声波发生器和/或同步的超声波发生器端将超声焊接以高精度施加到一个点和/或延伸面。在施加超声点焊的情况下,可应用连续重叠的点焊来产生持续的超声焊接。可以例如沿线性方向施加超声振动和/或沿着一个弧段往复地施加超声振动,也称为扭转振动。
在图8和9中示出通过超声焊接使内外导体分子键合同轴连接器2和同轴线缆互连的示范实施例。如图8最佳所示,单一的连接器主体4设有尺寸适合在其中接收同轴线缆9的外导体8的孔洞6。如图9最佳所示,从孔洞6朝着连接器主体4的连接器端部18径向向外成角度的扩口座10对着同轴连接器2的连接器端部敞开,从而提供配合表面,外导体8的前端扩口14可以通过从连接器端部18插入而接触前端扩口14的超声焊机的外导体超声波发生器被超声焊接在所述配合表面上。
同轴线缆9的线缆端部12被插入孔洞6并且在外导体8的前边缘上执行环形扩口操作。所得到的前端扩口14可以根据扩口座10相对于同轴连接器2的纵轴线的角度而成角度。通过在扩口座10上执行扩口操作,所得到的前端扩口14能被形成为具有与扩口座的角度直接对应的关系。可以利用外导体超声波发生器的前边缘来执行扩口操作,所述外导体超声波发生器设有锥形的圆筒内唇(其连接器端部直径小于外导体8的内径),用于在最初时将外导体8的前边缘接合并扩张抵靠扩口座10上。
可以利用单独的扩口工具来实施扩口操作,或者通过将外导体超声波发生器行进到接触外导体8的头部的前边缘,导致外导体8的前边缘抵靠扩口座10被扩张来实施扩口操作。扩口后,外导体超声波发生器被行进到前端扩口14上(如果在扩口完成后还没有被如此放置的话),并可以开始超声焊接。
可以例如利用线性的和/或扭转的振动来实施超声焊接。在将前端扩口14焊接到扩口座10的线性振动超声型摩擦焊接中,施加线性振动到前端扩口14的线缆端部侧,而同轴连接器2及其内的扩口座10在夹具内保持静止。线性振动产生了使前端扩口14和扩口座10之间的接触面塑化的摩擦热,冷却后形成分子键合。在采用线性振动超声型摩擦焊接的情况下,可应用例如根据材料特性、外导体8的直径和/或侧壁厚度而选择的合适频率和线性位移,比如20-40KHz以及20-30微米。
在另一个实施例中,如图3和10-14所示,连接器主体4和包壳30的分子键合可以被预施加在作为连接器适配器1的同轴线缆9的端部上以提供一种标准线缆终端部,所需要的界面端部5可以应用到该终端部上从而提供简化的批量制造及存货(其可以根据每个特定客户要求所需的任一与连接界面的界面端部5快速地收尾)。如以上几个实施例所示,被配置为在连接器端部18处作为连接器适配器1的连接器主体4可以被配置为通过激光焊接、旋转焊接或超声焊接与外导体8分子键合。
在将所需的内导体帽20联接到内导体24、优选通过前面所描述的分子键合联接到内导体24的情况下,对应的界面端部5可以被放置在配合表面49上并被超声焊接。例如如图10所示,配合表面49可以设有朝着连接器端部18减小的直径(比如锥形或弧形表面),从而实现一种可以通过应用轴向压缩而逐步变紧的自对准配合。
如图14最佳所示,所选的界面端部5放置在连接器适配器1的连接器端部18上的配合表面49上。界面端部5可以例如以一种自对准过盈配合的方式被放置在配合表面49上,直到连接器适配器1的连接器端部抵靠界面端部孔洞内的肩部和/或连接器适配器1的线缆端部抵靠包壳30的连接器端部的止挡肩部33为止。
环形密封沟槽52被设置在用于垫圈54(比如聚合物O形圈)的配合表面上,以对连接器适配器1和所选定的界面端部5的互连进行环境密封。
当连接器适配器1和连接器端部2之间的配合表面与所得到的组件的连接器端部18间隔开时,施加径向的超声焊接。多个超声波发生器可以径向向内地朝着界面端部5的线缆端部12的外径延伸,从而对结合区域施加选定的超声振动。替代地,单个超声波发生器可以被实施为以连续的焊接步骤或者在沿着连结区的连续圆周路径中移动,以寻址到连结区的外径的若干指定弧形部分中的每一个上,或者到连结区的外径的重叠弧形部分上。在密封沟槽52和垫圈54存在的情况下,即使没有实现邻接圆周焊接,互连仍保持环境密封。
本领域技术人员明白,已经示出了在包壳30和护套28之间,在外导体8和连接器主体4之间,在内导体24和内导体帽20之间以及在连接器适配器1和界面端部5之间的分子键合。可以单独实施或者与其他组合地实施这些互连中的每一个,从而实现所需要的成本、可靠性、安装速度和多功能性的平衡。
本领域技术人员明白,分子键合不需要其他的环境密封,简化了同轴连接器2的构造,以及不需要多个分开的元件和/或分散组件。因为用于形成分子键合的激光焊接、旋转焊接或超声焊接工艺的局部熔化能破坏中间焊接区中的任何氧化铝表面表面覆层,所以不需要关于移除或管理互连表面上存在氧化铝这个问题的额外处理,从而针对同轴线缆导体和/或连接器主体能成本和重量有效地使用铝材。最后,在每个机-电互连处都建立了分子键合的情况下,可明显地减少和/或彻底消除这种互连所产生的PIM。
部件表
1 连接器适配器
2 同轴连接器
4 连接器主体
5 界面端部
6 孔洞
8 外导体
9 同轴线缆
10 扩口座
11 内突出肩部
12 线缆端部
14 前端扩口
15 摩擦沟槽
16 环形材料腔
17 孔洞侧壁
18 连接器端部
20 内导体帽
21 内导体槽
22 内导体界面
23 预备端部
24 内导体
25 材料间隙
26 介电材料
27 旋转键
28 护套
30 包壳
31 连接界面
32 包壳凸缘
34 支撑表面
36 联接螺母
38 准直圆筒体
39 工具平坦部
40 连接器主体凸缘
41 保持凸起
42 互锁孔
44 摩擦表面
46 应力消除控制孔
49 配合表面
52 密封沟槽
54 垫圈
在前面的描述中,参考了具有已知等同物的材料、比值、整数或部件,它们的这些等同物也纳入本文,如同被单独给出一样。
虽然已经通过对本发明实施例的描述说明了本发明,并且虽然详细地描述了这些实施例,但是这并不意味着申请人意在将后附权利要求的范围约束为或者以任意方式限制为这些细节。对于本领域技术人员来说其他的优点和改动是很明显的。因此,本发明在它更宽的方面并不被限制为特定的细节、代表性设备、方法以及所述和所图示的示例。所以,在不违反申请人的基本发明概念的范围和精神的前提下,可以根据所述细节做出改变。另外,应当明白,在不背离后面的权利要求所限定的本发明范围或精神的前提下,可以进行改进和/或改变。

Claims (20)

1.一种同轴线缆和同轴连接器的组合件,所述组合件包括:
同轴线缆,所述同轴线缆设有被同轴地支撑在外导体内的内导体;
包围外导体的聚合物护套;
具有孔洞的单一的连接器主体;
包围连接器主体的外径的包壳;
外导体插入孔洞内,在外导体和连接器主体之间以及在护套和包壳之间形成分子键合。
2.根据权利要求1所述的组合件,其中在外导体和连接器主体之间的分子键合在外导体的外径和孔洞的内径之间位于孔洞的连接器端部处。
3.根据权利要求1所述的组合件,其中外导体的端部位于环形扩口座内,所述环形扩口座从孔洞的侧壁朝着连接器的连接器端部径向向内成角度;环形扩口座对着连接器的连接器端部敞开,外导体和连接器主体之间的分子键合靠近外导体的端部。
4.根据权利要求1所述的组合件,其中外导体的端部被扩口且放置在从孔洞朝着连接器的连接器端部径向向外成角度的环形扩口座上,环形扩口座向连接器的连接器端部敞开;连接器主体和外导体之间的分子键合靠近环形扩口座。
5.根据权利要求1所述的组合件,还包括通过分子键合被联接到内导体的预备端部的内导体帽。
6.根据权利要求5所述的组合件,其中内导体帽具有旋转键。
7.根据权利要求1所述的组合件,还包括在连接器主体的外径上靠近连接器端部的配合表面;
置于配合表面上的界面端部;界面端部具有连接界面;
界面端部通过分子键合互连联接到配合表面。
8.根据权利要求1所述的组合件,其中内导体朝着作为连接界面的元件的连接器端部延伸。
9.根据权利要求1所述的组合件,其中包壳包括在连接器的连接器端部处的连接器界面的准直圆筒体。
10.一种将同轴连接器与实心外导体同轴线缆互连的方法,同轴线缆设置有内导体,所述内导体通过介电材料被同轴地支撑在实心外导体的薄的圆筒侧壁内,所述方法包括以下步骤:
向整体的连接器主体提供孔洞;聚合物包壳包围连接器主体的外径;
将同轴线缆的前端插入孔洞;以及
将外导体分子键合到连接器主体,以及将包壳分子键合到同轴线缆的护套。
11.根据权利要求10所述的方法,其中外导体和连接器主体均是铝和铝合金材料中的其中一个。
12.根据权利要求10所述的方法,其中通过激光焊接形成在外导体和连接器主体之间的分子键合。
13.根据权利要求10所述的方法,其中通过超声焊接形成在外导体和连接器主体之间的分子键合。
14.根据权利要求10所述的方法,其中通过旋转焊接形成在外导体和连接器主体之间的分子键合。
15.根据权利要求10所述的方法,其中通过旋转焊接形成在包壳和护套之间的分子键合。
16.根据权利要求10所述的方法,还包括通过分子键合联接到内导体的端部的内导体帽。
17.根据权利要求16所述的方法,其中通过旋转焊接形成在内导体帽和内导体之间的分子键合。
18.根据权利要求16所述的方法,其中通过超声焊接形成在内导体帽和内导体之间的分子键合。
19.根据权利要求10所述的方法,还包括通过分子键合联接到连接器主体的连接器端部的界面端部。
20.根据权利要求19所述的方法,其中在连接器主体和界面端部之间的分子键合是通过径向超声焊接形成的。
CN201180054849.1A 2010-11-22 2011-09-23 具有分子键合互连的连接器和同轴线缆 Expired - Fee Related CN103210552B (zh)

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